KR100683648B1 - Method for populating LCD module - Google Patents

Method for populating LCD module Download PDF

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KR100683648B1
KR100683648B1 KR1020000022144A KR20000022144A KR100683648B1 KR 100683648 B1 KR100683648 B1 KR 100683648B1 KR 1020000022144 A KR1020000022144 A KR 1020000022144A KR 20000022144 A KR20000022144 A KR 20000022144A KR 100683648 B1 KR100683648 B1 KR 100683648B1
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base film
anisotropic conductive
conductive adhesive
liquid crystal
crystal display
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KR1020000022144A
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Korean (ko)
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KR20010097774A (en
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윤용환
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삼성에스디아이 주식회사
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136286—Wiring, e.g. gate line, drain line
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13458—Terminal pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136286—Wiring, e.g. gate line, drain line
    • G02F1/13629—Multilayer wirings

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

목적 : 액정 디스플레이의 전극 패드와 구동회로기판의 패드 사이에 연결되는 열압착 배선의 결합 신뢰성을 향상시킬 수 있는 액정 디스플레이 모듈의 배선 실장방법을 제공함에 목적이 있다.PURPOSE: It is an object of the present invention to provide a wiring mounting method of a liquid crystal display module that can improve coupling reliability of thermocompression wiring connected between an electrode pad of a liquid crystal display and a pad of a driving circuit board.

구성 : 열압착 배선은 베이스 필름의 상부에 도전라인을 형성하고 그 상부에 접착제층을 형성하며, 길이 방향의 양측 단부에 형성되는 이방성도전접착제를 포함하고; 상기 열압착 배선의 이방성도전접착제, 베이스 필름의 일부 그리고 이방성도전접착제와 베이스 필름의 겹치는 부분을 함께 열압착하여 구동회로기판의 패드 및 액정 디스플레이의 전극 패드 상에 실장함을 특징으로 한다.Configuration: The thermocompression wiring comprises an anisotropic conductive adhesive formed on both sides of the base film, forming a conductive line on top of the base film, and an adhesive layer on the top of the base film; The anisotropic conductive adhesive of the thermocompression wiring, a part of the base film, and an overlapping portion of the anisotropic conductive adhesive and the base film are thermally compressed together to be mounted on the pad of the driving circuit board and the electrode pad of the liquid crystal display.

효과 : 이방성도전접착제와 베이스 필름 및 양쪽 부재가 겹쳐지는 부분을 함께 열압착하여 실장하므로, 결합력이 향상되고 2차에 걸쳐 외부 충격을 완화시키므로 구조적인 신뢰성이 향상된다.Effect: Since the anisotropic conductive adhesive, the base film and the overlapping parts of both members are thermally pressed together to be mounted, the bonding strength is improved and the external impact is relieved over the second time, thereby improving the structural reliability.

열압착 배선, 이방성도전접착제, 구동회로기판Thermocompression wiring, anisotropic conductive adhesive, drive circuit board

Description

액정 디스플레이 모듈의 배선 실장방법{Method for populating LCD module} Wire mounting method of liquid crystal display module {Method for populating LCD module}             

도 1은 본 발명의 액정 디스플레이 모듈의 배선 실장방법을 설명하는 구성도.BRIEF DESCRIPTION OF THE DRAWINGS The block diagram explaining the wiring mounting method of the liquid crystal display module of this invention.

도 2는 도 1의 요부를 확대 도시한 단면도.2 is an enlarged cross-sectional view of the main portion of FIG.

도 3은 일반적인 액정 디스플레이 모듈을 도시한 조립 구성도.3 is an assembly configuration diagram showing a general liquid crystal display module.

도 4는 종래의 액정 디스플레이 모듈의 배선 실장방법을 설명하는 구성도.4 is a configuration diagram illustrating a wiring mounting method of a conventional liquid crystal display module.

* 도면의 주요 부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings

6-구동회로기판 6a-패드6-Drive Circuit Board 6a-Pad

100-열압착 배선 102-베이스 필름100-thermo crimp wiring 102-base film

108-이방성도전접착제108-Anisotropic Conductive Adhesive

본 발명은 구동회로의 전압 시그널을 액정 디스플레이의 전극으로 전달하기 위하여, 구동회로기판과 액정 디스플레이의 사이에 연결되는 액정 디스플레이 모듈의 배선 실장방법에 관한 것이다.The present invention relates to a wiring mounting method of a liquid crystal display module connected between a driving circuit board and a liquid crystal display in order to transfer a voltage signal of the driving circuit to an electrode of the liquid crystal display.

액정 디스플레이는 외부로부터 인가되는 전압에 의해 액정의 꼬임각이 변화되는 유전이방성을 이용하여, 백라이트 혹은 외부로부터 조사된 광(光)을 선택적으로 투과시키거나 반대로 투과되지 않게 함으로써 문자나 숫자 및 화상을 표시한다.The liquid crystal display uses dielectric anisotropy in which the twist angle of the liquid crystal is changed by a voltage applied from the outside to selectively transmit or reverse the letters, numbers, and images through the backlight or the light irradiated from the outside. Display.

이러한 액정 디스플레이는 평행하게 배치된 투명한 2매의 글라스기판에 ITO(Induim Tin Oxide) 투명전극을 형성하고, 그 상측에 액정의 유전이방성을 한정하는 배향막을 적층하며, 이렇게 형성된 2매의 글라스기판을 실링하고 그 사이공간에 액정을 주입 밀봉하여 구성한다. 또 2매의 글라스기판의 외측면에는 실제적으로 디스플레이의 효과를 얻기 위해, 백라이트의 광을 선편광시켜 주는 편광판을 부착하여 이루어진다.Such a liquid crystal display forms an ITO (Induim Tin Oxide) transparent electrode on two transparent glass substrates arranged in parallel, and laminates an alignment layer defining dielectric anisotropy of the liquid crystal on the upper side thereof. It is constructed by sealing and injecting and sealing liquid crystal in the space therebetween. Moreover, in order to obtain the effect of a display, the polarizing plate which linearly polarizes the light of a backlight is attached to the outer surface of two glass substrates.

도 3에 도시한 바와 같이, 상기한 액정 디스플레이(2)는 백라이트(4) 및 구동 LSI을 포함하는 구동회로기판(6)과 함께 조립되어 모듈화 되는 바, 이것은 베젤(8)에 의해 어셈블리되어진다. 이때 구동회로기판(6)과 액정 디스플레이(2)의 사이에는 구동회로의 시그널을 전달하기 위해, 열압착 배선(heat seal)(10) 및 제브라 컨넥터(12)를 연결하는데, 이러한 접속 조합방식은 QFD 모듈 방식으로 잘 알 려져 있다.As shown in FIG. 3, the liquid crystal display 2 is assembled and modularized with a driving circuit board 6 including a backlight 4 and a driving LSI, which is assembled by a bezel 8. . At this time, the heat seal 10 and the zebra connector 12 are connected between the driving circuit board 6 and the liquid crystal display 2 in order to transmit a signal of the driving circuit. The QFD modular approach is well known.

여기서 상기한 열압착 배선(10)은 베이스 필름으로 폴리에스터를 사용하고, 도전성 도료를 스크린 인쇄하여 도전라인을 형성하며, 그 도전라인의 상부에 금속입자가 분산된 전연성의 핫 멜트 접착제층을 도포하여 형성한다.Here, the thermally crimped wiring 10 uses polyester as a base film, screen-prints a conductive paint to form a conductive line, and applies a malleable hot melt adhesive layer in which metal particles are dispersed on top of the conductive line. To form.

이렇게 형성된 열압착 배선(10)은 도 4에 도시한 바와 같이, 구동회로기판(6)의 패드(혹은 액정 디스플레이의 전극 패드) 상부에 일측 단부를 올려놓고 실장 머신의 압착 헤드(14)를 이용하여 열압착하므로 간단하게 실장 및 접속할 수 있다. 이때 열압착 배선(10)의 단부에는 접착성을 향상시키기 위해 이방성도전접착제(16)를 형성한다.As shown in FIG. 4, the thermocompression wiring 10 thus formed is placed on one side of an upper portion of a pad (or an electrode pad of a liquid crystal display) of the driving circuit board 6, and the crimping head 14 of the mounting machine is used. Thermocompression bonding allows easy mounting and connection. At this time, the anisotropic conductive adhesive 16 is formed at the end of the thermocompression wiring 10 to improve adhesiveness.

그러나 종래의 열압착 배선(10) 실장 방법에 의하면, 이방성도전접착제(16)와 구동회로기판(6)의 패드(혹은 액정 디스플레이의 전극 패드)와의 결합력(통상 400 g/㎝)이 약하기 때문에, 운송이나 세트 제작후 사용중의 외부 충격에 의해 또한 충격 테스트에 의해 쉽게 분리되어 제품 불량을 초래하는 문제점이 있다.However, according to the conventional thermocompression wiring 10 mounting method, since the coupling force (usually 400 g / cm) between the anisotropic conductive adhesive 16 and the pad (or the electrode pad of the liquid crystal display) of the driving circuit board 6 is weak, There is a problem that the product is easily separated by an external shock during use after transportation or set production and also by a shock test, resulting in product defects.

앞서 설명한 종래 기술의 문제점을 해결하기 위한 것으로서, 본 발명은 구동회로기판 및 액정 디스플레이에 실장되는 열압착 배선의 압착 결합성을 향상시켜, 충격에 대한 내구성을 향상시키고 제품 불량을 방지할 수 있도록 하는 액정 디스플레이 모듈의 배선 실장방법을 제공함에 그 목적을 두고 있다.In order to solve the problems of the prior art described above, the present invention is to improve the compression bonding of the thermocompression wiring to be mounted on the driving circuit board and the liquid crystal display, to improve the durability against impact and to prevent product defects An object of the present invention is to provide a wiring mounting method of a liquid crystal display module.

이에 따라 본 발명에서는 구동회로기판의 패드와 액정 디스플레이의 전극 패드 사이에 구동회로의 시그널을 전달하는 열압착 배선을 실장함에 있어서, 상기 열압착 배선은 베이스 필름의 상부에 도전라인을 형성하고 그 상부에 접착제층을 형성하며, 길이 방향의 양측 단부에 형성되는 이방성도전접착제를 포함하고; 상기 열압착 배선의 이방성도전접착제, 베이스 필름의 일부 그리고 이방성도전접착제와 베이스 필름의 겹치는 부분을 함께 열압착하여 구동회로기판의 패드 및 액정 디스플레이의 전극 패드 상에 실장함을 특징으로 한다.Accordingly, in the present invention, in mounting a thermocompression wiring for transmitting a signal of a driving circuit between a pad of a driving circuit board and an electrode pad of a liquid crystal display, the thermocompression wiring forms a conductive line on an upper portion of a base film and an upper portion thereof. An anisotropic conductive adhesive formed on both ends of the longitudinal direction, the adhesive layer forming on the adhesive layer; The anisotropic conductive adhesive of the thermocompression wiring, a part of the base film, and an overlapping portion of the anisotropic conductive adhesive and the base film are thermally compressed together to be mounted on the pad of the driving circuit board and the electrode pad of the liquid crystal display.

이때 열압착되는 영역중에서 베이스 필름은 35% 이하 만큼 압착하는 것으로 한다.
At this time, the base film is pressed by 35% or less in the region to be thermally compressed.

이하, 본 발명을 실현하기 위한 바람직한 실시예를 첨부 도면에 의거하여 보다 상세하게 설명한다. 참고로 본 발명을 설명함에 있어서 종래의 구성과 동일한 부분에 대하여는 동일 부호를 부여하기로 한다.EMBODIMENT OF THE INVENTION Hereinafter, preferred embodiment for implementing this invention is demonstrated in detail based on an accompanying drawing. For reference, in describing the present invention, the same reference numerals will be given to the same parts as the conventional configurations.

도 1은 본 발명의 액정 디스플레이 모듈의 배선 실장방법을 설명하고 있으며, 도 2는 도 1의 요부를 확대하여 보여주고 있다.FIG. 1 illustrates a wiring mounting method of a liquid crystal display module of the present invention, and FIG. 2 shows an enlarged view of the main part of FIG.

도시한 바와 같이 본 발명에서는 구동회로기판(6)의 패드(6a)와 액정 디스플레이의 전극 패드(도시생략) 사이에 연결되어서 구동회로의 시그널을 전달하는 실장 배선으로 열압착 배선(100)을 사용한다.As shown, in the present invention, the thermocompression wiring 100 is used as a mounting wiring connected between the pad 6a of the driving circuit board 6 and the electrode pad (not shown) of the liquid crystal display to transmit a signal of the driving circuit. do.

본 발명에서 열압착 배선(100)은 폴리에스터로 된 베이스 필름(102)의 상부에 도전성 도료를 인쇄하여 도전라인(104)을 형성하고, 그 상부에 전연성의 핫 멜트 접착제층(106)을 형성하며, 길이 방향의 양측 단부에 이방성도전접착제(108)를 형성하여 이루어진다. 이러한 열압착 배선(100)은 도 2에 확대 도시한 바와 같이 베이스 필름(102)의 일부가 이방성도전접착제(108)를 덮어 겹쳐지도록 구성한다.In the present invention, the thermocompression wiring 100 forms a conductive line 104 by printing a conductive paint on the base film 102 made of polyester, and forms a malleable hot melt adhesive layer 106 thereon. It is made by forming an anisotropic conductive adhesive 108 at both ends in the longitudinal direction. The thermocompression wiring 100 is configured such that a portion of the base film 102 covers and overlaps the anisotropic conductive adhesive 108 as shown in an enlarged view in FIG. 2.

이렇게 구성된 열압착 배선(100)은 구동회로기판(6)의 패드(6a)(혹은 액정 디스플레이의 전극 패드) 상에 실장 머신의 압착 헤드(14)를 이용하여 실장되어지는바, 본 발명에서는 열압착 배선(100)의 단부에 형성된 이방성도전접착제(108), 베이스 필름(102)의 일부 그리고 이방성도전접착제(108)와 베이스 필름(102)의 겹쳐진 부분(A1)을 함께 열압착하여 구동회로기판(6)의 패드(6a)(혹은 액정 디스플레이의 전극 패드)에 결합되게 한다. 이때 베이스 필름(102)의 압착 부분(A1)(A2)은 열압착되는 영역(A)의 전체에서 35% 이하로 되게 형성하는 것이 좋으며, 바람직하게는 이방성도전접착제(108)와 베이스 필름(102)의 압착 비율을 2:1로 형성하는 것이 좋다.The thermocompression wiring 100 thus configured is mounted on the pad 6a of the drive circuit board 6 (or the electrode pad of the liquid crystal display) using the crimping head 14 of the mounting machine. The anisotropic conductive adhesive 108 formed at the end of the crimp wiring 100, a part of the base film 102 and the overlapping portion A1 of the anisotropic conductive adhesive 108 and the base film 102 are thermally compressed together to drive the circuit board. To pad 6a (or electrode pad of a liquid crystal display). At this time, it is preferable to form the compressed portions A1 and A2 of the base film 102 to be 35% or less in the entire area A to be thermally compressed. Preferably, the anisotropic conductive adhesive 108 and the base film 102 are formed. It is preferable to form a crimp ratio of 2 to 2: 1.

이렇게 결합되는 열압착 배선(100)의 베이스 필름(102)은 통상 300 g/㎝의 분리력을 갖도록 결합되므로, 외부로부터 충격이 가해질 경우 1차적으로 충격을 완화시킨다.Since the base film 102 of the thermocompression bonding line 100 coupled as described above is usually combined to have a separation force of 300 g / cm, the impact is primarily relieved when an impact is applied from the outside.

또 본 발명에 의하면 이방성도전접착제(108)와 베이스 필름(102)의 겹쳐진 부분(A1)은 타 부분(A2)(A3) 보다 두께가 크기 때문에 압착 헤드(14)에 의해 강하게 압착 결합되어진다. 그 결과 이방성도전접착제(108)와 베이스 필름(102)의 겹쳐진 부분(A1)은 850 g/㎝의 높은 결합력을 유지하며, 이 부분은 외부로부터 충격이 가해질 경우 그 충격력을 2차로 완화시키도록 작용한다. 이와 같은 높은 결합 력은 이방성도전접착제(108)와 구동회로기판(6)의 패드(6a)와의 압착 부분(A3)의 결합력 400 g/㎝ 보다 당연히 높은 것이다.In addition, according to the present invention, since the overlapping portion A1 of the anisotropic conductive adhesive 108 and the base film 102 is larger in thickness than the other portions A2 and A3, it is strongly pressed and bonded by the crimping head 14. As a result, the overlapping portion A1 of the anisotropic conductive adhesive 108 and the base film 102 maintains a high bonding force of 850 g / cm, which acts to relieve the impact force secondarily when an impact is applied from the outside. do. This high coupling force is naturally higher than the coupling force 400 g / cm of the crimping portion A3 between the anisotropic conductive adhesive 108 and the pad 6a of the driving circuit board 6.

한편 이방성도전접착제(108)와 베이스 필름(102)의 겹쳐진 부분(A1)은 전체 열압착 영역(A)중에서 20% 이하로 형성하는 것이 좋으며, 바람직하게는 베이스 필름(102)의 열압착 영역(A2)(A1)의 절반이하로 형성하는 것이 좋다.Meanwhile, the overlapped portion A1 of the anisotropic conductive adhesive 108 and the base film 102 may be formed to be 20% or less in the entire thermocompression bonding region A, and preferably the thermocompression bonding region of the base film 102 ( It is good to form less than half of A2) (A1).

이와 같이 실장된 본 발명의 열압착 배선(100)은 구동회로기판(6)의 패드와 액정 디스플레이의 전극 패드의 사이에서 구동 및 전압 시그널을 전달하여, 액정 디스플레이의 상·하 전극 사이에 주입된 액정을 트위스트되게 함으로써, 백라이트로부터 조사된 빛을 선택적으로 투과시켜 문자나 숫자 혹은 기타 임의의 아이콘을 표시한다.The thermocompression wiring 100 of the present invention mounted as described above transfers driving and voltage signals between the pad of the driving circuit board 6 and the electrode pad of the liquid crystal display, and is injected between the upper and lower electrodes of the liquid crystal display. By twisting the liquid crystal, the light irradiated from the backlight is selectively transmitted to display letters, numbers or other arbitrary icons.

이상에서 설명한 바와 같이 본 발명은 이방성도전접착제와 베이스 필름 및 양쪽 부재가 겹쳐지는 부분을 함께 열압착하여 구동회로기판 및 액정 디스플레이에 실장함으로써, 결합력을 높이고 2차에 걸쳐 외부 충격을 완화시키는 효과를 얻을 수 있다.As described above, according to the present invention, the anisotropic conductive adhesive, the base film and the overlapping portion of both members are thermally pressed together to be mounted on the driving circuit board and the liquid crystal display, thereby increasing the bonding force and mitigating external impacts over the second time. You can get it.

따라서 본 발명에 의하면 열압착 배선의 실장 불량을 해소할 수 있으며, 그 결과 제품의 신뢰성을 향상시키는 효과를 얻을 수 있다.Therefore, according to the present invention, the mounting failure of the thermocompression wiring can be eliminated, and as a result, the effect of improving the reliability of the product can be obtained.

Claims (3)

구동회로기판의 패드와 액정 디스플레이의 전극 패드 사이에 구동회로의 시그널을 전달하는 열압착 배선을 실장함에 있어서, In mounting the thermocompression wiring for transmitting the signal of the driving circuit between the pad of the driving circuit board and the electrode pad of the liquid crystal display, 상기 열압착 배선은 베이스 필름의 상부에 도전라인을 형성하고 그 상부에 절연성의 핫멜트 접착제층을 형성하며, 길이 방향의 양측 단부에 형성되는 이방성도전접착제를 포함하고, 상기 베이스 필름은 상기 이방성도전접착제의 일측단을 덮도록 형성되고; 상기 열압착 배선의 이방성도전접착제, 베이스 필름 및 이방성도전접착제와 베이스 필름의 겹치는 부분을 함께 열압착하여 구동회로기판의 패드 및 액정 디스플레이의 전극 패드 상에 실장함을 특징으로 하는 액정 디스플레이 모듈의 배선 실장방법.The thermocompression wiring may include an anisotropic conductive adhesive formed on both sides of the insulating film, and an insulating hot melt adhesive layer formed on the upper portion of the base film and having an insulating hot melt adhesive layer formed thereon, and the base film may be formed of the anisotropic conductive adhesive. Is formed to cover one end of the; The anisotropic conductive adhesive of the thermocompression wiring, the base film and the overlapping portion of the anisotropic conductive adhesive and the base film are thermally compressed together and mounted on the pad of the driving circuit board and the electrode pad of the liquid crystal display. How to mount. 제 1 항에 있어서, 열압착되는 영역중에서 베이스 필름은 35% 이하 만큼 압착하는 것을 특징으로 하는 액정 디스플레이 모듈의 배선 실장방법.The wire mounting method of claim 1, wherein the base film is compressed by 35% or less in the thermocompression-bonded region. 제 1 항에 있어서, 이방성도전접착제와 베이스 필름의 겹치는 부분은 열압착되는 전체 영역중에서 20% 이하로 형성하는 것을 특징으로 하는 액정 디스플레이 모듈의 배선 실장방법.The wire mounting method of claim 1, wherein an overlapping portion of the anisotropic conductive adhesive and the base film is formed to be 20% or less in the entire area to be thermally compressed.
KR1020000022144A 2000-04-26 2000-04-26 Method for populating LCD module KR100683648B1 (en)

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KR19990023344A (en) * 1997-08-04 1999-03-25 모리시다 요이치 Reflective Liquid Crystal Display

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Publication number Priority date Publication date Assignee Title
KR19990023344A (en) * 1997-08-04 1999-03-25 모리시다 요이치 Reflective Liquid Crystal Display

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