KR100673684B1 - Ptc-device improved in electrode structure - Google Patents

Ptc-device improved in electrode structure Download PDF

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KR100673684B1
KR100673684B1 KR1020050118967A KR20050118967A KR100673684B1 KR 100673684 B1 KR100673684 B1 KR 100673684B1 KR 1020050118967 A KR1020050118967 A KR 1020050118967A KR 20050118967 A KR20050118967 A KR 20050118967A KR 100673684 B1 KR100673684 B1 KR 100673684B1
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ptc
material layer
plate electrodes
attached
plated
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Korean (ko)
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이영준
이안나
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엘에스전선 주식회사
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H01C7/027—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient consisting of conducting or semi-conducting material dispersed in a non-conductive organic material

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  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Electromagnetism (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Thermistors And Varistors (AREA)

Abstract

A PTC(Positive Temperature Coefficient)-device with an improved electrode structure is provided to prevent a non-plated surface from eroding by a metal tap attached to an electrode. A PTC-device with an improved electrode structure includes a PTC material layer(100), a pair of plate electrodes(101,102) attached to both surfaces of the PTC material layer, and a pair of metal taps(103,104) attached to cover external surfaces of the plate electrodes(101,102). The plate electrodes(101,102) are formed by plating nickel as a plating agent. The widths of the metal taps(103,104) are identical with the widths of the plate electrodes(101,102). In the plate electrodes(101,102) of the PTC device, an M-side of an electrolyte copper thin film only is plated with nickel and an S-side of the electrolyte copper thin film directly contacts the metal taps(103,104).

Description

전극 구조가 개선된 ＰＴＣ 소자{PTC-device improved in electrode structure}PTC device improved in electrode structure

본 명세서에 첨부되는 다음의 도면들은 본 발명의 바람직한 실시예를 예시하는 것이며, 후술하는 발명의 상세한 설명과 함께 본 발명의 기술사상을 더욱 이해시키는 역할을 하는 것이므로, 본 발명은 그러한 도면에 기재된 사항에만 한정되어 해석되어서는 아니된다.The following drawings attached to this specification are illustrative of preferred embodiments of the present invention, and together with the detailed description of the invention to serve to further understand the technical spirit of the present invention, the present invention is a matter described in such drawings It should not be construed as limited to

도 1은 종래기술에 따른 PTC 소자의 외관을 도시하는 사시도.1 is a perspective view showing the appearance of a PTC device according to the prior art;

도 2는 도 1에서 전극 구조를 부분적으로 도시하는 단면도.FIG. 2 is a cross-sectional view partially showing the electrode structure in FIG. 1. FIG.

도 3은 본 발명의 바람직한 실시예에 따른 PTC 소자의 외관을 도시하는 사시도.3 is a perspective view showing the appearance of a PTC device according to a preferred embodiment of the present invention;

도 4는 도 3에서 전극 구조를 부분적으로 도시하는 단면도.4 is a cross-sectional view partially showing the electrode structure in FIG.

<도면의 주요 참조부호에 대한 설명><Description of main reference numerals in the drawings>

100...PTC 물질층 101,102...판형전극100 ... PTC material layer 101,102 ... plate electrode

103,104...금속탭103,104.Metal tab

본 발명은 PTC(Positive Temperature Coefficient) 소자에 관한 것으로서, 더욱 상세하게는 열전도나 전기전도 특성을 향상시키도록 전극의 도금 구조가 개선된 PTC 소자에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a PTC (Positive Temperature Coefficient) device, and more particularly, to a PTC device having an improved plating structure of an electrode to improve thermal conductivity or electrical conductivity.

PTC 물질은 주위의 온도가 상승하거나 정격치를 초과하는 전류가 유입되어 발열될 경우 저항이 급격히 상승하여 전류의 흐름을 차단하는 특성을 제공하므로 이를 이용하여 회로소자를 구성할 경우 온도상승시 폭발위험이 있는 리튬이온(Lithium-ion) 이차전지나 각종 전자회로를 이상동작으로부터 보호할 수 있다.The PTC material provides a property that the resistance rises rapidly when the ambient temperature rises or a current exceeding the rated value heats up, thereby blocking the flow of current.Therefore, there is no risk of explosion when the temperature rises. Lithium-ion secondary batteries and various electronic circuits can be protected from abnormal operation.

일반적으로 PTC 소자는 도 1에 도시된 바와 같이 PTC 특성을 갖는 PTC 물질층(10)과, PTC 물질층(10)의 양면에 부착되는 한 쌍의 금속전극(11,12)과, 금속전극(11,12) 외부에 부착되는 금속탭(13,14)으로 구성된다.In general, the PTC device includes a PTC material layer 10 having PTC characteristics, a pair of metal electrodes 11 and 12 attached to both surfaces of the PTC material layer 10, and a metal electrode (as shown in FIG. 1). 11 and 12, metal tabs 13 and 14 attached to the outside.

PTC 물질층(10)은 결정성을 갖는 고분자 물질과 전도성 물질의 혼합물로 이루어지며, 온도상승시 결정 영역이 아모퍼스(Armophous) 상태가 되면서 부피팽창을 수반하여 전도성 입자간의 접촉을 분리시킴으로써 저항이 상승하는 PTC 특성을 제공한다.The PTC material layer 10 is composed of a mixture of a crystalline polymer material and a conductive material, and when the temperature rises, the crystal region becomes amorphous and the resistance is separated by separating the contact between the conductive particles with volume expansion. Provide rising PTC characteristics.

금속전극(11,12)은 도 2에 도시된 바와 같이 전해동박(1)의 양면에 니켈 도금층(2,3)이 구비된 형태로 구성되어 PTC 물질층(10)의 양면에 각각 부착된다. As shown in FIG. 2, the metal electrodes 11 and 12 have nickel plating layers 2 and 3 provided on both surfaces of the electrolytic copper foil 1, and are attached to both surfaces of the PTC material layer 10.

금속탭(13,14)은 금속전극(11,12)의 외부면에 부분적으로 부착되고 그 단부가 PCB 기판 등에 솔더링 되는 판상의 리드로서, 금속전극(11,12)에 비해 폭이 좁은 형태로 이루어진다.The metal tabs 13 and 14 are plate-shaped leads which are partially attached to the outer surfaces of the metal electrodes 11 and 12 and whose ends are soldered to a PCB substrate or the like, and have a narrower width than the metal electrodes 11 and 12. Is done.

이상과 같은 구성을 갖는 종래의 PTC 소자는 특히, 양면이 모두 도금된 금속 전극을 채택하는 구조상 전극 제조를 위한 공정이 매우 까다롭고 재료비가 많이 소요되는 단점이 있다. 또한, 니켈 등의 도금제로 전극의 양면이 도금됨으로 인해 열전도도나 전기전도도가 비도금시에 비해 상대적으로 낮은 취약점이 있다.Conventional PTC device having the configuration as described above has a disadvantage in that the process for manufacturing the electrode is very difficult and material cost is particularly difficult to adopt a metal electrode plated on both sides. In addition, since both surfaces of the electrode are plated with a plating agent such as nickel, thermal conductivity or electrical conductivity is relatively low compared with non-plating.

본 발명은 상기와 같은 문제점을 해결하기 위해 창안된 것으로서, 열전도, 전기전도 등의 특성을 향상시키도록 일면 도금 구조의 전극을 구비한 PTC 소자를 제공하는 데 그 목적이 있다.The present invention has been made to solve the above problems, and an object thereof is to provide a PTC device having an electrode having a one-side plating structure to improve characteristics such as heat conduction and electric conduction.

상기와 같은 목적을 달성하기 위해 본 발명에 따른 PTC 소자는, PTC 특성을 갖는 PTC 물질층; 상기 PTC 물질층의 양면에 부착되는, 상기 PTC 물질층과 접촉하는 면에는 도금제가 도금되어 있고 그 타면에는 도금제가 도금되어 있지 않은 한 쌍의 판형전극; 및 상기 판형전극의 외부면을 덮도록 부착되는 한 쌍의 금속탭;을 포함한다.In order to achieve the above object, the PTC device according to the present invention includes a PTC material layer having PTC properties; A pair of plate-shaped electrodes which are attached to both surfaces of the PTC material layer and which have a plating agent plated on a surface thereof in contact with the PTC material layer, and whose plating agent is not plated on the other surface thereof; And a pair of metal tabs attached to cover the outer surface of the plate electrode.

바람직하게, 상기 판형전극은 전해동박의 일면에 상기 도금제로서 니켈이 도금되어 형성된다.Preferably, the plate-shaped electrode is formed by plating nickel on the one surface of the electrolytic copper foil as the plating agent.

상기 금속탭의 폭은 상기 판형전극의 폭과 일치하는 것이 바람직하다.Preferably, the width of the metal tab is equal to the width of the plate electrode.

이하, 첨부된 도면을 참조하여 본 발명의 바람직한 실시예를 상세히 설명하기로 한다. 이에 앞서, 본 명세서 및 청구범위에 사용된 용어나 단어는 통상적이거나 사전적인 의미로 한정해서 해석되어서는 아니되며, 발명자는 그 자신의 발명을 가장 최선의 방법으로 설명하기 위해 용어의 개념을 적절하게 정의할 수 있다는 원 칙에 입각하여 본 발명의 기술적 사상에 부합하는 의미와 개념으로 해석되어야만 한다. 따라서, 본 명세서에 기재된 실시예와 도면에 도시된 구성은 본 발명의 가장 바람직한 일 실시예에 불과할 뿐이고 본 발명의 기술적 사상을 모두 대변하는 것은 아니므로, 본 출원시점에 있어서 이들을 대체할 수 있는 다양한 균등물과 변형예들이 있을 수 있음을 이해하여야 한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. Prior to this, terms or words used in the specification and claims should not be construed as having a conventional or dictionary meaning, and the inventors should properly explain the concept of terms in order to best explain their own invention. Based on the principle that it can be defined, it should be interpreted as meaning and concept corresponding to the technical idea of the present invention. Therefore, the embodiments described in the specification and the drawings shown in the drawings are only the most preferred embodiment of the present invention and do not represent all of the technical idea of the present invention, various modifications that can be replaced at the time of the present application It should be understood that there may be equivalents and variations.

도 3은 본 발명의 바람직한 실시예에 따른 PTC 소자의 외관을 도시하는 사시도이다.3 is a perspective view showing the appearance of a PTC device according to a preferred embodiment of the present invention.

도 3을 참조하면, 본 발명의 바람직한 실시예에 따른 PTC 소자는 박막형태의 PTC 물질층(100)과, PTC 물질층(100)의 양면에 부착되는 한 쌍의 판형전극(101,102)과, 판형전극(101,102)의 외부면을 덮도록 부착되는 한 쌍의 금속탭(103,104)을 포함한다.Referring to FIG. 3, a PTC device according to a preferred embodiment of the present invention includes a thin film-like PTC material layer 100, a pair of plate-shaped electrodes 101 and 102 attached to both surfaces of the PTC material layer 100, and a plate shape. And a pair of metal tabs 103 and 104 attached to cover the outer surfaces of the electrodes 101 and 102.

PTC 물질층(100)은 결정성을 갖는 고분자 물질과 전도성 물질의 혼합물로 이루어지며, 온도상승시 결정 영역이 아모퍼스(Armophous) 상태가 되면서 부피팽창을 수반하여 전도성 입자간의 접촉을 분리시킴으로써 저항이 상승하는 PTC 특성을 제공한다. 이러한 PTC 물질층(100)으로는 가공성 등을 감안할 때 PTC 특성을 갖는 전도성 폴리머가 바람직하게 채용될 수 있다.The PTC material layer 100 is composed of a mixture of a crystalline polymer material and a conductive material. When the temperature rises, the crystal region becomes amorphous and the resistance is separated by separating the contact between the conductive particles with volume expansion. Provide rising PTC characteristics. As the PTC material layer 100, a conductive polymer having PTC characteristics may be preferably used in consideration of workability and the like.

판형전극(101,102)은 PTC 물질층(100)의 양면에 각각 부착된다. 도 4에 도시된 바와 같이, 판형전극(101,102)은 전해동박(1)의 일면에 니켈 도금층(2)을 형성하여 구비된다. 즉, 판형전극(101,102)의 몸체를 이루는 전해동박(1)의 양면 중 PTC 물질층(100)에 접촉되는 면에는 니켈 도금층(2)이 구비되고, 그 타면에는 별도 의 도금층이 구비되지 않는다.The plate electrodes 101 and 102 are attached to both surfaces of the PTC material layer 100, respectively. As shown in FIG. 4, the plate electrodes 101 and 102 are formed by forming a nickel plating layer 2 on one surface of the electrolytic copper foil 1. That is, the nickel plated layer 2 is provided on the surface of the electrolytic copper foil 1 forming the body of the plate electrodes 101 and 102 in contact with the PTC material layer 100, and the other surface is not provided with a separate plated layer.

통상적으로 전해동박(1)은 상대적으로 윤택이 없는 M면(Matt Surface)과, 상대적으로 윤택이 있는 S면(Shiny Surface)으로 구분 가능하도록 제작되며 M면이 PTC 물질층(100)과 접촉하는 것이 바람직하므로, 니켈 도금층(2)은 전해동박의 M면에 형성되는 것이 바람직하다.Typically, the electrolytic copper foil 1 is manufactured to be classified into a relatively matt M surface and a relatively shiny S surface, and the M surface is in contact with the PTC material layer 100. Since it is preferable, the nickel plating layer 2 is preferably formed in the M surface of an electrolytic copper foil.

금속탭(103,104)은 솔더링 등의 접합공정을 통해 판형전극(101,102)의 양면에 부착된다. 비록 도면에는 금속탭(103,104)이 판형전극(101,102)의 양면에서 상호 반대방향을 향하도록 엇갈리게 배치된 구조가 도시되어 있으나, 본 발명이 이러한 형태에 한정되지 않음은 물론이다.The metal tabs 103 and 104 are attached to both surfaces of the plate electrodes 101 and 102 through a bonding process such as soldering. Although the drawings show a structure in which the metal tabs 103 and 104 are staggered so as to face in opposite directions on both sides of the plate electrodes 101 and 102, the present invention is not limited thereto.

판형전극(101,102)을 이루는 전해동박(1)의 S면은 별도의 도금층 없이 외부에 그대로 노출되므로 부식 현상이 발생할 우려가 있다. 따라서, 금속탭(103,104)은 판형전극(101,102)의 외부 노출면을 덮도록 부착되며, 이를 위해 금속탭(103,104)의 폭은 상기 판형전극(101,102)의 폭과 일치하는 것이 바람직하다.Since the S surface of the electrolytic copper foil 1 constituting the plate electrodes 101 and 102 is exposed to the outside without a separate plating layer, corrosion may occur. Accordingly, the metal tabs 103 and 104 are attached to cover the external exposed surfaces of the plate electrodes 101 and 102, and for this purpose, the widths of the metal tabs 103 and 104 coincide with the widths of the plate electrodes 101 and 102.

상술한 바와 같은 구성을 가진 본 발명에 따르면 판형전극(101,102)의 일면에만 니켈이 도금되므로 PTC 소자의 동작특성이 향상되며, 판형전극(101,102)의 비도금면에 대한 부식 문제는 금속탭(103,104)의 구조적 개선을 통해 해결된다.According to the present invention having the above-described configuration, since only one surface of the plate electrodes 101 and 102 is plated with nickel, the operation characteristics of the PTC device are improved, and the corrosion problem of the non-plated surfaces of the plate electrodes 101 and 102 is caused by the metal tabs 103 and 104. Is solved through structural improvements.

즉, PTC 소자의 판형전극(101,102)은 그 전해동박(1)의 M면에만 니켈이 도금되고, 전해동박(1)의 S면은 직접적으로 금속탭(103,104)에 접촉하게 되므로 양면 도금시에 비해 상대적으로 열전도도나 전기전도도가 향상된다.In other words, the plate electrodes 101 and 102 of the PTC element are plated with nickel only on the M surface of the electrolytic copper foil 1, and the S surface of the electrolytic copper foil 1 is in direct contact with the metal tabs 103 and 104. This improves thermal conductivity and electrical conductivity.

또한, 금속탭(103,104)은 그 폭이 판형전극(101,102)의 폭과 일치하도록 형 성되어, 판형전극(101,102)에 대한 부착시 전해동박(1)의 S면을 덮음으로써 공기와의 접촉을 차단하므로 부식 작용이 억제된다.In addition, the metal tabs 103 and 104 are formed so that their widths match the widths of the plate electrodes 101 and 102, thereby covering the S surface of the electrolytic copper foil 1 when attaching the plate electrodes 101 and 102 to block contact with air. Therefore, the corrosive action is suppressed.

이상에서 본 발명은 비록 한정된 실시예와 도면에 의해 설명되었으나, 본 발명은 이것에 의해 한정되지 않으며 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자에 의해 본 발명의 기술사상과 아래에 기재될 특허청구범위의 균등범위 내에서 다양한 수정 및 변형이 가능함은 물론이다.Although the present invention has been described above by means of limited embodiments and drawings, the present invention is not limited thereto and will be described below by the person skilled in the art to which the present invention pertains. Of course, various modifications and variations are possible within the scope of the claims.

이상의 설명과 같이 본 발명에 따른 PTC 소자는 니켈이 일면 도금된 전해동박을 전극으로 사용하므로 전극 제조비용을 절감할 수 있으며, 양면 도금된 전해동박에 비해 열전도 효율이나 저저항 특성을 향상시킬 수 있다.As described above, since the PTC device according to the present invention uses an electrolytic copper foil plated with nickel as an electrode, the electrode manufacturing cost can be reduced, and thermal conductivity efficiency and low resistance characteristics can be improved as compared with the double-plated electrolytic copper foil.

또한, 전해동박의 표면이 외부에 노출되지 않도록 전극에 부착되는 금속탭 구조가 개시되므로 비도금된 S면에 대한 부식을 억제할 수 있다.In addition, since the metal tab structure attached to the electrode is disclosed so that the surface of the electrolytic copper foil is not exposed to the outside, corrosion to the unplated S surface can be suppressed.

Claims (3)

PTC 특성을 갖는 PTC 물질층;A PTC material layer having PTC properties; 상기 PTC 물질층의 양면에 부착되는, 상기 PTC 물질층과 접촉하는 면에는 도금제가 도금되어 있고 그 타면에는 도금제가 도금되어 있지 않은 한 쌍의 판형전극; 및A pair of plate-shaped electrodes which are attached to both surfaces of the PTC material layer and which have a plating agent plated on a surface thereof in contact with the PTC material layer, and whose plating agent is not plated on the other surface thereof; And 상기 판형전극의 외부면을 덮도록 부착되는 한 쌍의 금속탭;을 포함하는 PTC 소자.And a pair of metal tabs attached to cover the outer surface of the plate electrode. 제1항에 있어서,The method of claim 1, 상기 판형전극은 전해동박의 일면에 상기 도금제로서 니켈이 도금되어 형성된 것을 특징으로 하는 PTC 소자.The plate-shaped electrode is a PTC device, characterized in that formed on one surface of the electrolytic copper foil plated with nickel as the plating agent. 제1항 또는 제2항에 있어서,The method according to claim 1 or 2, 상기 금속탭의 폭이 상기 판형전극의 폭과 일치하는 것을 특징으로 하는 PTC 소자.And a width of the metal tab coincides with a width of the plate electrode.
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0284701A (en) * 1989-08-24 1990-03-26 Nippon Denso Co Ltd Formation of electrode of positive temperature coefficient porcelain semiconductor
JPH05258909A (en) * 1992-03-10 1993-10-08 Matsushita Electric Ind Co Ltd Glass-sealed thermistor
KR19980055326U (en) * 1996-12-30 1998-10-07 서두칠 Therching prevention structure of thermistor
KR20020081127A (en) * 2001-04-18 2002-10-26 티디케이가부시기가이샤 Polymer ptc element

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0284701A (en) * 1989-08-24 1990-03-26 Nippon Denso Co Ltd Formation of electrode of positive temperature coefficient porcelain semiconductor
JPH05258909A (en) * 1992-03-10 1993-10-08 Matsushita Electric Ind Co Ltd Glass-sealed thermistor
KR19980055326U (en) * 1996-12-30 1998-10-07 서두칠 Therching prevention structure of thermistor
KR20020081127A (en) * 2001-04-18 2002-10-26 티디케이가부시기가이샤 Polymer ptc element

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