JPH05258909A - Glass-sealed thermistor - Google Patents

Glass-sealed thermistor

Info

Publication number
JPH05258909A
JPH05258909A JP5112192A JP5112192A JPH05258909A JP H05258909 A JPH05258909 A JP H05258909A JP 5112192 A JP5112192 A JP 5112192A JP 5112192 A JP5112192 A JP 5112192A JP H05258909 A JPH05258909 A JP H05258909A
Authority
JP
Japan
Prior art keywords
glass
thermistor
lead wire
thermistor element
resisting property
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5112192A
Other languages
Japanese (ja)
Inventor
Masahiko Ajiyama
雅彦 味山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP5112192A priority Critical patent/JPH05258909A/en
Publication of JPH05258909A publication Critical patent/JPH05258909A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To obtain a glass-sealed thermistor, to be used for various electric apparatuses and motorcar apparatuses having heat-resisting property of 200 deg.C or higher and excellent acid-resisting property in which a lead wire can be connected to a thermistor element easily, and the removal of the oxide film on the surface of the lead wire is unnecessitated even after glass sealing operation is conducted. CONSTITUTION:The tips of lead wires 6a and 6b, consisting of an iron-nickel alloy on the surface of which platinum layers 5a and 5b are formed by plating or coating, are connected by parallel welding to the electrodes 2a and 2b of a thermistor element 1 on which electrodes 2a and 2b are formed on both opposing surfaces. By hermetically sealing the thermistor element 1 by heat-welding glass 4 to the thermistor element and the tips, including the welded part, of the lead wires 6a and 6b, a glass-sealed thermistor having excellent heat-resisting property, acid-resisting property and productivity can be obtained.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、家電機器、住設機器、
自動車機器等の温度センサとして用いられ、特に高耐熱
性、高信頼性が要求される分野に有用なガラス封入形サ
ーミスタに関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to home appliances, household appliances,
The present invention relates to a glass-encapsulated thermistor which is used as a temperature sensor in automobile equipment and is particularly useful in fields where high heat resistance and high reliability are required.

【0002】[0002]

【従来の技術】近年、家電機器、住設機器、自動車機器
等の業界よりサーミスタの高耐熱化、高精度化の要望が
大きくなってきている。
2. Description of the Related Art In recent years, demands for higher heat resistance and higher accuracy of thermistors have been increasing from the industries of home electric appliances, household appliances, automobile equipment and the like.

【0003】従来、この種のガラス封入形サーミスタ
は、図2の断面図に示すような構成であった。図2にお
いて、1は対向する両面に電極2a,2bを形成したサ
ーミスタ素体であり、その電極2a,2bにデュメット
リード線3a,3bを接続している。そして、サーミス
タ素体1およびデュメットリード線3a,3bの接続部
分を含む先端部にガラス4を溶着させてサーミスタ素体
1を気密封止している。
Conventionally, this type of glass-enclosed thermistor has a structure as shown in the sectional view of FIG. In FIG. 2, reference numeral 1 is a thermistor element body in which electrodes 2a and 2b are formed on opposite surfaces, and dumet lead wires 3a and 3b are connected to the electrodes 2a and 2b. Then, the thermistor element body 1 is hermetically sealed by welding glass 4 to the tip portion including the connecting portion of the thermistor element body 1 and the dumet lead wires 3a and 3b.

【0004】[0004]

【発明が解決しようとする課題】しかしながら上記のよ
うな従来の構成では、以下に示すような問題があった。
However, the conventional structure as described above has the following problems.

【0005】(1)リード線に銅の層を有するデュメッ
トリード線を用いているため、200℃を超える高温雰
囲気、酸化性の雰囲気、酸化性の液体中等に放置すれ
ば、デュメットリード線の銅の層の酸化がガラスに封止
されたデュメットリード線内部まで進行し、最終的には
ガラスのクラック発生やサーミスタ素体の劣化、破損に
つながる。
(1) Since the dumet lead wire having a copper layer is used as the lead wire, the dumet lead wire can be used if left in a high temperature atmosphere exceeding 200 ° C., an oxidizing atmosphere, an oxidizing liquid, or the like. The oxidation of the copper layer proceeds to the inside of the Dumet lead wire sealed in the glass, and eventually leads to the occurrence of cracks in the glass and deterioration and damage of the thermistor element body.

【0006】(2)デュメットリード線の表面には亜酸
化銅の絶縁層が存在するため、サーミスタ素体とデュメ
ットリード線を接続する方法として、デュメットリード
線の亜酸化銅の絶縁層を除去した後に溶接を行う方法、
または導電性塗料を用いる方法が行われているが、これ
らの方法では製造行程が繁雑であり、安価に製造するこ
とが不可能である。
(2) Since the insulating layer of cuprous oxide is present on the surface of the dumet lead wire, a method for connecting the thermistor element body and the dumet lead wire is to use the insulating layer of cuprous oxide of the dumet lead wire. How to perform welding after removing the
Alternatively, a method using a conductive paint has been carried out, but the manufacturing process is complicated by these methods, and it is impossible to manufacture at low cost.

【0007】(3)空気中、または酸素を含む雰囲気で
ガラス封止を行った場合、ガラス封止後ガラスから外に
引き出されているデュメットリード線の表面に酸化膜が
形成されており、実使用上においては、この酸化膜を除
去する必要がある。
(3) When the glass is sealed in air or in an atmosphere containing oxygen, an oxide film is formed on the surface of the Dumet lead wire that is drawn out from the glass after the glass is sealed. In actual use, it is necessary to remove this oxide film.

【0008】本発明はこのような問題点を解決するもの
で、200℃以上の耐熱性を有し、耐酸性に優れ、サー
ミスタ素体にリード線を容易に接続することが可能で、
かつガラス封止後もリード線表面の酸化膜除去の不要な
ガラス封入形サーミスタを提供することを目的とするも
のである。
The present invention solves the above problems and has a heat resistance of 200 ° C. or higher, an excellent acid resistance, and a lead wire can be easily connected to the thermistor body.
Moreover, it is an object of the present invention to provide a glass-enclosed thermistor which does not require removal of an oxide film on the surface of a lead wire even after glass sealing.

【0009】[0009]

【課題を解決するための手段】この目的を達成するため
に本発明のガラス封入形サーミスタは、メッキまたは被
覆により表面に貴金属層を設けた鉄ニッケル合金からな
るリード線を用いた構造とする。
To achieve this object, the glass-encapsulated thermistor of the present invention has a structure using a lead wire made of an iron-nickel alloy having a noble metal layer provided on the surface by plating or coating.

【0010】[0010]

【作用】この構成によれば、リード線に銅を含まない鉄
ニッケル合金を用いていることにより、200℃以上の
耐熱性および優れた耐酸性を得ることができ、さらにリ
ード線の表面に極めて酸化されにくい貴金属層を設けて
いることにより、サーミスタ素体に形成された電極とリ
ード線の接続方法として、容易かつ安定した溶接による
接続を得、ガラス封止後もリード線表面が酸化されるこ
とはない。
According to this structure, by using the iron-nickel alloy containing no copper for the lead wire, heat resistance of 200 ° C. or higher and excellent acid resistance can be obtained, and the surface of the lead wire can be extremely By providing a noble metal layer that is difficult to oxidize, the electrode formed on the thermistor body and the lead wire can be connected easily and stably by welding, and the lead wire surface is oxidized even after glass sealing. There is no such thing.

【0011】[0011]

【実施例】以下、本発明の一実施例について図面を用い
て説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

【0012】図1は本発明の一実施例によるガラス封入
形サーミスタの断面図である。ただし図2の従来例と同
一箇所には同一番号を付与している。図1において1
は、対向する両面に電極2a,2bを形成したサーミス
タ素体で、その電極2a,2bのそれぞれにメッキまた
は被覆により表面に白金層5a,5bを形成したニッケ
ル48〜52重量%を含有する鉄ニッケル合金からなる
リード線6a,6bの先端部がパラレル溶接により接続
されている。さらにサーミスタ素体1およびリード線6
a,6bの溶接部分を含む先端部にガラス4を加熱溶着
させることにより、サーミスタ素体1が気密封止されて
いる。
FIG. 1 is a sectional view of a glass-enclosed thermistor according to an embodiment of the present invention. However, the same parts as those in the conventional example of FIG. 1 in FIG.
Is a thermistor element body in which electrodes 2a and 2b are formed on opposite surfaces, and iron containing 48 to 52% by weight of nickel having platinum layers 5a and 5b formed on the surfaces of the electrodes 2a and 2b by plating or coating. The tips of the lead wires 6a and 6b made of nickel alloy are connected by parallel welding. Furthermore, the thermistor body 1 and the lead wire 6
The thermistor body 1 is hermetically sealed by heating and welding the glass 4 to the tip portion including the welded portions a and 6b.

【0013】この本実施例によるガラス封入形サーミス
タについて400℃の高温放置試験を行った結果、10
00時間保持においてもリード線6a,6bの劣化、ガ
ラス4のクラック発生および5%以上の抵抗値変化は観
察されなかった。さらに、パラレル溶接によるサーミス
タ素体1の抵抗値変化も5%以下であった。また、本実
施例ではリード線6a,6bの鉄ニッケル合金にニッケ
ル48〜52重量%の組成のものを用いたが、ニッケル
量が上記組成範囲よりもやや少ないかまたはやや多い鉄
ニッケル合金を用いた場合でも、リード線6a,6bの
劣化やガラス4のクラック発生は非常に少なかった。さ
らに、白金層5a,5bの代わりに金などの他の貴金属
層を形成した場合も上記劣化やクラック発生は少なかっ
た。
The glass-enclosed thermistor according to this embodiment was subjected to a high temperature storage test at 400 ° C., and as a result, 10
Even after being held for 00 hours, deterioration of the lead wires 6a and 6b, occurrence of cracks in the glass 4 and change in resistance value of 5% or more were not observed. Further, the change in resistance value of the thermistor element body 1 due to parallel welding was 5% or less. Further, in the present embodiment, the iron-nickel alloy of the lead wires 6a and 6b has a composition of 48 to 52% by weight of nickel. However, an iron-nickel alloy having a nickel amount slightly smaller or slightly larger than the above composition range is used. Even when it was present, the deterioration of the lead wires 6a and 6b and the occurrence of cracks in the glass 4 were very small. Further, even when other noble metal layers such as gold were formed instead of the platinum layers 5a and 5b, the above-mentioned deterioration and crack generation were small.

【0014】以上のように本実施例のガラス封入形サー
ミスタは、リード線6a,6bに銅を含まない鉄ニッケ
ル合金を用いているために200℃以上の耐熱性および
優れた耐酸性を有し、さらにリード線6a,6bの表面
に極めて酸化されにくい白金層5a,5bを設けている
ためにサーミスタ素体1に形成された電極2a,2bと
リード線6a,6bが溶接により容易かつ安定に接続で
きて安価になり、またガラス封止後のリード線6a,6
b表面の酸化膜除去も不必要である。
As described above, since the glass-enclosed thermistor of this embodiment uses the iron-nickel alloy containing no copper in the lead wires 6a and 6b, it has heat resistance of 200 ° C. or higher and excellent acid resistance. Further, since the platinum layers 5a and 5b, which are extremely hard to be oxidized, are provided on the surfaces of the lead wires 6a and 6b, the electrodes 2a and 2b formed on the thermistor body 1 and the lead wires 6a and 6b can be easily and stably welded. The connection is cheaper and the lead wires 6a and 6 are sealed with glass.
It is not necessary to remove the oxide film on the surface b.

【0015】[0015]

【発明の効果】以上のように本発明のガラス封入形サー
ミスタは、リード線に表面に白金層を形成した鉄ニッケ
ル合金を用いたことにより、下記のような効果が得ら
れ、その実用価値は大なるものである。
As described above, the glass-enclosed thermistor of the present invention has the following effects by using the iron-nickel alloy having the platinum layer formed on the surface of the lead wire, and its practical value is It is great.

【0016】(1)リード線に銅を含まない鉄ニッケル
合金を用いていることにより、200℃以上の耐熱性お
よび優れた耐酸性を得ることができる。
(1) By using an iron-nickel alloy containing no copper for the lead wire, heat resistance of 200 ° C. or higher and excellent acid resistance can be obtained.

【0017】(2)リード線の表面に極めて酸化されに
くい貴金属層を設けていることにより、サーミスタ素体
に形成された電極とリード線との容易かつ安定した溶接
による接続を得ることができる。さらに、ガラス封止後
もリード線表面の酸化膜除去は不必要である。
(2) By providing the surface of the lead wire with the noble metal layer which is extremely difficult to be oxidized, the electrode formed on the thermistor element and the lead wire can be easily and stably connected by welding. Further, it is unnecessary to remove the oxide film on the surface of the lead wire even after the glass sealing.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例によるガラス封入形サーミス
タの断面図
FIG. 1 is a sectional view of a glass-enclosed thermistor according to an embodiment of the present invention.

【図2】従来のガラス封入形サーミスタの断面図FIG. 2 is a sectional view of a conventional glass-enclosed thermistor.

【符号の説明】[Explanation of symbols]

1 サーミスタ素体 2a,2b 電極 4 ガラス 5a,5b 白金層 6a,6b リード線 1 Thermistor body 2a, 2b Electrode 4 Glass 5a, 5b Platinum layer 6a, 6b Lead wire

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】サーミスタ素体の対向する両面に形成した
電極のそれぞれにメッキまたは被覆により表面に貴金属
層を設けた鉄ニッケル合金からなるリード線の先端部が
接続され、前記サーミスタ素体および前記リード線の接
続部分を含む先端部にガラスを加熱溶着させて前記サー
ミスタ素体を気密封止したガラス封入形サーミスタ。
1. A tip of a lead wire made of an iron-nickel alloy having a noble metal layer on the surface thereof is connected to each of the electrodes formed on opposite sides of the thermistor body, and the thermistor body and the thermistor body are formed. A glass-encapsulated thermistor in which glass is heated and welded to a tip portion including a connecting portion of a lead wire to hermetically seal the thermistor body.
【請求項2】リード線に、白金層を設けた48〜52重
量%のニッケルを含有する鉄ニッケル合金を用いた請求
項1記載のガラス封入形サーミスタ。
2. The glass-encapsulated thermistor according to claim 1, wherein the lead wire is made of an iron-nickel alloy containing 48 to 52% by weight of nickel and provided with a platinum layer.
JP5112192A 1992-03-10 1992-03-10 Glass-sealed thermistor Pending JPH05258909A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5112192A JPH05258909A (en) 1992-03-10 1992-03-10 Glass-sealed thermistor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5112192A JPH05258909A (en) 1992-03-10 1992-03-10 Glass-sealed thermistor

Publications (1)

Publication Number Publication Date
JPH05258909A true JPH05258909A (en) 1993-10-08

Family

ID=12877976

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5112192A Pending JPH05258909A (en) 1992-03-10 1992-03-10 Glass-sealed thermistor

Country Status (1)

Country Link
JP (1) JPH05258909A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100673684B1 (en) * 2005-12-07 2007-01-24 엘에스전선 주식회사 Ptc-device improved in electrode structure
CN104156102A (en) * 2013-05-13 2014-11-19 奇景光电股份有限公司 Pixel matrix, touch display device and drving method thereof
CN104535215A (en) * 2014-12-02 2015-04-22 苏州长风航空电子有限公司 Method for manufacturing platinum resistor thermo-sensitive element

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03136203A (en) * 1989-10-20 1991-06-11 Matsushita Electric Ind Co Ltd Glass sealed type thermistor

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03136203A (en) * 1989-10-20 1991-06-11 Matsushita Electric Ind Co Ltd Glass sealed type thermistor

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100673684B1 (en) * 2005-12-07 2007-01-24 엘에스전선 주식회사 Ptc-device improved in electrode structure
CN104156102A (en) * 2013-05-13 2014-11-19 奇景光电股份有限公司 Pixel matrix, touch display device and drving method thereof
CN104156102B (en) * 2013-05-13 2017-04-12 奇景光电股份有限公司 Pixel matrix, touch display device and drving method thereof
CN104535215A (en) * 2014-12-02 2015-04-22 苏州长风航空电子有限公司 Method for manufacturing platinum resistor thermo-sensitive element

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