KR100671952B1 - A chip inductor using amorphous powder and manufacturing method thereof - Google Patents

Abstract

A chip inductor using amorphous powder and a fabrication method thereof are provided to perform a stable operation under various environmental conditions, by performing a coating process to improve hardness and endurance on a surface of a magnet and a terminal. A magnetic core(10) has a rectangular chip shape and is made of amorphous powder. An electric wire(50) wound around the magnetic core applies a current. The magnetic core has a resin coating film coated with an epoxy resin on the surface, and has a terminal(15) composed of a silver metal layer on both ends.

Description

A chip inductor using amorphous powder and manufacturing method

1 is a B-H diagram showing the magnetic flux density characteristics for each material of the magnetic core.

2 is a front view of a chip inductor using amorphous powder according to an embodiment of the present invention.

3 is a cross-sectional view taken along the line III-III of FIG.

Figure 4 is a flow chart showing a method of manufacturing a chip inductor using amorphous powder in accordance with an embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

10: magnetic core 15: terminal

20: resin coating film 31: silver metal layer

32: nickel plating layer 33: gold plating layer

40: UV coating film 50: electric wire

The present invention relates to a chip inductor using amorphous powder, and a method of manufacturing the same. More particularly, the magnetic core is composed of amorphous powder having a higher saturation magnetic flux density and less heat generation and permeability change than ferrite and sand dust metal powder, and the surface of magnetic core. And a chip inductor suitable for miniaturization and stable operation by coating the terminal to improve hardness and corrosion resistance.

In general, an inductor is a component using an electromagnetic action generated by flowing a current through a core wound around a core, and an inductance value increases as the number of turns increases.

In recent years, various electric, electronic and information communication devices have been miniaturized, light weighted, and thinned. Accordingly, inductors have been rapidly converted into chip inductors, which are manufactured in the form of chips, and which can be compact and have high-density surface-mounted automation.

Conventional chip inductors are mainly composed of permeable ferrite or senddust as magnetic core material, and are composed of a resonant circuit or a filter circuit for amplifying or blocking a signal of a specific frequency band. It is used as an EMI countermeasure element such as noise cancellation using the property of increasing impedance in a specific frequency band.

However, such a conventional chip inductor may cause damage to the product due to heat generation due to increasing iron loss in the high frequency region, and there is a limit to increase the design magnetic flux density due to the saturation magnetic flux density, which limits the miniaturization of the product. The problem is that the permeability varies depending on the frequency range and temperature, which limits the applicable field.

The present invention is to solve the problem of the chip inductor according to the prior art described above. That is, the object of the present invention is that the magnetic core is composed of amorphous powder having a high saturation magnetic flux density and low heat generation and permeability change, and is suitable for miniaturization by applying a coating treatment to improve hardness and corrosion resistance on the surface and the terminal portion of the magnetic core. The present invention provides a chip inductor that operates stably under various environments and a method of manufacturing the same.

Chip inductor using the amorphous powder according to the present invention to achieve the above object, the magnetic core of the square chip form made of amorphous powder; It is configured to include; including a wire wound around the magnetic core to apply a current

The magnetic core is characterized in that a resin coating film coated with an epoxy resin is formed on a surface thereof, and a terminal made of a silver (Ag) metal layer is formed at each end.

In addition, the method of manufacturing a chip inductor using amorphous powder according to the present invention, by mixing the amorphous powder with a glass melt or an organic insulating material of a temperature of 530 ℃ or less to coat each particle of the amorphous powder with a glass or organic insulating material Steps; A blending step of adding a binder to the coated powder particles and then mixing the coated powder particles; Forming a magnetic core by loading the molded amorphous powder into a mold and pressing the molded powder, and curing the same by a firing process at a temperature of 530 ° C. or lower; Forming a resin coating film by applying an epoxy resin to a surface of the amorphous magnetic core in which the molding is completed; A terminal forming step of forming terminals at both ends of the amorphous magnetic core respectively; Winding an electric wire in a central portion of an amorphous magnetic core in which the terminal forming step is completed, and bonding both ends of the electric wire to each terminal; And UV coating such that a UV coating film is formed on one surface of the amorphous magnetic core to which the wire is wound.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a B-H diagram showing magnetic flux density characteristics for each material of a magnetic core.

Chip inductor using amorphous powder according to the present invention uses an amorphous (amorhpous) as a magnetic material constituting a magnetic core, as shown in Figure 1, amorphous is a higher than the conventional magnetic materials used in ferrite and sender It has a saturation magnetic flux density, which makes it possible to increase the design magnetic flux density for the same size, which is more advantageous for miniaturization. In addition, iron loss is less than that of conventional ferrites and senders, so there is little possibility of damage to the product due to heat generation, and the permeability is almost unaffected by the frequency range and temperature, and thus it is applicable to various fields.

FIG. 2 is a front view of a chip inductor using amorphous powder according to an embodiment of the present invention, and FIG. 3 is a cross-sectional view taken along line III-III of FIG. 2.

As shown in Figure 2 and 3, the chip inductor using the amorphous powder according to an embodiment of the present invention is wound around the magnetic core 10 and magnetic core 10 of the rectangular chip form made of amorphous powder is applied to the current It consists of an electric wire 50 to make.

The amorphous powder constituting the magnetic core 10 includes 73 to 90% by weight of iron (Fe), 5 to 15% by weight of silicon (Si), 1 to 10% by weight of boron (B) and other trace elements. It is composed. Here, cobalt (Co) or nickel (Ni) may be used in the same weight ratio instead of iron. Other trace elements include Al ₂ O ₃ , Na ₂ O, Li ₂ O, ZnO, P ₂ O ₅ , Cr, C, etc. which are commonly used by those skilled in the art to maintain the ease of molding and the strength of the molded product. Can be.

Epoxy resin 20 is coated on the entire surface of the magnetic core 10 to firmly fix the external shape of the magnetic core 10 made of amorphous powder with weak cohesive force, and each of both ends of the magnetic core 10 is silver (Ag) metal. The layer 31, the nickel (Ni) plating layer 32, and the gold (Au) plating layer 33 are sequentially formed to form a terminal 15.

Here, the nickel plating layer 32 is to improve the corrosion resistance and hardness of the terminal 15, and preferably formed to a thickness of about 5 to 30 mm. In addition, the gold plating layer 33 forming the outermost portion of the terminal 15 is soldered between the terminal 15 and the land of the printed circuit board in the process of mounting the chip inductor on the printed circuit board (PCB). ) Is easily made, preferably formed to a thickness of 2 μm or less, and in addition to gold, tin (Sn) or tin (Sn) -copper (Cu) having good affinity with lead may be used.

Both ends of the wire 50 wound around the magnetic core 10 are connected to both terminals 15 of the magnetic core 10, and preferably, enameled copper wire having a diameter of 0.1 to 0.14 mm is used.

On the other hand, one surface of the chip inductor using amorphous powder according to the present embodiment is formed by forming a UV coating film (UltraViolet coating film; 40) flat, so as to print the inductance value, etc. on the body of the chip inductor, the pressing force applied from the outside It also protects against adverse conditions such as humidity and temperature, while making it easy to grasp the vacuum tongs when transporting with an automatic transfer device.

Hereinafter, a method of manufacturing a chip inductor using amorphous powder according to an embodiment of the present invention will be described in detail.

4 is a flowchart illustrating a method of manufacturing a chip inductor using amorphous powder according to an embodiment of the present invention.

First, the amorphous powder is mixed with a low-temperature glass melt or an organic insulating material to coat each particle of the amorphous powder with a glass or an organic insulating material (S10). The temperature of the glass melt or the organic insulating material is preferably kept below 530 ° C.

Thereafter, the powder particles having a size in the range of 10 to 200 μm are selected, and a blending process is performed in which a binder is added to the selected powder particles and then mixed (S20).

When the branding step (S20) is completed, the powder is loaded in the mold and press-molded to make the magnetic core 10 (S30), preferably after press-molding for about 60 minutes to cure through a firing process (燒成, firing) It is preferable to maintain the firing temperature at 530 ° C. or lower so that the intrinsic properties of the amorphous powder do not disappear.

Thereafter, an epoxy resin is applied to the surface of the amorphous magnetic core 10 in which the molding is completed to form a resin coating film 20, thereby firmly fixing the external shape of the magnetic core 10 made of amorphous powder having low cohesive force (S40).

Thereafter, a terminal forming step S50 of forming terminals 15 at both ends of the amorphous magnetic core 10 is performed, and the terminal forming step S50 is performed by a silver dipping process S51, a nickel plating process S52, and a gold. The plating process (S53) is configured in this order.

The silver dipping process (S51) is a process for metallizing both ends of the amorphous magnetic core 10, and dipping both ends of the amorphous magnetic core 10 in silver paste, respectively, and having a temperature of 150 to 200 ° C. After drying in, to form a silver metal layer 31 by performing low-temperature baking at a temperature of 150 ~ 530 ℃, the process of dipping and drying both ends respectively as follows.

After loading the plurality of amorphous magnetic cores 10 of the resin coating step (S40) is completed to the component aligner operating in a vibrating manner, inserting a predetermined number of amorphous magnetic cores 10 aligned in position by the component aligner in the holder The holders in which the magnetic cores 10 are inserted are lowered by the transfer device so that one end of each amorphous magnetic core 10 inserted in the holder is dipped so as to be immersed in the silver liquid by a predetermined depth and taken out after a predetermined time. Thereafter, the silver liquid surrounding one end is dried, and the same process is performed on the other end after inserting the amorphous magnetic cores 10 which have been completed for dipping and drying at one end in the opposite direction to the holder. Here, when dipping, only the portion of the terminals 15 formed at the end of the amorphous magnetic core 10 should be accurately immersed in the silver liquid, and the silver liquid flows downward in the downward direction by gravity, resulting in bulge or burr. It is preferable to adjust the physical properties of the silver solution so that the solid content is 77 ~ 76 wt%, the viscosity is 37 ~ 50 Pa.s so as not to occur.

When the silver dipping process (S51) is completed as described above, nickel plating is performed on the silver metal layer 31 with a thickness of 5 to 30 μm to form the nickel plating layer 32 (S52), and again on the nickel plating layer 32. The terminal forming step S50 is completed by forming the gold plating layer 33 to a thickness of μm or less (S53). Here, tin or tin-copper plating layer may be formed instead of the gold plating layer as described above.

Thereafter, the electric wire 50 is wound around the center portion of the amorphous magnetic core 10 (S60), and both ends of the electric wire 50 are connected to each terminal 15 of the amorphous magnetic core 10 so as to be electrically conductive (S70). . Here, in the case of using thermocompression welding, which is commonly used to weld the wire 50, damage may occur on the surface of the amorphous magnetic core 10 having a relatively low hardness, so that the minimum force is applied to the body. The work must be performed by adjusting the force and heat, and it is preferable to use a spot welding method of welding by a high current without applying a physical force.

Finally, performing a UV coating step (S80) of one surface of the amorphous magnetic core 10 to complete the chip inductor using the amorphous powder according to this embodiment, the UV coating process will be described in detail as follows.

In order to contain the UV coating solution, a tray in which a coating liquid container consisting of components that do not react with the UV coating liquid is continuously prepared, and after containing the UV coating liquid in each coating liquid container of the tray, a plurality of amorphous magnetic cores 10 are coated in the coating liquid container of the tray. The inner surface of each magnetic core 10 is immersed in a predetermined depth in the UV coating liquid of each coating liquid container by being seated therein. The tray is then passed through an infrared dryer that generates infrared light to cure the UV coating solution and to separate the amorphous magnetic core 10 from the tray.

As such, various markings may be performed on one surface of the chip inductor on which the UV coating layer 40 is formed through silk screen printing or laser printing.

On the other hand, instead of the above-described silver dipping process (S51), the silver metal layer 31 may be formed on both ends of the amorphous magnetic core 10 by printing a silver solution on both ends of the amorphous magnetic core 10. .

The present invention described above is not limited to the above-described embodiments and the accompanying drawings, and various substitutions, modifications, and changes are possible in the art without departing from the technical spirit of the present invention. It will be clear to those of ordinary knowledge.

As described above, the chip inductor using the amorphous powder according to the present invention and a method for manufacturing the same are more advantageous for miniaturization by increasing the saturation magnetic flux density of the magnetic core and reducing the heat generation and permeability change, and are operated in the high frequency region or operated at high temperature. It is effective to provide a chip inductor that can operate relatively stably even in an environment exposed to the environment.

Claims (5)

Magnetic core of the square chip form made of amorphous powder; An electric wire wound around the magnetic core to apply an electric current; Consists of including The magnetic core is, A resin inductor coated with an epoxy resin is formed on a surface thereof, and a terminal made of a silver (Ag) metal layer is formed on each of both ends thereof. The method of claim 1, The terminal of the magnetic core, Chip inductor using amorphous powder, characterized in that the nickel (Ni) plating layer is further formed on the silver metal layer to improve the corrosion resistance. The method of claim 2, The terminal of the magnetic core, A chip inductor using amorphous powder, characterized in that the plating layer of any one selected from gold (Au), tin (Sn) or tin (Sn) -copper (Cu) is further formed on the nickel plating layer. Mixing the amorphous powder with a glass melt or organic insulating material having a temperature of 530 ° C. or lower to coat each particle of the amorphous powder with a glass or organic insulating material; A blending step of adding and adding a binder to the glass coated powder particles; Molding the magnetic core by loading the molded amorphous powder into a mold and pressing the molded powder, and curing the same by a firing process at a temperature of 530 ° C. or lower; Forming a resin coating film by applying an epoxy resin to a surface of the amorphous magnetic core in which the molding is completed; A terminal forming step of forming terminals at both ends of the amorphous magnetic core respectively; Winding an electric wire in a central portion of an amorphous magnetic core in which the terminal forming step is completed, and bonding both ends of the electric wire to each terminal; And UV coating to form a UV coating film on one surface of the amorphous magnetic core wound the wire; Chip inductor manufacturing method using amorphous powder, characterized in that comprises a. The method of claim 4, wherein The terminal forming step, Forming a silver metal layer by dipping both ends of the amorphous magnetic core in a silver paste and drying, and then performing low-temperature baking at a temperature of 150 to 530 ° C .; Forming a nickel plating layer by performing nickel plating on the silver metal layer with a thickness of 5 to 30 μm; Forming a plating layer of any one selected from gold, tin, and tin-copper on the nickel plating layer again to a thickness of 2 μm or less; Chip inductor manufacturing method using amorphous powder, characterized in that consisting of.

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