KR100669376B1 - Plasma display device - Google Patents

Abstract

The present invention relates to a plasma display device for improving the switching speed of a driver IC by lowering the inductance formed between the ground terminal and the pattern and the chassis base of the driver IC.

Plasma display device according to the invention, the plasma display panel; A chassis base to which the plasma display panel is attached at one side thereof and drive circuit parts are mounted at the other side thereof; A flexible printed circuit (FPC) electrically connecting the electrodes of the plasma display panel to the driving circuit unit; And a driver IC mounted on a tape carrier package (TCP) connected to the FPC to apply a switching voltage to an electrode of a plasma display panel according to a control signal of the driving circuit unit, wherein the ground terminal of the driver IC is formed of a pattern. The pattern is connected to the ground line, and the pattern is grounded to the chassis base by a conductive member passing through the pattern protection layer formed at one side thereof.

Driver IC, TCP, Conductive Member, Bump, Pattern, Solder Resist

Description

Plasma Display Device {PLASMA DISPLAY DEVICE}

1 is a perspective view of a plasma display device according to the present invention.

2 is a cross-sectional view taken along the line A-A of FIG.

3 is a perspective view of TCP in the plasma display device according to the present invention.

4 is a cross-sectional view of the first embodiment taken along the line B-B in FIG.

5 is a sectional view of a second embodiment along the line B-B in FIG.

6 is a cross-sectional view of the third embodiment taken along the line B-B in FIG.

7 is a cross-sectional view of the fourth embodiment taken along the line B-B in FIG.

The present invention relates to a plasma display apparatus, and more particularly, to a plasma display apparatus capable of increasing the switching speed of a driver IC provided between a driving circuit unit and a panel electrode.

As is known, a plasma display apparatus is an apparatus for displaying an image on a plasma display panel using a plasma generated by gas discharge. In such a plasma display device, an electrode printed on a plasma display panel is generally electrically connected to a driving circuit through a flexible printed circuit (FPC), and the driving circuit is configured to selectively form a wall voltage on a pixel of the plasma display panel. A driver IC is provided for applying an address voltage in accordance with a control signal to a furnace.

As widely used as a voltage application structure using an FPC and a driver IC, a chip on board (COB) in which a driver IC is mounted on a printed circuit board (PCB) and a driver IC is directly mounted on a film constituting the FPC Chip on film (COF) and the like, and small and inexpensive Tape Carrier Package (TCP) has recently been used.

This TCP bonds a bump (Au material) of a driver IC to a pattern made of copper (Cu) on an insulating film (usually a polymide material) and bonds it with a resin to apply a resin to protect the bump and the pattern bonding state. It is coming true. In addition, a pattern protective layer (solder resist) is used to insulate this pattern. This pattern has power and signal input wiring and ground wiring.

On the other hand, in order to express more than 256 gradations in the PDP, at least 8 address discharges must be generated for 1/60 second corresponding to 1TV field.For this purpose, the driver IC receives an input signal from the driving circuit and the address provided in the PDP through the FPC. To control the electrodes.

The wirings connecting the driver IC and external circuits, that is, the circuits formed in TCP, have a geometric length, and these wirings act as inductance during the high frequency switching action of the driver IC. This TCP pattern has a high inductance, or line resistance, that cannot be ignored when the driver IC switches at high frequencies. Therefore, when the driver IC switches at a high frequency, a high inductance due to the resistance (R) length of the wirings forming the pattern causes the ground voltage to be induced to the ground terminal of the driver IC to raise the ground voltage level. If the ground voltage level at this ground terminal continues to increase and the ground voltage level is out of the switching threshold voltage range, the driver IC's signal acts as a high level despite the low level. It makes the normal switching action difficult. In this way, it is difficult to improve the switching speed of the driver IC unless the inductance formed between the ground terminal of the driver IC, the ground wiring of the pattern, and the chassis base is lowered. The inability to increase this switching speed causes problems in that PDP gray scale expression and luminance cannot be increased. The faster the switching speed, the faster the addressing, so the subfields can be extended to enable finer gradation representation, and the retention period can be increased, resulting in increased luminance.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object thereof is to provide a plasma display device which improves the switching speed of a driver IC by lowering the inductance formed between the ground terminal and pattern of the driver IC and the chassis base. There is.

In order to achieve the above object, the plasma display device according to the present invention,

A plasma display panel;

A chassis base to which the plasma display panel is attached at one side thereof and drive circuit parts are mounted at the other side thereof;

A flexible printed circuit (FPC) electrically connecting the electrodes of the plasma display panel to the driving circuit unit; And

A driver IC mounted in a tape carrier package (TCP) connected to the FPC to apply a switching voltage to an electrode of a plasma display panel according to a control signal of the driving circuit unit.

Including;

The ground terminal of the driver IC is connected to the pattern,

The pattern is grounded to the chassis base by a conductive member penetrating the pattern protection layer formed at one side thereof.

The pattern is provided in the TCP.

The pattern protection layer is formed of a solder resist layer.

The pattern protection layer has a through hole having a straight cross section in its thickness direction.

The upper conductive member is formed of a conductive tape, and may be formed of aluminum (Al) tape.

The conductive member is formed to include a protrusion adhered to the pattern through a through hole formed in the pattern protection layer, a plate portion attached to the chassis base, and an inclined portion inclinedly connecting the plate portion and the protrusion.

The plate part is interposed between one side of the pattern and the chassis base opposite to the driver IC based on the driver IC.

In addition, the plate portion is formed on both sides of the pattern on the basis of the driver IC, interposed between both sides of the pattern and the chassis base opposite to each other, or integrally formed on both sides of the pattern on the basis of the driver IC, It is interposed between this pattern and the chassis base opposite them. In this case, the protrusion and the inclined portion are formed between one side of the pattern and the chassis base opposite thereto based on the driver IC.

The conductive member may include a protrusion attached to the pattern through a through hole formed in the pattern protection layer, and a plate portion formed in a plate shape on the protrusion and attached to the chassis base.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view of a plasma display device according to the present invention.

Referring to the plasma display device with reference to the drawings, the device basically includes a plasma display panel (hereinafter referred to as a 'PDP') 12 and a chassis base 14.

The PDP 12 is configured to display an image using gas discharge, and the present invention relates to the transmission of a signal between the PDP 12 and the chassis base 14 supporting the PDP 12. A detailed description of the description will be omitted.

The chassis base 14 is formed of an aluminum material having excellent thermal conductivity and light weight, and mounts and supports the PDP 12 on one side thereof, and drives the circuit portions 16 for driving the PDP 12 on the other side thereof. Mount it.

The front cover (not shown) is located outside the PDP 12 as described above, and the rear cover (not shown) is located outside the chassis base 14 so that the covers are combined to complete the plasma display device set. do.

2 is a cross-sectional view taken along the line A-A of FIG.

Referring to this figure, the electrodes 18 whose leading ends are drawn out at the edges of the PDP 12 are electrically connected to the driving circuit unit 16 through the FPC (Flexible Printed Circuit) 20 and the PDP from the driving circuit unit 16. Receives an input signal required for driving (12).

To this end, a plurality of driver ICs (Integrated Circuits) for selectively applying a switching voltage to the electrodes 18 of the PDP 12 according to the control signal of the driving circuit unit 16 between the PDP 12 and the driving circuit unit 16; 22).

The driver IC 22 is mounted on a TCP 24 and packaged, and a TCP (Tape Carrier Package) 24 is connected to the driving circuit unit 16 as its input terminal and the electrode 18 via the FPC 20 as its output terminal. Connected to the field. At this time, the driver IC 22 is disposed to face the chassis base 16.

That is, the TCP 24 is formed by bonding a pattern 36 (refer to FIG. 4) by bonding a bump (Au material) of the driver IC 22 and copper (Cu) formed on an insulating film (usually a polymide material). The bonding state is protected by the resin (corresponding to the second heat transfer member 32) to be applied. The pattern is also covered with a pattern protective layer 38 (see FIG. 4) for insulation. A detailed description of this configuration will be described later.

Before explaining this driver IC 22, the heat dissipation structure of the driver IC 22 is demonstrated. On the outer side of the driver IC 22, that is, on the outer side of the TCP 24, a crimping plate 26 for supporting the TCP 24 and pressing the driver IC 22 to the chassis base 14 side is provided.

The press plates 26 are arranged side by side along the lower edge portion of the chassis base 14. In this case, the crimping plate 26 may be disposed as an integral plate along the edge of the chassis base 14, but as shown in FIG. 1, the crimping plate 26 may include a plurality of plates corresponding to the respective driver ICs 22. It may be arranged at the edge of the base 16.

The pressing plate 26 extends from the outer edge of the first face 26a to the outer edge of the PDP 12 to face the driver IC 22 and extends from the outer edge of the PDP 12 to the FPC 20. It is formed with a second surface (26b) for supporting the. These first and second surfaces 26a and 26b are integrally formed. The pressing plate 26 may be formed by extruding or pressing aluminum having excellent thermal conductivity and light weight. In addition, the pressing plate 26 may be fixed to the chassis base 14 by a separate fastening member (not shown), for example, a screw, or may be fixed to the reinforcing member 28.

First and second heat transfer members 30 and 32 for dissipating the driver IC 22 between the crimp plate 26 and the driver IC 22 and between the reinforcement member 28 and the driver IC 22. Is interposed. The first heat transfer member 30 uses a soft heat conductive sheet to prevent cracking of the driver IC 22, and the second heat transfer member 32 includes a lower portion of the driver IC 22 and a chassis base ( 14) Use silicone oil or thermal grease that can maintain liquid or gel type to reduce thermal resistance. The first and second heat transfer members 30 and 32 improve adhesion to the pressing plate 26, the driver IC 22, and the reinforcing member 28. That is, no air layer is formed at the interface between the first and second heat transfer members 30 and 32 and the driver IC 22. Therefore, the heat dissipation of the driver IC 22 through the compression plate 26 is in close contact with the pressing plate 26 and the first and second heat transfer members 30 and 32 with respect to the driver IC 22 and the reinforcing member 28. The efficiency is further improved.

3 is a perspective view of TCP in the plasma display device according to the present invention.

Referring to this figure, the driver IC 22 embedded in the heat dissipation structure as described above receives the control signal of the driving circuit unit 16 from the input terminal 24a of the TCP 24 and receives the output terminal 24b of the TCP 24. The control signal is output to the FPC 20 connected thereto and the electrodes 18 connected thereto.

The driver IC 22 may be provided in various forms between the electrodes 18 and the driving circuit unit 16 so as to operate as described above. In this embodiment, the driver IC 22 mounted on the TCP 24 is provided. Illustrates the structure of. As the driver IC 22 is mounted on the TCP 24 in this manner, the ground terminal of the driver IC 22 is preferably connected to the ground wiring of the pattern 36 formed on the TCP 24.

4 is a cross-sectional view of the first embodiment taken along the line B-B in FIG.

Referring to the driver IC 22 with reference to this figure, each terminal of the driver IC 22 is connected to respective wires of the pattern 36 formed in the TCP 24 through bumps 34, The ground terminal of the driver IC 22 is also connected to the ground wiring of the pattern 36 via the bump 34. Of course, the ground terminal does not necessarily need to be connected to the pattern via the bump 34, and may be interposed through the bump 34 or another one as necessary. The interconnected bumps 34 and pattern 36 are molded with a second heat transfer member 32 and disposed between the TCP 24 and the chassis base 14. The TCP 24 is tightly supported by the chassis base 14 by the second heat transfer member 32.

The pattern protective layer 38 is provided on one side of the pattern 36. This pattern protective layer 38 is preferably provided with a solder resist layer (hereinafter referred to as a solder resist layer). The solder resist layer 38 electrically insulates the circuit patterns 36 formed on the TCP 24 from the chassis base 14 to prevent the wirings formed on the circuit patterns 36 of the TCP 24 from being shorted. Interposed between the 24 and the chassis base 14, both are attached. Therefore, the solder resist layer 38 is formed of a non-conductive material, and the ground wiring and the chassis base of the pattern 36 are grounded to ground the ground wiring formed on the pattern 36 of the TCP 24 to the chassis base 14. The conductive member 40 is interposed between the layers 14).

One side of the conductive member 40 penetrates through the solder resist layer 38 formed on one side of the pattern 36 to contact the ground wiring of the pattern 36, and the other side contacts the chassis base 14. The ground wiring of the pattern 36 and the chassis base 14 are electrically connected to each other. With this connection structure, the ground terminal of the driver IC 22 is grounded to the chassis base 14 through the ground wiring of the pattern 36.

In this way, the bump 34 connected to the ground terminal of the driver IC 22, the ground wiring of the pattern 36 connected to the bump 34, and the ground wiring of the pattern 36 and the chassis base 14 are provided. The conductive member 40 connected forms the shortest distance geometrically in grounding the ground terminal of the driver IC 22.

 As such, the conductive member 40 connecting the ground wiring of the pattern 36 to the chassis base 14 and the solder resist layer 38 through which the conductive member 40 penetrates may be formed in various structures.

First, the solder resist layer 38 has a predetermined thickness on one side of the pattern 36 of the TCP 24, and has a through hole 38a for penetrating and attaching the conductive member 40. The through hole 38a may have a shape corresponding to that of the conductive member 40 inserted therein, and FIG. 4 illustrates a straight cross section in the thickness direction of the solder resist layer 38 to facilitate the process of forming the hole 38a. The structure to form is illustrated.

The conductive member 40 may be formed in various structures so as to ground the pattern 36 to the chassis base 14 while interposed between the non-conductive solder resist layer 38 and the chassis base 14. It is preferable to have adhesiveness.

In terms of material, the conductive member 40 may be formed of a conductive tape that is easy to use. The conductive tape is preferably formed of a metal material having excellent electrical conductivity, and may be an example of an aluminum (Al) tape formed of an aluminum (Al) material.

In addition, in terms of structural aspects, the conductive member 40 includes a protrusion 40a, a plate portion 40b, and an inclined portion 40c. The protrusion 40a is attached to the side opposite to the chassis base 14 of the pattern 36 through the through holes 38a formed in the solder resist layer 38. The plate portion 40b is bonded to the TCP 24 opposite side of the chassis base 14. The protrusions 40a and the plate portions 40b are formed with substantial areas and are in surface contact with the pattern 36 and the chassis base 14, respectively, to minimize the respective contact resistances. The inclined portion 40c is formed on the inclined ground between the protrusion 40a and the plate portion 40b so as to connect both to the inclined ground and positioned in the through hole 38a. The inclined portion 40c makes it possible to simply form the conductive member 40 in a pressurized manner in the electrical connection between the pattern 36 and the chassis base 14.

In this way, the conductive member 40 penetrating the ground wiring of the pattern 36 to which the bumps 34 of the driver IC 22 are connected and the chassis base 14 opposite thereto are interposed therebetween. By directly grounding the ground wiring of the pattern 36 and the chassis base 14 to the shortest distance, the inductance formed therebetween is minimized.

By such a ground structure, a low inductance is formed at the ground terminal of the driver IC 22, and this inductance keeps the ground voltage level within the switching threshold voltage range. Therefore, the switching effect by the high frequency of the driver IC 22 is enabled.

Hereinafter, other embodiments of the conductive member 40 are illustrated, and the apparatuses of the present invention including the conductive members 40 operate in the same manner as the above-described embodiment, so a detailed description thereof is omitted and distinguished from the above embodiment. More various embodiments will be described based on the configurations.

The plate portion 40b is a portion interposed between the TCP 24 and the chassis base 14, and more specifically, between the solder resist 36 and the chassis base 14. The plate portion 40b may be formed in an appropriate number at a suitable position in the space between the above.

FIG. 4 illustrates that the plate portion 40b is interposed between one side of the pattern 36 and the chassis base 14 opposite to the driver IC 22. That is, the plate portion 40b is provided only on one side between the pattern 36 and the chassis base 14.

5 is a sectional view of a second embodiment along the line B-B in FIG.

Referring to the drawing, the plate portion 40b will be described. The plate portion 40b is formed on both sides of the pattern 36 on the basis of the driver IC 22, so as to oppose both sides of the pattern 36 and these, respectively. It is interposed between the chassis bases 14 to be described. In other words, the plate portion 40b is provided on both sides between the pattern 36 and the chassis base 14.

6 is a cross-sectional view of the third embodiment taken along the line B-B in FIG.

Referring to the drawing, the plate portion 40b will be described. The plate portion 40b is integrally formed on both sides of the pattern 36 on the basis of the driver IC 22, and the pattern 36 and the chassis facing them are It is interposed between the bases 14. In other words, the plate portion 40b is integrally provided at both sides between the pattern 36 and the chassis base 14. In this case, the second heat transfer member 32 is preferably attached to the plate portion 40b.

In addition, as shown in the first, second, and third embodiments, the protrusions 40a and the inclined portions 40c may have one side of the pattern 36 and a chassis facing the one side of the pattern 36 based on the driver IC 22. It is formed only between the bases 14, and not necessarily provided only on one side therebetween, but may be provided on both sides (not shown) between them based on the driver IC 22 in the same structure.

7 is a cross-sectional view of the fourth embodiment taken along the line B-B in FIG.

Referring to this figure, referring to the conductive member 40, the conductive member 40 is a projection 40a adhered to the pattern 36 through a through hole 38a formed in the solder resist layer 38, and It is formed by the plate part 40b which is formed in plate shape in this protrusion part 40a, and is attached to the chassis base 14. As shown in FIG. In other words, the protrusion 40a and the through hole 38a of the conductive member 40 are formed to correspond to each other. This fourth embodiment forms the attachment structure of the pattern 36 and the chassis base 14 in a more stable structure compared with the first, second, and third embodiments.

In addition, the plate portion 40b of the fourth embodiment may be provided at various positions between the pattern 36 and the chassis base 14 like the plate portions 40b of the first, second, and third embodiments. In addition, the protrusions 40a of the fourth embodiment may be provided at various positions, such as the protrusions 40a and the inclined portions 40c of the first, second, and third embodiments.

Although the preferred embodiments of the present invention have been described above, the present invention is not limited thereto, and various modifications and changes can be made within the scope of the claims and the detailed description of the invention and the accompanying drawings. Naturally, it belongs to the scope of the invention.

As described above, according to the plasma display device according to the present invention, the ground terminal of the driver IC is connected to the ground wiring of the TCP pattern by bumps, and penetrates through the pattern protection layer (solder resist layer) provided on one side of the pattern. By grounding the pattern ground wiring directly to the chassis base via a conductive member, the ground voltage level is lower than the switching threshold voltage, i.e., the inductance formed at the ground terminal of the driver IC and the ground wiring of the pattern is reduced, This improves the switching speed, thereby improving the reliability of TCP.

Claims (12)

A plasma display panel; A chassis base to which the plasma display panel is attached at one side thereof and drive circuit parts are mounted at the other side thereof; A flexible printed circuit (FPC) electrically connecting the electrodes of the plasma display panel and the driving circuit unit; And A driver IC mounted on a tape carrier package (TCP) connected to the FPC and applying a switching voltage to an electrode of the plasma display panel according to a control signal of the driving circuit unit; A conductive member connected to a pattern to which the ground terminal of the driver IC is connected and grounded in a plate shape to the chassis base on the opposite side of the pattern; A first heat transfer member interposed between the compression plate coupled to the chassis base and the driver IC, and And a second heat transfer member interposed between the driver IC and the chassis base at the conductive member side. The method of claim 1, And the pattern is provided in the TCP. The method of claim 1, The TCP includes a pattern protection layer for protecting the pattern, The pattern protection layer is a plasma display panel formed of a solder resist (Solder Resist) layer. The method of claim 1, The TCP includes a pattern protection layer for protecting the pattern, And the pattern protection layer has a through hole having a straight cross section in the thickness direction thereof. The method of claim 1, And the conductive member is formed of a conductive tape. The method of claim 1, And the conductive member is formed of aluminum (Al) tape. The method of claim 4, wherein And the conductive member includes a protrusion attached to the pattern through a through hole formed in the pattern protection layer, a plate attached to the chassis base, and an inclined portion inclined to connect the plate portion and the protrusion. The method of claim 7, wherein The plate unit is interposed between one side of the pattern and the chassis base opposite to the pattern based on the driver IC. The method of claim 7, wherein And the plate portion is formed on both sides of the pattern on the basis of the driver IC, and is interposed between both sides of the pattern and the chassis base facing each other. The method of claim 7, wherein The plate portion is integrally formed on both sides of the pattern on the basis of the driver IC, and interposed between the pattern and the chassis base facing them, And the second heat transfer member is interposed between the driver IC and the chassis base. The method according to claim 9 or 10, And the protrusion and the inclined portion are formed between one side of the pattern and the chassis base facing the pattern based on the driver IC. The method of claim 4, wherein And the conductive member includes a protrusion adhered to the pattern through a through hole formed in the pattern protection layer, and a plate portion formed in a plate shape on the protrusion and attached to the chassis base.

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