KR100649721B1 - Device for Controlling Hook Pin in Sputtering Apparatus - Google Patents

Abstract

The present invention relates to a hook pin control device of the sputtering apparatus to accurately control the rotation angle of the hook pin to prevent breakage of the substrate and the hook pin and to shorten the repair time.

The hook pin control device of the sputtering apparatus includes a fixed disc fixed on the base plate, a rotating disc rotatably installed on the fixed disc, a hook pin fixed on the rotating disc to seat the substrate, and a rotating drive source. A lever for rotating the rotating disc in accordance with the rotational power, and a stopper member for regulating the rotation range of the rotating disc.

According to the present invention, it is possible to accurately control the rotation angle of the hook pin.

Description

Device for Controlling Hook Pin in Sputtering Apparatus             

1 is a cross-sectional view showing a conventional thin film transistor.

2 shows a conventional sputtering apparatus.

3 is a plan view showing a conventional platen.

4A to 4F are views illustrating an operation of the sputtering apparatus shown in FIG. 2.

5 is a perspective view showing a conventional hook pin unit.

6 is a view showing a collision process of the sputtering apparatus shown in FIG.

7 is a perspective view showing a hook pin unit according to an embodiment of the present invention.

8 is a view showing a ball screw according to an embodiment of the present invention.

9a to 9b are views showing the operation of the sputtering apparatus according to an embodiment of the present invention.

<Description of Symbols for Main Parts of Drawings>

2,80: platen 4,50: hook pin

6,82 lift pin 8,84 base plate drive

10,86: base plate 12: first through hole

14: second through hole 16,22,88,100 substrate

18,90: Head 20: Robot

30,52: fixed disk 32,54: rotating disk

34,56: lever 70: protrusion

36,38,40,42,44,46,58,60,62,64,66,68: Ball screw

102 gate electrode 104 gate insulating film
106: semiconductor layer 108: ohmic contact layer
110: source electrode 112: drain electrode

114: protective film 116: pixel electrode

The present invention relates to an apparatus for manufacturing a liquid crystal display device, and more particularly, to a hook pin control apparatus of a sputtering apparatus, which can precisely control the rotation angle of the hook pin to prevent breakage of the substrate and the hook pin and to shorten the repair time. It is about.

Liquid crystal displays have advantages of small size, thinness, and low power consumption, and are used as notebook PCs, office automation devices, and audio / video devices. In particular, an active matrix liquid crystal display device using a thin film transistor (hereinafter referred to as "TFT") as a switch element is suitable for displaying a dynamic image.

In an active matrix type liquid crystal display, an image corresponding to a video signal such as a television signal is displayed on a pixel matrix (Picture Element Matrix or Pixel Matrix) in which pixels are arranged at intersections of gate lines and data lines. Each of the pixels includes a liquid crystal cell that adjusts the amount of transmitted light according to the voltage level of the data signal from the data line. The TFT is provided at the intersection of the gate line and the data lines to switch the data signal to be transmitted to the liquid crystal cell in response to the scan signal from the gate line.

Referring to FIG. 1, a TFT formed over a substrate 100 is shown. The manufacturing process of the TFT is as follows. First, the gate electrode 102 and the gate line are deposited on the substrate 100 with a metal such as Al, Mo, Cr, and the like, and then patterned by photolithography. On the substrate 100 on which the gate electrode 102 is formed, a gate insulating film 104 made of an inorganic film such as SiNx is formed. On the gate insulating film 104, a semiconductor layer 106 made of amorphous silicon (hereinafter referred to as "a-Si") and an ohmic contact layer 108 made of a-Si doped with n + ions are successively deposited. . The source electrode 110 and the drain electrode 112 made of metal such as Mo or Cr are formed on the ohmic contact layer 108 and the gate insulating film 104. The source electrode 110 is patterned at the same time as the data line. The ohmic contact layer 108 exposed through the opening between the source electrode 110 and the drain electrode 112 is removed by dry etching or wet etching. A protective film 114 of SiNx or SiOx is deposited on the substrate 100 to cover the TFT. Subsequently, a contact hole is formed on the passivation layer 114. A pixel electrode 116 made of indium tin oxide is deposited to be connected to the drain electrode 112 through the contact hole. In such a TFT process, a photoresist pattern formation, an etching process, a photoresist pattern stripping process, and the like are performed during patterning or contact hole formation of the electrode layers 102, 110, and 112.

In the process of manufacturing the liquid crystal display device, a sputtering apparatus as shown in FIG. 2 is used to deposit a gate, a source, a drain electrode and a gate line, a source line, and a drain line on a substrate.

Referring to FIG. 2, a conventional sputtering apparatus includes a platen 2 on which a substrate is seated in an electrode deposition process, and a robot not shown after the base plate 10 is raised from a lowered position to a raised position. The hook pin 4 on which the substrate on which the electrode is to be deposited is seated, the base plate driver 8 for lowering and raising the lift pin 6 to the lowered position and the raised position, and the base plate driver 8 are installed on the base plate driver 8 to lift the lift pin. A base plate 10 on which pins 6 and hook pins 4 are formed is provided. A platen 2 is attached to the platen 2 to heat the substrate so that the electrode can be easily deposited. The hook pin 4 rotates to provide a movement path of the substrate on which the electrode is deposited, and the substrate on which the electrode is to be deposited is seated by the robot. The lift pin 6 has a substrate on which electrodes are deposited. The base plate 10 supports the hook pin 4 and the lift pin 6 as well as being raised and lowered by the base plate drive 8. The base plate driver 8 raises the base plate 10 to a raised position where the electrode is deposited on the substrate and lowers the base plate 10 to the lowered position during the electrode deposition process.

3 is a plan view of the platen from above.

Referring to FIG. 3, the platen 2 has a first through hole 12 through which the hook pin 4 penetrates when the base plate 10 is raised and lowered, and a lift when the base plate 10 is raised and lowered. It consists of a second through hole 14 through which the pin 6 passes. The first through hole 12 is formed in a fan shape so as to flexibly correspond to the rotational movement of the hook pin 4. Since the first through hole 12 is formed in a fan shape, the hook pin 4 may be rotated from a predetermined angle (90 °) to a predetermined angle (40 °). That is, even when the hook pin 4 is rotated 130 degrees from the original position, it can pass through the first through hole 12.

4A to 4F are diagrams illustrating an operation process of a conventional sputtering apparatus.

4A to 4F, an electrode is deposited on the substrate 16 seated on the platen 2 by electrode deposition means (not shown). After the electrode is deposited on the substrate 16, the base plate 10 starts to rise from the lowered position to the raised position by the base plate driver 8. FIG. 4B shows a state where the hook pin 4 and the platen 2 are adjacent by the rise of the base plate 10. At this time, the head 18 of the hook pin 4 is rotated in a direction orthogonal to the base plate 10 so as to provide a moving path of the substrate 16. After this, the hook pin 4 passes through the first through hole 12 formed in the platen 2 as shown in FIG. 4C. After the hook pin 4 passes through the first through hole 12 formed in the platen 2, the head 18 of the hook pin 4 is rotated in a direction parallel to the base plate 10 as shown in FIG. 4D. . After the hook pin 4 is rotated in parallel with the base plate 10, the next substrate 22 on which the electrode is to be deposited by the robot 20 is seated on the hook pin 4 as shown in FIG. 4E. At this time, the substrate 16 on which the electrode is deposited is seated on the lift pin 6. Subsequently, the substrate 16 on which the electrode is deposited is transferred to an unloader part not shown by the robot 20 as shown in FIG. 4F. After the substrate 16 is transferred to the unloader by the robot 20, the base plate 10 is lowered to a lowered position as shown in FIG. 4A. As described above, the conventional sputtering apparatus forms the electrode on the substrate while repeating the processes of FIGS. 4A to 4F.

5 is a perspective view showing a conventional hook pin unit.

Referring to FIG. 5, the conventional hook pin unit is installed on the base plate 10 and is installed between the fixed disc 30 to support the hook pin 4, and between the fixed disc 30 and the hook pin 4. And a rotating disc 32 which is rotated by the pivoting movement of the lever 34. The fixed disk 30 is fixed to the base plate 10 by the first and second screws 36 and 38 to support the rotating disk 32 and the hook pin 4. The hook pin 4 is fixed on the rotating disc 32 by third to fifth screws 40, 42, 44. The lever 34 is installed in a lever driving unit (not shown) to rotate the rotation disc 32 by the rotational movement of the lever driving unit. The lever drive unit is coupled to an air cylinder (not shown) to transmit a rotational movement of the air cylinder to the lever 34. Rotating disk 32 is coupled to the lever 34 by the sixth screw 46 is rotated at a predetermined angle (within 130 °) to provide a moving path of the substrate when the base plate 10 is lowered.

However, since the conventional sputtering apparatus does not have a control means for controlling the rotation angle of the hook pin 4, the hook pin 4 can be rotated by a predetermined angle, for example, 130 ° or more. When the hook pin 4 is rotated by a predetermined angle or more as described above, collision between the hook pin 4 and the platen 2 occurs when the platen 2 descends as shown in FIG. 6. When the hook pin 4 and the platen 2 collide, breakage of the substrate 16 and the hook pin 4 and warpage of the base plate 10 occur, and an overload of the motor driving the platen 2 occurs. I get caught. As a result, it takes considerable repair time to disassemble the sputtering device and take the necessary measures to pump the chamber. In addition, since the sputtering apparatus is disassembled and assembled, there is a fear that leakage occurs in the chamber.

Accordingly, an object of the present invention is to provide a hook pin control device of the sputtering device that can accurately control the rotation angle of the hook pin.

In order to achieve the above object, the hook pin control device of the sputtering apparatus according to the present invention is a fixed disk fixed on the base plate, a rotating disk rotatably installed on the fixed disk, and the substrate is fixed on the rotating disk A hook pin to be seated, a lever for rotating the rotation disc in accordance with the rotational power from the rotation drive source, and a stopper member for regulating the rotation range of the rotation disc.
Hook pin control device of the sputtering apparatus according to the present invention is a fixed disk fixed on the base plate, a rotating disk rotatably installed on the fixed disk, the hook pin is fixed on the rotating disk to seat the substrate And a lever for rotating the rotating disc in accordance with the rotational power from the rotating drive source, and fixing the fixed disc on the base plate, and a protrusion protruding to a height higher than the bottom of the lever. With a restricting screw.

Other objects and features of the present invention in addition to the above objects will become apparent from the description of the embodiments with reference to the accompanying drawings.

Hereinafter, exemplary embodiments of the present invention will be described with reference to FIGS. 7 to 9B.

7 is a perspective view showing a hook pin unit according to an embodiment of the present invention.

Referring to FIG. 7, the hook pin unit of the sputtering apparatus according to the present invention is provided on the base plate 86 to support the fixed pin 52 and the fixed pin 52, the fixed disk 52 and the hook pin 50 Rotation disc 54 is installed between the rotary disk 54 is rotated by the rotational movement of the lever 56, and the hook pin 50 is installed on the rotary disk 54 and rotated by the rotational movement of the rotary disk 54 Equipped. The first and second screws 58 and 60 pass through the fixed disk 52 to fix the fixed disk 52 to the base plate 86. The protrusion 70 is formed on the first screw 58 as shown in FIG. 8. The protrusion 70 formed on the first screw 58 protrudes to a height higher than the bottom of the lever 56 so as to contact the lever 56 when the lever 56 is over-rotated to adjust the rotation angle of the rotation disc 54. Restrict. Therefore, the rotation disk 54 is rotated only within a predetermined angle, for example, 130 ° by the projection 70 of the first screw 58. The fixed disk 52 is fixed to the base plate 86 to support the rotating disk 54 and the hook pin 50. The hook pin 50 is fixed on the rotating disc 54 by third to fifth screws 62, 64, 66. The lever 56 is installed in the lever drive part (not shown) to rotate the rotation disc 54 by the rotational movement of the lever drive part. The lever drive unit is coupled to an air cylinder (not shown) to transmit a rotational movement of the air cylinder to the lever 56. The lever 56 is fixed to the rotary disk 54 by the sixth screw 68.

9A to 9B are views illustrating an operation process of the sputtering apparatus of the present invention.

9A to 9B, an electrode is deposited on a substrate 88 seated on the platen 80 by electrode deposition means (not shown). After the electrode is deposited on the substrate 88, the base plate 86 starts to be raised from the lowered position to the raised position by the base plate driver 84. When the base plate 86 is raised to the raised position, the head 90 of the hook pin 50 is rotated in a direction orthogonal to the base plate 86 so as to provide a movement path of the substrate 88. At this time, the lever 56 for rotating the hook pin 50 is rotated within a predetermined angle (130 °) by the projection 70 formed on the first screw (58). That is, the protrusion 70 formed on the first screw 58 limits the rotation width of the lever 56 so that the lever 56 cannot rotate more than a predetermined angle (130 °). Thereafter, the hook pin 50 passes through the first through hole formed in the platen 80 as shown in FIG. 9B. At this time, since the hook pin 50 is rotated by a predetermined angle (130 °) or less, the collision between the platen 80 and the hook pin 50 does not occur. After the hook pin 50 passes through the first through hole formed in the platen 80, the head 90 of the hook pin 50 is rotated in a direction parallel to the base plate 10. After the head 90 of the hook pin 50 is rotated in parallel with the base plate 10, a substrate on which the electrode is to be deposited is seated on the head 90 of the hook pin 50 by a robot (not shown). Meanwhile, the substrate 88 on which the electrode is deposited is mounted on the lift pin 82. Subsequently, the substrate 88 seated on the lift pin 82 by the robot is transferred to an unloader portion (not shown). After the substrate 88 is transferred to the unloader portion, the base plate 86 is lowered to the lowered position.

As described above, the hook pin control device of the sputtering apparatus according to the present invention can accurately control the rotation angle of the hook pin. Therefore, the collision between the hook pin and the platen does not occur, thereby reducing the repair time significantly.                     

Those skilled in the art will appreciate that various changes and modifications can be made without departing from the technical spirit of the present invention. Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification but should be defined by the claims.

Claims (7)

A fixed disc fixed on the base plate, A rotating disc rotatably installed on the fixed disc; A hook pin fixed to the rotating disc to seat the substrate; A lever for rotating the rotating disc in accordance with a rotating power from a rotating drive source; And a stopper member for regulating the rotation range of the rotating disc. The method of claim 1, The stopper member is a hook pin control device of the sputtering apparatus, characterized in that any one of a plurality of screws for fixing the fixed disk on the base plate. The method of claim 2, The stopper member is a hook pin control device of the sputtering device, characterized in that the protrusion protruding to the top of the screw having a height higher than the bottom of the lever. The method of claim 3, wherein The stopper member is a hook pin control device of the sputtering apparatus, characterized in that for regulating the turning angle of the lever. The method of claim 4, wherein The stopper member is a hook pin control device of the sputtering apparatus, characterized in that installed between 90 ° to 130 ° from the reference position on which the substrate is seated. The method of claim 4, wherein The stopper member is a hook pin control device of the sputtering apparatus, characterized in that installed at a position 130 ° from the reference position on which the substrate is seated. A fixed disc fixed on the base plate, A rotating disc rotatably installed on the fixed disc; A hook pin fixed to the rotating disc to seat the substrate; A lever for rotating the rotating disc in accordance with a rotating power from a rotating drive source; And a screw for fixing the fixed disc on the base plate and limiting the turning angle of the lever by a protrusion projecting to a height higher than the bottom of the lever.

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