KR100647629B1 - Method of manufacturing thin film transistor, thin film transistor manufactured by the method, method of manufacturing flat panel display device, and flat panel display device manufactured by the method - Google Patents

Abstract

The present invention is to provide a thin film transistor on a plastic substrate so that it can be applied to a flexible device, for this purpose, the step of preparing a film containing a plurality of conductive patterns having a plurality of patterns different from each other at a base; Bonding the film on a substrate; forming a thin film transistor on the film, the thin film transistor being electrically connected to a conductive pattern of any one of the conductive patterns; and covering the thin film transistor on the film. Forming an insulating film so as to form an insulating film, the substrate having the thin film transistor, the substrate having the thin film transistor manufactured, the manufacturing method of the flat panel display device, and the flat panel display device manufactured according to the above. to provide.

Description

A method of manufacturing a substrate having a thin film transistor, a substrate having a thin film transistor manufactured according to the same, a method of manufacturing a flat panel display device, and a flat panel display device manufactured according to the method. method, method of manufacturing flat panel display device, and flat panel display device manufactured by the method}

1 to 5 are cross-sectional views schematically showing manufacturing processes of a thin film transistor provided on a plastic material substrate according to an exemplary embodiment of the present invention;

6 is a cross-sectional view illustrating a process of manufacturing an organic light emitting display device using a substrate manufactured by the method of FIGS. 1 to 5;

7 is a cross-sectional view of an organic light emitting display device manufactured according to another exemplary embodiment of the present invention.

8 is a cross-sectional view of an organic light emitting display device manufactured according to another exemplary embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

10: substrate 20: barrier layer

30: film 31: the base

32: first conductive pattern 31a: first opening

31b: second opening 33: organic layer

34: counter electrode 40: second conductive pattern

41: source electrode 42: drain electrode

43: semiconductor layer 44: gate insulating film

45 gate electrode 46 insulating film

The present invention relates to a method of manufacturing a substrate having a thin film transistor, a substrate having a thin film transistor manufactured according to the present invention, a method of manufacturing a flat panel display device, and a flat panel display device manufactured according to the present invention. To a method of manufacturing a substrate having a thin film transistor that can be applied to a flexible device, a substrate having a thin film transistor manufactured according to the present invention, a method of manufacturing a flat panel display device, and a flat panel display device manufactured accordingly. It is about.

Thin film transistors used in flat panel displays such as liquid crystal display devices, organic electroluminescent display devices, or inorganic electroluminescent display devices (hereinafter referred to as TFTs) are used to drive the switching elements and the pixels that control the operation of each pixel. Used as a drive element.

This TFT has a semiconductor layer, a gate electrode, and a source / drain electrode. The semiconductor layer has a source / drain region doped with a high concentration of impurities and a channel region formed between the source / drain regions, and the gate electrode is insulated from the semiconductor layer and positioned in a region corresponding to the channel region. The source / drain electrodes are in contact with the source / drain regions, respectively.

On the other hand, recent flat panel display devices are required to be thin and flexible.

In order to achieve such a flexible characteristic, many attempts have been made to use plastic substrates, unlike conventional glass substrates.

By the way, in the case of such a plastic substrate, since moisture permeability and oxygen permeability are inferior to a glass substrate, it is necessary to form a separate barrier layer. The barrier layer is coated on the surface of the plastic substrate to prevent oxygen or moisture from penetrating through the substrate, and the formation of the barrier layer is expensive and expensive.

In order to obtain a flexible flat panel display, an organic semiconductor thin film transistor is used instead of a conventional silicon thin film transistor. The organic semiconductor can be formed in a low temperature process and has the advantage of realizing a low-cost thin film transistor, and can be easily applied to a plastic substrate that cannot be used at a high temperature.

By the way, when manufacturing a thin film transistor using an organic semiconductor in this way, and subsequently proceeds to make a light emitting device, there is a problem that the organic semiconductor is easily denatured using the existing process. In particular, in the case of the organic EL device, forming a pixel electrode connected to the thin film transistor also becomes a problem, and forming an opening for the light emitting device in the pixel defining layer also becomes a problem.

Accordingly, in order to manufacture a flexible flat panel display, a new method corresponding thereto will be required.

The present invention is to solve the various problems including the above problems, the method of manufacturing a substrate having a thin film transistor provided on a plastic substrate, which can be applied to a flexible device, a thin film transistor manufactured according to the An object of the present invention is to provide a substrate, a method of manufacturing a flat panel display, and a flat panel display manufactured accordingly.

In order to achieve the above object and various other objects, the present invention provides a step of preparing a film containing a plurality of conductive patterns having at least two types of different patterns on a substrate, and bonding the film on a substrate. Forming a thin film transistor on the film, the thin film transistor being electrically connected to a conductive pattern of any one of the conductive patterns, and forming an insulating film on the film to cover the thin film transistor. A method for manufacturing a substrate having a thin film transistor is provided.

The present invention also provides a substrate having a thin film transistor manufactured according to this manufacturing method.

In order to achieve the above object, the present invention also provides a step of preparing a film including a plurality of conductive patterns having a plurality of patterns different from each other on a substrate, bonding the film on a substrate, and Forming a thin film transistor on the film, the thin film transistor being electrically connected to a conductive pattern of any one of the conductive patterns, forming an insulating film on the film to cover the thin film transistor, and forming a predetermined region of the conductive pattern Forming an opening in the insulating layer to expose the insulating film; and forming a display element on the conductive pattern exposed through the opening.

The present invention also provides a flat panel display manufactured according to this manufacturing method.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 to 5 are views sequentially showing a method of manufacturing a substrate having a thin film transistor according to an embodiment of the present invention, Figure 6 is a flat panel display according to an embodiment of the present invention using this substrate Figures show a method of manufacturing the device.

First, as shown in FIG. 1, the film 30 is laminated on the substrate 10 by a lamination roller R.

The film 30 includes a plurality of conductive patterns 32 and 40 having at least two kinds of patterns different from each other on a substrate 31 formed of a resin material. A plurality of conductive patterns 32 and a second conductive pattern 40 are provided, respectively.

The first conductive pattern 32 and the second conductive pattern 40 are each formed to have regularity in a predetermined pattern.

In a preferred embodiment of the present invention, the first conductive pattern 32 may be a pixel electrode, as described below, and may be formed of a single layer or a plurality of conductive materials.

The first conductive pattern 32 may be formed of ITO, IZO, ZnO, or In2O3 when the pixel electrode is used as the transparent electrode, and Ag, Mg, Al, Pt, or the like when the pixel electrode is used as the reflective electrode. Pd, Au, Ni, Nd, Ir, Cr, and compounds thereof may be provided. In this case, when the pixel electrode is used as the transparent electrode, the pixel electrode becomes the anode electrode, and when the pixel electrode is used as the reflective electrode, the pixel electrode becomes the cathode electrode. However, the present invention is not limited thereto, and even when the pixel electrode is used as the reflective electrode, the reflective film may be formed of Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, or a compound thereof. , ITO, IZO, ZnO, or In 2 O 3 can be formed thereon. Of course, in addition to that can be used, such as a conductive polymer.

The second conductive pattern 40 may also be formed of the same material as the first conductive pattern 32. However, the present invention is not limited thereto, and the second conductive pattern 40 may be formed of the first conductive pattern 32. May be formed of other materials.

In the film 30, at least one surface of the film 30 is provided such that the first conductive pattern 32 and the second conductive pattern 40 are not exposed to the outside. 1, when the film 30 is laminated on the substrate 10, the surface where the first conductive patterns 32 and the second conductive patterns 40 are not exposed is laminated toward the outside. . 1 to 6, the first conductive pattern 32 and the second conductive pattern 40 of the film 30 are expressed to be exposed in the direction of the substrate 10, but the present invention is not necessarily limited thereto, and the present invention is not limited thereto. The patterns may not be exposed on either side of the film 30.

Bonding of the film 30 can be a variety of methods, as can be seen in Figure 1, may be laminated, in addition to the adhesive can be pasted.

The substrate 10 may be a plastic substrate. At this time, the barrier layer 20 may be coated on the surface opposite to the surface to which the film 30 is attached. The barrier layer 20 prevents moisture from penetrating through the substrate 10.

The barrier layer 20 may be a composite of an inorganic layer and a polymer layer.

As the inorganic layer, metal oxide, metal nitride, metal carbide, metal oxynitride and compounds thereof may be used. As the metal oxide, silica, alumina, titania, indium oxide, tin oxide, indium tin oxide, and compounds thereof may be used. Aluminum nitride, silicon nitride, and compounds thereof may be used as the metal nitride. Silicon carbide may be used as the metal carbide, and silicon oxynitride may be used as the metal oxynitride. In addition to the inorganic layer, any inorganic material that can block the penetration of moisture and oxygen such as silicon can be used.

On the other hand, such an inorganic material layer can be formed by vapor deposition, there is a limit that the voids provided in the inorganic material layer grows as it is when the inorganic material layer is vacuum deposited. Therefore, in order to prevent these voids from continuously growing in the same position, a polymer layer is further provided in addition to the inorganic layer. The polymer layer may be an organic polymer, an organic polymer, an organometallic polymer, a hybrid organic / inorganic polymer, or the like.

The barrier layer 20 is not necessarily provided, and may be applied without the barrier layer 20.

The substrate 10 is not necessarily limited to a plastic material, and may be a glass material or a metal material.

After bonding the film 30, as shown in FIG. 2, this film 30 is patterned and the 1st opening 31a and the 2nd opening 31b are formed.

As described later, the first opening 31a is for contacting the drain electrode with the first conductive pattern 32, and the second opening 31b is for forming the light emitting element as described later.

After patterning the film 30, as can be seen in FIG. 3, the source electrode 41 and the drain electrode 42 are formed on the base 31.

At this time, the drain electrode 42 contacts the first conductive pattern 32 by the first opening 31a described above.

After the source and drain electrodes 41 and 42 are formed, as shown in FIG. 4, the semiconductor layer 43 is formed to cover the source and drain electrodes 41 and 42 to form a thin film transistor (TFT). Configure In this case, the second conductive pattern 40 described above becomes the gate electrode 45. Therefore, the second conductive pattern 40 is provided in a pattern corresponding to the gate electrode 45, and although not shown in the drawing, various wiring patterns connected to the gate electrode 45 may be provided together.

The semiconductor layer 43 may be an organic semiconductor.

The organic semiconductor may be provided as a semiconducting organic material, and as a polymer, polythiophene and its derivatives, polyparaphenylenevinylene and its derivatives, polyparaphenylene and its derivatives, polyfluorene and its derivatives, Polythiophenevinylene and derivatives thereof, polythiophene-heterocyclic aromatic copolymers and derivatives thereof, and as low molecular weights, oligoacenes of pentacene, tetracene, naphthalene and derivatives thereof, alpha-6-ti Ophene, oligothiophenes of alpha-5-thiophene and derivatives thereof, phthalocyanine and derivatives thereof with or without metals, pyromellitic dianhydrides or pyromellitic diimides and derivatives thereof, fur Reylenetetracarboxylic acid dianhydride or perylenetetracarboxylic diimide and derivatives thereof.

At this time, the organic semiconductor layer is formed to cover the source electrode 41 and the drain electrode 42, and then partitioned to have an area as shown in FIG. 4 by a laser etching method (LAT). Of course, in addition to this, various patterning methods used in an organic semiconductor may be used as it is, and may not necessarily be patterned into an area as shown in FIG. 4.

In addition, an inorganic semiconductor may be used as the semiconductor layer 43. An inorganic semiconductor may include CdS, GaS, ZnS, CdSe, CaSe, ZnSe, CdTe, SiC, and Si.

After the semiconductor layer 43 is formed, as shown in FIG. 5, an insulating film 46 is further formed to cover this TFT. The insulating film 46 protects the TFT and forms a predetermined opening to serve as a pixel define layer, as will be described later.

The insulating layer 46 may be formed of a single layer or a composite layer of inorganic material and / or organic material. As the inorganic material, SiO2, SiNx, Al2O3, TiO2, Ta2O5, HfO2, ZrO2, BST, PZT, etc. may be used. General purpose polymers (PMMA, PS), polymer derivatives having phenol groups, acrylic polymers, imide polymers, arylether polymers, amide polymers, fluorine polymers, p-xylene polymers, vinyl alcohol polymers and blends thereof It is possible. However, the present invention is not limited thereto, and various insulating materials may be used.

After the substrate 10 including the thin film transistor TFT is formed by the above method, as shown in FIG. 6, a predetermined portion of the insulating film 20 is etched to determine the first conductive pattern 32. The third opening 46a is formed to expose the portion. The third opening 46a can be formed in various ways, and photolithography can be applied.

In the present invention, the above-described second opening 31b can be formed simultaneously with the formation of the third opening 46a.

An organic layer 33 including a light emitting layer (not shown) is formed in the third opening 46a, and an opposite electrode 34 is formed to cover the organic layer 33 to form an organic electroluminescent element OLED.

The organic layer 33 may be a low molecular or high molecular organic layer.

In the case of a low molecular organic layer, a hole injection layer (HIL), a hole transport layer (HTL), an emission layer (EML), an electron transport layer (ETL), an electron injection layer (EIL) Electron Injection Layer, etc. may be formed by stacking a single or complex structure, and usable organic materials are copper phthalocyanine (CuPc), N, N-di (naphthalen-1-yl) -N, N ' -Diphenyl-benzidine (N, N'-Di (naphthalene-1-yl) -N, N'-diphenyl-benzidine (NPB), tris-8-hydroxyquinoline aluminum (Alq3) It can be used in various ways. These low molecular weight organic layers are formed by the vacuum deposition method.

In the case of the polymer organic layer, the structure may include a hole transporting layer (HTL) and a light emitting layer (EML). In this case, PEDOT is used as the hole transporting layer, and polyvinylvinylene (PPV) and polyfluorene are used as the light emitting layer. Polymer organic materials such as (Polyfluorene) are used and can be formed by screen printing or inkjet printing.

The counter electrode 34 may be provided as a transparent electrode or a reflective electrode. When used as a transparent electrode, ITO, IZO, ZnO, or In2O3 may be used. When used as a reflective electrode, Li, Ca, LiF / Ca, LiF / Al, Al, Mg, and compounds thereof may be used. have. However, the present invention is not limited thereto, and even when the transparent electrode is provided, a metal having a small work function, that is, Li, Ca, LiF / Ca, LiF / Al, Al, Mg, and a compound thereof may be oriented in the organic layer 33. After the deposition is directed toward, the auxiliary electrode layer or the bus electrode line may be formed on the transparent electrode forming material such as ITO, IZO, ZnO, or In 2 O 3.

According to the present invention, the film 30 on which the first conductive pattern 32 and the second conductive pattern 40 are formed is bonded to the substrate 10 so that the first conductive pattern 32 becomes a pixel electrode. By making the second conductive pattern 40 become the gate electrode 45 of the TFT, especially when the substrate 10 is used as a plastic material, a flat panel display device can be manufactured more simply.

In addition, since the first conductive pattern 32 and the second conductive pattern 40 also function as a barrier to block the penetration of moisture and oxygen, the airtightness of the device may be further improved.

7 illustrates a flat panel display device according to another exemplary embodiment of the present invention.

This is because the first conductive pattern 32 is used as the pixel electrode and the second conductive pattern 40 is used as the wiring pattern. After forming the source / drain electrodes 41 and 42 on the base 31 of the film 30, and forming the semiconductor layer 43 to cover the source / drain electrodes 41 and 42, the gate insulating film ( After forming 44, the gate electrode 45 is formed.

At this time, the drain electrode 42 is in contact with the first conductive pattern 32 through the first opening 31a. In addition, the gate insulating layer 44 may be patterned into an island type, as shown in FIG. 7, so that the gate insulating layer 44 may be less stressed when the substrate 10 is bent, and at least a region corresponding to the semiconductor layer 43. It can be patterned to cover. However, the present invention is not limited thereto, and may be formed to cover all of the entire regions other than the region where the light emitting device is formed.

The gate insulating layer 44 may be formed of an inorganic material and / or an organic material. As inorganic materials, SiO2, SiNx, Al2O3, TiO2, Ta2O5, HfO2, ZrO2, BST, PZT, etc. are possible, and as organic materials, general purpose polymers (PMMA, PS), polymer derivatives having phenol groups, acrylic polymers, imide polymers , Arylether polymers, amide polymers, fluorine polymers, p-xylene polymers, vinyl alcohol polymers and blends thereof. In addition, inorganic-organic laminated films are also possible.

The other structure is the same as the above-described embodiment, so detailed description thereof will be omitted.

FIG. 8 illustrates a flat panel display according to another exemplary embodiment of the present invention. Similar to the embodiment of FIG. 7 described above, the first conductive pattern 32 is used as a pixel electrode and the second conductive The pattern 40 is used as a wiring pattern.

In this case, the semiconductor layer 43 is first formed on the film 30, and then the source electrode 41 and the drain electrode 42 are formed so as to contact the semiconductor layer 43. In this case, the first opening 31a is formed outside the semiconductor layer 43 so that the contact between the drain electrode 42 and the first conductive pattern 32 is made, but is not necessarily limited thereto. After the 43 is formed on the film 30, a first opening may be formed to penetrate the semiconductor layer 43 and the base 31 by laser etching, or the like, and then a drain electrode may be formed.

The other structure is the same as the above-described embodiment, so detailed description thereof will be omitted.

In the embodiment according to FIGS. 7 and 8, the second conductive pattern 40 may be used as one electrode of the capacitor, in addition to the wiring, or may be used as at least a part of various electric elements.

Although not shown in the drawings, various conductive patterns having patterns other than the first and second conductive patterns 32 and 40 are formed in the film 30 so that the conductive patterns may be formed in various electrical devices. To be a part.

The above descriptions correspond to preferred embodiments of the present invention, but are not necessarily limited thereto, and the structure of the TFT and the structure of the light emitting device may be variously modified.

Meanwhile, in the above-described embodiments, only the case of the active driving type electroluminescent device has been described. However, as described above, any other display device having a thin film transistor can be applied to any device, for example, a thin film transistor liquid crystal display. It can also be applied to a display device such as a device (TFT LCD).

In addition, the thin film transistor formed on the plastic substrate according to the present invention as described above is provided in all devices having a flexible thin film transistor, such as a flexible electronic sheet (smart card), other than the display device as described above. Of course it can be.

According to the present invention made as described above, the following effects can be obtained.

First, by bonding a film on which conductive patterns are formed to a substrate, a flat panel display device can be manufactured more simply.

Second, even in the case of using a plastic material as a substrate, it is possible to manufacture a flat plate market value by a simple process, the conductive pattern can also function as a barrier layer to block the penetration of moisture and oxygen.

Third, by using a thin film, the flexible characteristics can be further increased.

Although the present invention has been described with reference to the embodiments shown in the drawings, these are merely exemplary, and those skilled in the art will understand that various modifications and equivalent other embodiments are possible. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

Claims (23)

Preparing a film including at least two types of conductive patterns on a substrate; Bonding the film on a substrate; Forming a thin film transistor on the film, the thin film transistor being electrically connected to any one of the conductive patterns; And Forming an insulating film on the film to cover the thin film transistor. The method of claim 1, Forming the thin film transistor, A source electrode and a drain electrode are formed on the film by using a conductive pattern different from the conductive pattern electrically connected to the thin film transistor among the conductive patterns as a gate electrode, wherein any one of the source electrode and the drain electrode is Forming a conductive pattern electrically connected to the thin film transistor; And Forming a semiconductor layer in contact with the source electrode and the drain electrode, respectively. The method of claim 1, Forming the thin film transistor, Forming a source electrode and a drain electrode on the film, wherein any one of the source electrode and the drain electrode is connected to a conductive pattern electrically connected to the thin film transistor; Forming a semiconductor layer in contact with the source electrode and the drain electrode, respectively; Forming a gate insulating film on the semiconductor layer; And Forming a gate electrode on the gate insulating film; manufacturing method of a substrate having a thin film transistor comprising a. The method of claim 1, Forming the thin film transistor, Forming a semiconductor layer on the film; Forming a source electrode and a drain electrode in contact with the semiconductor layer, wherein any one of the source electrode and the drain electrode is connected to a conductive pattern electrically connected to the thin film transistor; Forming a gate insulating film on the semiconductor layer, the source electrode and the drain electrode; And Forming a gate electrode on the gate insulating film; manufacturing method of a substrate having a thin film transistor comprising a. The method of claim 1, The film is formed on at least one surface of the substrate so that the conductive patterns are not exposed, and the bonding of the film is performed such that a surface of the substrate on which the conductive patterns are not exposed faces outward. Manufacturing method. The method of claim 1, And at least one kind of conductive pattern electrically connected to the thin film transistor and at least one kind of other conductive patterns is at least a part of an electric element. The method according to claim 3 or 4, And the gate insulating film is patterned into at least a region corresponding to the semiconductor layer. The method according to any one of claims 2 to 4, And the semiconductor layer is formed of an organic material. The method of claim 8, The organic material is pentacene, tetracene, tetratracene, anthracene, naphthalene, alpha-6-thiophene, alpha-4-thiophene, perylene and its derivatives, ru Rubrene and its derivatives, coronene and its derivatives, perylene tetracarboxylic diimide and its derivatives, perylene tetracarboxylic dianhydride and its derivatives Derivatives, oligoacenes and derivatives thereof of naphthalene, oligothiophenes and derivatives thereof of alpha-5-thiophene, phthalocyanine and derivatives thereof with or without metal, pyromellitic dianhydrides and derivatives thereof, A method of manufacturing a substrate with a thin film transistor, characterized in that it comprises at least one of pyromellitic diimide and derivatives thereof. The method according to any one of claims 1 to 6, The substrate is a method of manufacturing a substrate having a thin film transistor, characterized in that the plastic substrate. A substrate having a thin film transistor, which is manufactured according to any one of claims 1 to 6. Preparing a film including a plurality of conductive patterns having a plurality of conductive patterns having different patterns thereon; Bonding the film on a substrate; Forming a thin film transistor on the film, the thin film transistor being electrically connected to any one of the conductive patterns; Forming an insulating film on the film to cover the thin film transistor; Forming openings in the insulating layer to expose a predetermined region of the conductive pattern; And And forming a display device on the conductive pattern exposed through the opening. The method of claim 12, Forming the thin film transistor, A source electrode and a drain electrode are formed on the film using a conductive pattern different from the conductive pattern electrically connected to the thin film transistor as a gate electrode, wherein any one of the source electrode and the drain electrode is electrically connected to the thin film transistor. Forming a connection to the connected conductive pattern; And Forming a semiconductor layer in contact with the source electrode and the drain electrode, respectively. The method of claim 12, Forming the thin film transistor, Forming a source electrode and a drain electrode on the film, wherein any one of the source electrode and the drain electrode is connected to a conductive pattern electrically connected to the thin film transistor; Forming a semiconductor layer in contact with the source electrode and the drain electrode, respectively; Forming a gate insulating film on the semiconductor layer; And And forming a gate electrode on the gate insulating layer. The method of claim 12, Forming the thin film transistor, Forming a semiconductor layer on the film; Forming a source electrode and a drain electrode in contact with the semiconductor layer, wherein any one of the source electrode and the drain electrode is connected to a conductive pattern electrically connected to the thin film transistor; Forming a gate insulating film on the semiconductor layer, the source electrode and the drain electrode; And And forming a gate electrode on the gate insulating layer. The method of claim 12, The film is formed on at least one surface such that the conductive patterns are not exposed, and the bonding of the film is performed such that the surface where the conductive patterns are not exposed faces outward. The method of claim 16, And prior to forming the thin film transistor, patterning the film to expose a predetermined portion of the conductive pattern electrically connected to the thin film transistor. The method of claim 12, And at least one kind of conductive pattern electrically connected to the thin film transistor and at least one kind of other conductive patterns becomes at least a part of an electric element. The method according to claim 14 or 15, And the gate insulating film is patterned into at least a region corresponding to the semiconductor layer. The method according to any one of claims 13 to 15, And the semiconductor layer is formed of an organic material. The method of claim 20, The organic material is pentacene, tetracene, tetratracene, anthracene, naphthalene, alpha-6-thiophene, alpha-4-thiophene, perylene and its derivatives, ru Rubrene and its derivatives, coronene and its derivatives, perylene tetracarboxylic diimide and its derivatives, perylene tetracarboxylic dianhydride and its derivatives Derivatives, oligoacenes and derivatives thereof of naphthalene, oligothiophenes and derivatives thereof of alpha-5-thiophene, phthalocyanine and derivatives thereof with or without metal, pyromellitic dianhydrides and derivatives thereof, A method for manufacturing a flat panel display comprising at least one of pyromellitic diimide and derivatives thereof. The method according to any one of claims 12 to 18, And the substrate is a plastic substrate. 19. A flat panel display manufactured by any one of claims 12 to 18.

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