KR100646631B1 - Light emitting diode with heat sink-lead - Google Patents

Abstract

An LED with a radiation lead is provided to reduce thermal load by broadening a connection part in which a lead and a chip placement part of a light emitting device are interconnected. A light emitting device has a plurality of branched leg parts(100a,110a) separated from each other, a connection part(100b,110b) for interconnecting the leg parts, and a lead(100,110) composed of a chip placement part(100c) connected to the connection part. The minimum with of the connection part is not smaller than the width of the chip placement part. The leg part includes a lower leg part and an upper leg part having a greater width than that of the lower leg part.

Description

Light emitting diode with heat sink lead {Light emitting diode with heat sink-lead}

1 is a perspective view of a conventional light emitting device

2 to 4 are perspective views for explaining the light emitting device according to the present invention

<Description of the symbols of the main parts of the drawings>

100: first lead 100a: first leg portion

100b: first connection portion 100c: chip seat

110: second lead 110a: second leg portion

110b: second connection part 115: stop part

130: light emitting chip 150: wiring

170: molding part

The present invention relates to a light emitting device, and more particularly, to a heat dissipation structure of a light emitting device in which each lead has a plurality of leg portions and a light emitting chip is mounted on any one lead.

1 is a perspective view for explaining a conventional light emitting device. As shown in FIG. 1, a conventional light emitting device includes first and second leads 10 and 20, a light emitting chip 30 mounted on the first lead 10, and the light emitting chip 30. And a wire 40 connecting the second lead 20 and a part 50 surrounding the light emitting chip 30 and a part of the first and second leads 10 and 20. At this time, the first and second leads 10 and 20 each have two leg portions, and each leg portion is connected by the connecting portion 10a at the upper portion thereof. In particular, the first lead 10 further includes a chip seating portion 10b extending from the connection portion toward the connection portion of the second lead 20, wherein the light emitting chip 30 is formed on the chip seating portion 10b. It is mounted.

In the structure of the conventional light emitting device as described above, electrical energy is transferred from the connecting portion, which is an electrical connecting portion, to the chip seating portion. In addition, heat generated from the light emitting chip 30 is also moved through the same passage. However, in the conventional lead, as shown in FIG. 1, the connection part 10a is designed to be narrower than the chip seating part 10b in order to reduce the material, thereby causing a problem such as peeling because the thermal load is concentrated on the road. In addition, since the area of the heat flow path is small, a relatively large amount of heat is not released, which causes problems in the heat dissipation effect.

In order to solve the above problems, the light emitting device of the present invention minimizes the curvature between the lead and the chip seat and widens the heat dissipation path, thereby preventing a lot of thermal loads. In addition, it is an object of the present invention to improve the heat dissipation structure of the entire light emitting device by designing the heat generated from the heat source to more efficiently radiate to the outside.

In order to achieve the above object, in the light emitting device provided with a lead consisting of a plurality of branched legs spaced apart from each other, the connecting portion connecting the leg portion and the chip mounting portion connected to the connecting portion of the present invention, the width of the connection portion is chip mounting Provided is a light emitting device characterized in that it is equal to or larger than the width of the part.

The leg part may include a lower leg part and an upper leg part having a larger width than the lower leg part, and the chip seat part and the connection part may have a quadrangular shape.

In this case, the chip seat portion and the connecting portion may have a shape in which the entire shape thereof becomes narrower from the connection portion toward the tip of the chip seat portion.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various forms, and only the embodiments are intended to complete the disclosure of the present invention, and to those skilled in the art to fully understand the scope of the invention. It is provided to inform you. Like reference numerals in the drawings refer to like elements.

2 to 4 are perspective views for explaining the light emitting device according to the present invention.

As shown in FIG. 2, the light emitting device according to the present invention is connected to the first and second leads 100 and 110 by a pair of legs 100a and 110a and is connected by the connection parts 100b and 110b, respectively. The chip mounting portion 100c extending from the first connection portion 100b of the first lead 100 toward the second connection portion 110a of the second lead 110 and mounted on the chip mounting portion 100c. The light emitting chip 130, the wiring 150 connecting the light emitting chip 130 and the second lead 110, a part of the first and second leads 100 and 110, and the light emitting chip 130. And a molding unit 170 surrounding the wiring 150. In this case, each of the first and second leads 100 and 110 has two leg portions 100a, and each leg portion 100a and 110a is connected by the connecting portions 100b and 110b at an upper portion thereof.

The first and second leads 100 and 110 are manufactured through a predetermined mold process, and are formed in the middle portions of the pair of leg portions 100a and 110a and the pair of leg portions 100a and 110a, respectively. It includes a stop 115 (Stopper). The stop part 115 supports only a portion of the leg parts 100a and 110a to be inserted when the light emitting device is mounted to a device mounting part such as a substrate, and protrudes from the middle part of the leg parts 100a and 110a. .

In this case, the leg portions 100a and 110a may have a larger width of the upper leg portion 101a than the lower portion of the stop portion 115 as shown in FIGS. 3 and 4. That is, the portion inserted into the slot of the device mounting part, such as a standardized or ready-made substrate, is formed in the same dimensions as the prior art, and the portion exposed to the top of the device mounting part can increase its width. In this case, the width of the upper part of the stop part 115 is larger than the size of the hole of the device mounting part on which the light emitting device is to be mounted.

The light emitting chip 130 is a vertical light emitting chip and is mounted on the recess of the chip seat 100c. In this case, the light emitting chip 130 may be a horizontal light emitting chip in which a first electrode and a second electrode are formed on the same plane. In this case, an insulator may be formed between the horizontal light emitting chip and the chip seating part 100c.

The wiring 150 is for connecting the second electrode and the second lead 110 of the light emitting chip 130 and is usually made of gold (Au) or aluminum (Al). In this case, when the light emitting chip 130 is horizontal, the light emitting chip 130 may further include a metal wiring for connecting the first electrode and the first lead 100 of the light emitting chip 130.

The molding part 170 is to protect the light emitting chip 130 and the wiring 150 and to fix the first and second leads 100 and 110 at a predetermined interval. The epoxy may be formed using a mold such as a separate mold cup. It is formed of resin or silicone resin. In addition, a convex lens part may be formed on the molding part 170. This may be formed in the form of a lens on the top as shown in the light collecting effect. Of course, the present invention is not limited thereto and may be configured in various forms according to convenience and purpose in the process.

In addition, an upper portion of the light emitting chip 130 may further include a predetermined phosphor for obtaining light of a desired color. That is, an epoxy resin including a phosphor is coated inside the chip seat 100c to form an inner circumferential molding portion that is heat-cured for a predetermined time, and a transparent epoxy is formed at the tip of the lead terminal to improve the transmittance of light emitted from the light emitting device. It can be configured by forming an outer peripheral molding portion made of resin.

The chip seating portion 100c is a portion in which the light emitting chip 130 is mounted, and is connected to the leg portion 100a by the first connection portion 100b. The light emitting chip 130 is mounted on the chip seat 100c, and is formed in the shape of a recess to reflect light emitted from the light emitting chip 130 upward. When the light emitting device is operated, heat generated from the light emitting chip 130 is transferred to the first leg part 100a through the chip seating part 100c and the connecting part, and the transferred heat is transmitted through the end of the leg part 100a. Emitted to the outside. At this time, electrical energy is moved from the first connecting portion 100b, which is an electrical connecting portion, to the chip seating portion 100c. In addition, the heat generated from the light emitting chip 130 is also moved through the same passage. Therefore, when the first connection portion 100b is narrow, thermal load is concentrated on the road, causing problems such as peeling. In addition, since the width of the heat passage is small, a relatively large amount of heat is not released, which causes problems in the heat dissipation effect. Therefore, as shown in FIG. 3, when the first connection part 100b is wider than the chip seat part 100c, heat transferred from the chip seat part 100c is transferred to the chip seat part 100c and the first connection part 100b. ) Can be discharged to the outside faster without a bottleneck, and as shown in FIG. 4, when the width of the chip seat 101c and the first connection portion 100b is increased together to form a square shape, the first connection portion It is possible to transfer heat more quickly than when only the width of 100b is increased. That is, the heat generated from the light emitting chip 130 is realized by various shapes such that the minimum width of the first connection part 100b is equal to or greater than the width of the chip seat part 100c, and thus the chip seat part 100c and the first width of the first connection part 100b are formed. It can be discharged to the outside more quickly without the bottleneck between the connecting portion (100b).

Comparison of the heat dissipation effect according to the width of the first connection portion 100b and the chip seating portion 100c will be described with the following table.

Table 1 below is for comparing the temperature difference between the conventional light emitting device and the light emitting device according to the present invention, the maximum temperature is measured on the light emitting chip 130 and the minimum temperature is measured on the surface of the light emitting device. According to Table 1 below, when the width of the first connection portion 100b is larger than the chip seating portion 100c, the maximum and minimum temperatures are about 1 degree Celsius lower than those of the conventional light emitting device. In addition, as shown in FIG. 4, when the widths of the first connection part 100b and the chip seating part 100c are increased to have a quadrangular shape, the maximum and minimum temperatures are about 5 degrees Celsius lower than those of the conventional light emitting device. It can be seen that the temperature difference is also lowered. When comparing the values in Table 1 below, it is possible to increase the width of the first connection part 100b and the chip seating part 100c together to increase the heat dissipation effect, rather than to increase the width of the first connection part 100b. have.

TABLE 1

Maximum temperature [℃] Minimum temperature [℃] Temperature difference [℃] Conventional light emitting device 60.6 50.7 10 Increasing connection width 59.7 50.1 9.6 Increased width of connection and chip seat 55.3 46.8 8.5

Hereinafter, the manufacturing process of the light emitting device will be described briefly.

Referring to FIG. 2, first, a pair of first leg parts 100a and a chip seating part 100c connected by the first leg part 100a and the first connection part 100b are formed in a predetermined mold process. A first lead 100, a pair of second leg parts 110a, and a second lead 110 connected by the second leg part 110a and the second connecting part 110b are prepared.

Thereafter, the light emitting chip 130 is mounted on the concave portion of the chip seating portion 100c of the first lead 100. The light emitting chip 130 is a vertical light emitting chip, and an adhesive (not shown) is formed between the light emitting chip 130 and the chip seat 100c. In this case, the light emitting chip 130 may be a horizontal light emitting chip in which a first electrode and a second electrode are formed on the same plane. In this case, an insulator may be formed between the horizontal light emitting chip and the chip mounting part 100c.

Next, a wire 150 is formed to connect the light emitting chip 130 and the second lead 110 through a wire bonding process.

Thereafter, a predetermined amount of a liquid epoxy resin or a silicone resin is injected into the prepared mold cup, and then the lead in which the light emitting chip 130 is mounted is dipped into the mold cup and left at a predetermined temperature for a predetermined time to connect the light emitting chip 130 and the wiring 150. ) To form a molding unit 170. After the molding part 170 is cured, the mold cup is removed, and trimming unnecessary parts other than the first and second leads 100 and 110 are completed to complete the light emitting device.

The rights of the present invention are not limited to the embodiments described above, but are defined by the claims, and various changes and modifications can be made by those skilled in the art within the scope of the claims. It is self-evident.

As described above, the present invention widens the connection portion where the light emitting device lead and the chip seat portion are connected, thereby reducing the thermal load. In addition, a large amount of heat generated from the heat source is designed to radiate heat to improve the radiating structure of the entire light emitting device can provide a more efficient light emitting device.

Claims (4)

In the light emitting device provided with a lead consisting of a plurality of branched legs spaced apart from each other, a connecting portion for connecting the legs and a chip seat connected to the connecting portion, The minimum width of the connection portion is light emitting device, characterized in that equal to or larger than the width of the chip seat. The light emitting device of claim 1, wherein the leg part comprises a lower leg part and an upper leg part having a width greater than that of the lower leg part. The light emitting device according to claim 1 or 2, wherein the chip seat and the connection portion have a quadrangular shape. The light emitting device according to claim 1 or 2, wherein the chip mounting portion and the connecting portion have a shape in which the overall shape thereof becomes narrower from the connecting portion to the tip of the chip mounting portion.

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