KR100646092B1 - Circuit board structure of front end module - Google Patents

Abstract

A substrate structure of a front end module is provided to improve the receive performance of an antenna and effectively check whether a circuit has an error or not in manufacturing a product. An element mounting layer(E) includes a plurality of pattern regions(E1-E4), a transmission unit(500), a reception unit(400) and a transmission/reception separating unit, and a ground pattern(E5) formed at a non-open region separated from the pattern region(E5). A ground layer(F) includes a plurality of via holes(F1) and a ground pattern(F2) separated from the via holes(F1). A wiring layer(G) includes a transmission path pattern(G1) and a ground pattern(G3) separated from the transmission path pattern(G1). A lower ground layer(H) includes a ground pattern(H2) and a connection pattern(H1) separated from the ground pattern(H2).

Description

Circuit board structure of front end module

1 is a circuit block diagram schematically showing the components of a front end module used in a general mobile communication terminal.

Figure 2 is a circuit block diagram schematically showing the components of the front-end module according to an embodiment of the present invention.

3 is a top view exemplarily illustrating a form in which each component of a front end module according to an embodiment of the present invention is mounted on a substrate;

Figure 4 is a top view schematically showing the substrate structure of the front end module according to the first embodiment of the present invention.

5 is a top view schematically illustrating a substrate structure of a front end module according to a second embodiment of the present invention.

6 is a graph illustrating a comparison of current flow characteristics according to a substrate structure of a front-end module and a substrate structure of a conventional front-end module according to embodiments of the present invention.

7 is a graph illustrating a comparison of spurious response characteristics of a substrate structure of a front end module and a substrate structure of a conventional front end module according to embodiments of the present invention.

8 is a graph illustrating a comparison of reception sensitivity characteristics according to a substrate structure of a front-end module according to embodiments of the present invention and a substrate structure of a conventional front-end module.

FIG. 9 is a diagram illustrating a test pattern formed on a lower ground layer forming a substrate structure of a front end module according to an embodiment of the present invention.

10 is a circuit diagram showing an equivalent circuit of an inductor provided in the antenna terminal of the front-end module according to an embodiment of the present invention.

<Explanation of symbols for main parts of drawing>

100: antenna 110: inductor

200: switching circuit 210: GPS band pass filter

220: load switch 300: duplexer

400: receiver 500: transmitter

600: baseband processing unit E, I: device mounting layer

F, J: upper ground layer G, K: wiring layer

H, L: lower ground layer

The present invention relates to a substrate structure of a front end module provided in a mobile communication terminal for processing RF communication.

A front end module (FEM) is a transmitting / receiving device that controls radio signals used in a mobile communication terminal. A composite part in which various electronic components are serially implemented on a single board to minimize integration space. Means.

For example, a diplexer for separating a PCS (Personal Communications System) signal and a Code Division Multiple Access (CDMA) signal, a duplexer for separating transmission and reception signals, and a transmitter (Tx) filter For example, components such as a receiver (Rx) filter may be configured as a chip having a minimized size as a single module.

The mobile communication terminal includes a plurality of chip modules composed of various electronic devices including the front end module, and each module needs to be isolated from each other because it causes thermal or electrical interference.

This will be described with the front end module as an example.

1 is a circuit block diagram schematically showing the components of a front end module 10 used in a general mobile communication terminal.

According to FIG. 1, the front end module 10 includes a duplexer end 11, a receiver end 12, a transmitter end 13, and a baseband end 14, wherein each element constituting these components is placed on a substrate. Shown together is a form separated by an isolation wall A in mounting on.

Each element constituting the duplexer end 11, the receiving end 12, the transmitting end 13, and the baseband end 14 will be briefly described as follows.

The receiver 12 includes a low noise amplifier (LNA), a surface acoustic wave (SAW) filter, a frequency mixer, an oscillator, a low pass filter (LPF), and the like. .

In addition, the transmitter 13 receives a quadband modulator, an Rx / Tx phase locked loop (PLL), which provides a frequency source signal to generate an RF signal as an intermediate frequency signal, and a control voltage. It consists of a variable gain amplifier (AGC) that adjusts and amplifies the gain, a driving amplifier, a Tx SAW filter, and a power amplifier that amplifies the power of the output signal and delivers it to the antenna.

The baseband stage 14 is a TCXO (Temperature Compensated X_tal Oscillator) for providing a reference frequency signal, a phase synchronization circuit for synchronizing a phase in converting an intermediate frequency signal into a baseband signal, A transmitting end DA (digital to analog) converter, a receiving end AD (analog to digital) converter, and the like are provided.

The baseband stage 14 generates multimedia data by analyzing digital signals, controls the operation of each circuit unit, modulates / demodulates the intermediate frequency signals converted by the transmitter 13 and the receiver 12, Handles A / D or D / A conversion.

The transmission filter or the reception filter is provided as a saw filter, and filters the transmission band frequency signal or the reception band frequency signal, and the power amplifier low noise amplifier is predetermined so that the transmitted signal can be processed as the transmission signal or the reception signal, respectively. Amplify to a signal of magnitude.

The front end module made of various electronic components is exposed to severe radio wave interference and generates high heat.

In general, such electromagnetic interference is called EMI (Electromanetic Emission / Interface), the electromagnetic signal that is unnecessarily radiated (RE) or conducted (CE) conducted from the electronic device, and the thermal conduction phenomenon of the adjacent electronic device It impairs the function, worsens the circuit function, and causes the malfunction of the equipment.

For this reason, an isolation wall is formed as described above to block radio wave interference and dissipate heat, and a metal shield can is covered to correspond to the isolation wall. The isolation structure has a limitation in blocking radio interference.

That is, current characteristics, reception sensitivity, single tone desensitization (STD) characteristics, and spurless characteristics affect the performance of the front-end module. There are many associations with the structure, and there is a limit to improving these characteristics with the conventional structure.

Accordingly, an object of the present invention is to provide a front end module that stably performs an RF communication function by improving the ground pattern structure by removing the conventional isolation wall structure.

In order to achieve the above object, a substrate structure of a front end module including a transmitter, a receiver, and a transceiver for transmitting and receiving according to the present invention has a plurality of pattern regions formed thereon, and the transmitter, the receiver, and the transceiver for transmitting and receiving are mounted, and the pattern region. A device mounting layer having a ground pattern formed in a non-open region separated from the device; An upper ground layer having a plurality of via holes formed therein and separated from the via holes to form a ground pattern; A wiring layer having a transmission path pattern formed thereon and a ground pattern separated from the transmission path pattern; And a lower ground layer formed with a ground pattern and separated from the ground pattern to form a connection pattern.

In addition, the substrate structure of the front-end module including a transmitter, a receiver, and a transceiver, according to the present invention, a plurality of pattern regions are formed, and at least one or more of the regions in which the transmitter, the receiver, and the transceiver are mounted are non-open regions. An element mounting layer on which no ground pattern is formed; A plurality of via holes are formed, and a ground pattern is formed by being separated from the via holes, and a non-open area corresponding to a boundary between the mounting area where the ground pattern is not formed in the non-open area of the device mounting layer and the remaining mounting area. Ground layer; A wiring layer having a transmission path pattern formed thereon, a ground pattern separated from the transmission path pattern, and having a non-open area corresponding to the upper ground layer; And a lower ground layer on which a ground pattern is formed and is separated from the ground pattern to form a connection pattern.

In addition, the plurality of pattern regions constituting the substrate structure of the front-end module according to the present invention includes at least two or more patterns of a chip mounting pattern, a bonding pattern, a transmission path pattern, an electrode pattern, and a surface mounting technology (SMT) pattern. It is characterized by.

In addition, a ground pattern is formed in a non-open area formed therein, and the receiver mounting area forming the substrate structure of the front-end module according to the present invention, and the receiver mounting area and the transmission / reception splitter mounting area are respectively formed pattern areas. The other area is characterized by a non-open area.

In addition, the front-end module having a substrate structure according to the present invention is characterized in that the code division multiple access (CDMA) front-end module.

In addition, the lower ground layer constituting the substrate structure of the front-end module according to the present invention is characterized in that it comprises a test pattern connected to the transmission path of the predetermined mounting elements of the connection pattern.

In addition, the test pattern constituting the substrate structure of the front-end module according to the present invention is characterized in that formed on at least one surface end of the plurality of surfaces of the lower ground layer.

In addition, the transmission and reception separation unit constituting the substrate structure of the front-end module according to the present invention is characterized in that it further comprises an element connected to the antenna terminal to perform the antenna matching and electrostatic discharge suppression function.

In addition, the device constituting the substrate structure of the front-end module according to the present invention is implemented in the form of a strip line in the wiring layer, it is characterized in that through the via hole and the upper ground layer and the device mounting layer.

Hereinafter, a board structure of a front end module according to embodiments of the present invention will be described in detail with reference to the accompanying drawings. The front end module according to an embodiment of the present invention is a communication module for processing a CDMA signal.

2 is a circuit block diagram schematically showing the components of the front-end module according to an embodiment of the present invention.

Referring to FIG. 2, the front-end module according to the embodiment of the present invention includes a duplexer 300, a receiver 400, and a transmitter 500, and the receiver 400 is a low noise amplifier (LNA) again. 412, an RF receiver 410 composed of a reception band pass filter (Rx BPF) 414, and an IF receiver composed of a first mixer 422, a first phase synchronization circuit 424, and a first IF filter 426 (412). 420 and a receiving processor 430.

In addition, the transmitter 500 includes an RF transmitter 510 consisting of a power amplifier module (PAM) 512 and a transmit band pass filter (Tx BPF) 514, a second mixer 522, and a second phase synchronizer circuit. 524, an IF transmitter 520 composed of the second IF filter 526, and a transmitter processor 530.

In addition, the duplexer 300 is connected to the antenna 100 through the switching circuit 200, the inductor 110 is connected to the antenna 100 end.

In addition, the switching circuit 200 is connected to the reception processing unit 430 through a GPS band pass filter (GPS BPF) 210, a load switch 220 is connected to the power amplification module 512, the reception processing unit ( 430 and the transmission processor 530 are connected to the baseband processor 600, respectively.

The functions of the components of the front-end module having such a connection configuration will be briefly described as follows.

The antenna 100 receives the GPS signal and the CDMA signal and transmits the same to the switching circuit 200. The switching circuit 200 separates the GPS signal and the CDMA signal and transmits the GPS signal to the GPS bandpass filter 210. The CDMA signal is transmitted to the duplexer 300.

The switching circuit 200 may be implemented as, for example, a diplexer or a single pole double throw (SPDT) switch. The diplexer is a high pass passive device (HPF) configured with a high performance passive element (IPD). It consists of a filter (high band filter) and a low pass filter (LPF). By applying frequency division multiplexing, the entire signal (mixed with multiple frequency signals) is divided into two frequency bands without overlapping frequency spectrum. Separate.

The HPF provided in the diplexer passes a relatively high band CDMA signal from the signal input from the antenna 100 to the duplexer 300, and the LPF filters the GPS signal in the low band to filter the GPS band pass filter 210. To pass).

The SPDT switch is an integrated circuit (IC) switch that can also operate as a bias power supply and operates from DC to about 3 GHz with two positive control voltages. The control voltage is very low and can be opened and closed at 2.4V.

The duplexer 300 separates the CDMA signal into a transmission signal and a reception signal and transfers the CDMA signal to the antenna 100 and the receiver 400, respectively.

The low noise amplifier 412 amplifies the received signal by suppressing the noise component, and the reception bandpass filter 414 filters the mixed signals generated during the amplification process and passes only the received signal of the corresponding band.

The first phase synchronizer circuit 424 includes a TCXO (Temperature Compensated Crystal Oscillator), a comparator (Phase detector), a pulse / voltage converter, a VCO, and a feedback circuit (divider). The VCO provides a stable and variable frequency source as needed.

The first mixer 422 mixes the RF reception signal transmitted from the reception bandpass filter 414 with the frequency source signal transmitted from the first phase synchronizer circuit 424 and receives an intermediate frequency (IF) reception signal. To create.

The first IF filter 426 filters the mixed noise component signals in the mixing process and transfers the filtered signals to the reception processor 430.

The reception processing unit (commonly referred to as "RF BBA" or "RF receiver") 430 includes a modulator, a low pass filter (LPF), a D / A converter, and the like to code / receive a received signal. Filter and convert to digital signal.

In particular, the reception processor 430 implemented as a single chip includes a GPS signal processing unit (Asynchronous GPS) therein, and the GPS signal processing unit demodulates the GPS signal transmitted from the GPS bandpass filter 210 and converts the digital signal into digital data. The conversion is transmitted to the baseband processor 600.

The baseband processor (commonly referred to as "BBA" or "MSM") 600 includes a CPU, a CDMA digital modulator, a channel encoder / decoder, etc., and codes / decodes a CDMA signal as a multimedia data. A user interface is provided by controlling input and output devices such as a display device and a keypad.

In addition, the baseband processor 600 detects the signal strength to generate a gain control signal in modulating and demodulating a transmission / reception call, and transmits the gain control signal to the low noise amplifier 412 or the power amplifier module 512. Adjust the signal strength.

Next, referring to the transmitter 500, the transmitter 530 includes a demodulator, a low pass filter, an A / D converter, and the like to digitize the transmitted signal transmitted from the baseband processor 600. Decode / filter and convert to analog signals.

The second IF filter 526 filters only signals of a corresponding band among the analogized signals input from the transmission processor 530, and the second mixer 522 filters the baseband signals transmitted from the second IF filter 526. It is mixed with the frequency source signal transmitted from the second phase synchronization circuit 524 to generate an IF transmission signal.

The second phase synchronizer circuit 524 has a configuration similar to that of the first phase synchronizer circuit 424 described above, and provides a frequency source signal for generating a transmission band frequency.

The transmission bandpass filter 514 filters the received signal as an RF signal, and the power amplification module 512 amplifies the filtered signal to a sufficient size so that the filtered signal can be emitted through the antenna 100.

3 is a top view exemplarily illustrating a form in which each component of a front end module according to an embodiment of the present invention is mounted on a substrate.

Referring to FIG. 3, a front-end module according to an embodiment of the present invention is mounted on a substrate, and an antenna 100 is mounted on a protrusion of the uppermost end of the substrate, and a switching circuit 200 is mounted under the block. To form.

The receiver 400, the transmitter 500, and the duplexer 300 are mounted together in an area E below the block of the switching circuit 200, and the transmitter 500, the receiver 400, and the duplexer 300 are each circuit. A digital chip, a passive element, and a bonding part, a transmission pattern, and the like that are formed on the substrate are molded, and thus can be operated as one independent front end module.

4 is a top view schematically illustrating a substrate structure of a front end module according to a first embodiment of the present invention.

4 illustrates a form in which the transmitter 500, the receiver 400, and the duplexer 300 constituting a single module are mounted, and have a multilayer structure.

The substrate according to the first embodiment includes an element mounting layer (E), an upper ground layer (F), a wiring layer (G), and a lower ground layer (H). The device mounting layer (E) includes a transmitting unit (500). ), Patterns such as a die bonding pattern E1, a line bonding pattern E2, a transmission path pattern E3, and an electrode pattern E4 on which the elements of the receiver 400 and the duplexer 300 are mounted are formed.

At this time, unlike the conventional structure in which the isolation wall is simply formed on the line, the substrate according to the first embodiment has the ground pattern E5 formed at a predetermined distance from the pattern regions in the non-open region.

The upper ground layer F positioned under the device mounting layer E has a plurality of via holes F1 through which the device mounting layer E, the wiring layer G, and the lower ground layer H are energized. In the region, a ground pattern F2 separated from the via hole F1 is formed.

In the wiring layer G positioned below the upper ground layer F, a transmission path (wiring line) pattern G1 for energizing the devices mounted on the device mounting layer E is formed, and a via hole is formed at the end of the substrate. The ground pattern G3 separated from the transmission path pattern and the via hole is formed in the remaining area.

The lower ground layer H has a connection pattern H1 such as a bonding pattern, a surface mounting technology (SMT) pattern, and the like, and a ground pattern H2 separated from the connection pattern is formed on the circumferential side.

5 is a top view schematically illustrating a substrate structure of a front end module according to a second embodiment of the present invention.

The substrate illustrated in FIG. 5 illustrates a form in which the transmitter 500, the receiver 400, and the duplexer 300 constituting a single module have a multilayer structure.

The substrate according to the second embodiment includes a device mounting layer (I), an upper ground layer (J), a wiring layer (K) and a lower ground layer (L) similarly to the first embodiment. (J) includes a die bonding pattern I1, a line bonding pattern I2, a transmission path pattern I3, and an electrode pattern I4 on which elements of the transmitter 500, the receiver 400, and the duplexer 300 are mounted. Etc. patterns are formed.

In this case, unlike the first embodiment, the ground pattern I5 is formed in a portion of the non-open area at predetermined intervals from the pattern areas.

In describing the substrate structure according to the second embodiment, detailed description of the same structure as in the first embodiment will be omitted.

In the mounting area 500 of the device mounting layer I, a ground pattern I5 is formed in a non-open area other than the pattern areas I1, I2, I3, and I4, and the receiving part 400 mounting area and the duplexer are formed. In the mounted area, the ground pattern is not formed in non-open areas other than the pattern areas I1, I2, I3, and I4.

A plurality of via holes J1 are formed in the upper ground layer J disposed under the device mounting layer I, and a ground pattern J2 separated from the via holes J1 is formed in the remaining area, and the device mounting layer The non-open area J3 is formed in a line shape corresponding to the boundary between the receiver 400 mounting area and the duplexer 300 mounting area in (I).

The wiring layer K positioned under the upper ground J layer is formed with a transmission path pattern K1, a via hole is formed at the end of the substrate, and a transmission pattern K1 and a ground pattern separated from the via hole in the remaining area. K3 is formed.

In addition, the wiring layer K, like the upper ground layer J, has a non-open area K4 corresponding to a boundary between the receiver 400 mounting area and the duplexer 300 mounting area of the device mounting layer I. Is formed.

The non-open region K4 in the form of a line formed in the wiring layer K and the upper ground layer J has a difference from the above-described first embodiment in which only a ground pattern is formed.

The lower ground layer L has a connection pattern L1 such as a bonding pattern and a surface mounting technology (SMT) pattern formed on the circumference thereof, and a ground pattern L2 separated from the connection pattern L1 is formed in the remaining part. .

The performance of the front end module according to the first and second embodiments having the substrate structure as described above is compared with the performance of the front end module of the conventional structure.

6 is a graph illustrating a comparison of current flow characteristics according to a substrate structure of a front-end module according to embodiments of the present invention and a substrate structure of a conventional front-end module, and FIG. 7 is a diagram illustrating embodiments of the present invention. FIG. 8 is a graph illustrating a comparison of spurious response characteristics according to a substrate structure of a front-end module and a substrate structure of a conventional front-end module, and FIG. 8 illustrates a substrate structure of a front-end module and a conventional front-end module according to embodiments of the present invention. Is a graph comparing the reception sensitivity characteristics of the substrate structure.

In general, as an item for testing the performance of the front-end module, current characteristics, reception sensitivity, STD characteristics, spurious characteristics, etc. are measured. For reference, the spurious characteristics are frequencies other than the required frequency band. A measure of the amount that a component is sent or received. When an unnecessary frequency is transmitted, it is called spurious radiation. When an unnecessary frequency is received, it is called a spurious response. The spurious sensitivity is lower.

The required frequency band is determined by the allowable deviation of the occupied frequency band width (including 99.5% of total radiation energy). Examples of unnecessary frequencies include harmonic components, low harmonic components, parasitic components, and modulated wave components.

In addition, STD is a measure of the ability to receive a band signal in a channel when a single tone exists at a predetermined position from the center frequency of the assigned channel, and is usually used as an indicator of sharpness of an IF filter.

6, 7 and 8, the current characteristics (M) and the spurious characteristics (P) indicating the performance of the transmission unit are the substrate (A) according to the first embodiment and the substrate (B) according to the second embodiment. It was measured to be improved over the substrate (C) according to the structure.

In addition, the reception sensitivity (D) and STD (N) characteristics indicating the performance of the receiver are also improved in the substrate A according to the first embodiment and the substrate B according to the second embodiment than the substrate C according to the conventional structure. Was measured.

In addition, a test pattern may be formed on the lower ground layer constituting the substrate structure according to the first and second embodiments, and FIG. 9 illustrates a lower ground layer constituting the substrate structure of the front end module according to the embodiment of the present invention. Illustrates a test pattern formed in the example.

9, the transmission line connected to the IF receiver 420 is connected to the test pattern "TP_Rx_CP" (a), and the transmission line connected to the IF transmitter 520 is connected to the test pattern "TP_Tx_CP" (b). Thus, even if the transmitter 500, the receiver 400, and the duplexer 300 are molded and finally single-modulated, the transmitter 500, the receiver 400, and the duplexer 300 may be externally checked whether the signal is normally processed.

Then, the transmission path between the first phase circuit (exactly, the "VCO of the first phase circuit") 424 and the first mixer 422 has the test patterns "Rx_Lo_OUT" (c) and " By bypassing through Rx_Lo_IN "(d), it is possible to externally check whether the correct frequency source is provided to the first mixer 422 without flowing.

In addition, a GPS signal properly filtered from the GPS bandpass filter 210 to the GPS signal processor included in the reception processor 430 is input through the test patterns "GPS_INM" (e) and "GPS_INP" (f). Whether the signal is amplified without noise components in the GPS signal processor can be checked from the outside.

10 is a circuit diagram illustrating an equivalent circuit of the inductor 110 provided at the antenna 100 terminal of the front end module according to the embodiment of the present invention.

As shown in FIG. 2, an inductor 110 is provided at an end of the antenna 100 to match antenna elements (match load generated between elements), and an electrostatic discharge (ESD) flowing in or out of a circuit. Static Discharge) Removes the component.

4 and 5, it can be seen that the inductor is implemented in the form of microstrip lines G4 and K5 in the wiring layers forming the substrate structures according to the first and second embodiments, and FIG. 10. Referring to the analysis from the circuit side as follows.

According to FIG. 10, an equivalent circuit of the microstrip lines G4 and K5 is composed of an inductor L and a capacitor C. The inductor L component is formed of the microstrip lines G4 and K5. The coil component according to the twisted shape, and the capacitor (C) means the parasitic capacitor component.

Total impedance of the equivalent circuit with _{the, "1 / Z o = 1} / L + 1 / C" is represented by, "L = jωL, C = 1 / jωC" _{so, "1 / Z o = 1} / jωL + jωC ". This is again summarized by the formula "1 / Z _o = (ωC-1 / ωL) j".

The value of the parasitic capacitor is almost close to the value of " 0 ", and when the inductance value having a predetermined value is calculated as the inverse, the imaginary part is calculated as a smaller value than the coil component of the conventional chip inductor. Has little effect on

The present invention has been described above with reference to the preferred embodiments, which are merely examples and are not intended to limit the present invention, and those skilled in the art to which the present invention pertains do not depart from the essential characteristics of the present invention. It will be appreciated that various modifications and applications are not possible that are not illustrated above. For example, each component specifically shown in the embodiment of the present invention can be modified. And differences relating to such modifications and applications will have to be construed as being included in the scope of the invention defined in the appended claims.

According to the substrate structure of the front-end module according to the present invention, the ground pattern structure is improved in terms of isolation, thereby improving performances such as current characteristics, spurious characteristics, STD characteristics, reception sensitivity, and the functions of the receiving end and the transmitting end are more stable than before. It is effective to remain.

In addition, according to the present invention, the ground pattern structure is improved, the inductor is mounted in the form of a transmission path pattern in the inner layer, and the test pattern is formed together with the ground pattern to improve the reception performance of the antenna, the operation of the circuit during production The abnormality can be judged efficiently.

Claims (9)

In the substrate structure of the front end module including a transmitter, a receiver, and a transceiver, A device mounting layer in which a plurality of pattern regions are formed, the transmitter, the receiver and the transceiver are mounted, and a ground pattern is formed in a non-open region separated from the pattern region; An upper ground layer having a plurality of via holes formed therein and separated from the via holes to form a ground pattern; A wiring layer having a transmission path pattern formed thereon and a ground pattern separated from the transmission path pattern; And The ground pattern is formed, the substrate structure of the front-end module, characterized in that it comprises a lower ground layer separated from the ground pattern formed a connection pattern. In the substrate structure of the front end module including a transmitter, a receiver, and a transceiver, A device mounting layer in which a plurality of pattern regions are formed, and at least one or more regions among the regions in which the transmitter, the receiver, and the transmitter / receiver are mounted; A plurality of via holes are formed, and a ground pattern is formed by being separated from the via holes, and a non-open area corresponding to a boundary between the mounting area where the ground pattern is not formed in the non-open area of the device mounting layer and the remaining mounting area. Ground layer; A wiring layer having a transmission path pattern formed thereon, a ground pattern separated from the transmission path pattern, and having a non-open area corresponding to the upper ground layer; And A ground pattern is formed, and the substrate structure of the front end module, characterized in that it comprises a lower ground layer separated from the ground pattern to form a connection pattern. The method of claim 1 or 2, wherein the plurality of pattern areas A substrate structure of a front end module comprising at least two or more patterns of a chip mounting pattern, a bonding pattern, a transmission path pattern, an electrode pattern, and a surface mounting technology (SMT) pattern. The method of claim 2, In the transmitter mounting area, a ground pattern is formed in a non-open area formed therein, And the receiver mounting area and the transmission / reception separation unit mounting area are non-open areas, except for the pattern area formed therein, respectively. The method of claim 1, wherein the front end module Board structure of a front-end module, characterized in that the CDMA (Code Division Multiple Access) front-end module. The method of claim 1 or 2, wherein the lower ground layer And a test pattern connected to a transmission path of predetermined mounting elements among the connection patterns. The method of claim 6, wherein the test pattern is Substrate structure of the front end module, characterized in that formed on the end of at least one surface of the plurality of surfaces of the lower ground layer. According to claim 1 or claim 2, wherein the transmission and reception separation unit And a device connected to the antenna terminal to perform antenna matching and electrostatic discharge suppression. The device of claim 8, wherein the device is The board structure of the front end module is implemented in the form of a strip line in the wiring layer, and through the via hole and the upper ground layer and the device mounting layer.

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