KR100645535B1 - Organic electro luminescence display device and fabrication method of the same - Google Patents

Abstract

An organic electro-luminescence display device and a fabrication method of the same are provided to obtain a uniform line load by connecting a metal line with a scan line, a light emitting control line, a gate electrode by using a contact hole. An organic electro-luminescence display device includes an organic electro-luminescence display panel. The organic electro-luminescence display panel includes a pixel unit(100), a scanning/emitting control driver unit(200), a plurality of scan lines(S1-Sn), a plurality of light emitting control lines(E1-En), and a plurality of metal lines(110,130). The pixel unit includes a plurality of pixels(P11-Pnm). Each of unit pixels includes red, green, and blue pixels. The scan lines, the light emitting control lines, and a plurality of data lines(D1-Dm) are formed on a second direction on the pixels.

Description

Organic Electroluminescent Display Device and Fabrication Method of The Same

1 is a block diagram of a conventional organic light emitting display device.

2 is a block diagram of an organic light emitting display device according to an embodiment of the present invention.

3 is a configuration diagram of an EL display panel according to an embodiment of the present invention.

4 is a configuration diagram showing a method of manufacturing an EL display panel according to an embodiment of the present invention.

5A, 5B, 5C, 5D, and 5E are cross-sectional views illustrating a method of manufacturing an organic light emitting display device according to an embodiment of the present invention.

Explanation of symbols on the main parts of the drawings

100: pixel part

200: scan / light emission control driver

300: data driver 1

115: contact hole

The present invention relates to an organic light emitting display device, and more particularly, to an organic light emitting display device formed by bonding a plurality of EL display panels.

Recently, flat panel display devices have been actively researched. In particular, organic light emitting display devices have attracted attention as next generation flat panel display devices due to their excellent luminance and viewing angle characteristics.

Unlike the liquid crystal display, the organic light emitting display device uses a light emitting diode that emits a specific light without requiring a separate light source unit. Such a light emitting diode emits light corresponding to the amount of driving current flowing into the anode electrode.

1 is a block diagram of a conventional organic light emitting display device.

The organic light emitting display device includes a pixel unit 10, a scan driver 20, a data driver 30, and a light emission control driver 40.

The scan driver 20 sequentially supplies scan signals to the scan lines S1 to Sn in response to a scan control signal from a timing controller (not shown), that is, a start pulse and a clock signal.

The data driver 30 supplies data voltages corresponding to the R, G, and B data to the data lines DR1 to DBm in response to a data control signal supplied from a timing controller (not shown).

The light emission control driver 40 includes a shift register and supplies a light emission control signal to the light emission control lines E1 to En sequentially in response to a start pulse and a clock signal from a timing controller (not shown).

The pixel unit 10 includes a plurality of pixels P11 to Pnm positioned in an area where a plurality of scan lines S1 to Sn, a plurality of data lines D1 to Dm, and a plurality of emission control lines E1 to En cross each other. And a predetermined image is displayed according to the applied data voltage. One unit pixel (Pnm) is composed of red, green and blue subpixels.

The red, green, and blue subpixels of the pixel portion 10 have the same pixel circuit configuration, and emit red, green, and blue light corresponding to the current to which each organic EL element is applied. Accordingly, the pixel Pnm displays a specific color by combining light emitted from the red, green, and blue subpixels forming the pixel Pnm.

The scan lines S1 to Sn and the emission control lines E1 to En of the organic light emitting display device apply respective signals to the thin film transistors of the pixel unit 10 to activate the pixels P11 to Pnm. In this operation, connection of the scan lines S1 to Sn and the emission control lines E1 to En and the gate electrodes of the thin film transistors is required. When the gate electrodes are unevenly connected, the line loads of the scan lines S1 to Sn and the light emission control lines E1 to En are different, resulting in a delay in signal input time.

SUMMARY OF THE INVENTION An object of the present invention for solving the above problems is in a panel of an organic light emitting display device formed by joining a plurality of EL display panels, using a contact hole to uniformly scan lines, emission control lines and gate electrode wirings of the pixel portion. Disclosed is a panel of an organic light emitting display device and a method of manufacturing the panel.

The present invention for achieving the above object is an organic light emitting display device formed by bonding a plurality of EL display panels including a plurality of scan lines and light emission control lines and a plurality of metal wires connected to intersect the scan line and light emission control lines. In each of the EL display panels, the EL display panel is formed in a diagonal direction on a pixel portion displaying an image, and the plurality of scan lines, light emission control lines and the metal wirings are electrically formed by a contact hole formed using a first mask. A first region connected to the connection; And a second area formed using a second mask and activated by receiving a scan signal and a light emission control signal from the first area.

In addition, the present invention for achieving the above object, an organic electroluminescence is formed by bonding a plurality of EL display panels comprising a plurality of scan lines and light emission control lines and a plurality of metal wires connected to intersect the scan line and light emission control lines. In the manufacturing method of the display device, each of the EL display panels is manufactured by dividing a pixel portion for displaying an image into n × n regions of the same size, and stacking semiconductor layers defining source / drain regions and channels. Forming a substrate; Forming metal wires connected to the gate electrode and the gate electrode on the substrate to transfer scan signals and emission control signals; Forming a contact hole exposing the source / drain region and a contact hole exposing the metal lines in a first region to which the scan line, the emission control line, and the metal lines are connected using a first mask; Forming a contact hole exposing the source / drain region in a second region activated by receiving a scan signal and a light emission control signal from the first region using a second mask; And a source / drain electrode, a scan line, and a light emission control line on contact holes formed in the first and second regions.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Example

2 is a block diagram of an organic light emitting display device according to an embodiment of the present invention.

Referring to FIG. 2, an organic light emitting display device according to an embodiment of the present invention includes a panel formed by attaching a plurality of EL display panels 1 to 8 and a data driver connected to each of the EL display panels 1 to 8. It consists of (1-8).

One EL display panel 400 and one data driver 500 connected to the EL display panel constitute one sub organic light emitting display device 450 constituting the organic light emitting display device.

Each EL display panel 400 is electrically connected to the data driver 500. Electrical connection between one EL display panel 400 and the data driver 500 is achieved through a metal pattern printed on the flexible film. That is, the output terminal of the data driver 500 is electrically connected to one end of the metal pattern, and the data line provided on the EL display panel 400 is electrically connected to the other end of the metal pattern.

Each data driver 500 supplies a data signal to the pixel part through a plurality of conductive lines provided on the flexible film. The conductive lines apply data signals to 24 red, green, and blue subpixel lines positioned in eight vertically arranged pixel lines. One EL display panel 400 is connected to 60 conductive lines to receive a data signal to each pixel.

In addition, a circuit for generating a scanning signal for selecting a pixel constituting the pixel portion and a light emission control signal for controlling the light emission operation of the pixel is incorporated in the EL display panel 400. Therefore, the EL display panel 400 does not require scanning signal generating means or light emitting control signal generating means separately provided externally.

One EL display panel 400 can be produced through the same manufacturing process as the panel of the conventional small size organic light emitting display device. Therefore, one large panel is formed by attaching several identical EL display panels 400 produced through the same manufacturing process.

The EL display panel 400 may have thin film transistors having the same size since the masks used to manufacture one panel are the same. In addition, the thin film transistor of each pixel has polysilicon as a channel of the thin film transistor for fast response speed and uniformity. At this time, the polysilicon forms an amorphous silicon layer on the glass substrate, and then crystallizes the amorphous silicon layer into polysilicon through a Low Temperature Poly Si (LTPS) process. When laser shots used in the LTPS process are different, pixels having a difference in threshold voltage and mobility may be formed. Therefore, the EL display panel 400 made through the same process as described above can form a thin film transistor using the same laser shot, so that in the case of the large panel in which the EL display panel 400 is bonded, the uniformity of the entire pixel can be satisfied. Can be.

Each of the EL display panels 400 may be attached to the neighboring EL display panels 400 by using a UV curable resin or a thermosetting resin, specifically an epoxy resin.

3 is a configuration diagram of an EL display panel according to an embodiment of the present invention.

Referring to FIG. 3, an EL display panel according to an exemplary embodiment of the present invention includes a pixel unit 100, a scan / light emission control driver 200, a plurality of scan lines S1 -Sn, and a plurality of emission control lines E1-. En) and a plurality of metal wires 110 and 130.

In FIG. 3, the direction of pixels activated by the n-th scan signal is referred to as the first direction, and the direction perpendicular to the first direction is referred to as the second direction.

The pixel unit 100 includes a plurality of pixels P11 to Pnm, and one unit pixel Pnm includes red, green, and blue subpixels. The pixels P11 to Pnm are formed by repeating red, green, and blue subpixels regularly along a first direction, and repeating the same shape along the second direction.

The arrangement of the pixels P11 to Pnm may be implemented through various changes. That is, the red, green, and blue subpixels are arranged in a stripe structure in the first direction, but the pattern of the arrangement may be different in the second direction. In addition, the arrangement of the pixels P11 to Pnm may have a mosaic arrangement in which the arrangement of the pixels P11 to Pnm is not arranged in a line in the vertical or horizontal direction. As described above, the arrangement of the pixels P11 to Pnm may be variously changed.

The red, green, and blue subpixels of the pixel Pnm have the same pixel circuit configuration. The red, green, and blue subpixels emit red, green, and blue light corresponding to the current applied to the organic EL element OLED. Accordingly, the pixel Pnm displays a specific color by combining light emitted by the red, green, and blue subpixels forming the pixel Pnm.

In the pixel unit 100, a plurality of scan lines S1 to Sn, emission control lines E1 to En, and a plurality of data lines D1 to Dm are formed on the pixels P11 to Pnm in a second direction. .

In addition, a plurality of metal wires 110 and 130 for connecting each scan line Sn and the emission control line En with the respective pixels P11 to Pnm are formed in the respective scan line Sn and the emission control line E1 to. It is formed in the first direction intersecting with En). Each pixel Pnm receives a scan signal and an emission control signal from the connected metal wires 110 and 130, and receives a data signal from the data lines D1 to Dm to display a predetermined image.

The scan / light emission control driver 200 is located on the EL display panel 400 and is formed between the data driver located outside the EL display panel 400 and the pixel portion 100 located in the EL display panel 400. This is to form a driving unit for applying a data signal, a scanning signal, and a light emission control signal to one side of the pixel unit 100 in order to bond a plurality of EL display panels 400 to manufacture one organic light emitting display device.

The scan / light emission control driver 200 receives a scan control signal, that is, clock signals for driving the scan / light emission control driver 200 from a timing controller (not shown), and outputs a scan signal and a light emission control signal to the pixel unit 100. Will output

The scan line Sn and the emission control line En extending from the scan / light emission control driver 200 are formed in the second direction. The scan line and the emission control lines Sn and En must sequentially activate the pixels Pn1 to Pnm in the first direction with one scan signal and one emission control signal. Therefore, the scan lines and the emission control lines Sn and En cross the scan lines and the emission control lines Sn and En and use the metal wires 110 and 130 formed in the first direction to form the pixels Pn1 to Pnm in the first direction. And are respectively connected.

Each of the metal wires 110 and 130 is formed across the pixels formed in the first direction. The metal line 110 connected to the scan line Sn is connected to the gate electrode of the thin film transistor on the pixels Pn1 to Pnm in the first direction turned on by the scan signal. In addition, the metal wire 130 connected to the emission control line En is connected to the gate electrode of the emission control transistor on the pixels Pn1 to Pnm in the first direction turned on by the emission control signal.

The transistors may include the metal wires 110 and 130 formed across the transistors as gate electrodes, and may include a gate electrode connected to the metal wires 110 and 130 separately.

The electrical connection between the scan line Sn, the emission control line En, and the metal wires 110 and 130 is achieved through the contact hole 115. Each scan line Sn and the emission control line En are formed to cross the pixels P1m to Pnm formed in the second direction and are directly connected to the pixels Pn1 to Pnm formed in the first direction. Are connected to the metal wires 110 and 130.

Each of the scan lines S1 to Sn is connected to the metal line 110 using one contact hole 115. That is, the first scan line S1 contacts the contact hole 115 on the pixel P11 crossing the metal line 110 crossing the pixels P11 to P1m in the first direction activated by the first scan signal. Is electrically connected through In addition, the n-th scan line Sn has a contact hole 115 on the pixel Pnn crossing the metal line 110 crossing the pixels Pn1 to Pnm in the first direction turned on by the nth scan signal. Is electrically connected through

Therefore, the contact holes 115 connect the scan lines and the metal lines on the n × n-th pixel and are formed in a diagonal direction.

Each of the emission control lines E1 to En is connected to the metal wire 130 using one contact hole 115. That is, the first emission control line E1 contacts the contact hole on the pixel P11 that intersects the metal wire 130 crossing the pixels P11 to P1m in the first direction that emits light by the first emission control signal. Electrically connected via 115. In addition, the n th light emission control line En contacts the pixel Pnn crossing the metal line 130 crossing the pixels Pn1 to Pnm in the first direction that emit light by the nth light emission control signal. It is electrically connected through the hole 115.

Accordingly, the n × n-th pixels P11 to Pnn include two contact holes 115 connecting scan lines S1 to Sn and emission control lines E1 to En and metal wires 110 and 130. These contact holes 115 are formed in a diagonal direction.

As described above, each of the scan lines Sn and the light emission control line En is connected to the metal wirings 110 and 130 through one contact hole 115, thereby making the line loads of forming the contact holes 115 the same. It is possible to prevent signal delay that may occur when inputting a scan signal and a light emission control signal.

4 is a configuration diagram showing a method of manufacturing an EL display panel according to an embodiment of the present invention.

Referring to Fig. 4, the pixel portion 100 of the EL display panel according to the embodiment of the present invention is divided into n x n areas having the same area.

The n × n regions are divided into a first region A including the contact hole 115 and a second region B not including the contact hole 115. The contact hole 115 refers to the contact hole 115 electrically connecting the scan lines S1 to Sn and the emission control lines E1 to En and the metal wires 110 and 130 shown in FIG. 3.

The first region A includes contact holes 115 formed in a diagonal direction, and each contact hole 115 is formed on the n × n-th pixels P11 to Pnm. The first region A is formed diagonally in the pixel portion 100. Therefore, the contact holes 115 may be formed in the same manner through the first mask along the first area A. FIG. That is, the same contact holes 115 may be formed in the plurality of first regions A by using one first mask a plurality of times.

The second region B does not include the contact holes 115 as described above, and forms the pixel portion 100 except for the first region A. FIG. The second region B is composed of a plurality of small regions having the same size, and is uniformly formed by using the second mask according to the second region B, which does not include the contact holes 115, a plurality of times. do.

5A, 5B, 5C, 5D and 5E are sectional views showing the manufacturing method of the EL display panel according to the embodiment of the present invention.

5A, 5B, 5C, 5D, and 5E illustrate a first region A and a second region B, wherein A1 of the first region A represents thin film transistors of the pixel portion 100, A2. Denotes a scan line Sn and the metal wire 110 crossing the scan line Sn, and A3 denotes a light emission control line En and a metal wire 130 intersecting with the scan line Sn. In addition, B1 of the second region B denotes the thin film transistors of the pixel portion 100, B2 denotes the scan line Sn and the metal wire 110 intersecting with the scan line Sn, and B3 denotes the light emission control line En and the metal intersected therewith. The wiring 130 is shown.

Referring to FIG. 5A, a semiconductor layer is stacked on the lower substrate 600 provided in the first area A and the second area B. FIG. The semiconductor layer is crystallized through a Low Temperature Poly Si (LTPS) process after laminating an amorphous semiconductor. This semiconductor layer is formed on A1 and B1 forming the thin film transistor.

A gate insulating layer 610 is formed on the semiconductor layer. A silicon oxide film or a silicon nitride film may be used as the gate insulating film 610. Gate electrodes 120 are formed on A1 and B1 on the gate insulating layer 610, and metal wires 110 and 130 are formed on A2, B2, A3, and B3.

Molybdenum, molybdenum alloy, aluminum alloy, etc., which are the same materials as the gate electrode 120, are used for the metal wires 110 and 130. Molybdenum alloys have excellent thermal stability and good adhesion to ITO membranes. As such molybdenum alloy, molybdenum tungsten is used a lot. The metal wires 110 and 130 and the gate electrode 120 are formed by stacking and patterning a conductive film of the materials. The metal wires 110 and 130 and the gate electrode 120 may operate as the gate electrodes 120 by the metal wires 110 and 130 according to the arrangement of the thin film transistors of the pixel, and the metal wires 110 and 130 and the gate electrode 120. The wire connecting the 120 may further include.

When the gate electrode 120 is formed on the thin film transistors A1 and B1, conductive impurities are implanted into the lower crystalline semiconductor layer using the gate electrode 120 as a mask to form a source / drain region 630. In this case, a region in which a channel is formed between the source / drain regions 630 is defined.

Referring to FIG. 5B, a first insulating layer 650 is formed on the substrate 600 of the first region A and the second region B on which the gate electrode 120 and the metal wirings 110 and 130 are formed. The first insulating film 650 may be formed of a silicon oxide film, a silicon nitride film, or the like, which is the same inorganic film as the gate insulating film 610. In addition, the first insulating layer 650 may be formed of an acrylic polymer film or BCB (BenzoCycloButene).

Referring to FIG. 5C, contact holes 635, 115a and 115b are formed in the first region A in which the first insulating layer 650 is formed using the first mask 700A.

The contact holes 635, 115a, and 115b may contact the first insulating layer 650 and the gate insulating layer 610 to expose the source / drain regions 630 below, and the first insulating layer 650. And contact holes 115a and 115b exposing the metal wires 110 and 130 formed in the A2 and A3 regions by etching.

Referring to FIG. 5D, contact holes 637 are formed in the second region B in which the first insulating layer 650 is formed using the second mask 700B.

The contact holes 637 may etch the first insulating layer 650 and the gate insulating layer 610 to expose the lower source / drain regions 630. Therefore, a contact hole exposing the metal wires 110 and 130 formed in B2 and B3 is not formed in the second region B in which the second mask 700b is used.

When the first mask 700A is selectively used only for the first area A, and the second mask 700B is selectively used only for the second area B, two masks 700A and 700B are used. Contact holes 635, 637, 115a, and 115b may be formed in a region divided by n.

Referring to FIG. 5E, a conductive film is stacked and patterned in the first region A and the second region B in which the plurality of contact holes 635, 637, 115a, and 115b are formed to form a source / drain electrode 660. Source / drain electrodes 660 are respectively connected to exposed source / drain regions 630. Accordingly, the semiconductor layer, the gate electrode 120, and the source / drain electrodes 660 form a thin film transistor.

In addition, the conductive film is patterned to form the scan line 670a and the emission control line 670b.

The scan lines 670a and the emission control lines 670b are connected to the exposed metal wires 110 and 130, respectively. Therefore, the metal wires 110 and 130 connected to the gate electrode 120 are electrically connected to the scan line 670a or the light emission control line 670b through the contact holes 115a and 115b.

As such, when the contact holes 115 are unevenly formed in one pixel unit 100, the contact holes 115 of the respective regions may be formed using only two masks 700A and 700B. Can be reduced. In addition, the contact hole 635 for forming the source / drain electrode 660 and the contact holes 115a and 115b connecting the scan line 670a and the emission control line 670b may be formed at the same time. Can be effectively reduced.

According to the present invention as described above, in the panel of the organic light emitting display device which is formed by joining a plurality of EL display panels, each contact is made with a metal line connected to the scanning line, the light emission control line and the gate electrode of each EL display panel. By connecting alone, the line load can be made uniform. Therefore, the delay of the input signal can be prevented, and the contact holes are regularly formed on the pixels positioned diagonally, thereby reducing the number of masks forming the contact holes, thereby simplifying the process and reducing the cost.

Although described above with reference to a preferred embodiment of the present invention, those skilled in the art will be variously modified and changed within the scope of the invention without departing from the spirit and scope of the invention described in the claims below I can understand that you can.

Claims (6)

A method of manufacturing an organic light emitting display device formed by bonding a plurality of EL display panels including a plurality of scan lines and light emission control lines and a plurality of metal wires connected to intersect the scan line and light emission control lines. The manufacturing method of the display panel is Dividing the pixel portion displaying an image into n × n regions of the same size, Forming a substrate on which semiconductor layers defining source / drain regions and channels are stacked; Forming metal wires connected to the gate electrode and the gate electrode on the substrate to transfer scan signals and emission control signals; Forming a contact hole exposing the source / drain area and a contact hole exposing the metal wires in a first area to which the scan line, the emission control line, and the metal wires are connected using a first mask; Forming a contact hole exposing the source / drain region in a second region activated by receiving a scan signal and a light emission control signal from the first region using a second mask; And A method of manufacturing an organic light emitting display device, comprising: forming a source / drain electrode, a scan line, and a light emission control line on contact holes formed in the first and second regions. The method of claim 1, wherein the first region of the pixel portion is formed in a diagonal direction. The organic light emitting display device as claimed in claim 2, wherein the contact hole electrically connecting the metal wires, the scan line, and the emission control line in the first area is formed on a diagonally located pixel. Manufacturing method. An organic light emitting display device formed by bonding a plurality of EL display panels including a plurality of scan lines and light emission control lines and a plurality of metal wires connected to intersect the scan line and light emission control lines, wherein each of the EL display panels comprises: , A first area formed in a diagonal direction on a pixel portion displaying an image and electrically connected to each of the scan lines, the emission control lines, and the metal wires by a contact hole formed using a first mask; And And a second area formed using a second mask and activated by receiving a scan signal and a light emission control signal from the first area. The organic light emitting display device as claimed in claim 4, wherein each of the metal wires is electrically connected to each of the scan lines or the light emission control lines through one contact hole. The organic light emitting display as claimed in claim 5, wherein each of the contact holes for electrically connecting the metal wires, the scan line, and the emission control line in the first area is formed on a diagonally located pixel. Device.

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