KR100634111B1 - Organic electroluminescent display device and method for fabricating the same - Google Patents

Abstract

An organic electroluminescent display device and a method of fabricating the same are provided to prevent a seal pattern from being dispersed on a display region of a second substrate by forming an intercept pattern on the second substrate. A first substrate(210) is disposed opposite to a second substrate to form a display region having plural pixel regions. A thin film transistor is positioned in the pixel region. An organic luminescent diode is positioned in the pixel region. A seal pattern(270) is positioned around the display region on the first substrate. An intercept pattern(280) is formed on a lower portion of the second substrate to receive the seal pattern. A receiving space between an inner wall(281) and an outer wall(282) is wider than a width of the seal pattern.

Description

Organic electroluminescent device and method for manufacturing the same {Organic electroluminescent display device and method for fabricating the same}

1 is a cross-sectional view showing a conventional organic light emitting display device.

2 is a cross-sectional view of a conventional dual panel type organic light emitting display device.

3 is a plan view schematically showing the first and second substrates of FIG. 2 before bonding;

4 is a view schematically illustrating a case where a distribution of a seal pattern is not uniform when two substrates of a conventional dual panel type organic light emitting diode are bonded together.

FIG. 5 schematically illustrates a case in which two substrates are misaligned when two substrates of a conventional dual panel type organic light emitting diode are bonded together.

FIG. 6 is a plan view schematically illustrating first and second substrates of a dual panel type organic light emitting display device according to an exemplary embodiment of the present invention; FIG.

FIG. 7 is a cross-sectional view illustrating an organic light emitting display device in which the first and second substrates of FIG. 6 are bonded.

8 is a view schematically showing a case in which misalignment occurs when the two substrates of the dual panel type organic light emitting diode according to the embodiment of the present invention are bonded together.

9 is a cross-sectional view showing a dual panel organic light emitting display device according to an embodiment of the present invention.

10 to 11 are cross-sectional views showing a method of manufacturing a second substrate of an organic light emitting display device according to an embodiment of the present invention.

<Description of Symbols for Major Parts of Drawings>

210: first substrate 260: second substrate

270: seal pattern 280: blocking pattern

281: inner wall portion 282: outer wall portion

The present invention relates to an organic electroluminescent display device (OELD), and more particularly, to a dual-panel type organic electroluminescent device and a method of manufacturing the same.

Until recently, cathode ray tubes (CRT) have been mainly used as display devices. However, recently, flat panel display devices such as plasma display panels (PDPs), liquid crystal display devices (LCDs), and organic light emitting diodes, which can replace CRTs, have been widely studied and used.

Among the flat panel display devices as described above, the organic light emitting display device is a self-light emitting device, and since the backlight used in the liquid crystal display device, which is a non-light emitting device, is not necessary, it is possible to be light and thin. In addition, the viewing angle and contrast ratio are superior to those of the liquid crystal display, and are advantageous in terms of power consumption. In addition, DC low voltage driving is possible, the response speed is fast, and the internal component is solid, so it is resistant to external shock, the use temperature range is wide, and in particular, it has a low cost in terms of manufacturing cost. In particular, unlike a liquid crystal display or a plasma display, the process is very simple. For example, the deposition and encapsulation processes are mostly.

1 is a cross-sectional view showing a conventional organic light emitting display device.

As shown in FIG. 1, a conventional organic light emitting display device includes first and second substrates 10 and 60 facing each other. The driving thin film transistor Td positioned in the pixel area P in the display area DR is positioned on the first substrate 10. Although not shown, a switching thin film transistor connected to the driving thin film transistor Td and connected to the gate wiring and the data wiring is positioned on the first substrate 10. An organic light emitting diode E connected to the driving thin film transistor Td is positioned on the driving thin film transistor Td. The organic light emitting diode E includes a first electrode 48, an organic light emitting layer 54, and a second electrode 56.

Light emitted from the organic light emitting layer 54 emits light toward the transmissive electrode among the first and second electrodes 48 and 56. According to the light emitting direction, the organic light emitting display device may be classified into an upper light emitting method or a lower light emitting method.

The second substrate 60 is an encapsulation substrate, and recesses 62 are formed therein. In the concave inlet portion 62, a moisture absorbent 64 for enclosing the organic light emitting diode E by blocking moisture absorption from the outside is enclosed.

In the non-display area NR, which is an edge of the first and second substrates 10 and 60, a seal pattern 70 for bonding the two substrates 10 and 60 is positioned.

In the organic light emitting device as described above, not only an array element including a driving thin film transistor and the like, but also an organic light emitting diode is formed on one substrate, that is, the first substrate. Therefore, the production yield of the organic light emitting display device substantially depends on the production yield of the first substrate. The yield of the first substrate is determined by the product of the yield of the array element and the yield of the organic light emitting diode. Accordingly, when a failure occurs in any one of the array element and the organic light emitting diode, the organic light emitting element becomes defective. As such, in the organic light emitting display device of FIG. 1, the production yield is likely to be lowered due to any one of the main components. In addition, in the organic light emitting display device of FIG. 1, the opening ratio is lowered in the first substrate direction in which the light emitting direction is lowered by a pattern such as a thin film transistor formed on the first substrate.

In order to improve the above problems, a dual-panel type organic electroluminescent device has been proposed.

2 is a cross-sectional view illustrating a conventional dual panel type organic light emitting display device.

As shown in FIG. 2, in the conventional dual panel type organic light emitting diode, the driving thin film transistor Td and the organic light emitting diode E are separated from each other on the first and second substrates 110 and 160.

The organic light emitting diode E positioned on the second substrate 160 includes the first and second electrodes 144 and 158 and the organic light emitting layer 156, and is separated by the pixel region P by the partition wall 154. . The connection pattern 120 positioned between the first and second substrates 110 and 160 connects the organic light emitting diode E of the second substrate 160 to the driving thin film transistor Td of the first substrate 110. do. The connection pattern 120 is connected to the driving thin film transistor Td through the connection electrode 121.

A seal pattern 170 may be disposed between the first and second substrates 110 and 160 to bond the two substrates 110 and 160 along the non-display area NR around the display area DR.

In the dual panel type organic light emitting diode as described above, since the main components for determining the production yield are separately located on two substrates, the production yield may be improved compared to the organic light emitting diode of FIG. 1. In addition, the organic light emitting display device of FIG. 2 has a second substrate direction in which the light emitting direction is upward, and the aperture ratio is improved as compared to the organic light emitting display device of FIG. 1.

However, since the main components are located in each of the two substrates, the two substrates must be aligned correctly and bonded.

3 is a plan view schematically illustrating the first and second substrates of FIG. 2 before bonding.

As shown in FIG. 3, a seal pattern 170 is formed on the first substrate 110 at a desired bonding position along the periphery of the display area DR. Meanwhile, the portion indicated by the dotted line 161 of the second substrate 160 is a position where the central portion of the seal pattern 170 is in contact with the first substrate 110. As such, in order to align and accurately bond the two substrates 110 and 160, the seal pattern 170 is formed at the bonding position of the first substrate 110, and the center of the seal pattern 170 is the two substrate 110. , 160, should contact each other to correspond to the dotted line 161 of the second substrate 160.

However, when the two substrates are bonded together, the distribution of the seal pattern becomes uneven or the misalignment of the two substrates causes the center of the seal pattern to be inconsistent with the dotted line of the second substrate. The light emitting element may be defective.

4 is a view schematically illustrating a case where the distribution of the seal pattern is not uniform when the two substrates of the conventional dual panel type organic light emitting diode are bonded, and FIG. 5 is the two substrates of the conventional dual panel type organic light emitting diode. Figure 2 is a diagram schematically illustrating a case where two substrates are misaligned during bonding.

As shown in FIG. 4, when the two substrates 110 and 160 are bonded together, the seal pattern 170 is not uniformly distributed due to the bonding pressure, or the like, and is spread around the two substrates 110, as shown in FIG. 5. , 160 is misaligned, the seal pattern 170 may invade the pattern 190 in the display area DR of the second substrate 160 positioned adjacent thereto. As a result, the conventional dual panel type organic light emitting display device has a problem in that it becomes defective.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-described problems, and an object thereof is to provide an organic light emitting device capable of preventing defects in a seal pattern when bonding two substrates.

In order to achieve the object as described above, the present invention comprises a first substrate and a second substrate having a display area including a plurality of pixel areas, facing each other; A thin film transistor positioned in the pixel region; An organic light emitting diode positioned in the pixel region; A seal pattern positioned around the display area on the first substrate; An organic light emitting display device includes a blocking pattern formed under the second substrate to accommodate the seal pattern and having a space between the inner wall portion and the outer wall portion wider than the width of the seal pattern.

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A barrier rib may be further disposed between the pixel regions.

The blocking pattern may be made of the same material as the barrier rib.
In order to achieve the above object, another aspect of the present invention is to provide a display area including a plurality of pixel areas, the first substrate and the second substrate facing each other; A thin film transistor positioned in the pixel region on the first substrate; An organic light emitting diode positioned in the pixel region on the second substrate; A seal pattern positioned around the display area on the first substrate; And a blocking pattern formed under the second substrate and having a space between the inner wall part and the outer wall part accommodating the seal pattern than the width of the seal pattern.

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The display device may further include a connection pattern connecting the thin film transistor and the organic light emitting diode.

The organic light emitting diode may include a first electrode, an organic light emitting layer, and a second electrode sequentially disposed below the second substrate.

The first electrode may be transmissive, and the second electrode may be opaque.

In order to achieve the above object, another aspect of the present invention, forming a seal pattern in the periphery of the display area of the first substrate including a plurality of pixel areas; Forming a blocking pattern in which a receiving space between an inner wall and an outer wall is wider than a width of the seal pattern to accommodate the seal pattern on a second substrate; Forming a thin film transistor in the pixel region; Forming an organic light emitting diode in the pixel region; And bonding the first substrate and the second substrate such that the blocking pattern is accommodated in the seal pattern.

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The method may further include forming barrier ribs between the pixel areas.

The blocking pattern may be formed in the same process as the partition wall.

The thin film transistor may be formed above the first substrate, and the organic light emitting diode may be formed below the second substrate.

The method may further include forming a connection pattern connecting the thin film transistor and the organic light emitting diode.

The forming of the organic light emitting diode may include forming a first electrode, an organic light emitting layer, and a second electrode sequentially below the second substrate.

The first electrode may be transmissive, and the second electrode may be opaque.

In another aspect, to achieve the object as described above, another aspect of the present invention is to provide a display area including a plurality of pixel areas, the first substrate and the second substrate facing each other; A thin film transistor positioned in the pixel region; An organic light emitting diode positioned in the pixel region; A seal pattern positioned around the display area on the first substrate; And a blocking pattern formed under the second substrate to accommodate the seal pattern, the blocking pattern being disposed between the seal pattern and the display area and spaced apart from the seal pattern.

The blocking pattern may further include an outer wall portion, and the seal pattern may be located between the outer wall portion and the inner wall portion.

A barrier rib may be further disposed between the pixel regions.

The blocking pattern may be made of the same material as the barrier rib.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 6 is a plan view schematically illustrating first and second substrates of a dual panel type organic light emitting display device according to an exemplary embodiment of the present invention, and FIG. 7 illustrates an organic light emitting device to which the first and second substrates of FIG. 6 are bonded. It is sectional drawing. 6 and 7, components inside the display area are omitted for convenience of description.

As shown in FIG. 6, the ratios of the periphery of the display area DR to the first and second substrates 210 and 260 of the dual-panel type organic light emitting display device according to the embodiment of the present invention are respectively shown. The seal pattern 270 and the blocking pattern 280 are formed along the display area NR. Before bonding the two substrates 210 and 260, the seal pattern 270 is formed at a desired bonding position of the first substrate 210. On the other hand, the second substrate 260 is formed with a blocking pattern 280 along both sides of the dotted line 261 that the center of the seal pattern 270 is in contact when the two substrates 210 and 260 are bonded. The blocking pattern 280 includes an inner wall portion 281 located along the inside of the dotted line 261 and an outer wall portion 282 located along the outside of the dotted line 261, and the inner wall portion 281 and the outer wall portion An accommodation space 283 is located between the 282.

Aligning the two substrates 210 and 260 by aligning the seal pattern 270 of the first substrate 210 and the dotted line 261 of the second substrate 260 shown in FIG. As a result, an organic light emitting display device is formed.

As shown in FIG. 7, when the two substrates 210 and 260 are bonded together, the seal pattern 270 is located in the accommodation space 283 of the blocking pattern 280, and the center of the seal pattern 270 is formed in the second area. In contact with the dotted line 261 portion of the substrate 260. That is, by bonding the two substrates 210 and 260, the seal pattern 270 is surrounded by the inner wall portion 281 and the outer wall portion 282 of the blocking pattern 280. In addition, the interval between the inner wall portion 281 and the outer wall portion 282 is greater than the width of the blocking pattern 280, and between the inner wall portion 281 and the blocking pattern 280, and the outer wall portion 282 and the blocking pattern ( A space is provided between 280.

As such, when the two substrates 210 and 260 are correctly aligned and bonded, the seal pattern 270 formed on the first substrate is in contact with the second substrate 260 in the accommodation space 283. In particular, even when the seal pattern 270 spreads to the periphery due to the bonding pressure, the inner wall portion and the outer wall portions 281 and 282 of the blocking pattern 280 move to the peripheral display area DR as shown in FIG. 3. It is not spread, but is located in the blocking pattern 280. Therefore, the seal pattern 270 may be prevented from invading the pattern located in the display area DR of the second substrate 260.

On the other hand, even when misalignment occurs when the two substrates are bonded together, it is possible to prevent the seal pattern from invading the pattern located in the display area of the second substrate within a predetermined range.

FIG. 8 schematically illustrates a case in which misalignment occurs when two substrates of the dual panel type organic light emitting diode according to the present invention are bonded together.

As shown in FIG. 8, even when misalignment occurs when the two substrates 210 and 260 are bonded together, when the seal pattern 270 does not deviate outside of the blocking pattern 280 because the misalignment range is not large, the blocking pattern The seal pattern 270 may be prevented from invading the display area DR of the second substrate 260 by 280.

Further, even if the seal pattern is formed slightly outside the desired bonding area of the first substrate, the seal pattern can be prevented from invading into the display area of the second substrate.

As described above, in the embodiment of the present invention, when bonding, a blocking pattern having an accommodation space in which the seal pattern of the first substrate is accommodated is formed on the second substrate, and the accommodation space is defined by the inner wall portion and the outer wall portion. . Therefore, even when the seal pattern is spread to the periphery of the two substrates, the seal pattern is uniformly spread in the receiving space by the blocking pattern, thereby preventing the spreading out of the blocking pattern. In addition, even if misalignment occurs when the two substrates are bonded, or even if the seal pattern is not accurately formed at the bonding position of the first substrate, the seal pattern prevents the seal pattern from deviating from the blocking pattern. As such, by forming the blocking pattern on the second substrate, it is possible to prevent the seal pattern from invading into the display area of the second substrate when the two substrates are joined. Accordingly, the seal pattern can be prevented from invading the pattern inside the display area of the second substrate.

In addition, since the blocking pattern prevents the seal pattern from spreading, it is possible to prevent the seal pattern from bursting by excessively applying the bonding pressure or the like to the seal pattern.

In addition, by adjusting the distance between the inner wall portion and the outer wall portion of the blocking pattern, that is, the width of the receiving space, the width of the seal pattern can be adjusted to a desired degree. Therefore, the seal pattern can be formed more precisely to meet the desired degree.

In an exemplary embodiment of the present invention, the blocking pattern may be made of the same material in the same process as the partition wall in the display area to simplify the process. Of course, the blocking pattern may be formed in a different process from the partition wall.

9 is a cross-sectional view illustrating a dual panel type organic light emitting display device according to an exemplary embodiment of the present invention.

As shown in FIG. 9, the driving thin film transistor Td is positioned in the pixel area P in the display area DR on the first substrate 210. Although not shown, gate wiring and data wiring crossing each other are positioned on the first substrate 210, and power wiring crossing the gate wiring is positioned. The gate line, the data line, and the power line define one pixel area P. FIG. Meanwhile, a switching thin film transistor connected to the gate wiring and the data wiring and connected to the driving thin film transistor Td is positioned in the pixel area P. The driving thin film transistor Td transmits a signal transmitted from the power wiring to the connection electrode 221 according to the switching action of the switching thin film transistor. The connection electrode 221 may be formed to extend from the drain electrode of the driving thin film transistor Td.

The organic light emitting diode E is positioned under the second substrate 260. The organic light emitting diode E includes a first electrode 244, an organic light emitting layer 256, and a second electrode 258 sequentially positioned below the second substrate 260. The organic light emitting diode E is separated for each pixel region P by the partition wall 254. That is, the first electrode 244 is positioned in the entire display area DR under the second substrate 260, and the organic light emitting layer 256 and the second electrode 258 are partitioned by the partition 254. Stars are separated.

The partition wall 254 is positioned under the first electrode 254 and is positioned between the adjacent pixel areas P. Referring to FIG. In particular, the partition wall 254 may be formed in a line shape or in a lattice shape. That is, the partition wall 254 may be formed in a line shape in order to separate pixel areas P positioned in two neighboring columns or rows by columns or rows. Meanwhile, the partition wall 254 may be formed along the periphery of the pixel area P to separate pixel areas P adjacent to each other.

A buffer layer 248 is formed between the partition wall 254 and the first electrode 244. The buffer layer 248 is formed to prevent a short circuit between the first and second electrodes 244 and 258.

The second electrode 258 and the driving thin film transistor Td are electrically connected to each other by a connection pattern 220 positioned between the first and second substrates 210 and 260. The driving thin film transistor Td and the connection pattern 220 are connected by the connection electrode 221.

In the non-display area NR of the second substrate 260, the blocking pattern 280 described above is formed. The seal pattern 270 is positioned in the accommodation space 283 of the blocking pattern 280 to contact the second substrate 260. Inner and outer walls 281 and 282 of the blocking pattern 280 are respectively positioned on the inner and outer sides of the seal pattern 270 to surround the seal pattern 270.

As described above, the organic light emitting display device according to the embodiment of the present invention corresponds to the direction of the second substrate 260 in which the light emitting direction is upward. In order to have a top light emitting direction, the first electrode 244 may be made of a transparent conductive material. For example, the first electrode 244 is at least one or more of a transparent conductive material including indium-tin-oxide (ITO) and indium-zinc-oxide (IZO). Can be done with. Meanwhile, the first electrode 244 may be formed to a thickness of about several tens of micrometers so as to have light transmittance. The second electrode 258 may be made of an opaque conductive material. For example, it may be made of at least one or more of an opaque conductive material including aluminum (Al) and an aluminum alloy. In addition, the first and second electrodes 244 and 258 may be different ones of an anode and a cathode. The organic light emitting layer 256 may include an organic material layer that substantially emits light, a hole injection layer, a hole transport layer, an electron injection layer, and an electron transport layer. If the first and second electrodes 244 and 258 are an anode and a cathode, respectively, a hole injection layer, a hole transport layer, an organic material layer, an electron transport layer, and the like from the first electrode 244 to the second electrode 258, The electron injection layer may be located in order.

As illustrated in FIG. 9, the connection pattern 220 may have an insulation pattern formed of an organic insulation material or an inorganic insulation material at a lower portion thereof to have a predetermined height.

Hereinafter, a method of forming a second substrate of an organic light emitting display device according to an embodiment of the present invention will be described.

10 to 11 are cross-sectional views illustrating a method of manufacturing a second substrate of an organic light emitting display device according to an embodiment of the present invention.

As shown in FIG. 10, the first electrode 244 is formed in the entire display area NR on the second substrate 260. Next, a buffer layer 248 is formed on the first electrode 244. The buffer layer 248 is formed between the pixel regions P. FIG.

Next, the partition wall 254 is formed on the buffer layer 248, and at the same time, the blocking pattern 280 having the inner wall portion 281 and the outer wall portion 282 is formed in the non-display area NR. The partition wall 254 may be formed in a line type extending along the data line or the gate line, or may be formed in a lattice shape along the periphery of the pixel area P.

Next, as shown in FIG. 11, an organic light emitting layer 256 is formed in each pixel region P. As shown in FIG. The organic light emitting layer 256 may be formed by an inkjet method, a nozzle coating method, or a deposition method using a shadow mask. The organic light emitting layer 256 may be formed independently of each other for each pixel region P or may be formed in a line type.

Next, the second electrode 258 is formed on the organic light emitting layer 256. The second electrode 258 is formed independently of each other in the pixel region P. FIG.

Meanwhile, in forming the organic light emitting layer 256 and the second electrode 258 described above, when the partition wall 254 is formed in a lattice shape, the partition wall 254 separates the pixel areas P independently of each other. The organic light emitting material and the second electrode material may be deposited over the entire display area DR. In this case, the organic light emitting layer 256 and the second electrode 258 are automatically separated and formed in each pixel region P by the partition wall 254, and the organic light emitting material and the second light emitting layer are formed on the partition wall 254. 2 electrode material may be formed.

Through the above-described process, the second substrate of the organic light emitting display device having the blocking pattern formed in the same process as the partition wall can be formed.

As described above, the second substrate is bonded to the first substrate on which the seal pattern is formed and the seal pattern is positioned in the accommodation space of the blocking pattern, thereby forming a dual panel type organic light emitting display device according to an exemplary embodiment of the present invention.

In the above-described embodiment of the present invention, the case where the seal pattern is formed on the first substrate and the blocking pattern is formed on the second substrate has been described as an example. However, on the contrary, a blocking pattern may be formed on the first substrate and a seal pattern may be formed on the second substrate. Furthermore, the seal pattern may be formed on any one of the first and second substrates, and the blocking pattern may be formed on at least one of the first and second substrates.

In addition, in the above-described embodiment of the present invention, a case in which the blocking pattern includes an outer wall portion and an inner wall portion has been described as an example. However, the blocking pattern may have only the inner wall portion as a minimum configuration for preventing the seal pattern from invading into the display area.

Embodiment of the present invention described above is an example of the present invention, it is possible to change freely within the scope included in the spirit of the present invention. Accordingly, the invention includes modifications of the invention within the scope of the appended claims and their equivalents.

The present invention is to form a blocking pattern for accommodating the seal pattern on the second substrate bonded to the first substrate on which the seal pattern is formed.

Therefore, even when the seal pattern is spread around by the bonding pressure when the two substrates are bonded together, it is possible to prevent the seal pattern from spreading and invading the display area of the second substrate by the blocking pattern. In addition, even when misalignment occurs when the two substrates are bonded together, it is possible to prevent the seal pattern from invading into the display area of the second substrate by the blocking pattern.

As a result, the present invention has an effect of reducing defects by preventing the seal pattern from invading the pattern located in the display area of the second substrate when the two substrates are bonded together.

Claims (20)

A first substrate and a second substrate facing each other, the display area including a plurality of pixel areas; A thin film transistor positioned in the pixel region; An organic light emitting diode positioned in the pixel region; A seal pattern positioned around the display area on the first substrate; A blocking pattern formed under the second substrate to accommodate the seal pattern and having an accommodation space between an inner wall portion and an outer wall portion wider than a width of the seal pattern; Organic electroluminescent device comprising a. delete The method of claim 1, The organic light emitting device further comprises a partition wall located between the pixel region. The method of claim 3, wherein The blocking pattern is an organic light emitting diode made of the same material as the barrier rib. A first substrate and a second substrate facing each other, the display area including a plurality of pixel areas; A thin film transistor positioned in the pixel region on the first substrate; An organic light emitting diode positioned in the pixel region on the second substrate; A seal pattern positioned around the display area on the first substrate; A blocking pattern formed under the second substrate and having a space between the inner wall portion and the outer wall portion accommodating the seal pattern is wider than the width of the seal pattern; Organic electroluminescent device comprising a. The method of claim 5, The organic light emitting device further comprises a connection pattern connecting the thin film transistor and the organic light emitting diode. The method of claim 5, The organic light emitting diode includes an organic light emitting diode including a first electrode, an organic light emitting layer, and a second electrode sequentially positioned below the second substrate. The method of claim 7, wherein The first electrode has a light transmitting property, the second electrode has an opaque organic light emitting device. Forming a seal pattern around the display area of the first substrate including a plurality of pixel areas; Forming a blocking pattern in which a receiving space between an inner wall and an outer wall is wider than a width of the seal pattern to accommodate the seal pattern on a second substrate; Forming a thin film transistor in the pixel region; Forming an organic light emitting diode in the pixel region; Bonding the first substrate to the second substrate such that the blocking pattern is received in the seal pattern; Organic electroluminescent device manufacturing method comprising a. delete The method of claim 9, A method of manufacturing an organic light emitting display device, the method comprising: forming a partition between the pixel areas. The method of claim 11, The blocking pattern is formed in the same process as the partition wall organic light emitting device manufacturing method. The method of claim 9, The thin film transistor is formed on the upper portion of the first substrate, the organic light emitting diode is formed on the lower portion of the second substrate. The method of claim 13, And forming a connection pattern connecting the thin film transistor and the organic light emitting diode. The method of claim 13, The forming of the organic light emitting diode may include forming a first electrode, an organic light emitting layer, and a second electrode sequentially below the second substrate. The method of claim 15, The first electrode has a light transmitting property, the second electrode has an opaque organic light emitting device manufacturing method. A first substrate and a second substrate facing each other, the display area including a plurality of pixel areas; A thin film transistor positioned in the pixel region; An organic light emitting diode positioned in the pixel region; A seal pattern positioned around the display area on the first substrate; A blocking pattern formed under the second substrate to accommodate the seal pattern, the blocking pattern being disposed between the seal pattern and the display area and spaced apart from the seal pattern; Organic electroluminescent device comprising a. The method of claim 17, The organic light emitting device is formed under the second substrate, the second blocking pattern is spaced apart from the seal pattern to the outside of the seal pattern. The method of claim 17, The organic light emitting device further comprises a partition wall located between the pixel region. The method of claim 19, The blocking pattern is an organic light emitting diode made of the same material as the barrier rib.

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