KR100628434B1 - Backlight Assembly of Liquid Crystal Display - Google Patents
Backlight Assembly of Liquid Crystal Display Download PDFInfo
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- KR100628434B1 KR100628434B1 KR1019980034607A KR19980034607A KR100628434B1 KR 100628434 B1 KR100628434 B1 KR 100628434B1 KR 1019980034607 A KR1019980034607 A KR 1019980034607A KR 19980034607 A KR19980034607 A KR 19980034607A KR 100628434 B1 KR100628434 B1 KR 100628434B1
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- mold frame
- lcd panel
- lamp assembly
- heat dissipation
- chassis
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133615—Edge-illuminating devices, i.e. illuminating from the side
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
- G02B6/0023—Means for improving the coupling-in of light from the light source into the light guide provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
- G02B6/0031—Reflecting element, sheet or layer
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
- G02F1/133314—Back frames
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Liquid Crystal (AREA)
Abstract
램프 어셈블리가 접하고 게이트 및 소스 PCB가 위치하는 몰드프레임의 측벽과 제 1 마운팅부를 감싸도록 열방출막을 형성하거나, 몰드프레임의 외측면에서부터 수납공간쪽으로 형성된 삽입홈에 열방출 샤시를 삽입하여 램프에서 발생된 고온의 열이 열방출막을 따라 바텀샤시 및 탑샤시쪽으로 신속하게 방출시킴으로써, PCB에 열이 전달되는 것을 방지하여 LCD 모듈의 신뢰성을 향상시킬 수 있다. The heat dissipation film is formed to surround the first frame and the side wall of the mold frame where the lamp assembly is in contact with the gate and the source PCB, or the heat dissipation chassis is inserted into the insertion groove formed from the outer side of the mold frame toward the storage space. By discharging the high temperature heat rapidly to the bottom chassis and the top chassis along the heat release film, it is possible to prevent heat transfer to the PCB to improve the reliability of the LCD module.
또한, 램프 어셈블리가 접하는 몰드프레임의 측면과 제 1 마운팅부에 열방출막을 형성할 경우 램프 커버 및 클립을 조립하는 공정이 제거되어 제품의 생산성이 향상될 수 있다.In addition, when the heat dissipation film is formed on the side of the mold frame and the first mounting portion in which the lamp assembly is in contact, the process of assembling the lamp cover and the clip may be removed, thereby improving productivity of the product.
Description
본 발명은 액정표시장치의 백라이트 어셈블리에 관한 것으로, 더욱 상세하게는 램프 어셈블리에서 발산되는 고온의 열을 외부로 방출시키기 위해 램프 어셈블리가 설치되는 몰드프레임의 내측면에서부터 바텀샤시 및 탑샤시가 접촉되는 부분까지 열방출막을 형성하거나 열방출 샤시를 삽입한 액정표시장치의 백라이트 어셈블리에 관한 것이다.The present invention relates to a backlight assembly of a liquid crystal display, and more particularly, a bottom chassis and a top chassis are in contact with each other from an inner surface of a mold frame in which a lamp assembly is installed to dissipate high temperature heat emitted from the lamp assembly to the outside. The present invention relates to a backlight assembly of a liquid crystal display device in which a heat dissipation film is formed or a heat dissipation chassis is inserted.
일반적으로 널리 사용되고 있는 표시장치들 중의 하나인 CRT(Cathode Ray Tube)는 TV를 비롯해서 계측기기, 정보 단말기기 등의 모니터에 주로 이용되고 있으나, CRT 자체의 무게와 크기로 인해 전자 제품의 소형화, 경량화의 요구에 적극 대응할 수 없었다. CRT (Cathode Ray Tube), one of the widely used display devices, is mainly used for monitors such as TVs, measuring devices, information terminal devices, etc., but due to the weight and size of the CRT itself, the miniaturization and weight reduction of electronic products Could not respond actively to the demands of.
이러한, CRT를 대체하기 위해 소형, 경량화 및 저소비전력의 장점을 갖고 있는 액정표시장치가 활발하게 개발되어 왔고, 최근에는 평판 표시장치로서의 역할을 충분히 수행할 수 있을 정도로 개발되어 랩탑형 컴퓨터 뿐만 아니라 데이스 탑형 컴퓨터의 모니터로도 사용되고 있어 액정표시장치의 수요는 계속적으로 증가되고 있는 실정이다. In order to replace the CRT, liquid crystal displays having advantages of small size, light weight, and low power consumption have been actively developed, and recently, the liquid crystal display has been developed enough to perform a role as a flat panel display device. As it is also used as a monitor of a tower computer, the demand for a liquid crystal display device is continuously increasing.
이와 같은 액정표시장치의 대부분은 외부에서 들어오는 광의 양을 조절하여 화면에 표시하는 수광성소자이기 때문에 LCD 패널에 광을 조사하기 위한 별도의 장치, 즉 백라이트 어셈블리가 반드시 필요하다. Since most of the liquid crystal display devices are light-receiving elements that display the screen by adjusting the amount of light coming from the outside, a separate device, that is, a backlight assembly, for irradiating light to the LCD panel is necessary.
백라이트 어셈블리는 크게 상부면 가장자리를 따라 수납공간이 형성된 몰드프레임과, 몰드프레임의 수납공간에 설치되어 빛을 발산하는 램프 어셈블리와, 몰드프레임에 수납되어 LCD 패널쪽 으로 빛을 안내하는 도광판과, 몰드프레임의 하부면에 설치되어 몰드프레임에 수납된의 각 부재들을 지지하는 바텀샤시와, 몰드프레임과 체결되어 LCD 패널을 지지하는 탑샤시와, 모니터 케이스와 조립되는 몰드프레임의 마운팅부에 끼워지고 탑샤시와 접촉되어 불요 주파수를 접지시키는 클립으로 구성된다.The backlight assembly includes a mold frame in which a storage space is formed along an upper edge of the upper surface, a lamp assembly installed in the storage space of the mold frame to emit light, a light guide plate stored in the mold frame, and guides the light toward the LCD panel, and a mold. A bottom chassis installed on the lower surface of the frame to support each member of the mold frame, a top chassis fastened to the mold frame to support the LCD panel, and fitted to a mounting portion of the mold frame assembled with the monitor case. It consists of a clip that contacts the chassis and grounds the unwanted frequencies.
램프 어셈블리는 몰드프레임의 길이방향 일측면에 설치되어 빛을 발산하는 램프와, 램프를 감싸고 있으며 램프에서 발산된 빛을 도광판으로 반사하는 램프 커버와, 램프에 고전압을 인가하는 와이어로 구성된다.The lamp assembly includes a lamp installed on one side of the mold frame in the longitudinal direction to emit light, a lamp cover surrounding the lamp and reflecting the light emitted from the lamp to the light guide plate, and a wire for applying a high voltage to the lamp.
여기서, 테스크 탑형 컴퓨터의 모니터로 사용되는 액정표시장치의 경우 LCD 패널의 성능이 CRT의 성능과 동일해야 하기 때문에 램프에서 강한 빛이 출사되며 이로 인해 고온의 열이 발생된다.Here, in the case of a liquid crystal display device used as a monitor of a desktop computer, since the performance of the LCD panel should be the same as that of the CRT, strong light is emitted from the lamp, which generates high temperature heat.
그러나, 램프 어셈블리를 수납하는 몰드프레임의 제질은 열방출성이 저하되는 플라스틱 재질이기 때문에 램프에서 발생된 열이 외부로 방출되지 못하여 LCD 모듈의 내부의 온도를 계속적으로 상승시킨다.However, since the material of the mold frame for accommodating the lamp assembly is a plastic material having low heat dissipation, heat generated from the lamp cannot be released to the outside, thereby continuously increasing the temperature inside the LCD module.
이로 인해 몰드프레임에 수납된 도광판 및 시트류들이 고온의 열에 의해 팽창과 수축을 반복하면서 변형이 발생되고, LCD 패널을 구동시키는 PCB에 전달되어 열적 노이즈로 작용하면서 LCD 모듈의 화질을 저하시키는 문제점이 있다.As a result, the light guide plate and the sheets stored in the mold frame are deformed while repeating expansion and contraction by high temperature heat, and are transmitted to the PCB which drives the LCD panel, which acts as thermal noise, thereby degrading the image quality of the LCD module. have.
한편, 빛의 휘도를 상승시키기 위해 램프의 외주면에 램프 커버를 감싸는 공정과, PCB에 실장된 소자들에서 발생되는 전자파를 차폐하기 위해 몰드프레임과 탑샤시 사이에 전자파의 접지경로를 제공하는 클립을 삽입하는 공정이 반드시 수반되기 때문에 제품의 생산성이 저하된다.On the other hand, the process of wrapping the lamp cover on the outer circumferential surface of the lamp to increase the brightness of the light, and to provide a grounding path of the electromagnetic wave between the mold frame and the top chassis to shield the electromagnetic waves generated from the elements mounted on the PCB Productivity is reduced because the process of inserting is necessarily accompanied.
따라서, 본 발명의 목적은 상기와 같은 문제점을 감안하여 안출된 것으로써, 램프 어셈블리에서 발생된 열을 외부로 원활하게 방출시켜 도광판 및 시트들이 변형되는 것을 방지하고, 열적 노이즈로 인해 LCD 몰듈의 화질이 저하되는 것을 방지하여 제품의 신뢰성을 향상시키는데 있다.Accordingly, an object of the present invention is to devise in view of the above problems, to smoothly discharge the heat generated in the lamp assembly to the outside to prevent the light guide plate and sheet from being deformed, the thermal image quality of the LCD module This is to prevent the degradation and to improve the reliability of the product.
본 발명의 다른 목적은 몰드프레임과 램프의 빛을 반사하는 램프 커버와 탑샤시 사이에 클립을 삽입하는 공정을 제거하여 LCD 모듈의 생산성을 향상시키는데 있다.Another object of the present invention is to improve the productivity of the LCD module by eliminating the process of inserting the clip between the lamp cover and the top chassis reflecting the light of the mold frame and the lamp.
본 발명의 다른 목적은 다음의 상세한 설명과 첨부된 도면으로부터 보다 명확해 질 것이다.Other objects of the present invention will become more apparent from the following detailed description and the accompanying drawings.
본 발명은 일측면에 따르면 램프 어셈블리와 접하는 몰드프레임의 내측벽에서부터 바텀샤시와 탑샤시가 접하는 몰드프레임의 내측벽까지 열방출막 형성하거나, 램프 어셈블리가 설치되는 몰드프레임의 외측면에서 램프 어셈블리 쪽으로 삽입홈을 형성하여 몰드프레임의 외측면을 감싸도록 열방출 샤시를 삽입홈에 끼운다.According to an aspect of the present invention, a heat dissipation film is formed from the inner wall of the mold frame in contact with the lamp assembly to the inner wall of the mold frame in contact with the bottom chassis and the top chassis, or inserted into the lamp assembly from the outer surface of the mold frame in which the lamp assembly is installed. The heat dissipation chassis is inserted into the insertion groove so as to form a groove to surround the outer surface of the mold frame.
본 발명의 다른 측면에 따르면 램프 어셈블리와 접하는 몰드프레임의 내측벽에 열방출막을 형성할 때 LCD 모듈을 모니터 케이스에 연결시키는 몰드프레임의 마운팅부까지 연장시켜 형성하여 몰드프레임과 탑샤시를 직접 접촉시킨다.According to another aspect of the present invention, when the heat dissipation film is formed on the inner wall of the mold frame in contact with the lamp assembly, the LCD module is extended to the mounting portion of the mold frame connecting the monitor case to directly contact the mold frame with the top chassis. .
이하, 본 발명에 의한 액정표시장치의 열방출 장치의 구조를 첨부된 도면 도 1 내지 도 3을 참조하여 설명하면 다음과 같다.Hereinafter, a structure of a heat dissipation device of a liquid crystal display according to the present invention will be described with reference to FIGS. 1 to 3.
LCD 모듈(100)은 크게 몰드프레임(110)과, 몰드프레임(110)의 대향하는 양측에 설치되어 빛을 발산하는 램프 어셈블리(130)와, 몰드프레임(110)의 기저면에서부터 차례대로 적층되어 빛을 반사하고 안내하며 집광하는 반사판(140), 도광판(142), 광학 시트류(144)와, 몰드프레임(110)의 하부에 설치되어 몰드프레임(110)에 삽입된 각 부재들을 지지하는 바텀샤시(150)와, 광학시트류(144)의 상부에 설치되어 정보를 디스플레이하는 LCD 패널(160)과, LCD 패널(160)과 전기적으로 연결되어 LCD 패널(160)을 구동시키는 PCB(172, 174)와, 몰드프레임(110)에 체결되어 LCD 패널(160)이 몰드프레임(110)에서 이탈되는 것을 방지하는 탑샤시(180)로 구성된다.The LCD module 100 is largely stacked on the mold frame 110, the lamp assembly 130 installed on opposite sides of the mold frame 110 to emit light, and sequentially stacked from the base surface of the mold frame 110. A bottom chassis for supporting each member inserted into the mold frame 110 by reflecting plate 140, light guide plate 142, optical sheet 144, and the mold frame 110 to reflect, guide, and collect light. 150, an LCD panel 160 installed on the optical sheet 144 to display information, and PCBs 172 and 174 electrically connected to the LCD panel 160 to drive the LCD panel 160. And a top chassis 180 fastened to the mold frame 110 to prevent the LCD panel 160 from being separated from the mold frame 110.
도 2a 및 도 2b에 도시된 바와 같이 몰드프레임(110)의 가장자리를 따라 상부면에서부터 하부면까지 관통되는 수납공간(112)이 형성되어 램프 어셈블리(130), 반사판(140), 도광판(142), 광학 시트류(144) 및 LCD 패널(160)이 삽입되며, 도 1에 도시된 바와 같이 몰드프레임(110)의 외측면에는 액정표시장치(100)를 모니터 케이스에 고정시키기 위한 복수개의 제 1 마운팅부(114)가 형성된다. As shown in FIGS. 2A and 2B, an accommodating space 112 penetrates from an upper surface to a lower surface along an edge of the mold frame 110 to form a lamp assembly 130, a reflector plate 140, and a light guide plate 142. , The optical sheets 144 and the LCD panel 160 are inserted, and as shown in FIG. 1, a plurality of first parts for fixing the liquid crystal display device 100 to the monitor case on the outer surface of the mold frame 110. The mounting part 114 is formed.
또한, PCB(172, 174)는 LCD 패널(160)의 장변방향 일측과 단변방향 일측에 TCP(175)에 의해 연결되는데, LCD 패널(160)의 단변방향에 연결된 게이트 PCB(172)는 도 2a에 도시된 바와 같이 LCD 패널(160)과 평행이되도록 몰드프레임(110)의 상부면에 설치된다. In addition, the PCBs 172 and 174 are connected by one side of the LCD panel 160 to one side of the long side direction and one side of the LCD side 160 by the TCP 175. The gate PCB 172 connected to the side of the LCD panel 160 in the short side direction is illustrated in FIG. 2A. As shown in the upper portion of the mold frame 110 to be parallel to the LCD panel 160 is installed.
또한, LCD 패널(160)의 장변방향에 연결된 소스 PCB(174)는 TCP(175)의 절곡에 의해 몰드프레임(110)의 후면에 위치되어 고정용 스크류들(도시 안됨)에 의해 몰드프레임(110)에 고정된다. In addition, the source PCB 174 connected to the long side direction of the LCD panel 160 is located at the rear side of the mold frame 110 by bending the TCP 175, and the mold frame 110 by fixing screws (not shown). It is fixed to).
제 1 실시예에 따르면 도 2a 및 2b에 도시된 바와 같이 램프 어셈블리(130)가 설치되는 몰드프레임(110)의 장변방향과 게이트 PCB(172)와 대응되는 몰드프레임(110)의 단변방향 일측에는 소스 및 게이트 PCB(174, 172)에 램프 어셈블리(130)에서 발생된 고온의 열이 전달되는 것을 방지하기 위해 도전성 재질로 열방출막(120)이 형성된다. According to the first embodiment, as shown in FIGS. 2A and 2B, a long side direction of the mold frame 110 in which the lamp assembly 130 is installed and a short side direction of the mold frame 110 corresponding to the gate PCB 172 are provided. The heat emission layer 120 is formed of a conductive material to prevent the high temperature heat generated from the lamp assembly 130 from being transferred to the source and gate PCBs 174 and 172.
열방출막(120)은 몰드프레임(110)의 장변방향에서부터 게이트 PCB(172)가 설치된 몰드프레임(110)의 단변방향 일측면 까지 연장되고, 게이트 PCB(172)가 설치되지 않는 쪽에는 제 1 마운팅부(114)가 형성된 부분까지 연장된 후 탑샤시(180) 및 바텀샤시(150)에 접촉되어 열을 방출시키도록 몰드프레임(110)의 내측면에서부터 몰드프레임(110)의 상부면과 외측면 및 몰드프레임(110)의 하부면을 감싼다.The heat emission layer 120 extends from the long side direction of the mold frame 110 to one side of the mold frame 110 in which the gate PCB 172 is installed, and the first mounting on the side where the gate PCB 172 is not installed. After extending to the portion 114 is formed, the upper surface and the outer surface of the mold frame 110 from the inner surface of the mold frame 110 so as to contact the top chassis 180 and the bottom chassis 150 to release heat. And a lower surface of the mold frame 110.
바람직하게, 열방출막(120)은 몰드프레임(110)을 사출하는 프레임(도시 안됨) 중 램프 어셈블리(130)가 위치하는 몰드프레임(110)의 측면이 형성되는 부분에 금속시트를 부착하여 몰드프레임(110)과 일체로 제작하는 메탈 인터커넥트 몰딩(metal interconnect molding)방식에 의해 형성된다.Preferably, the heat dissipation film 120 is a mold frame by attaching a metal sheet to a portion of the frame (not shown) for ejecting the mold frame 110 is formed on the side of the mold frame 110 where the lamp assembly 130 is located It is formed by a metal interconnect molding method integrally fabricated with (110).
이와 같이 램프 어셈블리(130)가 설치되는 도광판(142)의 내측면에 열방출막(120)을 형성할 경우 도 2b에 도시된 바와 같이 열방출막(120)을 램프 커버 대신 사용할 수 있어 램프 어셈블리(130)는 양단에 전극이 형성되어 빛을 출사하는 램프(132)와, 램프(132)의 전극과 전기적으로 연결되어 램프(132)에 고전압을 인가하는 와이어(136)로 구성된다. As such, when the heat dissipation film 120 is formed on the inner surface of the light guide plate 142 in which the lamp assembly 130 is installed, the heat dissipation film 120 may be used in place of the lamp cover as shown in FIG. 2B. ) Is formed of a lamp 132 having an electrode formed at both ends thereof to emit light, and a wire 136 electrically connected to the electrode of the lamp 132 to apply a high voltage to the lamp 132.
따라서, 액정표시장치(100)의 조립 공정에서 램프(132)의 외측면에 램프 커버를 감싸는 공정이 진행되지 않으므로 작업시간이 줄어들고 제품의 생산비용이 절감된다. Therefore, the process of wrapping the lamp cover on the outer surface of the lamp 132 in the assembling process of the liquid crystal display device 100 does not proceed, thus reducing the work time and the production cost of the product.
한편, 바텀샤시(150)는 수납공간(112)으로 인해 개구된 몰드프레임(110)의 후면을 폐쇄하여 몰드프레임(110)에 수납된 램프 어셈블리(130), 반사판(140), 도광판(142), 광학 시트류들(144)이 몰드프레임(110)에서 이탈되는 것을 방지하는 것으로, 몰드프레임(110)의 하부면에 형성된 열방출막(120)과 접촉되어 고온의 열을 외부로 방출한다.Meanwhile, the bottom chassis 150 closes the rear surface of the mold frame 110 opened by the storage space 112 to store the lamp assembly 130, the reflector plate 140, and the light guide plate 142 accommodated in the mold frame 110. In order to prevent the optical sheets 144 from being separated from the mold frame 110, the optical sheets 144 are in contact with the heat dissipation film 120 formed on the lower surface of the mold frame 110 to emit high temperature heat to the outside.
탑샤시(180)는 금속재질로 형성되어 LCD 패널(160)의 가장자리 소정영역과 몰드프레임(110)의 외측면을 감싸도록 몰드프레임(110)에 체결되는 것으로, 제 1 마운팅부(114)와 대응되는 측면에 제 2 마운팅부(도시 안됨)가 형성되어 열방출막(120)과 탑샤시(180)가 접촉된다.The top chassis 180 is formed of a metal material and fastened to the mold frame 110 so as to surround a predetermined area of the edge of the LCD panel 160 and the outer surface of the mold frame 110, and the first mounting part 114. A second mounting part (not shown) is formed on a corresponding side surface so that the heat dissipation film 120 and the top chassis 180 are in contact with each other.
이와 같이 탑샤시(180)와 열방출막(120)이 접촉되면 PCB(172, 174)에서 발생된 전자파가 열방출막(120)을 따라 탑샤시(180) 쪽으로 이동되기 때문에 전자파를 접지시키기 위한 별도의 장치를 설치하지 않아도 되며, 램프(132)에서 발생된 열이 탑샤시(180)쪽으로 방출된다.As such, when the top chassis 180 and the heat dissipation layer 120 are in contact with each other, the electromagnetic waves generated from the PCBs 172 and 174 are moved toward the top chassis 180 along the heat dissipation layer 120. It is not necessary to install the device, and heat generated from the lamp 132 is discharged toward the top chassis 180.
여기서, 미설명 부호 176은 몰드프레임(110)의 상부에 형성된 열방출막(120)과 게이트 PCB(172)가 단락되는 것을 방지하기 위해 게이트 PCB(172)와 몰드프레임(110) 사이를 절연시켜 주는 절연테이프이다.Here, reference numeral 176 insulates between the gate PCB 172 and the mold frame 110 in order to prevent the heat emitting film 120 formed on the mold frame 110 and the gate PCB 172 is short-circuited. Insulation tape.
도 2 실시예에 따르면 도 3에 도시된 바와 같이 램프 어셈블리(130)가 설치된 몰드프레임(110)의 장변방향 측면과 게이트 PCB(172)가 설치되는 몰드프레임(110)의 도광판(142)의 단변방향 일측면에는 삽입홈이 형성되는데, 삽입홈은 몰드프레임(110)의 외측면에서 수납공간(112) 쪽으로 소정깊이까지 형성되고 몰드프레임(110)의 장변 및 단변방향 측면의 상단부 소정영역과 하단부 소정영역에 각각 형성된다.Referring to FIG. 2, the long side of the mold frame 110 in which the lamp assembly 130 is installed and the short side of the light guide plate 142 of the mold frame 110 in which the gate PCB 172 is installed, as shown in FIG. 3. An insertion groove is formed on one side of the mold, and the insertion groove is formed to a predetermined depth from the outer surface of the mold frame 110 toward the storage space 112, and the predetermined region and the lower end of the upper end of the long side and the short side of the mold frame 110. It is formed in each predetermined area.
또한, 삽입홈에는 램프 어셈블리(130)에서 발생된 열이 몰드프레임(110)의 상부에 설치된 게이트 PCB(172)와 몰드프레임(110)의 후면에 설치된 소스 PCB(174)로 전달되는 것을 방지하기 위해 "ㄷ"자 형상의 열방출 샤시(125)를 삽입홈에 끼워넣는다.In addition, the insertion groove prevents heat generated from the lamp assembly 130 from being transferred to the gate PCB 172 installed on the upper portion of the mold frame 110 and the source PCB 174 installed on the rear surface of the mold frame 110. Insert the heat release chassis 125 of the "C" shape into the insertion groove.
이와 같이 몰드프레임(110)의 외측면에서 수납공간(112) 쪽으로 열방출 샤시(125)를 삽입할 경우에는 램프 어셈블리(130)에 램프 커버(134)가 반드시 필요하며, 전자파를 차폐하기 위한 도전성 클립도 필요하다.As such, when the heat dissipation chassis 125 is inserted into the storage space 112 from the outer surface of the mold frame 110, the lamp cover 134 is necessarily required in the lamp assembly 130, and conductive to shield electromagnetic waves. You also need a clip.
이상에서 설명한 바와 같이 램프 어셈블리가 접하고 게이트 및 소스 PCB가 위치하는 몰드프레임의 측벽과 제 1 마운팅부를 감싸도록 열방출막을 형성하거나, 몰드프레임의 외측면에서부터 수납공간쪽으로 형성된 삽입홈에 열방출 샤시를 삽입하여 램프에서 발생된 고온의 열이 열방출막을 따라 바텀샤시 및 탑샤시쪽으로 신속하게 방출시킴으로써, PCB에 열이 전달되는 것을 방지하여 LCD 모듈의 신뢰성을 향상시킬 수 있는 효과가 있다. As described above, the heat dissipation film is formed to surround the first frame and the side wall of the mold frame in which the lamp assembly is in contact with the gate and the source PCB, or the heat dissipation chassis is inserted into the insertion groove formed from the outer side of the mold frame toward the storage space. By inserting the high temperature heat generated from the lamp into the bottom chassis and the top chassis quickly along the heat release film, it is possible to prevent heat transfer to the PCB to improve the reliability of the LCD module.
또한, 램프 어셈블리가 접하는 몰드프레임의 측면과 제 1 마운팅부에 열방출막을 형성할 경우 램프 커버 및 클립을 조립하는 공정이 제거되어 제품의 생산성이 향상될 수 있는 효과가 있다.In addition, when the heat dissipation film is formed on the side of the mold frame and the first mounting portion in which the lamp assembly is in contact, the process of assembling the lamp cover and the clip is removed, thereby improving productivity of the product.
도 1은 본 발명의 의한 액정표시장치의 외관 구조를 나타낸 평면도이고,1 is a plan view showing an external structure of a liquid crystal display device according to the present invention;
도 2a는 본 발명의 제 1 실시예로 도 1의 A-A'선을 따라 절단한 종단면도이며,2A is a longitudinal cross-sectional view taken along line AA ′ of FIG. 1 as a first embodiment of the present invention;
도 2b는 본 발명의 제 1 실시예로 도 2의 B-B'선을 따라 절단한 종단면도이다.FIG. 2B is a longitudinal cross-sectional view taken along the line BB ′ of FIG. 2 according to the first embodiment of the present invention.
도 3은 본 발명의 제 2 실시예로 도 1의 A-A'선을 따라 절단한 종단면도이다.3 is a longitudinal cross-sectional view taken along line AA ′ of FIG. 1 according to a second embodiment of the present invention.
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019980034607A KR100628434B1 (en) | 1998-08-26 | 1998-08-26 | Backlight Assembly of Liquid Crystal Display |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019980034607A KR100628434B1 (en) | 1998-08-26 | 1998-08-26 | Backlight Assembly of Liquid Crystal Display |
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| Publication Number | Publication Date |
|---|---|
| KR20000014955A KR20000014955A (en) | 2000-03-15 |
| KR100628434B1 true KR100628434B1 (en) | 2006-12-04 |
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| KR1019980034607A KR100628434B1 (en) | 1998-08-26 | 1998-08-26 | Backlight Assembly of Liquid Crystal Display |
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Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100463390B1 (en) * | 2002-02-05 | 2004-12-23 | 일진다이아몬드(주) | TFT-LCD module |
| KR100803179B1 (en) * | 2002-04-11 | 2008-02-14 | 삼성전자주식회사 | Back light assembly and method for assembling thereof |
| KR100864983B1 (en) * | 2002-07-08 | 2008-10-23 | 엘지디스플레이 주식회사 | Backlight unit of liquid crystal display |
| KR100698045B1 (en) * | 2002-11-26 | 2007-03-23 | 엘지.필립스 엘시디 주식회사 | Liquid crystal display device |
| KR101002497B1 (en) * | 2002-12-06 | 2010-12-17 | 엘지디스플레이 주식회사 | Liquid crystal display device |
| KR100595314B1 (en) * | 2004-05-28 | 2006-07-03 | 엘지.필립스 엘시디 주식회사 | Backlight unit |
| KR20080008751A (en) | 2006-07-21 | 2008-01-24 | 삼성전자주식회사 | Display device |
| KR100900696B1 (en) * | 2007-09-06 | 2009-06-04 | 한성엘컴텍 주식회사 | Surface emission device having light emission devices |
| CN102323685B (en) | 2011-10-12 | 2014-04-02 | 深圳市华星光电技术有限公司 | Back plate and backlight module of liquid crystal display device, and liquid crystal display device |
| KR20140110539A (en) | 2013-03-08 | 2014-09-17 | 삼성디스플레이 주식회사 | Display apparatus |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08129174A (en) * | 1994-10-31 | 1996-05-21 | Kyocera Corp | Illuminator for liquid crystal display device |
| KR0125763Y1 (en) * | 1994-11-30 | 1998-10-15 | 엄길용 | Liquid crystal module |
-
1998
- 1998-08-26 KR KR1019980034607A patent/KR100628434B1/en not_active IP Right Cessation
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08129174A (en) * | 1994-10-31 | 1996-05-21 | Kyocera Corp | Illuminator for liquid crystal display device |
| KR0125763Y1 (en) * | 1994-11-30 | 1998-10-15 | 엄길용 | Liquid crystal module |
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