KR100625915B1 - End effector assembly - Google Patents

Abstract

Generally, an end effector assembly for a substrate transfer robot is provided. In one embodiment, the end effector assembly for a substrate transfer robot includes an end effector with a plurality of metal pads disposed thereon. A polymer pad is disposed on each metal pad and the ratio of the exposed portion of the metal pad top surface to the polymer pad top surface is at least about 3.5 to one. In another embodiment, the end effector assembly for a substrate transfer robot includes an end effector with a plurality of polymer pads disposed thereon. Each polymer pad includes a fluoropolymer coating disposed on at least the top of the polymer pad. Metal pads and / or coatings allow the polymer pad to be used at least temporarily in applications above normal operating temperatures.

Description

End Effector Assembly {END EFFECTOR ASSEMBLY}

Embodiments of the present invention relate to an end effector assembly for supporting substrates.

Thin film transistors (TFTs) are typically fabricated on large glass substrates or plates used in monitors, flat panel displays, solar cells, personal digital assistants (PDAs), cell phones, and the like. TFTs are fabricated by successive deposition of various films including amorphous silicon, doped and undoped silicon oxides, silicon nitride, and the like in vacuum chambers generally disposed around a central transfer chamber in a cluster tool. The production of high quality polysilicon precursor films used in such structures requires controlling the hydrogen content of the film to less than about 1%. To achieve this low hydrogen content, post-deposition heat treatment of the film at a temperature of about 550 ° C. is required.

Thus, robots used to move substrates in such cluster tools must have end effectors designed to withstand these high temperatures. In general, conventional transfer robots are not suitable for operation at such high temperatures. In particular, end effectors of vacuum robots used in plate processing systems generally include one or more rubber friction pads on which the substrate is located. Friction pads can generally prevent the substrate from sliding against the end effector as the robot moves the substrate from chamber to chamber. Several high temperature rubber compounds are available but are generally limited to a maximum operating temperature of about 320 ° C., well below the 550 ° C. desired for polysilicon heat treatment processes. When the end effector of the robot is exposed to high temperatures for more than 10 seconds, these conventional rubber pads generally melt and stick to the substrate. Rubber melted on the back of the substrate is undesirable due to potential contamination and sequential processing results. Moreover, once the rubber pad is removed from the end effector, the end effector scratches the back side of the substrate, generating particulates and damaging or breaking the substrate. In addition, when the rubber pad melts, it is difficult to replace the pad.

Thus, there is a need for end effectors suitable for use at high temperatures.

In one aspect of the invention, an end effector assembly for a substrate transfer robot is provided. In one embodiment, the end effector assembly for a substrate transfer robot includes an end effector with a plurality of metal pads disposed thereon. A polymer pad is disposed on each metal pad and the ratio of the exposed portion of the metal pad top surface to the polymer pad top surface is at least about 3.5 to one.

In another embodiment, an end effector assembly for a substrate transfer robot is provided that includes an end effector with a plurality of polymer pads disposed thereon. Each polymer pad includes a fluoropolymer coating disposed on at least the top of the polymer pad.

In another embodiment, an end effector is provided having a plurality of metal pads disposed thereon. A polymer pad is disposed on each metal pad, and the ratio of the exposed portion of the metal pad top surface to the polymer pad top surface is at least about 3.5 to 1. Each polymer pad includes a fluoropolymer coating disposed on at least the top of the polymer pad. Metal pads and / or coatings allow the polymer pad to be used at least temporarily in applications above normal operating temperatures.

In yet another embodiment, an end effector assembly for a substrate transfer robot is provided that includes an end effector with a plurality of polymer pads disposed thereon. Polymer pads have a patterned surface that minimizes heat transfer with the substrate.

The present invention briefly summarized above will be described in more detail with reference to the embodiments shown in the accompanying drawings.

The accompanying drawings, however, are merely illustrative of exemplary embodiments of the invention and are not to be considered as limiting the scope of the invention, which may allow other equally effective embodiments of the invention.

1 is a plan view of one embodiment of a processing system.

2 is a plan view of one embodiment of a transfer robot.

3 is a cross-sectional view of an embodiment of the support by the cutting line 3--3 of FIG.

4 is a cross-sectional view of the supporting part by the cutting line 4--4 of FIG.

5 is a cross-sectional view of an embodiment of the central support by the cutting line 5--5 of FIG.

6 is a cross-sectional view of another embodiment of a central support.

7 is a graph showing the ratio of pad materials attached to a substrate to the number of substrates being transferred.

8A-8F are perspective views of polymer pads.

9 is a graph showing temperature rise per exposure time for various embodiments of a polymer pad.

For ease of understanding, like elements that are common in the figures are designated by like reference numerals.

1 shows a schematic layout of the cluster tool 100. In general, the cluster tool 100 includes a transfer chamber 102 in which a first transfer robot 104 is disposed. The transfer chamber 102 is surrounded by a plurality of processing chambers 106, one thermal processing chamber 108 and at least one load lock chamber 110. The two load lock chambers 110 shown in FIG. 1 are generally connected between the transfer chamber 102 and the factory interface 112.

The factory interface 112 is generally a second transfer robot that transfers the substrates 116 between the load locks 110 and the plurality of wafer storage cassettes 118 connected to or disposed in the factory interface 112. 114). The second transfer robot 114 may be configured similarly to the first transfer robot 104 described later. Factory interface 112 is generally maintained at or near atmospheric pressure. The second transfer robot 114 is generally configured to move laterally within the factory interface 112 such that the substrate 116 minimizes handling and time consumption between the load locks 110 and the cassettes 118. To be transported.

Each load lock chamber 110 generally has no vacuum loss from the transfer chamber 102 between an atmosphere lower than the atmosphere where the substrate 116 is maintained in the transfer chamber 102 and the atmospheric environment of the factory interface 112. To be transported. The load lock chambers 110 are configured to transport one or more substrates 116 simultaneously, and may further heat or cool the substrate. One of the load lock chambers that can be advantageously used is disclosed in US Patent No. 09 / 464,362 filed on December 15, 1999 (Representative List No. 3790), which is hereby incorporated by reference in its entirety.

The transfer chamber 102 is generally made from one mass made of a material such as aluminum to minimize vacuum leakage. The transfer chamber 102 includes a plurality of passages 122 disposed on the wall of the chamber 102 to enable transfer of the substrate therethrough. Each passageway 122 is optionally sealed by an isolation valve 120. One of the isolation valves that can be advantageously used is disclosed in US Pat. No. 6,079,693, issued June 27, 2000 to Ettinger et al., Which is hereby incorporated by reference in its entirety.

The processing chambers 106 are generally disposed around the transfer chamber 102. The processing chambers 106 may be configured to include etching chambers, deposition chambers and / or other chambers suitable for fabricating a desired structure or device on a substrate.

The heat treatment chamber 108 generally heats or heats one or more substrates 116 disposed therein. Thermal processing chamber 108 generally includes at least one substrate support (not shown) suitable for supporting one or more substrates 116 within thermal processing chamber 108. Thermal treatment chamber 108 may further include a thermal control system (not shown) that may include a lamp, resistive heater, fluid conduit, and the like, to uniformly heat the substrate to about 550 ° C. One of the thermal treatment chambers that can be advantageously used is disclosed in U.S. Provisional Application No. 60 / 259,035 filed on December 29, 2000 by Q. Shang (Representative Directory No. 5603L), which is hereby incorporated by reference in its entirety. Included as.

The first transfer robot 104 is disposed at the center of the transfer chamber 102. In general, the first transfer robot 104 is configured to transfer the substrates 116 between the chambers 106, 108, 110 that surround the transfer chamber 102. The first transfer robot 104 is generally configured to handle one substrate, but robots configured to handle multiple substrates may be used.

2 is a plan view of one embodiment of a first transfer robot 104. The first transfer robot 104 generally includes a robot body 202 connected by an linkage 204 to an end effector 206 that supports a substrate 116 (shown in phantom) on top. End effector 206 may be configured to hold the substrate thereon in a desired manner, eg, with friction, static electricity, vacuum chucks, clamps, edge grips, and the like. In one embodiment, the linkage 204 has a frog leg arrangement. Other arrangements for the linkage 204 may be used instead, for example a polar arrangement. An example of a polar robot that would benefit from the present invention is disclosed in US Patent No. 09 / 547,189 filed April 11, 2000 by Ettinger et al., Which is hereby incorporated by reference in its entirety.

The linkage 204 generally includes two wings 208 connected to two arms 212 by elbows 210. Each wing 208 is further connected to an electric motor (not shown) stacked concentrically within the robot body 202. Each arm 212 is connected to a wrist 216 by a bushing 214. The wrist 216 connects the linkage 204 to the end effector 206. Generally, the linkage 204 is made of aluminum, but materials having sufficient strength and smaller coefficient of thermal expansion, such as ceramics such as titanium, stainless steel, metal matrix or titanium doped alumina, may be used.

Each wing 208 is independently controlled by one of the concentric stacked motors. When the motors rotate in the same direction, the end effector 206 rotates at a predetermined angle at a radius about the center 218 of the robot body 202. As both motors rotate in the opposite direction, the linkage 204 expands or contracts accordingly, leading to an imaginary line 220 passing the end effector 206 through the center 218 of the first transfer robot 104. Move radially inward or outward. The first transfer robot 104 may also perform a hybrid operation that combines radial and rotational motions simultaneously.

The end effector 206 is generally made of aluminum, quartz, carbon, metal matrix or ceramic and is configured to minimize and deflect the substrate. In the embodiment shown in FIG. 2, the end effector 206 is ceramic and includes a base 228 from which the first member 230 and the second member 232 extend. The base 228 is connected to the list 216 of the first transfer robot 104. The first member 230 and the second member 232 are generally disposed in a typical mirror symmetrical spaced relationship about the imaginary line 220. The length and spacing between the first member 230 and the second member 232 are selected to adequately support the substrate while minimizing substrate deflection during transfer. At least one connecting member 234 is connected between the first member 230 and the second member 232 to provide additional structural strength to the end effector 206.

End effector 206 generally includes a plurality of substrate supports 222 disposed thereon to support the substrate. In the embodiment shown in FIG. 2, the end effector 206 has a total of six substrate supports 222 disposed three on each of the first and second members 230, 232. Substrate supports 222 generally include a number of edge supports 224 used with at least one central support 226. Two edge supports 224 and one central support 226 are shown on each member 230, 232.

3 shows a cross-sectional view of one embodiment of the edge support 224 by cut line 3--3 of FIG. Edge support 224 generally includes a metal pad 302 and a polymer pad 304. The metal pad 302 has a substrate contact top 306 and a mounting bottom 308. The bottom surface 308 is disposed on the end effector 206. The bottom 308 may be connected to the end effector 206 by adhesives, staking, screws, rivets or other fasteners. In the embodiment shown in FIG. 3, the metal pad 302 has a bottom surface of the end effector 206 through each hole 312 through the end effector 206, the polymer pad 304, and the metal pad 302. It is connected to the end effector 206 by a number of fasteners 310 (eg, two are shown) that are coupled to a nut or threaded insert 314 disposed in 316.

The top surface 306 of the metal pad 302 is partially covered with the polymer pad 304. In general, the ratio of the exposed portion of the top surface 306 to the exposed portion of the polymer pad 304 is at least about 3.5 to one. Since heat transfer from the metal pad 302 is faster than the polymer pad 304, heat is easily transferred from the metal pad 302, thereby acting as a heat sink for the polymer pad 304. The larger exposed area of the metal pad 302 causes heat to dissipate quickly from the metal pad 302, thereby cooling the polymer pad 304 connected to it.

One end of the metal pad 302 may include a lip 322 that projects upward from the top surface 306. In general, the lip 322 extends beyond the polymer pad 304 such that slipping in at least one direction when the substrate 116 is seated on the polymer pad 304 is suppressed by the lip 322.

The metal pad 302 is generally made of a thermally conductive metal. In one embodiment, the metal pad 302 is made of aluminum. The metal pad 302 may be further finished to improve the heat transfer rate. Polishing, coating, plating and other heat transfer enhancing operations or finishing of materials. The metal pad 302 may be mirror polished to at least 4 rms or more smooth surface finish. Alternatively and / or in addition, the metal pad 302 may be electropolished. The smooth polished surface extends the contact area between the metal pad 302 and the polymer pad 304 and the contact area between the metal pad 302 and the end effector 206, thus extending the contact area available for heat transfer. Let's do it. In addition, the smooth and / or polished surface finish of the exposed portion of the metal pad 302 reflects heat such that the metal pad 302 does not readily absorb heat while the end effector 206 is placed close to the hot zone. .

Polymer pad 304 generally consists of a high temperature polymer. In one embodiment, the polymer pad 304 is comprised of fluorocarbon elastomers. Examples of suitable compounds for the manufacture of the polymer pad 304 include, but are not limited to, high temperature plastics, polybenzimidazoles, fluoropolymers, VITON, KALREZ, CERAZOLEPBI, CHEMREZ, Parker FF350-75, and the like.

In one embodiment, the polymer pad 304 is white. The white polymer pad 304 is generally black and reduces the emissivity of the polymer pad compared to conventional high temperature polymers having emissivity greater than 0.8. In one embodiment, the emissivity of the white polymer pad is less than about 0.7, which results in about 14% improvement in heat absorption over the black material, bringing the polymer pad 302 to a cooling temperature (ie, less than about 350 ° C.). And substantially prevent the pad from adhering to the substrate. The polymer pad 304 is a layer, film or coating and may be bonded, pressed or snapped to the metal pad 302, cured or fixed. The polymer pad 304 may also be molded into the metal pad 302 and may include an insert molded therein to fit with the fastener penetrating the metal pad 302. Other methods of holding the elastomeric pads on the metal pad 302 are also contemplated.

Referring to the cross-sectional view of the polymer pad 304 of FIG. 4, the polymer pad 304 may optionally include a coating 402 on one or more sides of the pad 304. In one embodiment, the coating 402 is made of fluoropolymer disposed on at least the top surface 404 of the polymer pad 304. In the embodiment shown in FIG. 3, a coating 402 is further disposed on the underside 406 of the polymer pad 304. Coating 402 generally protects the underlying polymer (eg, polymer pad 304) from direct exposure to hot surfaces and radiant heat sources. Depending on the temperature at which the end effector 206 is exposed and depending on the material selection for the polymer pad 304 and the coating 402, the metal pad 302 may be removed in some configurations.

Referring back to FIG. 3, the end effector 206 may further include a thin metal layer 320. In one embodiment, metal layer 320 includes a reflective metal layer, such as aluminum, disposed on at least the top of end effector 206. The metal layer 320 is polished or electropolished to increase the radiation reflectivity of the metal layer 320. The thermal conductivity of the metal layer 320 further assists heat extraction from the metal pad 302, thereby maintaining the polymer pad 304 below the temperature at which the polymer pad 304 begins to stick to the substrate 116. .

5 illustrates one embodiment of a central support 226. The central support 226 generally includes a metal pad 502 with a polymer pad 504 disposed thereon. The central support 226 is generally identical to the edge support 224 described with reference to FIGS. 3 and 4 except that the metal pad 502 does not include a lip. The central support 226 may be used to support one or more edges of the substrate 116, but is generally used to support a central region of the substrate.

The central support 226 optionally includes a coating 506 disposed on at least the top surface 508 of the polymer pad 504. Coating 506 is generally the same as coating 402 described above.

6 is a cross-sectional view of another embodiment of a central support 600. The central support 600 generally includes a metal pad 604 disposed on the end effector 206. In general, a hot O-ring or gasket 602 is disposed on the top surface 618 of the metal pad 604. In the embodiment shown in FIG. 6, gasket 602 is biased against metal pad 604 by bushing 606. Bushing 606 is generally made of a material having high thermal conductivity, such as aluminum. The paste 608 is disposed in a hole 612 formed through the bushing 606, the metal pad 604 and the end effector 206. The fasteners 608 may be screws, rivets, dowel pins, spring pins, or other fasteners. In the embodiment shown in FIG. 6, the fastener 608 is engaged with a threaded nut 616 disposed under the end effector 206. The bottom of the end effector 206 may include a counter bore 614 that allows the nut 616 and the fastener 608 to remain at the same height or is recessed from outside the end effector 206.

Because the fastener 608 secures the bushing 606 to the metal pad 604, the angled sidewall 610 of the bushing 606 holds the gasket 602 to the metal pad 604. In general, the height of the bushing 606 relative to the metal pad 604 is determined by the diameter of the gasket 602 to prevent contact between the substrate 116 and the bushing 606 during operation of the first mobile robot 104. Or height).

7 is a graph showing the advantages of the present invention. The vertical axis 702 represents the pad trace remaining on the substrate as the ratio of the residue area remaining on the substrate to the contact area of the polymer pad. Horizontal axis 704 represents the number of cycles (ie, the number of substrates transferred to the polymer pads). Each cycle represents an exposure at about 550 ° C. for 10-15 seconds. Lines 706-716 represent test results using various substrate supports constructed as described in the chart below.

Line number Polymer pad material coating Metal pad

   706 Kalrez 8475

   708 Parker FF350-75

   710 Kalrez 8575 No

   712 Kalrez 8575

   714 Kalrez 8475

   716 Kalrez 8475

   718 Kalrez 8575

720 Chemrez SD653 Radish

As shown in Figure 7, the substrate supports of the invention substantially reduce or eliminate the adhesion of the polymer pad material to the substrate after repeated cycles. Contamination reduction and removal of the substrate by the substrate supports correspondingly increases device yield. Moreover, among other properties, the heat transfer characteristics, including the color of the polymer pad, the size ratio between the metal pad and the polymer pad, and the surface finish, are at a rate that allows exposure to temperatures above the rated temperature of the material comprising the polymer pad itself. The polymer pads are cooled effectively.

8A-8F illustrate various embodiments of a polymer pad having a patterned top surface that minimizes the contact area that can be used for heat transfer between the substrate and the polymer pad. By minimizing the contact area that can be used for heat transfer, the hot substrate will not heat up the polymer pad as quickly as a pad with a contact area covering the entire top surface of the polymer pad. 8A-8F illustrate some exemplary patterns for reducing the contact area between a polymer pad and a substrate supported thereon, although other patterns may be considered and considered within the scope of the following claims.

8A shows a perspective view of polymer pad 800A. Pad 800A includes patterned top surface 802A. A plurality of dimples 804 are formed on the upper surface 802A. Dimples 804 may have any geometry and may be disposed on top surface 802A in a symmetrical, regular (ie equidistant) or arbitrary pattern. The dimples 804 extend below the plane of the top surface 802A supporting the substrate, thereby reducing the contact area between the pad 800A and the substrate.

In the embodiment shown in FIG. 8B, the polymer pad 800B includes a patterned top surface 802B that includes a plurality of protrusions 806, and the plurality of protrusions 806 extend from the top surface 802B. The protrusions 806 may have any geometry and may be disposed on the top surface 802B in a symmetrical, regular (ie equidistant) or any pattern. Each protrusion 806 has a top 808 on the coplanar plane that supports the substrate seated thereon. Top 808 may be flat, as shown, or curved or pointed. Since the substrate is seated on the protrusions 806, the contact area of the pad 800B with the substrate is reduced.

In the embodiment shown in FIG. 8C, the polymer pad 800C includes a patterned top surface 802C composed of a grating 810, with the grating 810 extending from the top surface 802C. Grating 810 generally consists of a web of protruding support members 812 that may have any geometry and may be disposed on top surface 802C in a symmetrical, regular (ie equidistant) or arbitrary pattern. The support member 812 generally protrudes into a coplanar surface supporting a substrate seated thereon and forms a recessed region 814 therebetween. Since the substrate is seated on the support members 812 of the grating 810, the contact area of the pad 800C is reduced.

In the embodiment shown in FIG. 8D, the polymer pad 800D includes a patterned top surface 802D composed of a mesh 816, with the mesh 816 extending from the top surface 802D. Mesh 816 generally consists of a number of intersecting ridges 818 protruding from top surface 802D. The ridge lines 818 may intersect at any angle and may be straight, curved or complex. The ridge lines 818 may be disposed on the top surface 802D in a symmetrical, regular (ie equidistant) or arbitrary pattern. Ridges 818 generally protrude into a coplanar surface supporting a substrate seated thereon and form a recessed region 820 therebetween. As the substrate rests on the ridges 818 of the mesh 816, the contact area of the pad 800D is reduced.

In the embodiment shown in FIG. 8E, the polymer pad 800E includes a patterned top surface 802E consisting of a plurality of ridges 822, with the plurality of ridges 822 extending from the top surface 802E. The ridge lines 822 generally protrude from the top surface 802E and may be straight, curved or complex. The ridge lines 822 may be disposed on the top surface 802E in a symmetrical, regular (ie equidistant) or any pattern. Ridges 822 generally protrude into a coplanar surface supporting a substrate seated thereon and form a recessed region 824 therebetween. As the substrate rests on the ridges 822, the contact area of the pad 800E is reduced.

In the embodiment shown in FIG. 8F, the polymer pad 800F includes a patterned top surface 802F in which a plurality of grooves 826 are formed. The grooves 826 generally protrude into the top surface 802F and may be straight, curved or complex. The grooves 826 may be disposed on the top surface 802F in a symmetrical, regular (ie equidistant) or arbitrary pattern. The grooves 826 reduce the surface area of the top surface 802F supporting the substrate seated thereon, thereby reducing the contact area of the pad 800F.

9 is a graph showing the advantages of the patterned surface of the polymer pad described above. Vertical axis 902 represents the polymer pad temperature in degrees Celsius. Horizontal axis 904 represents the exposure time in seconds. Lines 906-912 represent test results using various substrate supports constructed as described in the chart below.

Line number Polymer pad material pattern Pad color

   906 CHEMREZ Flat Black

   908 KALREZ Flat White

   910 CHEMREZ protrusion black

912 KALREZ protrusion white

As shown in FIG. 9, the patterned polymer pads of the present invention substantially reduce pad temperature rise when exposed to a hot substrate. Thus, the tendency of the polymer pad to stick to the substrate after repeated cycles is reduced, and the service life of the polymer pad is extended.

While the embodiments of the present invention have been described above, another embodiment of the present invention is possible without departing from the spirit and scope determined by the following claims.

Claims (47)

An end effector assembly for a substrate transfer robot, End effector; A plurality of metal pads having a top surface and a bottom surface disposed on the first side of the end effector; And A polymer pad having a top surface and a bottom surface and disposed on each of the metal pads; The ratio of the exposed portion of the top of the metal pad to the top of the polymer pad is at least about 3.5 to 1, End effector assembly. The method of claim 1, At least one of the polymer pads is white, End effector assembly. The method of claim 1, At least one of the polymer pads has a top surface coated with a fluoropolymer, End effector assembly. The method of claim 1, At least one of the polymer pads has at least a top surface coated with a fluoropolymer, End effector assembly. The method of claim 1, At least one of the polymer pads is secured to the metal pad, End effector assembly. The method of claim 1, At least one of the polymer pads is rod fixed, screwed, bolted, riveted, attached, cured or molded to the metal pad, End effector assembly. The method of claim 1, At least one of the polymer pads has an emissivity of less than about 0.7, End effector assembly. The method of claim 1, The metal pad is mirror polished to more than 4 rms or more smoothly, End effector assembly. The method of claim 1, The metal pad is electropolished, End effector assembly. The method of claim 1, The metal pad is made of aluminum, End effector assembly. The method of claim 1, The metal pad further comprising a lip extending from the top surface to a height above the polymer pad top surface, End effector assembly. The method of claim 1, The end effector consists of a ceramic or quartz material, End effector assembly. The method of claim 1, The end effector comprising a metal layer disposed on a first side, End effector assembly. The method of claim 13, The metal layer is aluminum, End effector assembly. The method of claim 13, Wherein the metal layer is electropolished or mirror polished, End effector assembly. The method of claim 1, wherein the end effector, A base portion; A first member extending from the base to a first end; And And a second member extending from the base portion to the second end portion in a spaced relationship with the first member. Two or more substrate supports are disposed on the first member and the second member, each substrate support comprising one metal pad and one polymer pad, End effector assembly. The method of claim 1, The top surface of the polymer pad is patterned, End effector assembly. The method of claim 1, Wherein the pattern comprises a plurality of dimples or protrusions, gratings, meshes, grooves or ridges, End effector assembly. An end effector assembly for a substrate transfer robot, End effector; A plurality of polymer pads disposed on said end effector, said plurality of polymer pads having top and bottom surfaces suitable for supporting a substrate; And Comprising; a fluoropolymer coating disposed on at least an upper surface of the polymer pad; End effector assembly. The method of claim 19, A metal pad having a top surface and a bottom surface and disposed between the respective polymer pads and the end effector, The bottom surface is disposed on the first side of the end effector and the ratio of the exposed portion of the top surface of the metal pad to the top surface of the polymer pad is at least about 3.5 to 1, End effector assembly. The method of claim 19, The polymer pad is white, End effector assembly. The method of claim 19, Wherein the polymer pad is rod fixed, screwed, bolted, riveted, attached, cured or molded to the end effector, End effector assembly. The method of claim 19, At least one of the polymer pads has an emissivity of less than about 0.7, End effector assembly. The method of claim 20, At least one of the metal pads is mirror polished to at least 4 rms or more smoothly, End effector assembly. The method of claim 20, At least one of the metal pads is electropolished, End effector assembly. The method of claim 20, At least one of the metal pads further comprises a lip extending from a top surface thereof to a height above the polymer pad top surface, End effector assembly. The method of claim 19, The end effector is made of ceramic or quartz material, End effector assembly. The method of claim 27, The end effector comprising a metal layer disposed on a first side, End effector assembly. The method of claim 28, The metal layer is aluminum, End effector assembly. The method of claim 28, Wherein the metal layer is electropolished or mirror polished, End effector assembly. The method of claim 19, wherein the end effector, A base portion; A first member extending from the base to a first end; And And a second member extending from the base portion to the second end portion in a spaced relationship with the first member. Two or more substrate supports are disposed on the first member and the second member, each substrate support comprising one metal pad and one polymer pad, End effector assembly. The method of claim 19, At least one of the polymer pads is patterned on top of the polymer pad, End effector assembly. The method of claim 32, Wherein the pattern comprises a plurality of dimples or protrusions, gratings, meshes, grooves or ridges, End effector assembly. An end effector assembly for a substrate transfer robot, End effector; A plurality of metal pads having a top surface and a bottom surface disposed on the first side of the end effector; A polymer pad having a top surface and a bottom surface and disposed on each of the metal pads; And And a fluoropolymer coating disposed on at least an upper surface of the polymer pad. The ratio of the exposed portion of the top of the metal pad to the top of the polymer pad is at least about 3.5 to 1, End effector assembly. The method of claim 34, wherein At least one of the polymer pads is white, End effector assembly. The method of claim 34, wherein At least one of the polymer pads is rod fixed, screwed, bolted, riveted, attached, cured or molded to the metal pad, End effector assembly. The method of claim 34, wherein At least one of the polymer pads has an emissivity of less than about 0.7, End effector assembly. The method of claim 34, wherein The metal pad is mirror polished to more than 4 rms or more smoothly, End effector assembly. The method of claim 34, wherein The metal pad is electropolished, End effector assembly. The method of claim 34, wherein The metal pad further comprising a lip extending from the top surface to a height above the polymer pad top surface, End effector assembly. The method of claim 34, wherein The end effector consists of a ceramic or quartz material, End effector assembly. 42. The method of claim 41 wherein The end effector comprising a metal layer disposed on the first side, End effector assembly. The method of claim 42, The metal layer is aluminum, End effector assembly. The method of claim 42, Wherein the metal layer is electropolished or mirror polished, End effector assembly. The method of claim 34, wherein the end effector, A base portion; A first member extending from the base to a first end; And And a second member extending from the base portion to the second end portion in a spaced relationship with the first member. Two or more substrate supports are disposed on the first member and the second member, each substrate support comprising one metal pad and one polymer pad, End effector assembly. The method of claim 34, wherein The top surface of the polymer pad is patterned, End effector assembly. The method of claim 46, Wherein the pattern comprises a plurality of dimples or protrusions, gratings, meshes, grooves or ridges, End effector assembly.

Images