AU2001280503A1 - Robotic end effector for semiconductor wafer processing - Google Patents

Robotic end effector for semiconductor wafer processing

Info

Publication number
AU2001280503A1
AU2001280503A1 AU2001280503A AU8050301A AU2001280503A1 AU 2001280503 A1 AU2001280503 A1 AU 2001280503A1 AU 2001280503 A AU2001280503 A AU 2001280503A AU 8050301 A AU8050301 A AU 8050301A AU 2001280503 A1 AU2001280503 A1 AU 2001280503A1
Authority
AU
Australia
Prior art keywords
semiconductor wafer
end effector
wafer processing
robotic end
robotic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001280503A
Inventor
Nis Krauskoft
Dominic G. Pelletier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Innovent Inc
Original Assignee
Innovent Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Innovent Inc filed Critical Innovent Inc
Publication of AU2001280503A1 publication Critical patent/AU2001280503A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
AU2001280503A 2000-07-10 2001-07-10 Robotic end effector for semiconductor wafer processing Abandoned AU2001280503A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US21717300P 2000-07-10 2000-07-10
US60217173 2000-07-10
PCT/US2001/021710 WO2002005326A2 (en) 2000-07-10 2001-07-10 Robotic end effector provided with wafer supporting pads elastically mounted

Publications (1)

Publication Number Publication Date
AU2001280503A1 true AU2001280503A1 (en) 2002-01-21

Family

ID=22809948

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001280503A Abandoned AU2001280503A1 (en) 2000-07-10 2001-07-10 Robotic end effector for semiconductor wafer processing

Country Status (3)

Country Link
US (1) US20020041102A1 (en)
AU (1) AU2001280503A1 (en)
WO (1) WO2002005326A2 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6634686B2 (en) * 2001-10-03 2003-10-21 Applied Materials, Inc. End effector assembly
US7048316B1 (en) * 2002-07-12 2006-05-23 Novellus Systems, Inc. Compound angled pad end-effector
US7032287B1 (en) 2002-07-19 2006-04-25 Nanometrics Incorporated Edge grip chuck
US7641247B2 (en) * 2002-12-17 2010-01-05 Applied Materials, Inc. End effector assembly for supporting a substrate
US7458457B2 (en) * 2004-12-22 2008-12-02 Hiller Diane E Jewelry holder
US20070221335A1 (en) * 2006-03-23 2007-09-27 Recif Technologies Device for contact by adhesion to a glass or semiconductor plate (wafer) surface or the like and system for gripping such a plate comprising such a device
JP6224437B2 (en) * 2013-11-26 2017-11-01 東京エレクトロン株式会社 Substrate transfer device
KR102177156B1 (en) 2014-03-10 2020-11-10 삼성전자주식회사 robot and substrate processing apparatus including the same
US10014205B2 (en) * 2015-12-14 2018-07-03 Kawasaki Jukogyo Kabushiki Kaisha Substrate conveyance robot and operating method thereof
JP6833350B2 (en) * 2016-06-01 2021-02-24 キヤノン株式会社 Manufacturing methods for holding devices, transport devices, lithography equipment, and articles
US10399231B2 (en) 2017-05-22 2019-09-03 Taiwan Semiconductor Manufacturing Company, Ltd. Substrate handling contacts and methods
JP6830980B2 (en) * 2019-05-16 2021-02-17 本田技研工業株式会社 Cooling structure of vehicle battery unit
JP7415782B2 (en) * 2020-05-11 2024-01-17 東京エレクトロン株式会社 Substrate transfer mechanism and substrate transfer method

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0590238A (en) * 1991-09-27 1993-04-09 Dainippon Screen Mfg Co Ltd Substrate rotary holding jig of pivoted substrate treating device
JP3151118B2 (en) * 1995-03-01 2001-04-03 東京エレクトロン株式会社 Heat treatment equipment
US6146504A (en) * 1998-05-21 2000-11-14 Applied Materials, Inc. Substrate support and lift apparatus and method
DE10003639C2 (en) * 2000-01-28 2003-06-18 Steag Rtp Systems Gmbh Device for the thermal treatment of substrates

Also Published As

Publication number Publication date
US20020041102A1 (en) 2002-04-11
WO2002005326A2 (en) 2002-01-17
WO2002005326A3 (en) 2002-05-23

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