KR100623349B1 - Film for organic electroluminescent device kit - Google Patents

Abstract

The present invention discloses a film for an organic electroluminescent device kit having a structure capable of preventing the generation of metallic particles in the process of separating into unit films and suppressing the shape deformation of each metal wiring formed in the pad portion. The film for an organic EL device kit according to the present invention comprises a first pad portion connected to the relay board and a second pad portion connected to the pad of the device panel at both ends, the first pad is the second pad of the adjacent film, respectively. And the second pad on which the cut line is formed is connected to the first pad of another adjacent film to cut the cut line of the second pad. Here, an insulating layer having a predetermined width is formed to cross a plurality of metal wires on the cut line of the second pad part, and a plating layer is formed in an area of the metal wires except for the insulating layer forming area.

Film for Organic Electroluminescent Device Kit

Description

Film for organic electroluminescent device kit

1 is a plan view showing a typical organic electroluminescent device kit.

FIG. 2 is a cross-sectional view taken along the line A-A of FIG. 1, with the panel and the relay board separated.

3 is a plan view of the film shown in FIG.

4 is a cross-sectional view taken along line B-B of FIG. 3.

5 is a plan view of a film for an organic EL device kit according to the present invention.

6 is a cross-sectional view taken along the line D-D.

The present invention relates to a film for an organic electroluminescent device kit, and relates to a film for an organic electroluminescent device kit capable of suppressing generation of conductive metal particles appearing in the process of transferring a film wound in a reel form to a unit film.

The organic electroluminescent device kit is a subassembly including an organic electroluminescent device, and a general organic electroluminescent device kit is shown in FIG. 1. The conventional organic EL device kit as shown in FIG. 1 includes a panel 10, a bracket 20, and a relay board 30.

The bracket 20 is mounted in a state of surrounding the panel 10 to support the panel 10. In addition, the relay board 30 positioned below the panel 10 and the bracket 20 has a cutout formed at the center thereof to accommodate the lower panel 10, and an outer portion thereof, that is, the outside of the bracket 20. In the exposed area, various elements such as a DC power supply unit for applying DC power to the organic EL device of the panel 10 are mounted.

FIG. 2 is a cross-sectional view taken along the line A-A of FIG. 1 and clearly shows the structure of the above-described device kit. On the other hand, as shown in Figure 2, the pad portion of the panel 10 supported by the bracket 20, the film 11 (COF; chip on which the integrated circuit chip 13 for driving the organic electroluminescent element is mounted) film, hereinafter referred to as "film", one end (pad portion) is connected.

In the device kit shown in FIG. 2, the film 11 extending to one side of the panel 10 is bent toward the panel 10, and at its distal end, the relay board 30 is located below the panel 10. The solder part 12 (solder or pad part) for the electrical connection of the pad part of this, and the panel 10 is formed.

The integrated circuit chip 13 for driving the organic electroluminescent element is mounted on the bottom of the film 11 adjacent to the solder portion 12. On the other hand, after extending to the outside of the panel 10, the film 11 facing each other due to the bent portion is shown in a spaced apart state in Figure 2, in the actual organic electroluminescent device kit is attached to each other through a double-sided tape have.

3 is a plan view of a state in which the film 11 shown in FIG. 2 is developed, and as described above, pads for electrical connection with the panel 10 and the relay board 30 of the device 11 are provided at both ends of the film 11. The parts 14 and 12 are comprised, respectively, and the center part shows the integrated circuit chip 13 for driving an element.

FIG. 4 is a cross-sectional view taken along the line BB of FIG. 3 and shows a plurality of conductive metals formed in the pad portion 14 and the pad portion 14 for connection with the panel 10 of the element in the film 11. The wirings 14A are shown.

In the manufacturing process of the film, the film 11 as shown in FIG. 3 is manufactured in a continuously connected state, and is then wound in a reel form and shipped. The film wound in reel form is cut into unit films to make up the kit shown in FIG. 2. On the other hand, the integrated circuit chip 13 shown in FIG. 3 is not mounted on the film wound in the reel form, and the integrated circuit chip 13 is mounted in a predetermined area after being cut into a unit film.

As described above, the pad portion 14 formed at one end of the film 11 is a portion electrically connected to the pad portion of the organic electroluminescent device panel 10, and a plurality of metal wires 14A are formed on the surface thereof. It is. A plurality of metal lines (data lines and scan lines) are formed on the pad portion of the organic light emitting device panel 10 with a fine pitch, and thus a plurality of metal lines formed on the pad portion 14 of the film 11. 14A also have a fine pitch.

On the other hand, a gold plated layer (not shown) is formed on the surface of the plurality of metal wires 14A formed on the pad portion 14 of the film 11, and the gold plated layer reduces the resistance of the metal wires 14A. To perform the function. In addition, since gold has low ductility, the metal wires 14A of the pad portion 14 of the film 11 may be smoothly fused to the metal lines formed on the pad portion of the organic electroluminescent device panel 10. have.

In order to obtain a unit film having such a structure, a film wound in a reel shape is cut by using a punching or cutting facility, and the punching tool or the cutting tool is a line in FIG. Contact CC.

Therefore, the punching or cutting tool made of a metallic material comes into contact with the metal wires 14A on which the gold plating layer is formed. Prior to this, the force of the punching tool or cutting tool acts on the gold plating layer formed on the surface of the metal wires 14A.

As the cutting tool rotates, fine metal particles are generated in the gold plating layer, and the metal particles remain in the pad portion 14. As described above, the plurality of metal wires 14A formed on the pad portion 14 of the film 11 have a very narrow pitch (45 μm, which is a general pitch between data lines of the organic electroluminescent element), and thus fine metal particles. They act as a factor that causes a short circuit of wires in the electrical connection process with the organic electroluminescent device panel 10.

In addition, the metal wires 14A may be bent due to contact with the metallic cutting tool and pressurized by the metal tool, and the cutting surface may be uneven. Such a shape of the metal lines 14A in the film 11 may also cause a short circuit of the lines in the electrical connection process with the organic electroluminescent element panel.

The present invention is to solve the above-mentioned problems caused by the structure of the film constituting the organic electroluminescent device kit, to prevent the occurrence of metallic particles in the process of separating into a unit film of each metal wiring formed in the pad portion It is an object of the present invention to provide a film for an organic electroluminescent device kit having a structure capable of suppressing shape deformation.

The film for an organic electroluminescent device kit according to the present invention for achieving the above object is composed of a first pad portion connected to the relay board and a second pad portion connected to the pad of the element panel at both ends, the first pad is The second pad of the adjacent film and the second pad on which the cut line is formed are manufactured by being connected to the first pad of another adjacent film to cut the cut line of the second pad. Here, an insulating layer having a predetermined width is formed to cross a plurality of metal wires on the cut line of the second pad part, and a plating layer is formed in an area of the metal wires except for the insulating layer forming area.

Hereinafter, the organic electroluminescent device kit according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 5 is a plan view of a film for an organic EL device kit according to the present invention, for convenience, illustrates a state after being cut into a unit film, and also illustrates a part of a cutting line outside of a pad in contact with a cutting tool.

The structure of the film for organic electroluminescent device kits according to the present invention is also the same as that of the general film shown in FIGS. 3 and 4. That is, the integrated circuit chip mounting area 23 is provided at the center of the base member 21A of the film 21, and at both ends, the pad of the relay board (30 in FIG. 1) and the organic electroluminescent element panel (10 in FIG. 1). The first pad portion 22 and the second pad portion 24 are respectively formed to be electrically connected to the pads of the pads. In addition, a plurality of conductive wires 22A and 24A are formed in each pad part 22 and 24, of course.

The biggest feature of the film 21 for an organic electroluminescent device kit according to the present invention is that all metal wirings the insulating layer 24B of a predetermined width on the second pad portion 24 connected to the pad of the organic electroluminescent device panel. It is formed in the form of crossing (24A). This insulating layer 24B is formed of a nonmetallic material, for example, polymide, or the like, and coincides with the cut line C-C.

After the insulating layer 24B is formed as described above, a gold plating layer is formed on the metal wires 24A using the electroplating method. In the gold plating layer forming process, the plating layer is not formed on the insulating layer 24B, and the gold plating layer is formed only on the surface of the metal wiring 24A made of metal such as copper or nickel.

FIG. 6 is a cross-sectional view taken along the line D-D in FIG. 5 and shows the relationship between the metal wiring 24A, the insulating layer 24B, and the gold plating layer 24C.

In FIG. 6, the metal wiring 24A formed on the film base member 21A of the second pad part 24, the insulating layer 24B and the metal wiring having a predetermined width formed across the metal wiring on the metal wiring 24A. The gold plating layer 24C formed in the remaining area | region except the insulating layer 24B formation area among 24A of surface areas is shown.

Referring to the phenomenon appearing in the process of cutting the film wound in the reel form, the second pad portion 24 is configured as a unit film as follows.

In order to obtain a unit film, a film wound in a reel shape is cut by using a punching or cutting facility, in which a punching tool or a cutting tool is cut along a line CC of FIG. 6, which is a cutting line of the second pad part 24. Contact.

As described above, an insulating layer 24B made of a nonmetallic material is formed on the cutting schedule line C-C, so that the metallic cutting tool comes into contact with the insulating layer 24B. In this state, the force of the cutting tool first acts on the insulating layer 24B and then is transmitted to the metal wiring 24A.

In the process of cutting the metal wiring 24A by the cutting tool, the insulating layer 24B formed thereon suppresses external scattering of the metal fine particles that may be formed in the metal wiring 24A to be cut. In particular, since the cutting tool does not contact the gold plated layer as compared with the conventional technique of cutting the gold plated layer formed on the surface of the metal wiring 24A, it is a matter of course that the generation of fine particles occurring in the gold plated layer can be prevented.

On the other hand, when the metal wire 24A is cut by the rotating metal cutting tool, the cut portions of the metal wires 24A may be bent, and the cut surface may become uneven. However, in the film according to the present invention, since the force (rotation force) of the cutting tool acts on the insulating layer 24B on the upper portion of the cutting tool before it is transmitted to the metal wire 24A, the insulating layer 24B performs the function of the buffer film. . Therefore, the phenomenon that the shape of the metal wiring 24A is deformed or the cutting surface is uneven after the cutting process does not occur.

After such a cutting process, the second pad 24 and the organic EL device panel of the unit film 21 are removed by performing a cleaning process on the film to remove the remaining insulating layer 24B present on the metal wiring 24A. Normal connection of the pad can be performed.

Meanwhile, in the above description, the insulating layer is formed only on the second pad part 24 connected to the pad part of the device panel. However, the first pad part connected to the pad part of the relay board 30 of FIG. 1 is described. The insulating layer of the same form can also be formed in (22).

As described above, in the film for organic electroluminescent device kits according to the present invention, the metal generated in the cutting process is formed by forming an insulating layer on the cutting line of the pad portion in contact with the cutting tool and forming a gold plating layer in other regions. It can suppress generation | occurrence | production of a fine particle, and has the effect which can prevent the shape deformation of a metal wiring and the formation of a nonuniform cut surface.

Preferred embodiments of the present invention described above are disclosed for purposes of illustration, and those skilled in the art having various ordinary knowledge of the present invention may make various modifications, changes, and additions within the spirit and scope of the present invention. Additions should be considered to be within the scope of the following claims.

Claims (2)

A first pad portion and a second pad portion respectively connected to the pad portion of the adjacent element are respectively formed at both ends, wherein the first pad portion having the cut line is formed of the second pad portion of the adjacent film and the cut line having the cut line. In the second pad portion is produced in a state connected to the first pad portion of another adjacent film, the film for organic electroluminescent device kit is formed by cutting the cut line of the first and second pad portion, The second pad part includes an insulating layer formed on the cutting line to cross a plurality of metal wires, and a plating layer is formed in an area of the metal wires except for the insulating layer forming area. Film for device kits. The method of claim 1, wherein the first pad part further includes an insulating layer formed on the cut line to cross a plurality of metal wires, and a plating layer is formed in an area of the metal wires except for the insulating layer forming area. Film for an organic electroluminescent device kit, characterized in that.

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