KR100615248B1 - Flat display device - Google Patents

Abstract

The present invention provides a buffer processing unit at an end portion of a support member for supporting a flat panel display panel so as to prevent other parts from being damaged by the end, and includes a flat panel display panel for implementing a predetermined image and the flat panel. A flat panel display device includes a support member for supporting a display panel, and a buffer processing unit provided at at least one end of the support member to smooth the end of the support member.

Description

Flat display device

1 is an exploded perspective view schematically illustrating an organic light emitting display device that is a flat panel display device according to an exemplary embodiment of the present invention;

Figure 2 is a cross-sectional view of the II and I when the panel and the support member of Figure 1 combined;

3 is a cross-sectional view showing an example of the organic electroluminescent unit of FIG. 1;

4 is a cross-sectional view illustrating another example of the organic light emitting unit of FIG. 1;

5 is a cross-sectional view of a flat panel display panel according to another exemplary embodiment of the present invention;

6 is a cross-sectional view showing another example of the buffer processing unit of the present invention.

<Brief Description of Major Codes in Drawings>

1: panel 2: substrate

3: display part 4: opposing member

5: junction 51: sealant

6: flexible printed circuit board 61: pad part

7: cushioning portion 8: support member

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flat panel display, and more particularly, to a flat panel display having a buffer processing unit at an end of a support member.

The flat panel display is a display device configured to implement an image on a flat substrate such as a liquid crystal display, an organic electroluminescent device, or an inorganic electroluminescent device.

In such a flat panel display, a pair of substrates are usually joined to edge portions thereof, and a pad portion having a plurality of terminals is exposed to the outside. A flexible circuit board or the like is bonded to the pad part to connect external electronic devices and internal circuits through terminals.

On the other hand, the flat panel display device is supported by a separate support member and mounted on an electronic device such as a mobile phone or a PDA. At this time, the flexible circuit board is bent in one side direction of the flat panel display device in order to minimize the volume. do.

However, at this time, the flexible circuit board may be damaged by the end of the support member supporting the flat panel display.

In general, the supporting member is open because the portion except the side facing the pad portion supports the panel and the pad portion is attached to the panel with the flexible circuit board. The flexible printed circuit board extends outward and bends to the rear surface of the supporting member through the open portion of the supporting member. At this time, the bent portion of the flexible printed circuit board and the end of the supporting member opening are in contact with each other.

However, since the end of the open portion of the support member is in a somewhat sharp state, the flexible circuit board in contact with the end is damaged, causing electrical failure of the panel.

The present invention has been made to solve the above problems, an object of the present invention is to form a buffer processing portion at the end of the support member for supporting the flat panel display panel, which can prevent the other parts from being damaged by this end It is to provide a flat panel display device.

In order to achieve the above object, according to the present invention, a flat panel display panel for implementing a predetermined image, a support member for supporting the flat panel display panel, and at least one end of the support member, the end of the support member is smooth It provides a flat panel display including a buffer processing unit to be made.

Hereinafter, with reference to an embodiment of the present invention shown in the accompanying drawings will be described in detail the present invention.

1 schematically illustrates a flat panel display device according to an exemplary embodiment of the present invention, and illustrates an organic light emitting display device. 2 is a cross-sectional view taken along line II of FIG. 1 in a state where a panel is coupled to a support member.

1 and 2, an organic electroluminescent display device according to an exemplary embodiment of the present invention includes an organic electroluminescent unit 3 including an organic electroluminescent element as described later on a substrate 2. ) Is formed, and the opposing member 4 is provided to seal the organic electroluminescent portion 3.

The substrate 2 may be a transparent glass material, in addition, acrylic, polyimide, polycarbonate, polyester, mylar and other plastic materials may be used. Of course, opaque materials may also be used.

On the substrate 2, an organic electroluminescent portion 3, which becomes a display portion, is formed, which includes an organic electroluminescent element, thereby implementing a predetermined image.

The organic electroluminescent element provided in the organic electroluminescent portion 3 can be applied in various forms, i.e., a passive matrix (PM) organic electroluminescent element of a simple matrix type or a thin film transistor layer Any active matrix (AM) organic EL device may be applied.

First, FIG. 3 illustrates an example of a passive type (PM type) organic electroluminescent device (OLED), and a buffer layer 21 is formed on SiO 2 or the like on the substrate 2, and the buffer layer 21 is formed. The first electrode layer 31 is formed in a predetermined pattern thereon, and the organic layer 33 and the second electrode layer 34 are sequentially formed on the first electrode layer 31. An insulating layer 32 may be further interposed between the lines of the first electrode layer 31, and the second electrode layer 34 may be formed in a pattern orthogonal to the pattern of the first electrode layer 31. . Although not shown in the drawings, a separate insulating layer may be further provided in a pattern orthogonal to the first electrode layer 31 for the pattern of the second electrode layer 34.

The organic layer 33 may be a low molecular or high molecular organic layer. When the low molecular organic layer is used, a hole injection layer (HIL), a hole transport layer (HTL), and an organic emission layer (EML) may be used. , Electron Transport Layer (ETL), Electron Injection Layer (EIL), etc. may be formed by stacking in a single or complex structure, and the usable organic materials may be copper phthalocyanine (CuPc), N, N-di (naphthalen-1-yl) -N, N'-diphenyl-benzidine (N, N'-Di (naphthalene-1-yl) -N, N'-diphenyl-benzidine: NPB), Tris Various applications include, for example, tris-8-hydroxyquinoline aluminum (Alq3). These low molecular weight organic layers are formed by the vacuum deposition method.

In the case of the polymer organic layer, the structure may include a hole transporting layer (HTL) and a light emitting layer (EML). In this case, PEDOT is used as the hole transporting layer, and polyvinylvinylene (PPV) and polyfluorene are used as the light emitting layer. Polymer organic materials such as (Polyfluorene) are used and can be formed by screen printing or inkjet printing.

The first electrode layer 31 functions as an anode electrode, and the second electrode layer 34 functions as a cathode electrode. Of course, the polarities of the first electrode layer 31 and the second electrode layer 34 may be reversed.

The first electrode layer 31 may be provided as a transparent electrode or a reflective electrode. When used as a transparent electrode may be provided with ITO, IZO, ZnO, or In2O3, when used as a reflective electrode Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, and compounds thereof After the reflection film is formed, ITO, IZO, ZnO, or In 2 O 3 can be formed thereon.

The second electrode layer 34 may also be provided as a transparent electrode or a reflective electrode. When the second electrode layer 34 is used as a transparent electrode, the second electrode layer 34 is used as a cathode electrode, and thus a metal having a small work function, that is, Li, Ca, or LiF is used. / Ca, LiF / Al, Al, Mg, and their compounds are deposited in the direction of the organic film 33, and then the auxiliary electrode layer with a material for forming a transparent electrode, such as ITO, IZO, ZnO, or In2O3 Or a bus electrode line can be formed. When used as a reflective electrode, Li, Ca, LiF / Ca, LiF / Al, Al, Mg, and compounds thereof are formed by depositing the entire surface.

4 illustrates an example of an AM type organic light emitting diode (OLED). Each pixel of the organic electroluminescent portion 3 has a TFT structure as shown in FIG. 5 and an EL element OLED which is a self-luminous element.

The TFT is not necessarily possible with the structure shown in FIG. 4, and the number and structure can be variously modified. The active driving organic electroluminescent device will be described in more detail as follows.

As shown in Fig. 4, a buffer layer 21 is formed on SiO 2 or the like on the glass substrate 2, and the above-described TFT is provided on the buffer layer 21.

The TFT has an active layer 22 formed on the buffer layer 21, a gate insulating film 23 formed on the active layer 22, and a gate electrode 24 on the gate insulating film 23.

The active layer 22 may be formed of an amorphous silicon thin film or a polycrystalline silicon thin film, but is not limited thereto, and an organic semiconductor may be used. This semiconductor active layer has source and drain regions doped with N-type or P-type impurities at a high concentration.

The gate insulating film 23 is provided on the active layer 22 by SiO 2 or the like, and the gate electrode 24 is formed on a predetermined region of the gate insulating film 23 by a conductive film such as MoW or Al / Cu. The gate electrode 24 is connected to a gate line for applying a TFT on / off signal. The region where the gate electrode 24 is formed corresponds to the channel region of the active layer 22.

An inter-insulator 25 is formed on the gate electrode 22, and the source electrode 26 and the drain electrode 27 are respectively formed in the source region and the drain region of the active layer 22 through contact holes. It is formed to be in contact with.

A passivation film 28 made of SiO 2 or the like is formed on the source and drain electrodes 26 and 27, and a planarization film 29 made of acryl, polyimide, or the like is formed on the passivation film 28. have.

Although not shown in the drawings, at least one capacitor is connected to the TFT. In addition, the circuit including the TFT is not necessarily limited to the example illustrated in FIG. 4, and may be variously modified.

Meanwhile, an organic light emitting diode OLED is connected to the drain electrode 27, and is connected to the first electrode layer 31, which is an anode of the organic light emitting diode OLED. The first electrode layer 31 is formed on the passivation film 28, and an insulating pixel definition film 29 is formed thereon, and a predetermined opening is formed in the pixel definition film 29. Thereafter, an organic electroluminescent element (OLED) is formed.

The organic light emitting diode OLED displays predetermined image information by emitting red, green, and blue light according to the flow of current, and is connected to the drain electrode 27 of the TFT and receives positive power therefrom. The first electrode layer 31 and the second electrode layer 34 provided to cover all the pixels to supply negative power, and the organic layer disposed between the first electrode layer 31 and the second electrode layer 34 to emit light. It consists of 33.

The material of the first electrode layer 31 and the second electrode layer 34 may be the same as the above-described PM.

As described above, the organic electroluminescent portion formed on the substrate 2 is sealed by the opposing member 4, as shown in FIGS. 1 and 2. The opposing member 4 may be provided with a glass or plastic material in the same manner as the substrate 2. In addition, the opposing member 4 may be formed of a metal cap or the like.

The substrate 2 and the opposing member 4 are joined to each other by the sealant 51. The sealant 51 is applied to the edge of the opposing member 4 to the outside of the organic electroluminescent portion, and the opposing member 4 coated with the sealant is bonded to the substrate 2 as shown in FIGS. 1 and 2. The part in which the sealant 51 is formed forms the junction part 5 which joins the board | substrate 2 and the opposing member 4.

On the other hand, at least one edge of the substrate 2 is disposed so that the pad portion 61 is exposed to the outer side of the opposing member (4). The pad portion 61 is provided with a plurality of terminals (not shown), and the flexible circuit board 6 is connected to the terminals.

The panel 1 is supported by a support member 8, which is provided to fix the panel 1 and to be coupled to an external device, and at least one side thereof is a flexible circuit board ( 6) is open to escape. And, the other side is configured to surround the panel (1). The support member 8 is applicable to the present invention any type of support member in addition to the form as shown in FIG. The support member 8 may be formed of a metal or a synthetic resin material.

As shown in FIG. 2, the panel 1 is supported by the support member 8. The panel 1 is provided by a separate adhesive member 81 such that the opposing member 4 faces the support member 8. Are bonded. The adhesive member 81 may be a double-sided tape may be used, in addition to this, other adhesives may be used. Of course, the panel 1 may be attached to and detachably attached to the support member 8.

On the other hand, the flexible printed circuit board 6 connected to the pad portion 61 is in close contact with the outer surface of the support member 8 in order to minimize its volume when the flat panel display device is mounted on an external device. The flexible circuit board 6 in close contact with the outer surface of the support member 8 may be bonded and fixed to the support member 8 by an adhesive means (not shown) such as a separate adhesive or double-sided tape.

In this way, the flexible printed circuit board 6 is bent as shown in FIG. 2 at the portion where the flexible printed circuit board 6 is brought into close contact with the outside of the support member 8.

However, at this time, the bent flexible circuit board 6 may be damaged by contacting the bent portion of the end of the support member 8.

In order to solve this problem, the present invention forms a buffer processing unit 7 at at least one end of the support member 8.

That is, as shown in Figs. 1 and 2, by forming the buffer processing section 7 at the open end of the support member 8 so that the end is smooth, the same as the flexible circuit board 6 It is flexible and will not be damaged in case of weak material contact.

The buffer processing unit 7 may be formed by attaching a separate member to the end of the support member 8, as shown in Figs. 1 and 2, or may be formed by applying an insulating member such as silicon to dry. In addition, it is also possible to bond bars with the same rigidity as the metal. Of course, synthetic resin materials such as plastics can also be used.

5 illustrates a flat panel display according to another exemplary embodiment, in which the substrate 2 is in close contact with the support member 8. Also in this case, the buffer processing unit 7 is formed at the end of the supporting member 8 in the same manner as in the above-described embodiment, so that the flexible circuit board 6 is not damaged when bent.

The buffer processing unit 7 may be used by combining a separate member as in the above-described embodiments, but is not limited thereto. As shown in FIG. 6, the buffer processing unit 7 may be formed by bending an end of the support member 8. It may be.

The present invention described above is not necessarily applied only to an organic light emitting display device, but may be applied to various flat panel display devices such as a liquid crystal display, an inorganic electroluminescent display, and an electron emission display.

According to the present invention, it is possible to prevent damage to other components such as a flexible printed circuit board by a buffer processing unit that smoothes the end portion supporting the flat panel display panel.

In the present specification, the present invention has been described with reference to limited embodiments, but various embodiments are possible within the scope of the present invention. In addition, although not described, equivalent means will also be referred to as incorporated in the present invention. Therefore, the true scope of the present invention will be defined by the claims below.

Claims (6)

A flat panel display panel for implementing a predetermined image; A support member supporting the flat panel display panel; A buffer processing unit provided at at least one end of the support member to smooth the end of the support member; And And a pad part disposed on at least one edge of the substrate and including a plurality of terminals exposed to the outside of the flat panel display panel. A flexible printed circuit board is connected to the pad, and the flexible printed circuit board is bent in the direction of the buffer processing unit. The method of claim 1, And the buffer processing unit is integrally formed with an end portion of the support member. The method of claim 1, And the buffer processing unit is formed of an insulator. The method of claim 1, And the support member is a rigid member. The method of claim 1, And the buffer processing unit is formed by bending an end portion of the support member. delete

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