KR100604309B1 - A component recognition apparatus for chip mounter - Google Patents

Abstract

An object of the present invention is to provide a component recognizing device for a component mounting machine in which a line scan camera is used as a photographing device and an electronic component attracted to a nozzle does not move unnecessarily for recognizing a part. The present invention relates to a head device comprising a frame, a head portion mounted on the frame and having a plurality of nozzle portions for sucking the electronic component and mounting the same on an external substrate, and a head portion coupled to the head portion for detecting a positional error of the electronic component A line scan camera, and an image of each electronic component adsorbed to a plurality of nozzle units are introduced into the line scan camera, and the length of the optical path is set so that the focal lengths from the respective electronic components to be imaged, A component recognizing device for a component mounting machine having a video transmitting portion for controlling a component.

Description

[0001] The present invention relates to a component recognition apparatus for chip mounter,

1 is a perspective view showing a conventional component body and a part recognition apparatus for a component mounting machine adopted therefor,

Fig. 2 is an enlarged perspective view of the component recognizing apparatus for the component mounting machine of Fig. 1,

3 is a perspective view illustrating a part recognition apparatus and a head unit according to an embodiment of the present invention,

Figs. 4A and 4B are cross-sectional views showing the arrangement of prisms for making the focal distance from the electronic component of Fig. 3 to the line scan camera constant,

FIG. 5 is a plan view showing the structure of the image transfer unit of FIG. 4,

6 is a perspective view illustrating an example in which a part recognition device and a head part of a component body are combined according to an embodiment of the present invention,

7A and 7B are perspective views showing the operating principle of the reflecting mirror portion.

Description of the Related Art [0002]

140: head part 142: frame

144: Nozzle part 150: Component recognition device

155: Line scan camera 160: Image transmission unit

161: Reflex portion 165: Reflector

167: reflector coupling device 168: optical actuator

170: focus adjusting unit 180: first optical system

181: first optical device 185: first optical transmission part

190: second optical system 192: second optical device

193: Third optical device 195: Second optical transmission

P: Electronic component v: First optical system moving speed

kv: moving speed of the second optical system

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component recognition apparatus for a component mounting apparatus, and more particularly, to a component recognition apparatus for a component mounting apparatus for recognizing a position of an electronic component mounted on a nozzle unit, .

The component mounting machine is a device for mounting a component such as a semiconductor package on a printed circuit board (PCB). In recent years, printed circuit boards have high density and high functionality, and accordingly individual integrated circuit electronic components also have high functionality. As a result, the number of output pins mounted on the electronic circuit board increases, and the distance between the output pins becomes narrower.

Therefore, before the electronic component is mounted, it is required that the electronic component is accurately mounted on the electronic circuit board by being rotated at an accurate angle. In order to accurately mount the component at a predetermined position, the component state of the component and the center position must be accurately checked before the component supplied from the component supply unit is mounted on the substrate. For this purpose, a component recognition apparatus is used.

In recent years, a line scan camera has been used for the part recognition apparatus. This is because the line scan camera has better resolution than a conventional two-dimensional CCD camera, and thus it meets the recent tendency that the electronic parts become finer and the precision becomes higher.

Fig. 1 shows a conventional component recognition apparatus disclosed in U.S. Patent No. 6,446,333 and a component mounting apparatus employing the same. Referring to the drawing, a conveying path 23 is provided in the center portion of the base 21 in the X direction. The conveying path 23 conveys the substrate 15.

An electronic component supply unit 32 is disposed on both sides of the conveyance path 23 and a tape feeder 34 and a tray feeder 36 are provided on the electronic component supply unit 32. The tape feeder 34 supplies the electronic parts to be taped and the tray feeder 36 functions to supply the electronic parts P stored in the tray 38.

The head portion 40 of the electronic component is mounted on the X-axis table 25. The head portion is provided with a plurality of nozzle portions 44 arranged in a line. The X-axis table 25 is laid on a Y-axis table 26 provided in a pair in parallel with each other.

The head portion 40 is moved horizontally due to the driving of the X-axis table 25 and the Y-axis table 26. The nozzle portion 44 provided in the head portion moves the tape feeder 34 and the tray feeder 34, The electronic part P is picked up from the tray 38 of the transport path 23 and mounted on the substrate 15 on the transport path 23. [ The electronic component P mounted on the nozzle unit 44 is picked up by the line scan camera 50 before being mounted on the board 15. [

The line scan camera 50 reads images one line at a time and stores them in a memory. Therefore, in order to recognize the electronic parts that are attracted in a line, the conventional part recognition device attaches the line scan camera to the base 21, and then the nozzle part 44 of the head part, And the adsorption state and the center position of the adsorbent P are detected.

2, the head unit 40 is provided with nozzle units 44 arranged in a line, and each of the nozzle units 44 adsorbs the electronic components P1, P2, and P3 . The nozzle portion 44 is provided with a circular reflection plate 52. The reflecting plate 52 reflects the illumination light from the lower light source and illuminates the electronic parts P1, P2, and P3 that are attracted to the nozzle unit 44. [

On the movement path of the head unit 40, a line scan camera 50 is provided. Therefore, the electronic part is recognized by using the optical system of the line scan camera 50 while horizontally moving the head part supporting the electronic parts P1, P2, and P3 from above the line scan camera 50. [

1 and 2, when the head part 40 does not move to the substrate 15 immediately after the electronic part P is picked up, the part recognition device for the component mounting machine having the above- And must be moved to the upper side of the line scan camera 50 to recognize the parts. As a result, there is a problem in that a delay occurs in the component mounting time, and the efficiency of the component body is reduced.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to provide a component recognizing apparatus for a component mounting apparatus which uses a line scan camera as a photographing apparatus and does not unnecessarily move an electronic component And an object of the present invention is to provide a device.

In order to achieve the above object, according to a preferred embodiment of the present invention,

A head mounted on the frame and having a plurality of nozzle portions for sucking and mounting an electronic component on an external substrate;

A line scan camera coupled to the head unit and detecting a positional error of the electronic component adsorbed on the nozzle unit; And

And an image transferring unit for injecting images of the respective electronic components sucked into the plurality of nozzle units into the line scan camera and adjusting the focal lengths from the respective electronic components to be photographed to the line scan cameras to be the same .

Wherein the image transferring unit includes a reflecting part including a reflecting mirror disposed below the electronic parts and reflecting the image of the electronic parts mounted on the nozzle part, and refracting the image from the reflecting mirror to enter the line scanning camera, And a focus adjusting unit for adjusting the focal length of the line scan camera to be the same for each electronic component.

In this case, the focus adjustment unit may include:

A first optical system that reflects an image from the reflector at right angles, and a first optical transmission unit that drives the first optical device to move at a constant velocity; And

A second optical device and a third optical device for reflecting an image reflected from the first optical device at right angles and introducing the reflected light into a line scan camera; And a second optical system having a second optical transmission section for driving the third optical device to move at a constant speed,

The second optical system is disposed to be far away from the line scan camera as compared with the first optical system, and the first optical system has a moving speed twice as fast as the second optical system.

Here, the first optical transmission portion and the second optical transmission portion are first and second lead-type first and second lead-type ball screws driven by the same optical actuator, and the first and second lead portions have cross- It is preferable that the first lead has the same diameter and the first lead has a screw pitch twice that of the second lead.

The first optical system and the second optical system are preferably linearly guided by a linear motion (LM) guide.

The reflector may include a reflector driver for driving the reflector to prevent interference with the electronic component when the nozzle portion is lowered.

And the image transfer unit is coupled to the head unit.

It is preferable that the first, second, and third optical devices are prisms.

Embodiments of the present invention will now be described in detail with reference to the accompanying drawings. Referring to FIG. 3, the component recognizing apparatus 150 for a component mounting machine according to the present invention includes a head unit 140, a line scan camera 155, and a video transmitting unit 160.

The head portion 140 has a frame 142 and a plurality of nozzle portions 144 mounted on the frame. The nozzle portion 144 can be raised, lowered, and rotated. Accordingly, when the nozzle part descends and sucks the electronic part P, the nozzle part moves up toward the substrate (not shown). When the nozzle part reaches the substrate, the electronic part P is mounted on the substrate while descending and rotating.

A line scan camera 155 is coupled to the frame 142 of the head unit 140. The line scan camera 155 serves to detect a positional error of the electronic component P sucked by the nozzle unit 144. The line scan camera 155 is superior in resolution to a two-dimensional CCD camera, and is particularly advantageous for recognizing positional errors of fine electronic components.

In this case, the focal length from the respective electronic components P1 and P2 to the line scan camera 155 should be constant. In order to make the focal distance constant, an image transfer unit 160 is disposed between the electronic part P sucked to the nozzle unit and the line scan camera 155. The image transferring unit 160 functions to transfer the images of the electronic components P1 and P2 sucked by the plurality of nozzle units 144 arranged in a row to the line scan camera 155, The optical path (optical path) S between the electronic component P as an object and the line scan camera 155 is adjusted to be the same.

The image transmitting unit 160 includes a reflecting part 161 and a focus adjusting part 170. The image transmitting part 160 includes a light source and a light source. The reflecting portion 161 includes a reflecting mirror 165. The reflector 165 reflects the electronic components P mounted on the nozzle unit 144 by being disposed below the electronic components P. [

In this case, the reflector 165 may correspond to one reflector for each of the electronic components P1 and P2 that are attracted to the respective nozzle portions 144, and a plurality of reflectors may be disposed. 3, it is preferable that one reflector 165 is formed to reflect all of the electronic components P that are attracted to the head 140, This is because it is possible to easily form the mirror driving device for driving.

The flow of the image of the electronic component P reflected by the reflecting mirror 165 is changed by the focus adjusting unit 170 so as to be introduced into the line scan camera 155.

The focus adjusting unit 170 includes a first optical system 180 and a second optical system 190. The first optical system 180 and the second optical system 190 are provided with a plurality of optical devices 181, . The optical devices 181, 192, and 193 change the flow direction of the image of the electronic component P reflected by the reflecting mirror 165 to enter the line scan camera 155. The optical devices 181, 192, and 193 may use various optical components. For example, reflected light having a light condensing device may be used. Alternatively, a prism may be used. Alternatively, have. In particular, in the case of a prism, a light condensing device for preventing light from being emitted is unnecessary, and it is more preferable since light can be refracted.

It is preferable that the first optical system 180 includes a first optical device 181 and the second optical system 190 includes a second optical device 192 and a third optical device 193. [ The first optical device 181 refracts the image from the reflector 165 at right angles and the second optical device 192 refracts the image reflected from the first optical device 181 at right angles, And the third optical device 193 refracts the refracted image from the second optical device 192 into the line scan camera 155.

By using the three optical devices 181, 192, and 193, the focal length from the electronic component P to the line scan camera 155 can be easily set to be constant I can do it.

4A and 4B, the structure and operation principle of the image transfer unit 160 for making the focal distances from the electronic component P to the line scan camera 155 the same will be described in detail. Here, the distances from the respective electronic components P1 and P2 to the reflecting mirror 165 are all the same, so the path from the electronic components P1 and P2 to the reflecting mirror 165 is omitted.

The image reflected by the reflecting mirror 165 is incident on the first optical device 181. The lens camera 155 is mounted on the head unit and is fixed and photographs the electronic components P1 and P2 reflected from the reflector 165 from left to right.

First, as shown in FIG. 4A, the image of the electronic component P1 disposed on the left side of the head portion is recognized. Then, as shown in the drawing, the image transfer unit 160 moves to the right side to sequentially recognize the images of the electronic components. And finally, as shown in Fig. 4B, the image of the electronic component P2 disposed on the right side of the head portion is recognized. In this case, the first, second, and third optical devices 181, 192, and 193 move so that the focal lengths of the respective electronic components are the same.

The second optical device 192 and the third optical device 193 are constantly moved at the same speed. Therefore, it is preferable that the second optical device 192 and the third optical device 193 are integrally disposed.

The second optical device 192 and the third optical device 193 are disposed in the direction opposite to the line scan camera 155 on the basis of the first optical device 181, It is preferable that the moving speed of the third optical device 193 is lower than that of the first optical device 181 so that the clearance between the line scan camera 155 and the second and third optical devices 192 and 193 The second optical device 192 and the third optical device 193 are arranged at a relatively low speed relative to the first optical device 181 so that the first optical device 181 and This is because the second and third optical devices 192 and 193 are prevented from colliding with each other.

It is assumed that the second optical device 192 and the third optical device 193 move at a moving speed of v and the first optical device 181 moves constantly from a P1 state to a P2 state at a moving speed of kv. The first optical device 181, the second optical device 192, and the third optical device 192, from the mirror 165 to the focal lengths from the line scan camera 155 to the P1 state and the electronic part P2 state, The length of the optical path from the line scanner camera 155 to the line scan camera 155 should be the same in the case where the electronic component is in the state P1 and the case where the electronic component is in the state P2 is S2.

In this case, the moving speed kv of the first optical device 181, which makes the optical paths the same, can be calculated with a simple formula, and the vision system can be easily constructed from this.

The distance from the reflecting mirror 165 to the first optical device 181 is a1 and the distance from the first optical device 181 to the second optical device 192 is a1, The distance from the second optical device 192 to the third optical device 193 is c1 and the distance from the third optical device 193 to the rotor line camera 155 is d1, The optical path is expressed by Equation (1).

  S1 = a1 + b1 + c1 + d1

The length of the optical path in the P2 state is denoted by S2, the distance from the reflecting mirror to the first optical device is a2, the distance from the first optical device to the second optical device is b2, C2 is the distance from the first optical device to the third optical device, and d2 is the distance from the third optical device to the third optical device, and the optical path is expressed by Equation (2).

S2 = a2 + b2 + c2 + d2

Here, distances a1 and a2 from the reflecting mirror to the first optical device are the same. The c1 and c2 distances from the second optical device to the third optical device are also the same. Therefore, Equation (1) can also be expressed as Equation (3).

S2 = a2 + b1 + c2 + d1

In addition, the first optical device 181, the second optical device 192, and the third optical device 193 move at a constant speed. Therefore, the distance traveled by the first optical device 181 for a time t is kvt, and the distance traveled by the second optical device 192 and the third optical device 193 for a time t is vt. Therefore, a2 and c2 can be expressed as shown in Equation (4).

  c2 = kvt + c1 - vt

  a2 = a1 - vt

If Equation (4) is substituted into Equation (3), it can be expressed as Equation (5).

 S2 = a1 - vt + b1 + kvt + c1 - vt + d1

     = (a1 + b1 + c1 + d1) + kvt - 2vt

     = S1 + kvt - 2vt

Therefore, in order for S1 and S2 to be equal to each other, kvt must be 2vt. Therefore, if the first optical device 181 moves at twice the speed as the second optical device 192 and the third optical device 193, the optical path length is always constant.

5, the first optical system 180 includes a first optical device 181 and a first optical device 185 for driving the first optical device 181 to move at a constant speed, Respectively. In addition, the second optical system 190, along with the second optical device 192 and the third optical device 193, is connected to the second optical device 192 so that the focal length from the electronic component to the line scan camera is the same, And a second optical transmission portion 195 for driving the third optical device 193 to move at a constant speed.

5 is a plan view showing the lower part of the head part. The part recognition device 150 includes a first optical transmission part 185, a second optical transmission part 195, and the first second optical transmission part. Lt; RTI ID = 0.0 > embodiment. ≪ / RTI >

1, a line scan camera 155 is disposed on one side of a head unit (not shown), and a first optical device 181 having a first optical device 181 is provided between the line scan camera 155 and the reflector 165 An optical system 180 and a second optical system 190 including a second optical device 192 and a third optical device 193 are arranged. Here, the second optical system 190 is arranged to be far from the line scan camera 155 in comparison with the first optical system 180.

Here, the first optical transmission portion and the second optical transmission portion are a first lead 185 and a second lead 195 using a ball screw method, respectively.

The first lead 185 and the second lead 195 may be rotated by different actuators. Alternatively, the first lead 185 and the second lead 195 may be rotated by the same optical actuator 168. In this case, in order for the first optical system 180 to have a speed twice as fast as the moving speed of the second optical system 190, the first lead and the second lead are formed to have the same diameter, 185 may be formed to have a screw pitch that is twice the screw pitch of the second lead 195. That is, since the linear movement distance when the ball screw lead makes one rotation is the pitch of the screw, the screw pitch of the first lead is twice as large as the screw pitch of the second lead, The moving speed is twice as fast as that of the moving body 190.

Brackets 184 and 194 are provided on the first optical system and the second optical system, respectively, and are engaged with the ball screw nut and move. In order to guide the first and second leads 185 and 195 to perform linear motion, a linear motion guide 175 is employed to smoothly move the linear motion of the optical devices 181, 192 and 193 This is possible.

In this case, as shown in FIG. 6, the image transfer unit 160 and the line scan camera 155 are preferably coupled to the head unit 140. That is, the first lead 185 and the second lead 195 are coupled to the frame 142 so as to be disposed on the side of the electronic component sucked to the nozzle unit 144, and the line scan camera 165 is connected to the bracket 152, Or the like. In this case, the line scan camera 155, the reflector 165, the first optical device 181, the second optical device 192, and the third optical device 193 are arranged at the same height do.

This makes it possible to recognize a positional error or the like of the electronic part in a state in which the nozzle part 144 sucks the electronic part P without the head part 140 needing to move to the separately disposed part recognition device .

Here, the reflecting mirror 165 is formed below the electronic component P, and is preferably disposed so as to be inclined in order to recognize the position and the like of the electronic component. In this case, it is preferable that the reflector 165 is also connected to the head part 140 by a reflector coupling device 167 such as a belt.

However, when the electronic part P is picked up or the electronic part is mounted on the board, the nozzle part 144 is lowered. At this time, since the reflecting mirror 165 is positioned below the electronic component P as shown in FIG. 7A, the electronic component P interferes with the reflecting mirror 165. [ 7B, when the nozzle portion is lowered, the reflector actuator 168 is driven to move the reflector 165 such that the reflector 165 is disposed in parallel to the downward direction of the nozzle portion, as shown in FIG. 7B.

7A, the reflector is arranged to be inclined from the lower side of the electronic component so as to reflect the image of the electronic component. In the pickup stage of the electronic component, as shown in FIG. 7B, So as not to interfere with the electronic component.

According to the present invention having the above-described structure, the unnecessary moving operation of moving the head part to the line scan camera can be omitted, so that no delay occurs in the component mounting time, and as a result, the efficiency of the component body is increased .

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims. . Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

Claims (5)

A head unit mounted on the frame and having a plurality of nozzle units for sucking an electronic component and mounting the same on an external substrate; A line scan camera coupled to the head unit and detecting a positional error of the electronic component adsorbed on the nozzle unit; A reflecting part including a reflecting mirror disposed below the electronic parts and reflecting an image of the electronic parts attracted to the nozzle part; A first optical system that reflects an image from the reflector at right angles, and a first optical transmission unit that drives the first optical device to move at a constant velocity; And A second optical device and a third optical device for reflecting the image reflected from the first optical device at right angles and introducing the reflected light into the line scan camera; And a second optical system having a second optical transmission unit for driving the optical device and the third optical device to move at a constant speed. delete The method according to claim 1, Wherein the second optical system is disposed so as to be far away from the line scan camera as compared with the first optical system, and the first optical system has a moving speed twice that of the second optical system. The method according to claim 1, The first optical transmission portion and the second optical transmission portion are first lead and second lead of each ball screw type driven by the same optical actuator, Wherein the first lead and the second lead have the same diameter in cross section and the first lead has a screw pitch twice that of the second lead. The method according to claim 1, Wherein the first optical system and the second optical system are linearly guided by an LM (linear motion) guide.

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