KR100593487B1 - A nitrogen gas keeping warmth / heater for exhaust gas purge of semiconductor and LCD production equipment - Google Patents

Abstract

The present invention is supplied to the exhaust pipe of the exhaust pipe of the equipment for semiconductor and LCD production equipment, the thermal insulation / heating of the pipe in the equipment for LCD production equipment that is used for purging the exhaust gas It relates to the heat insulation / heating of the nitrogen gas for purging (N ₂ Gas).

The present invention is a semiconductor and LCD (LCD) that can ensure the stability of the nitrogen gas (N ₂ Gas) by keeping the heat / heating by using a high temperature steam (Steam) piped to the production site, It is to provide nitrogen gas insulation / heating device for purge of exhaust gas of production equipment.

Nitrogen gas tank, pneumatic intake and exhaust system, heating supply piping, nitrogen gas supply piping, temperature sensor, check valve

Description

Nitrogen gas keeping warmer / heater for exhaust gas purge of semiconductor and LCD production equipment

Figure 1 is an exemplary view showing a state of heating / heating the nitrogen gas (N ₂ Gas) supplied to the gas discharge pipe of the conventional semiconductor and LCD (LCD) production facilities.

Figure 2 is an exemplary view showing a state of heating / heating the nitrogen gas (N ₂ Gas) supplied to the gas discharge pipe of the semiconductor and LCD (LCD) production facilities according to the present invention.

Figure 3 is a partial cross-sectional configuration of the main portion of the present invention.

4 is another exemplary embodiment of FIG.

Figure 5 is another exemplary embodiment of a heat / heating apparatus according to the present invention.

Figure 6 is yet another embodiment of the thermal insulation / heating apparatus according to the present invention.

※ Explanation of code for main part of drawing ※

10: discharge pipe 100: semiconductor and LCD (LCD) production equipment

200: nitrogen gas tank 300: intake and exhaust device using pneumatic

400: heating supply pipe 500: nitrogen gas supply pipe

501: temperature sensor 600: check valve

700: heating tank 800: body

801 steam inlet 802 steam outlet

803: side walls 804: nitrogen gas transfer pipe

805: cap 806: bulkhead

807: nitrogen gas inlet 808: nitrogen gas outlet

809: Chamber

The present invention is supplied to the exhaust pipe of the exhaust pipe of the equipment for semiconductor and LCD production equipment, the insulation of the pipe in the equipment for semiconductor and LCD production equipment that is used for purging the exhaust gas / relates to thermal insulation / heating of the heating and purging with nitrogen gas (N ₂ gas) for.

In general, in the semiconductor and LCD production site, fire and explosion prevention and powder are formed from exhaust vapor such as silane (SILANE, SiH ₄ ) in the piping of the production facility, and the powder is adhered to the piping. In order to prevent this from happening, purge with inert gas (nitrogen gas) was carried out in order to explode when ignited if the unburned gas is in the furnace or other places, so to vent it out of the furnace before ignition. The purge using nitrogen gas also prevents the silane (SILANE, SiH _4: hydride) powdering due to the temperature drop of the exhaust gas. Nitrogen gas is heated by using an electric heater and supplied for purging, or it is discharged by wrapping the pipe part using an electric heat insulating device (heater jacket: HEATER JACKET). Maintain proper temperature to prevent powder from remaining silane, etc. Scrubber (Scrubber), which overlaps the corrugation, and removes water in the steam by flowing steam therebetween, or washes gas mixed with air pollutants to absorb the pollutants in the gas into water. Device to separate).

Chemical products emitted during the production process using various gases in facilities used for low temperature deposition, etching and thin film processes, which are chemical vapor deposition methods for semiconductor and LCD wafer fabrication (FAB) fabrication processes In order to prevent powder or liquid substances from being recombined into dangerous substances by secondary reaction and prevent the risk of spontaneous ignition and explosion, it is possible to prevent clogging and malfunction of discharge pipe, valve, pump, etc. The gas is heated with high temperature nitrogen gas using a heater or the heating jacket is used to cover the discharge pipe of the outlet with a heater heater to warm the temperature.

Devices that prevent the powdering of silanes (SILANE, SiH ₄ ) by heating and supplying nitrogen gas with an electric heater (electric heater) or by insulating the pipes with an electric heat insulator (2) bring excessive waste of production cost. Of course, there is a risk of fire due to overheating of the electric heater 1, and difficulty in maintenance and management, and it has a disadvantage of including electrical risks (short, explosion, etc.) by using electricity.

The present invention has been made to solve the above problems, the production of semiconductor and LCD (N ₂ Gas) supplied to the discharge pipe of the exhaust pipe of the semiconductor and LCD (LCD) production equipment By heating by using high temperature steam piped on site, it is possible to escape from electrical shorts (explosion) that may occur when electricity is used, as well as fire due to overheating of electric heater (electric heater). It is an object of the present invention to provide a nitrogen gas insulation / heater for purging exhaust gases of semiconductor and LCD (LCD) production equipment which can prevent the occurrence and reduce the maintenance and maintenance costs.

The configuration of the present invention for achieving the above object, the nitrogen gas for purging (Purge) to prevent the exhaust gas generated in the semiconductor and LCD (LCD) production facility 100 is not deposited in the discharge pipe 10 (N ₂ Gas) In the device to heat / heat)

Nitrogen gas (N ₂ Gas) tank 200 on the nitrogen gas supply pipe 500 connected to the intake and exhaust device 300 using the pneumatic pressure installed in the exhaust pipe 10 of the semiconductor and LCD production equipment 100 ) Is installed, inside the nitrogen gas (N ₂ Gas) tank 200 is a heating supply pipe 400 is circulated in the factory and hot steam for heating is circulated, the heating supply pipe ( 400) nitrogen gas (N ₂ gas) in the column, nitrogen gas (N ₂ gas) tank 200 by being generated in a characterized in that one to be thermal insulation / heating.

Heating supply pipe located inside the nitrogen gas (N ₂ Gas) tank 200 according to the present invention

As a spring form (400) is characterized in that to increase the surface that can be contacted with nitrogen gas (N ₂ Gas).

Heating supply pipe located inside the nitrogen gas (N ₂ Gas) tank 200 according to the present invention

The high temperature steam supplied to the 400 is a temperature sensor installed in the nitrogen gas supply pipe (500)

The supply of hot steam is adjusted by the check valve 600 which is adjusted according to the signal sensed by 501, so that the heating / heating of the nitrogen gas and the exhaust gas is performed.

Nitrogen gas supply pipe connected to the intake and exhaust device 300 using pneumatic pressure, which is installed in the exhaust pipe discharge pipe 10 of the semiconductor and LCD (LCD) production facility 100 according to the present invention

500 is installed in the factory to pass through the heating tank 700 installed on the heating supply pipe 400 in which the heating steam is circulated, and the high temperature steam circulated to the heating tank 700 Nitrogen gas (N ₂ Gas) in the nitrogen gas supply pipe 500 is characterized in that it can be kept warm / heated.

Nitrogen gas thermal insulation / heating device according to the present invention, the steam inlet 801 and the other side of the steam inlet 801 is a high temperature steam is injected into one side of the tubular body 800, the other side wall 803 Nitrogen gas transfer pipe 804 penetrating the upper and lower portions are provided, the cap 805 having a space for circulating nitrogen gas is installed on the side side where the steam inlet 801 is located, the steam outlet The interior of the chamber 802 is separated by a partition wall 806, and a chamber 809 having a nitrogen gas inlet 807 and a nitrogen gas outlet 808 in the upper portion is provided.

The nitrogen gas tank 200 according to the present invention is characterized in that the nitrogen gas supply pipe 500 is connected to the intake and exhaust device 300 using a plurality of pneumatic pressure installed in the gas discharge pipe (10).

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Figure 2 is an exemplary view showing a state of keeping / heating the nitrogen gas (N ₂ Gas) supplied to the gas discharge pipe of the semiconductor and LCD (LCD) production equipment according to the present invention, Figure 3 is an extract of the main portion of the present invention Partial cross section configuration diagram.

As shown in FIGS. 2 and 3, nitrogen gas (N ₂ Gas) transported along the nitrogen gas supply pipe 500 to the exhaust gas discharged along the discharge pipe 10 of the semiconductor and LCD production equipment uses pneumatic pressure. It is supplied through the intake and exhaust device 300 to prevent the phenomenon that the uncombusted exhaust gas, that is, the unburned exhaust gas in the furnace or other places to be taken out of the furnace and at the same time prevents explosion when ignited.

Nitrogen gas (N ₂ Gas) used for purge as described above is supplied in a state of being kept warm / heated at around 100 ~ 130 ℃, nitrogen gas (N ₂ Gas) is supplied to the heat / heated The reason is to prevent this because the powder is formed from the residual silane that may occur in the discharge pipe 10 when the temperature of the exhaust gas is lowered.

Nitrogen gas (N ₂ Gas) to be maintained / heated as described above is located inside the nitrogen gas tank 200, the heating supply pipe circulating the heating steam steam piped in the factory

400 is kept warm / heated.

Nitrogen gas in the nitrogen gas tank 200 that is kept warm / heated by the heating supply pipe 400 is supplied through the intake and exhaust device 300 using pneumatic pressure installed in parallel with the discharge pipe 10.

As described above, the thermal insulation / heating temperature of the nitrogen gas supplied to the discharge pipe 10 is suitably 100 to 130 ° C., and the adjustment of the thermal insulation / heating temperature of the nitrogen gas is based on the supply amount of the hot steam circulated into the heating supply pipe 400. It is decided by.

The supply of hot steam is adjusted by the temperature sensor 501 installed in the nitrogen gas supply pipe 500 to detect the temperature of the nitrogen gas, and to the heating supply pipe 400 by a signal detected by the temperature sensor 501. While the installed check valve 600 is adjusted, the supply amount of hot steam is controlled.

Nitrogen gas, which is kept warm / heated by the high temperature steam transferred to the heating supply pipe 400, is supplied to the intake and exhaust device 300 using the pneumatic pressure installed in the discharge pipe 10, and the high temperature nitrogen gas is discharged from the exhaust gas. By being mixed and supplied, fire and explosion prevention and powder are formed from the exhaust steam to prevent clogging due to adhesion to the pipe.

Figure 4 is when the intake and exhaust device 300 using a plurality of pneumatic pressure in the discharge pipe 100 is a plurality of nitrogen gas supply pipe 500 as shown in Figure 4 so as to supply the nitrogen gas.

5 shows that the nitrogen gas and the high temperature steam flows in reverse, and passes through the nitrogen gas supply pipe 500 wound in a spring form so as to increase the thermal contact efficiency to the heating tank 700 to which the high temperature steam is supplied. Nitrogen gas (N ₂ Gas) is to be kept warm / heated by the high temperature steam supplied to 700).

Figure 6 is another type of thermal insulation / heating device, the hot steam is introduced through the steam inlet 801 inside the body 800 is discharged through the steam outlet 802 is circulated hot steam.

As described above, the high temperature steam circulated into the body 800 heats / heats the nitrogen gas of the nitrogen gas transfer pipe 804 so that both ends penetrate both side walls 803 so as to be located inside the body 800. The nitrogen gas flows through the nitrogen gas inlet 807 under the chamber 809 having the partition wall 806 and penetrates the body 800 through the lower portion of the body 800 in the nitrogen gas transfer pipe 804. It is transferred to the cap 805 installed on the opposite side to the chamber 809 by the transfer through the transfer pipe located in the).

Nitrogen gas transferred to the cap 805 is a nitrogen gas transfer pipe located above the body 800

It is transported along 804 and is discharged through the nitrogen gas outlet 808 installed at the top of the chamber 809.

Nitrogen gas discharge port 808 through which nitrogen gas is discharged as described above is connected to an intake / exhaust device 300 using pneumatic pressure installed in the discharge pipe 10 to a pipe (not shown) to discharge the heated / heated nitrogen gas discharge pipe. Supply to (10).

As described above, the present invention,

First, it can escape the electrical risk (Short) that can occur when using electricity;

Second, it is a very useful invention that can prevent the occurrence of fire due to overheating of the electric heater (electric heater), and can obtain the effect of reducing maintenance costs.

Claims (6)

In the device for insulating / heating the nitrogen gas (N ₂ Gas) for purge so that the exhaust gas generated in the semiconductor and LCD (LCD) production facility 100 is not deposited inside the discharge pipe 10, Nitrogen gas (N ₂ Gas) tank 200 on the nitrogen gas supply pipe 500 connected to the intake and exhaust device 300 using the pneumatic pressure installed in the exhaust pipe 10 of the semiconductor and LCD production equipment 100 ) are present and installed, the nitrogen gas (N ₂ gas) tank 200 inside the pipe in the factory and the heating temperature steam (steam) heating the supply pipe 400, the position where the circulation, the heat supply pipe (400 Emission gas purge of semiconductor and LCD production equipment, characterized in that the nitrogen gas (N ₂ Gas) in the nitrogen gas (N ₂ Gas) tank 200 can be kept warm / heated by the heat generated in the Nitrogen gas insulation / heating device for Purge). According to claim 1, wherein the heating supply pipe 400 located in the nitrogen gas (N ₂ Gas) tank 200 in the form of a spring to increase the surface to which the nitrogen gas (N ₂ Gas) can be contacted. Nitrogen gas insulation / heater for purge exhaust gas of semiconductor and LCD production equipment. The method of claim 1 wherein said nitrogen gas (N ₂ Gas) tank 200, high-temperature steam fed to the heat supply pipe 400 is located inside the temperature sensor installed in the nitrogen gas supply pipe 500, The semiconductor and LCD (LCD) production equipment characterized in that the heating and warming of nitrogen gas and exhaust gas is made while the supply amount of hot steam is adjusted by the check valve 600 is adjusted according to the signal sensed by 501 Nitrogen gas insulation / heating device to prevent purge of exhaust gas. According to claim 1, Nitrogen gas supply pipe connected to the intake and exhaust device 300 using the pneumatic pressure extending to the exhaust pipe discharge pipe 10 of the semiconductor and LCD (LCD) production facility 100 500 is installed in the factory to pass through the heating tank 700 installed on the heating supply pipe 400 in which the heating steam is circulated, and the high temperature steam circulated to the heating tank 700 Nitrogen gas insulation / heating device for the exhaust gas purge (purge) of the semiconductor and LCD (LCD) production equipment, characterized in that the nitrogen gas (N ₂ Gas) in the nitrogen gas supply pipe (500) can be maintained / heated. According to claim 1 or claim 4, Nitrogen gas thermal insulation / heating device, the steam inlet 801 to the high-temperature steam is injected into one side of the tubular body 800 and the steam outlet 802 is formed on the other side, the inside The nitrogen gas transfer pipe 804 penetrating both side walls 803 is installed up and down, and a cap 805 having a space to allow nitrogen gas to be circulated on the side where the steam inlet 801 is located is provided. The inside of which is separated by the partition wall 806 at the side where the steam outlet 802 is located, and a chamber 809 having a nitrogen gas inlet 807 and a nitrogen gas outlet 808 at the upper part is provided. Nitrogen gas insulation / heating device for purge the exhaust gas of semiconductor and LCD (LCD) production equipment. According to claim 1, The nitrogen gas tank 200 is characterized in that the nitrogen gas supply pipe 500 connected to the intake and exhaust device 300 using a plurality of air pressure installed in the gas discharge pipe 10 is characterized in that the semiconductor And emissions from LCD production equipment Nitrogen gas insulation / heating device for purge.

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