KR100592229B1 - Method of manufacturing partition wall of gas discharge display device - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a partition wall of a gas discharge display device, and more particularly to a method for manufacturing an AC plasma display panel (PDP) barrier rib having a high-definition straight wall structure. Method for fabricating a barrier rib of plasma display panel according to the present invention is a resist of the X-ray lithography & galvanoforming & abforming (LIGA) process, which is a kind of micro-machining technology. After applying the patterning method using resist coating (PMMA) and synchrotron radiation, an initial PMMA patterning structure is made and then a dielectric pattern is used instead of metal (Ni, Cu, etc.) plating. Plating forms a partition wall of a high-definition straight wall structure.

Description

Method for fabricating a barrier rib of plasma display panel

1 is a view showing a partition manufacturing method of a gas discharge display device according to a conventional screen printing method in order of process;

2 is a view showing the partition wall manufacturing method of the gas discharge display device by a conventional etching method in order of process;

3 is a view showing the partition wall manufacturing method of the gas discharge display device according to the conventional sandblasting method by process order,

4 is a view showing the partition wall manufacturing method of the gas discharge display device by the conventional squeegee method in order of process,

FIG. 5 is a view showing the partition wall manufacturing method of a gas discharge display device using a conventional photosensitive face in order of a process; FIG.

6a to 6e are views showing the partition wall manufacturing method of the gas discharge display device according to the present invention in order of process;

7 is an explanatory diagram showing an operating principle of a syncrotron;

8 is an explanatory diagram for explaining the principle of electrophoresis.

<Description of Symbols for Main Parts of Drawings>

11.Substrate 12.Data Electrode

13. Dielectric layer 14. Auxiliary electrode for partition wall formation

15. Resist 16. Masks for X-ray Lithography

16a. Blank layer 16b, absorber layer

17. Bulkhead

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing partition walls of gas discharge display devices, and more particularly, to a method for manufacturing AC plasma display panel (PDP) barrier ribs having a high-definition straight wall structure.

The partition wall functions as a core layer of the PDP as it has various functions such as securing the discharge cell space in the PDP, preventing crosstalk between each discharge cell, and maintaining the discharge space from external pressure when sealing the upper and lower plates. do. The barrier ribs generally require a height of 100 μm or more to secure a discharge space between the upper plate and the lower plate. Various barrier rib manufacturing methods have been used to obtain such a thickness.

1 is a cross-sectional view schematically illustrating a process of manufacturing a partition wall of a PDP by a conventional screen printing method. The screen printing method printing process applied for the longest time consists of the printing process by screen printing, a drying process, and a baking process, as shown. These processes can be easily manufactured with relatively simple equipment such as printing presses and kilns, and have high strengths in material use efficiency. However, this method is difficult to use due to the limitation of the lighting resolution (realization) that it is impossible to manufacture a partition wall having a line width of less than 50㎛ to date, because it requires more than 10 repeated printing process.

FIG. 2 is a diagram illustrating a method of manufacturing a partition wall of a gas discharge display device by a conventional etching method in order of a process. As shown in the drawing, the etching method includes coating a frit glass paste on a substrate and baking it, applying a resist thereon, exposing and developing a mask to form a mask, and then etching the frit glass layer using the same. The barrier ribs are formed and the resist is removed and fired again. It is difficult to form a straight wall structure because it uses a wet etching method.

3 is a diagram illustrating a method of manufacturing a partition of a gas discharge display device according to a conventional sandblasting method, in order of process. Sandblast process as shown is the most widely used in AC PDP developments, such as being applied by each manufacturer such as Fujitsu because it is possible to manufacture the partition wall close to the straight wall shape in a high-definition pattern It is a manufacturing method of the bulkhead. However, it is applied to ultra high-definition patterns such as SXGA and HDTV, development of lead-free firt glass (environmentally friendly material) as a material for bulkhead, development of reuse method of sandblasted frit glass for low cost, and electrode or discharge There are still many problems to be solved, such as pollution of space.

4 is a diagram illustrating a method of manufacturing a partition wall of a gas discharge display device according to a conventional squeezing method in order of process. As shown, the squeegeeing method forms a partition by applying a thick resist on the substrate, filling the glass paste with the remaining resist subpattern through exposure and development, and then firing the removed subpattern. It is possible to form the partition wall of fine shape because it is processed using a light source, and it has the advantage of being suitable for the glass substrate, but it takes much time when applying the pattern over 100μm, the formed pattern is torn down, there is a risk of cracking of the wall when firing, and the photosensitive film even after firing The remaining problem is how to clean it out.

FIG. 5 is a diagram illustrating a method of manufacturing a barrier rib of a gas discharge display device using a conventional photosensitive paste, in order of process. As shown, the method using the photosensitive paste is a method of applying a paste of a thick photosensitive partition material to dry, and then lifting the patterned mask to expose and develop to fire the remaining shape to form the partition wall. Although the process using a paste of the photosensitive partition material can be fixed compared to screen printing, the material has a weakness that the cost of the material is high, the use efficiency of the material is low, and the stability of the exposure process including the number of exposures should be given. I have it.

In addition, the Addtive method by dry film has high efficiency of use of the material of the Frit Glass itself and high definition, but removing the resist after forming the thick film is an important problem. The thick film formed in a strip process for resist removal has a problem of collapse.

As described above, since each manufacturing process has advantages and improvements at the same time, each company is accelerating the development for PDP application.

Meanwhile, in December '97, a ceramic specialist, Kyocera, Japan, developed and reported a press molding method using a mold. The biggest advantage of this method is a high reliability process that can form barrier ribs up to a line width of 20 µm with a simple process. By reducing the width of the partition to the maximum, it is a method of increasing the light emitting area, thereby improving the brightness and efficiency. In particular, since the number of processes is reduced and simple equipment such as presses and molds are used, the low cost of PDP manufacturing can be achieved at the same time. However, since technical and specific methods such as paste, mold material, firing process and mold desorption method have not been presented, there is a problem in the application of large-scale PDP production. In addition, there is a problem that causes deformation in the glass substrate during pressing, heat molding.

As such, existing processes for forming the barrier ribs have various problems and limitations, such as limitations of characteristics, complexity of processes, contamination, and process cost.

SUMMARY OF THE INVENTION The present invention has been made to improve the above problems, and manufactures a partition of a gas discharge display device (especially an AC PDP), which is capable of manufacturing a high resolution partition for an HDTV by applying a micromachining method that can lower the process cost. The purpose is to provide a method.

In order to achieve the above object, a method of manufacturing a gas discharge display device according to the present invention includes the steps of: (a) forming auxiliary electrodes for barrier rib manufacturing on a substrate on which data electrodes are formed; (B) applying a photoresist thick film of a predetermined thickness or more on a substrate on which the auxiliary electrode is formed; (C) patterning the photoresist thick film by X-ray lithography using an X-ray mask to form a photoresist pattern having grooves to expose the auxiliary electrodes; (D) forming a barrier rib in the grooves by connecting power of the auxiliary electrodes; And (e) removing the photoresist pattern through stripping.

In the present invention, in the step (a), the auxiliary electrodes form a dielectric layer on the substrate on which the data electrodes are formed and are formed on the dielectric layer, respectively, at positions corresponding to intermediate points between the data electrodes. In the step (b), the thick photoresist film is formed to have a thickness of 100 μm or more by casting a PMMA resist, and the step (b) includes (b-1) a crosslinked polymer and a reaction accelerator. ) And a photoresist manufacturing step of liquefying the adhesion promoter; And (b-2) applying the photoresist uniformly onto the substrate by a casting method. In the step (c), the X-ray mask is made of a low atomic number material such as diamond or beryllium. It is made of a blank layer that transmits X-rays and an absorbing layer made of a plateau number material such as Au and W, and absorbs X-rays. In the step (d), the electrophoresis method is SiO _{2 type} , B ₂ O ₃ or It is preferable that the alumina lead-free dielectric powder is made in an electrolyte solution in which at least one metal salt of LiCl, NaCl, KCl, CaCl 2 is added to a solution in which the alumina-based lead-free dielectric powder is dispersed.

In addition, another method of manufacturing a gas discharge display device according to the present invention in order to achieve the above object, (A) forming a secondary electrode for forming a partition on the substrate on which the data electrodes are formed; (B) applying a photoresist thick film of a predetermined thickness or more on a substrate on which the auxiliary electrode is formed; (C) patterning the photoresist thick film by lithography using ultraviolet light to form a photoresist pattern having grooves to expose the auxiliary electrodes; (D) forming a barrier rib in the grooves by connecting power of the auxiliary electrodes; And (e) removing the photoresist pattern through stripping.

In the present invention, in the step (a), the auxiliary electrodes form a dielectric layer on the substrate on which the data electrodes are formed and are formed on the dielectric layer, respectively, at positions corresponding to intermediate points between the data electrodes. In the step (b), the thick photoresist film is formed to have a thickness of 100 μm or more by casting a PMMA resist, and the step (b) includes (b-1) a crosslinked polymer and a reaction accelerator. ) And a photoresist manufacturing step of liquefying the adhesion promoter; And (b-2) applying the photoresist uniformly onto the substrate by a casting method. In the step (d), the electrophoresis method is based on SiO ₂ , B ₂ O ₃ , or alumina. It is preferable that the lead-free dielectric powder of is made in an electrolyte solution in which at least one metal salt of LiCl, NaCl, KCl, CaCl ₂ is added.

Hereinafter, a method of manufacturing a gas discharge display device according to the present invention will be described in detail with reference to the drawings.

In the present invention, it is possible to manufacture a high resolution, high-definition straight wall structure for HDTV, and at the same time, a micro-machining (micro-machining) technology for lowering the cost of manufacturing a barrier of AC PDP is manufactured. That is, the present invention is a resist coating of the X-ray lithography & galvanoforming & abforming (LIGA) process, which is a kind of micro-machining technology, which is an ultra-fine process technology applied to a conventional micro electronics mechenic system (MEMS). (PMMA) and patterning method using synchrotron radiation to create an initial PMMA patterning structure, followed by dielectric pattern plating instead of metal (Ni, Cu, etc.) To form. LIGA (X-ray lithography & Galvanoforming & Abforming) process is a representative micromachining process. patterning process technology).

6A through 6D are diagrams illustrating a method of manufacturing a partition wall of a gas discharge display device according to the present invention, in order of processing. In the method of manufacturing a partition wall as shown, after applying X-ray lithography technique to PMMA in a micro machining process, a dielectric (SiO ₂ -B ₂ O ₃ based) powder is dispersed in a solution. Electrophoresis shows a new process for making high aspect ratio bulkheads. The process method of the specific Example is as follows.

First, before the barrier ribs are stacked, as shown in FIG. 6A, a data electrode 12 is formed on a substrate, and a dielectric layer 13 is formed thereon to cover the data electrode 12. Next, the auxiliary electrode 14 for implementing the electrophoresis method is formed on the dielectric layer 13. This auxiliary electrode 14 can be applied not only to electrophoresis, but also used in accordance with the structural change.

Next, as shown in FIG. 6B, the photoresist is a dielectric layer in which the auxiliary electrode 14 is formed by liquefying photoresist with cross linked polymers, a reaction accelerator, and an adhesion promoter. 13) to form a photoresist thick film 15 '. In the case of photoresist coating, spin coating may be performed, but since a thick film of 100 μm or more is usually formed, uniform coating is performed by casting. The thus-coated photoresist thick film 15 'is subjected to X-ray lithography using the mask 16 for X-rays. At this time, the mask 16 is composed of a mask blank (thin membrane) 16a and an absorber 16b. The mask blank layer 16a is made of a low atominc number diamond, beryllium, or the like which is transparent to X ray and mechanically and thermally stable, and is an absorber. 16b is made of high atomic number Au, W and the like which are excellent in absorbing X-rays. After this X-ray exposure, development is carried out in a conventional manner as shown in FIG. 6C. That is, FIG. 6C shows a photoresist pattern 15 after developing.

Next, as shown in FIG. 6D, the power source is connected to the auxiliary electrode 14 from the outside to form the partition wall 17 by electrophoresis. Here, electrophoresis used is electrophoresis of SiO ₂ -B ₂ O ₃ system. The metal salt (LiCl, NaCl, KCl, CaCl ₂ , etc.) is added to the metal particles to the surface of the dielectric particles to form a (+) charge, at which time the auxiliary electrode 14 of the panel (- When the voltage is applied, the phosphor-charged particles are moved and attached to the auxiliary electrode 14 formed on the panel by electrophoresis. In this way, a barrier rib 17 is formed.

Next, as shown in FIG. 6E, only the partition 17 is left after removing the photoresist pattern 15 through stripping.

The bulkhead manufacturing process as described above is largely divided into a micro-machining process and an electrophoresis method. X-ray lithography is used as a micromachining process. The principle of syncrotron, the basic principle of X-ray lithography, is shown in FIG. 7.

Since the electrons move in a linear motion, they rotate the electrons by applying a magnetic field H. The accelerating electrons come out of synchrotron radiation. This synchrotron radiation is an electromagnetic wave (X-ray) in which electromagnetic waves and magnetic waves are combined, and has a wavelength of 1 to 4 GHz. There is little error and the surface roughness (roughness) is Ra = 300Å and the surface is smooth.

X-ray lithography uses shorter wavelength X-rays, and uses high energy for a short time, so high aspect ratios are easily obtained. In addition, there is an advantage that the reproducibility is good regardless of the topography of the substrate, the substrate type, and the surface reflection of the substrate. This is a strong advantage to enable mass production. Another important advantage is the absence of low atomic number contamination.

Mass transfer in the electrode / electrolyte system occurs by electromigration, convection, and diffusion as shown in FIG. 8. Electrophoresis refers to the movement of ions or molecules by electrical forces, also called electrophoresis. Diffusion is caused by the difference in concentration of ions or molecules, and the movement of ions to the electrode surface is mainly caused by diffusion in electrochemical reactions such as electroplating. In this embodiment, lead-free glass powder of B ₂ O _3, SiO ₂ , or alumina is charged with alkali ions and used for electrophoresis. That is, it refers to the movement of materials to the cathode by attaching positively charged alkali ions such as K, Li, and Na to the outside of the SiO 2 -B 2 O 3 dielectric particles. The dielectric barrier ribs thus prepared are fired in the same temperature range as the conventional paste firing process in the temperature range of 530 to 580 ° C after electrophoresis. The firing removes other contaminants such as organic matter, and serves to increase the packaging density. In addition, the adhesion between the SiO ₂ -B ₂ O ₃ based dielectric and the substrate is improved to form a rigid structure.

In addition, the embodiment is also manufactured by applying a LIGA-like process method that is exposed to normal UV in place of X-ray. LIGA-like is the use of a typical photoresist thick film (thick PR), and instead of the X-rays to perform the desired patterning (patterning). In this case, since a general mask is used without specially manufacturing an X-ray mask, the manufacturing cost can be reduced. Although the pattern resolution is slightly lower than that using X-ray lithography, its value is sufficient because it is better than the resolution in current PDP manufacturing processes. As such, the LIGA-like method may also be applied in the present embodiment.

As described above, the method for fabricating a barrier rib of plasma display panel according to the present invention is LIGA (X-ray lithography & Galvanoforming & a kind of micro-machining technology) After the initial PMMA patterning structure was made by applying resist coating (PMMA) and patterning method using synchrotron radiation in the abforming process, instead of plating metal (Ni, Cu, etc.) By forming a partition wall having a high-definition straight wall structure by performing dielectric pattern plating, it is possible to produce an ultra-high definition product in a small device. In particular, it is still insufficient to cope with the large area of 40 ″ or more like PDP (X-ray lithography, mask manufacturing technology), but it has high aspect ratio that can control the line width in the unit of μm and the pattern thickness can be formed up to the unit of mm. Because of the high aspect ratio micro-structure manufacturing technology, it is possible to manufacture a high aspect ratio partition wall having a line width-to-ratio height of 1 to 10 or more, and a partition wall having a surface roughness of 300 mm or less can be obtained. The following are the main effects that can be obtained through the method of manufacturing the partition wall of the gas discharge display device according to the present invention.

1) High aspect ratio (100: 1 or more possible) Bulkhead can be formed with high productivity.

2) It is possible to form a smooth and smooth wall surface.

3) Since the line width can be controlled to several micro units, it can be applied to PDP for HDTV.

4) The partition wall shape may be processed in the form of a post rather than a stripe.

5) Barrier rib Electrode Applicable to the development of new AC PDP structure.

6) The compactness of the bulkhead is increased. That is, the outgas remaining in the partition wall is reduced, deterioration of phosphor and deterioration of characteristics are prevented, and the mechanical strength, heat dissipation characteristics, etc. of the partition wall are improved.

7) Light emission cross-sectional area, reflection efficiency, etc. are increased by decreasing bulkhead width and increasing phosphor volume within a certain cell size. This leads to an increase in AC PDP brightness and efficiency.

Claims (15)

(A) forming auxiliary electrodes for barrier rib manufacturing on a substrate on which data electrodes are formed; (B) applying a photoresist thick film of a predetermined thickness or more on a substrate on which the auxiliary electrode is formed; (C) patterning the photoresist thick film by X-ray lithography using an X-ray mask to form a photoresist pattern having grooves to expose the auxiliary electrodes; (D) forming a barrier rib in the grooves by connecting power to the auxiliary electrodes by electrophoresis; And (E) removing the photoresist pattern through stripping; partition wall manufacturing method of a gas discharge display device comprising a. The method of claim 1, The method of claim 1, wherein the auxiliary electrodes are formed between the data electrodes, respectively. The method of claim 1, In the step (a), the auxiliary electrodes are formed on the substrate on which the data electrodes are formed and are formed on the dielectric layer, wherein the auxiliary electrodes are formed at positions corresponding to intermediate points between the data electrodes. A method of manufacturing partition walls of gas discharge display devices. The method of claim 1, And (b) the photoresist thick film is formed of a PMMA resist. The method according to claim 1 or 4, The (b) step, (B-1) a photoresist manufacturing step of liquefying a cross link polymer, a reaction accelerator, and an adhesion promoter; And (B-2) an application step of uniformly applying the photoresist on the substrate by spin coating or casting; A barrier rib manufacturing method of a gas discharge display device comprising a. The method of claim 5, In the step (b), the thick photoresist film is formed to have a thickness of 100 μm or more by the casting method. The method of claim 1, In the step (c), the X-ray mask is made of a low atomic number material such as diamond and beryllium to transmit X-ray, and an absorbing layer made of high-numbered material such as Au and W to absorb X-ray. Forming a partition wall of the gas discharge display device, characterized in that formed. The method of claim 1, In the step (d), the electrophoresis is performed in an electrolyte solution in which at least one metal salt of LiCl, NaCl, KCl, or CaCl ₂ is added to a solution in which a lead-free dielectric powder of SiO ₂ , B ₂ O ₃ , or alumina is dispersed. A partition wall manufacturing method of a gas discharge display device, characterized in that. (A) forming auxiliary electrodes for barrier rib manufacturing on a substrate on which data electrodes are formed; (B) applying a photoresist thick film of a predetermined thickness or more on a substrate on which the auxiliary electrode is formed; (C) patterning the photoresist thick film by lithography using ultraviolet light to form a photoresist pattern having grooves to expose the auxiliary electrodes; (D) forming a barrier rib in the grooves by connecting power to the auxiliary electrodes by electrophoresis; And (E) removing the photoresist pattern through stripping; partition wall manufacturing method of a gas discharge display device comprising a. The method of claim 9, The method of claim 1, wherein the auxiliary electrodes are formed between the data electrodes, respectively. The method of claim 9, In the step (a), the auxiliary electrodes are formed on the substrate on which the data electrodes are formed and are formed on the dielectric layer, wherein the auxiliary electrodes are formed at positions corresponding to intermediate points between the data electrodes. A method of manufacturing partition walls of gas discharge display devices. The method of claim 9, And (b) the photoresist thick film is formed of a PMMA resist. The method of claim 9 or 12, The (b) step, (B-1) a photoresist manufacturing step of liquefying a cross link polymer, a reaction accelerator, and an adhesion promoter; And (B-2) an application step of uniformly applying the photoresist on the substrate by spin coating or casting; A barrier rib manufacturing method of a gas discharge display device comprising a. The method of claim 13, In the step (b), the thick photoresist film is formed to have a thickness of 100 μm or more by the casting method. The method of claim 9, In the step (d), the electrophoresis is performed in an electrolyte solution in which at least one metal salt of LiCl, NaCl, KCl, or CaCl ₂ is added to a solution in which a lead-free dielectric powder of SiO ₂ , B ₂ O ₃ , or alumina is dispersed. A partition wall manufacturing method of a gas discharge display device, characterized in that.

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