KR100590252B1 - Organic light emission device panel - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an organic light emitting display device, wherein the present invention includes a thin film transistor, a first electrode, a second electrode, and one or more light emitting layers between the first electrode and the second electrode, and the second electrode. A lower insulating substrate including an organic planarization layer formed over the entire surface of the substrate, and an upper insulating substrate for encapsulating the lower insulating substrate, wherein the organic planarization layer above the outer wiring part of the lower insulating substrates; The trench is formed to form a trench, and the trench is filled with an encapsulant, thereby bonding the upper insulating substrate and the lower insulating substrate to provide an organic light emitting display device.

Trench, sealant, organic planarization

Description

Organic electroluminescent display device {Organic light emission device panel}

1 is a cross-sectional view of a panel of an organic light emitting display device according to the related art,

2 is a cross-sectional view of the portion A of FIG.

3 is a view showing a panel of an organic electroluminescent display device according to an embodiment of the present invention seen from a light emitting surface;

4 is a cross-sectional view according to an embodiment of the present invention for the II 'of FIG.

5 is a cross-sectional view according to another embodiment of the present invention for the II ′ of FIG. 3.

Explanation of reference numerals for the main parts of the drawing

100, 200a, 200b: lower insulating substrate

110: organic light emitting device

130, 215, 215a, 215b: encapsulant

205: trench

235a and 235b: organic planarization film

140, 245a, 245b: upper insulation substrate

295: active area

The present invention relates to an organic light emitting display device, and more particularly, to an organic light emitting display device in which a trench is formed in a sealing portion of a substrate to be filled with an encapsulant.

Recently, an organic light emitting display device has attracted attention as a next generation display device due to advantages such as thin film type, wide viewing angle, light weight, small size, fast response speed, and low power consumption compared to CRT or LCD.

The conventional organic light emitting display device includes an organic light emitting diode formed on an insulating substrate and an encapsulation substrate facing the lower insulating substrate on the organic light emitting diode.

However, in the conventional organic light emitting display device, the light emitting layer material and the cathode electrode material of the organic light emitting diode have low moisture resistance and oxidation resistance, resulting in deterioration of the operation of the display. Creates. Thus, as time passes, the dark spot region diffuses around, resulting in the entire device not emitting light.

Therefore, generally, a process called encapsulation is performed to prevent the maximum exposure to moisture and oxygen. The process forms an absorbent on the encapsulation substrate to fix the absorbent therein, followed by nitrogen (N2) or argon ( The lower insulating substrate and the upper insulating substrate are bonded to each other through an encapsulant under an inert gas atmosphere such as Ar).

However, in the case of a top emission type organic light emitting display device, a problem occurs in that the adhesion between the encapsulant and the lower substrate decreases due to the organic planarization layer, which is an essential element of device fabrication. Defects will occur.

In order to solve the above problems, in Korean Patent Application No. 2000-21700, the organic electroluminescent display panel and its manufacturing method are formed on the lower substrate by forming an uneven portion, which is an inorganic film, to increase adhesion between the substrate and the encapsulant. The method of making is disclosed.

Hereinafter, the above description will be described with reference to the accompanying drawings.

Referring to FIG. 1, the organic light emitting diode 110 is formed on the lower insulating substrate 100. In this case, the organic light emitting device 110 is composed of an anode electrode, an organic layer including a light emitting layer, and a cathode electrode. After the organic light emitting device 110 is formed, an organic film for planarization is formed over the entire surface of the substrate, and the unevenness 120 of the inorganic film is formed in the sealing portion of the upper portion of the organic film. The organic light emitting diode 110 is encapsulated by adhering the upper substrate 140 and the lower insulating substrate 100 to the encapsulation bonding portion A of the lower insulating substrate 100 using the encapsulant 130. Therefore, the adhesion between the organic planarization layer and the encapsulant under the uneven portion 120 may be increased due to the uneven portion 120 of the inorganic layer.

However, referring to FIG. 2, which is a cross-sectional view of the portion A of FIG. 1, in the above technique, external moisture or gas is introduced (3) between organic membranes at portions other than the unevenness 120 of the bonding portion, and as a result, There is a limit to preventing deterioration from occurring.

 The technical problem to be solved by the present invention is to solve the problem of adhesion between the encapsulant and the organic planarization layer in the organic light emitting display device, and is caused by the penetration of external moisture and gas through the organic planarization layer at the encapsulation area and deterioration thereof. The purpose is to prevent the deterioration of the lifetime of the device.

In order to achieve the above technical problem, the present invention includes a thin film transistor, a first electrode, a second electrode, and one or a plurality of light emitting layers between the first electrode and the second electrode, and over the entire substrate on the second electrode. A lower insulating substrate including an organic planarization layer formed thereon, and an upper insulating substrate for encapsulating the lower insulating substrate, wherein the organic planarization layer layer on the outer wiring part of the lower insulating substrate is removed to form a trench. The trench is filled with an encapsulant, and the upper insulating substrate and the lower insulating substrate are bonded to each other, thereby providing an organic light emitting display device.

In the above, the organic planarization layer comprises at least one organic material, characterized in that the organic material is at least one material selected from the group consisting of acrylic, BCB and PI.

  In addition, the trench may include one or a plurality of trenches formed in the sealing portion of the lower substrate, and the trench may be formed using an etching process.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. The following embodiments are provided as examples to sufficiently convey the spirit of the present invention to those skilled in the art. Accordingly, the invention is not limited to the embodiments described below and may be embodied in other forms. In the drawings, lengths, thicknesses, and the like of layers and regions may be exaggerated for convenience. Like numbers refer to like elements throughout.

3 is a view showing a completed panel of an organic light emitting display device according to an embodiment of the present invention from a light emitting surface. The organic light emitting display device of the present invention includes an active region 295 in which a thin film transistor and an organic light emitting diode are formed on a lower insulating substrate, and an outer portion 215 in which wirings such as a gate line and a data line are formed. The scan driver 255 and the data driver 265 are formed outside the device. In addition, an encapsulant is formed on the outer portion of the substrate to surround the active region 295, and covers an edge of the substrate so as to surround the active region 295 within a range that does not impair the active region 295. Trench 205 is formed.

A plurality of organic light emitting diode pixels are formed in the active region 295, and the pixels include two transistors, one organic light emitting diode, and one capacitor, but the present invention is not limited thereto.

The organic light emitting diode is formed on a lower insulating substrate, and includes a first electrode, an organic layer including a light emitting layer, and a second electrode. When the first electrode functions as an anode electrode, the second electrode serves as a cathode electrode. When the first electrode acts as a cathode, the second electrode acts as an anode. In addition, the organic light emitting device is a top-emitting organic light emitting device that emits light toward the upper insulating substrate. In addition, the organic layer may be composed of several layers according to its function. Generally, the hole injection layer (HIL), the hole transport layer (HTL), the light emitting layer (EML), the hole suppression layer (HBL), and the electron transport layer (ETL) At least one of the electron injection layers EIL may have a multilayer structure. When the organic light emitting diode is formed, a planarization layer, which is an organic layer, is stacked over the entire surface of the substrate in order to increase the flatness of the front surface of the organic light emitting diode. However, in the present invention, the organic planarization layer is removed from the upper portion of the lower portion of the outer substrate 215 so as to enhance the adhesive force between the encapsulant and the lower insulating substrate.

4 is a sectional view according to an embodiment of the present invention with respect to II ′ of FIG. 3.

Referring to the drawings, the wiring line 225a of the device is formed on the outer portion 215 of the lower insulating substrate 200a, and the organic planarization layer 235a is formed on the upper portion of the lower insulating substrate 200a. . The organic planarization layer is preferably formed of a material such as acrylic, BCB and PI. The organic planarization layer is etched using an etching process to form a trench in the sealing part to expose the upper portion of the metal wiring layer formed at the bottom thereof. In addition, the trench is filled with an encapsulant 215a to encapsulate the upper insulating substrate 245a and the lower insulating substrate. The encapsulant 215a is preferably made of a resin cured by UV or a conventional encapsulant.

5 is a cross-sectional view taken along line II ′ of FIG. 3 according to another embodiment of the present invention. Referring to the drawings, an interconnection line 225b of an element is formed on the lower insulating substrate 200b and an inorganic protective layer 227 is formed on the lower insulating substrate 200b. The inorganic protective layer 227 serves to protect the metal electrode and other layers in the organic light emitting device. In addition, an organic planarization layer 235b is formed on the inorganic protective layer 227, the organic planarization layer 235b is formed of a material of acrylic, BCB, and PI, and the inorganic protective layer is formed of a silicon nitride film. It is preferable. The organic planarization layer is etched using an etching process to form a trench in the sealing part to expose the upper portion of the metal wiring layer formed at the bottom thereof. In addition, an encapsulant 215b is filled in the trench to encapsulate the upper insulating substrate 245b and the lower insulating substrate. The encapsulant 215b is preferably a resin cured by UV or a conventional encapsulant.

According to embodiments of the present invention, even if external moisture or gas penetrates the organic planarization layer 235a, moisture or gas penetrated by the encapsulant formed in the trench is blocked, and the encapsulant is formed on the upper insulating substrate. It is formed between the lower and the metal wiring to increase the adhesive strength. Therefore, it is possible to prevent deterioration or black spots of the device due to the inflow of moisture and gas, thereby improving the life characteristics of the device.

The trench formed in the encapsulation portion and the encapsulant in the trench block the inflow of external gas and water, and increase the adhesive force of the encapsulant, thereby improving the characteristics of the organic light emitting device inside the panel.

Although described above with reference to a preferred embodiment of the present invention, those skilled in the art will be variously modified and changed within the scope of the invention without departing from the spirit and scope of the invention described in the claims below I can understand that you can.

Claims (6)

 A thin film transistor, a first electrode, a second electrode, and one or a plurality of light emitting layers between the first electrode and the second electrode, and an organic planarization layer formed over the entire surface of the second electrode; A lower insulating substrate; An upper insulating substrate for encapsulating the lower insulating substrate, The organic planarization layer is formed by removing the organic planarization layer on the outer wiring part of the lower insulation substrate, and an encapsulant is filled in the trench to bond the upper insulation substrate and the lower insulation substrate together. Device. The organic light emitting display device of claim 1, wherein the organic planarization layer comprises at least one organic material, and the organic material is at least one material selected from the group consisting of acryl, BCB, and PI. The organic light emitting display device of claim 1, wherein the trench comprises one or a plurality of trenches formed in a sealing portion of the lower substrate. The organic light emitting display device of claim 3, wherein the trench is formed using an etching process. The organic light emitting display device of claim 1, wherein the organic planarization layer further includes an inorganic protective layer. The organic light emitting display device of claim 5, wherein the inorganic protective layer is formed of a silicon nitride film.

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