KR100586325B1 - The manufacturing method of chip for scagliola - Google Patents
The manufacturing method of chip for scagliola Download PDFInfo
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- KR100586325B1 KR100586325B1 KR1020030056865A KR20030056865A KR100586325B1 KR 100586325 B1 KR100586325 B1 KR 100586325B1 KR 1020030056865 A KR1020030056865 A KR 1020030056865A KR 20030056865 A KR20030056865 A KR 20030056865A KR 100586325 B1 KR100586325 B1 KR 100586325B1
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B18/00—Use of agglomerated or waste materials or refuse as fillers for mortars, concrete or artificial stone; Treatment of agglomerated or waste materials or refuse, specially adapted to enhance their filling properties in mortars, concrete or artificial stone
- C04B18/02—Agglomerated materials, e.g. artificial aggregates
- C04B18/022—Agglomerated materials, e.g. artificial aggregates agglomerated by an organic binder
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B20/00—Use of materials as fillers for mortars, concrete or artificial stone according to more than one of groups C04B14/00 - C04B18/00 and characterised by shape or grain distribution; Treatment of materials according to more than one of the groups C04B14/00 - C04B18/00 specially adapted to enhance their filling properties in mortars, concrete or artificial stone; Expanding or defibrillating materials
- C04B20/02—Treatment
- C04B20/04—Heat treatment
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B26/00—Compositions of mortars, concrete or artificial stone, containing only organic binders, e.g. polymer or resin concrete
- C04B26/02—Macromolecular compounds
- C04B26/10—Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- C04B26/18—Polyesters; Polycarbonates
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2103/00—Function or property of ingredients for mortars, concrete or artificial stone
- C04B2103/54—Pigments; Dyes
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
- C04B2111/54—Substitutes for natural stone, artistic materials or the like
- C04B2111/542—Artificial natural stone
- C04B2111/545—Artificial marble
Abstract
본 발명은 인조대리석용 칩의 제조방법에 관한 것이다. The present invention relates to a method of manufacturing a chip for artificial marble.
본 발명의 제조방법은, 열경화성수지와 무기충전제와 촉진제와 경화제와 안료를 혼합하여 액상의 컴파운드를 제조하는 컴파운드제조단계와; 컴파운드제조단계에 의해 제조된 액상의 컴파운드를 원통형의 드럼에 넣고 드럼을 회전시키면서 열을 가하여 경화시키는 컴파운드경화단계와; 컴파운드경화단계에 의해 경화된 컴파운드를 분쇄하여 칩을 얻는 컴파운드분쇄단계와; 컴파운드분쇄단계를 통해 얻어진 칩 중 인조대리석용 칩으로 사용하기에 적합한 칩만을 분류해 내는 칩선별단계;로 이루어진다. The manufacturing method of the present invention comprises a compound manufacturing step of preparing a liquid compound by mixing a thermosetting resin, an inorganic filler, an accelerator, a curing agent and a pigment; A compound hardening step of putting a liquid compound prepared by the compound manufacturing step into a cylindrical drum and applying heat while rotating the drum; A compound grinding step of pulverizing the compound cured by the compound hardening step to obtain a chip; Chip sorting step of classifying only the chips suitable for use as artificial marble chips among the chips obtained through the compound grinding step.
본 발명에 의해 기포함유율이 낮은 인조대리석용 칩을 얻을 수 있어 본 발명의 인조대리석용 칩을 사용하여 제조된 인조대리석은 천연대리석과 같은 질감이 보다 잘 표현되고, 칩의 깨짐 현상 및 이물질이 끼어 더러워지는 현상이 발생되지 않으며, 인조대리석을 성형함에 있어서 작업효율이 저하되지 않는다. According to the present invention, the artificial marble chip having a low inclusion rate can be obtained, and the artificial marble prepared by using the artificial marble chip of the present invention has a better texture, such as natural marble, and chipping phenomenon and foreign substances are caught. The phenomenon of getting dirty does not occur, and the working efficiency does not decrease in molding artificial marble.
또한, 부분적으로 여러 색상을 갖는 칩을 제공할 수 있으며, 컴파운드 제조공정에 펄을 더 혼합할 경우 펄의 입체감이 살아난다In addition, it is possible to provide a chip that is partially multicolored, and when the pearl is further mixed in the compound manufacturing process, the three-dimensional effect of the pearl is saved.
인조대리석, 칩, 컴파운드, 기포제거Artificial Marble, Chip, Compound, Bubble Removal
Description
도 1은 본 발명의 인조대리석용 칩의 제조방법 공정도1 is a process chart of the manufacturing method of artificial marble chip of the present invention
도 2는 본 발명에서 컴파운드의 기포를 제거하기 위해 사용되는 컴파운드경화장치의 개략도2 is a schematic view of a compound hardening device used to remove air bubbles in the compound in the present invention;
〈도면의 주요부분에 대한 부호의 설명〉<Explanation of symbols for main parts of drawing>
10. 컴파운드경화장치 11. 드럼10.
11a. 컴파운드투입공간 12. 드럼회전수단11a.
13. 발열수단 13. Heating means
본 발명은 천연대리석과 같은 질감을 갖는 인조대리석을 제조하기 위해 인조대리석의 제조과정에 투입되는 칩의 제조방법에 관한 것이다. The present invention relates to a method for manufacturing a chip that is put into the manufacturing process of artificial marble to manufacture artificial marble having the same texture as natural marble.
최근 천연대리석과 같은 질감이 표현된 다양한 형태의 인조대리석이 제조되고 있는 실정이다. Recently, various types of artificial marbles with the same texture as natural marble are produced.
인조대리석에 천연대리석의 질감을 표현하기 위한 방법으로 인조대리석의 제조시에 칩을 투입하여 성형한다. As a method for expressing the texture of natural marble in artificial marble, the chip is inserted and molded during the manufacture of artificial marble.
상기와 같은 칩은, 한국 특허출원 제10-2001-0029059호(인조대리석 제조방법, 2001. 05. 25.출원)에서와 같이 불포화폴리에스테르 등의 열경화성수지에 충전제와 촉진제와 경화제와 안료를 혼합, 교반하여 컴파운드를 제조하는 공정 후 상기 컴파운드를 몰드에 투입하여 경화시킴으로써 패널 형상의 판재를 제조하고, 이 판재를 조분쇄과정과 미분쇄과정을 거쳐 분쇄하는 공정을 통해 제조되었다. Such a chip is mixed with a filler, a promoter, a curing agent, and a pigment in a thermosetting resin such as unsaturated polyester, as in Korean Patent Application No. 10-2001-0029059 (Manufacturing Method of Artificial Marble, filed on May 25, 2001). After the process of preparing the compound by stirring, the compound was added to the mold and cured to prepare a panel-shaped plate material, and the plate material was manufactured through a process of pulverizing through a coarse grinding process and a fine grinding process.
그런데, 상기와 같은 방법에서 컴파운드의 경화는 몰드에 안치된 상태로 방치됨에 따라 자연스럽게 경화되는 것이어서 경화된 컴파운드에는 다량의 기포가 함유된 상태가 되므로 가공된 칩에도 상당한 기포가 함유될 수 밖에 없었다. However, in the above method, the compound is cured naturally as it is left in the mold, and the cured compound is in a state containing a large amount of bubbles.
이와 같이 다량의 기포가 함유된 칩을 인조대리석의 제조에 사용함에 따라 인조대리석의 표면 층에 놓이는 칩에 기포가 표현됨으로써 인조대리석의 질감을 저하시키는 문제점을 유발하였다. As the chips containing a large amount of bubbles are used in the manufacture of artificial marble, bubbles are expressed on the chips placed on the surface layer of the artificial marble, thereby causing a problem of deteriorating the texture of the artificial marble.
특히, 매끄러운 표면을 갖도록 인조대리석을 연마하는 경우에는 인조대리석의 표면에 기포가 더욱 선명하게 드러나며, 이 기포가 위치된 자리에 이물질이 끼고, 칩이 쉽게 깨지는 문제점이 있었다. In particular, when the artificial marble is polished to have a smooth surface, bubbles are more clearly exposed on the surface of the artificial marble, and foreign matter is caught in the place where the bubbles are located, and chips are easily broken.
또한, 인조대리석을 제조함에 있어서 프레스 성형법으로 제조하는 경우에는 금형 내에서의 유동성 저하로 인한 품질저하 및 압력으로 인한 칩의 깨짐 현상과 표면 함몰 등의 추가적인 문제점도 가지게 되었다. In addition, in the case of manufacturing artificial marble by the press molding method, there are additional problems such as chip breakage and surface depression due to deterioration in quality due to fluidity deterioration and pressure in the mold.
본 발명은 인조대리석이 천연대리석과 같은 질감을 갖도록 하기 위해 인조대리석의 제조 공정에 투입되는 칩에 기포가 함유되지 않도록 하여 보다 자연스러운 질감이 표현되도록 하고, 칩의 깨짐 현상 및 이물질이 끼어 더러워지는 현상이 발생되지 않도록 하며, 인조대리석을 성형함에 있어 작업성이 저하되는 것을 방지하려는데 목적이 있다.
In the present invention, the artificial marble has a texture similar to that of natural marble, so that bubbles are not contained in the chip that is added to the manufacturing process of the artificial marble so that a more natural texture is expressed, and the phenomenon of chip breakage and foreign matter gets caught. The purpose is to prevent the occurrence of this, and to prevent workability deterioration in molding artificial marble.
본 발명은 인조대리석용 칩의 제조방법에 관한 것이다. The present invention relates to a method of manufacturing a chip for artificial marble.
본 발명에서는 열경화성수지와 무기충전제와 촉진제와 경화제와 안료를 혼합하여 제조한 액상의 컴파운드를 경화시킴에 있어서 컴파운드를 원통형의 드럼에 넣고 드럼을 회전시키면서 열을 가하여 컴파운드에 들어있는 기포를 제거함으로써 경화된 컴파운드의 분쇄물인 칩이 기포를 함유하지 않도록 한다. In the present invention, in curing a liquid compound prepared by mixing a thermosetting resin, an inorganic filler, an accelerator, a curing agent, and a pigment, the compound is placed in a cylindrical drum and heated by rotating the drum to remove bubbles contained in the compound. The chips, which are ground products of the prepared compound, should not contain bubbles.
따라서, 본 발명의 인조대리석용 칩의 제조방법은, Therefore, the manufacturing method of the artificial marble chip of the present invention,
열경화성수지와 무기충전제와 촉진제와 경화제와 안료를 혼합하여 액상의 컴파운드를 제조하는 컴파운드제조단계와; A compound manufacturing step of preparing a liquid compound by mixing a thermosetting resin, an inorganic filler, an accelerator, a curing agent, and a pigment;
컴파운드제조단계에 의해 제조된 액상의 컴파운드를 원통형의 드럼에 넣고 드럼을 회전시키면서 열을 가하여 경화시키는 컴파운드경화단계;를 갖는다. Compound compounding step of putting the compound of the liquid prepared by the compound manufacturing step into a cylindrical drum and applying heat while rotating the drum;
또, 컴파운드경화단계에 의해 경화된 컴파운드를 분쇄하여 칩을 얻는 컴파운드분쇄단계와; In addition, the compound grinding step of obtaining a chip by pulverizing the compound cured by the compound curing step;
컴파운드분쇄단계를 통해 얻어진 칩 중 인조대리석용 칩으로 사용하기에 적합한 칩만을 분류해 내는 칩선별단계;를 갖는다. And a chip sorting step of classifying only chips suitable for use as artificial marble chips among the chips obtained through the compound grinding step.
이하, 본 발명의 기술적 사상을 보다 구체적으로 설명하면 다음과 같다. Hereinafter, the technical spirit of the present invention will be described in more detail.
본 발명은 열경화성수지를 주원료로 한 인조대리석용 칩을 제조하는 방법에 관한 것이다. The present invention relates to a method for manufacturing a chip for artificial marble using a thermosetting resin as a main raw material.
따라서, 본 발명에서도 열경화성수지와 무기충전제와 촉진제와 경화제와 안료를 혼합하여 액상의 컴파운드를 제조한 후 이 액상의 컴파운드를 경화시키고 경화된 컴파운드를 분쇄하는 방법으로 인조대리석용 칩을 제조한다. Therefore, in the present invention, a mixture of a thermosetting resin, an inorganic filler, an accelerator, a curing agent, and a pigment is prepared to prepare a liquid compound, and then, a method for preparing artificial marble is prepared by curing the liquid compound and pulverizing the cured compound.
상기 컴파운드의 제조과정에서 사용되는 열경화성수지로는 종래와 같이 메틸메타아크릴레이트 수지나 비닐에스테르 수지를 사용할 수 있고 바람직하게는 불포화폴리에스테르 수지(unsaturated polyester resin)를 사용할 수 있다. As the thermosetting resin used in the preparation of the compound, methyl methacrylate resin or vinyl ester resin may be used as in the prior art, and preferably, an unsaturated polyester resin may be used.
또, 무기충전제로는 탄산칼슘이나 수산화알루미늄 및 실리카 분말을 사용할 수 있으며, 촉진제로는 코발트-나프탈렌계 화합물을 사용할 수 있다. In addition, calcium carbonate, aluminum hydroxide and silica powder may be used as the inorganic filler, and cobalt-naphthalene-based compounds may be used as the accelerator.
또, 경화제로는 메틸에틸케톤퍼옥사이드를 사용할 수 있다. Moreover, methyl ethyl ketone peroxide can be used as a hardening | curing agent.
안료로는 칩의 색상에 따라 이산화티탄, 무기안료 또는 카본블랙 등을 사용할 수 있다. As the pigment, titanium dioxide, an inorganic pigment or carbon black may be used depending on the color of the chip.
즉, 백색의 칩을 얻고자 하는 경우에는 이산화티탄을 사용하고 흑색의 칩은 카본블랙을 사용하는 등 얻으려 하는 색상에 따라 안료를 선택하여 사용하는 것이다. In other words, when a white chip is to be obtained, titanium dioxide is used, and a black chip is selected by using a pigment according to a color to be obtained, such as using carbon black.
상기 과정에서 투입되는 열경화성수지와 무기충전제, 촉진제, 경화제 등의 투입량에 대하여는 이미 공지된 기술이므로 더 이상의 설명은 생략한다. The amount of the thermosetting resin and the inorganic filler, the accelerator, and the curing agent added in the above process is already known, and thus, further description thereof will be omitted.
그런데, 본 발명에서는 열경화성수지와 무기충전제와 촉진제와 경화제와 안료를 혼합하여 얻은 액상의 컴파운드가 경화하는 과정에서 기포를 함유하지 않도록 하여 완성된 칩도 기포를 함유하지 않도록 하려는 목적을 갖는다. However, the present invention has an object of not containing bubbles in a liquid compound obtained by mixing a thermosetting resin, an inorganic filler, an accelerator, a curing agent, and a pigment so as not to contain bubbles in the process of curing.
상기와 같은 목적을 달성하기 위해 본원출원의 발명자는 다양한 실험을 실시하였다. In order to achieve the above object, the inventor of the present application carried out various experiments.
그 예로 컴파운드의 재료인 열경화성수지와 무기충전제와 촉진제와 경화제와 안료를 혼합하기 위한 배합기에 진공탈포장치를 설치하여 기포를 제거하는 실험을 실시하였다. For example, an experiment was performed to remove bubbles by installing a vacuum degassing apparatus in a compounding compound for mixing a thermosetting resin, an inorganic filler, an accelerator, a curing agent, and a pigment as a compound material.
그 결과 낮은 점도(열경화성수지와 무기충전제의 혼합비에 따라 결정됨)의 컴파운드는 기포의 제거 효율이 우수하였으나 컴파운드를 판 형태로 제조하기 위해 형틀로 옮기는 과정 및 형틀에서 완전 겔 상태로 경화되는 과정 중에 기포가 함유되는 문제점이 발견되었다. As a result, the low viscosity compound (determined by the mixing ratio of thermosetting resin and inorganic filler) has excellent bubble removal efficiency, but the air bubbles during the process of transferring the compound to the mold to form the plate and curing in the mold to the complete gel state Problems containing these have been found.
뿐만 아니라, 컴파운드가 진공상태에 놓임에 따라 컴파운드의 경화가 매우 빠르게 이루어지므로 겔 초기단계로 경화된 컴파운드를 형틀에 붓는 작업을 매우 빠르게 실시해야 하는 어려움이 있었다. In addition, as the compound is placed in a vacuum state, since the compound is hardened very quickly, there is a difficulty in performing the pouring of the compound, which is cured at the initial stage of the gel, into the mold very quickly.
이에 반하여, 높은 점도의 컴파운드는 기포의 제거에 오랜 시간이 소요되는 문제점을 가지므로 진공을 통한 기포제거방법은 바람직하지 못하다는 결론을 얻었다. On the contrary, since a high viscosity compound has a problem that it takes a long time to remove bubbles, it was concluded that the method of removing bubbles through vacuum is not preferable.
본원출원의 발명자는 액상의 컴파운드에 열을 가하면서 고속 회전시킬 경우 액상의 컴파운드가 경화하는 과정에서 함유되는 기포가 제거된다는 것을 알 수 있었다. The inventors of the present application was found that when the high-speed rotation while applying heat to the liquid compound, the bubbles contained in the process of curing the liquid compound is removed.
보다 구체적으로 설명하며, 열경화성수지가 경화되는 온도가 유지되는 원통형의 드럼(11) 내부에 액상의 컴파운드를 투입한 후 드럼(11)을 회전시켜 컴파운드가 경화되는 과정에서 컴파운드는 드럼(11)과 함께 회전되도록 하고, 이로 인하여 기포가 제거되도록 한 것이다. In more detail, the compound is introduced in the process of curing the compound by rotating the
상기와 같이 드럼(11) 내부에서 컴파운드를 회전시키면 기포가 제거되는데 완전한 겔 상태로 경화된 컴파운드를 드럼(11)으로부터 이탈시켜 완전 경화시킨 결과 기포를 찾을 수 없을 정도로 좋은 품질의 칩을 얻을 수 있었다. As described above, when the compound is rotated in the
그런데 상기 과정에서 완전 겔 상태의 컴파운드를 경화시킴에 있어서, 겔 상태의 컴파운드를 드럼으로부터 이탈시켜 방치하여 경화시킴에 따라 드럼으로부터 이탈된 겔 상태의 컴파운드를 칼등으로 잘게 자르고 이 것을 다시 분쇄기에 투입함으로써 작은 입자의 칩을 얻기 위해 여러 번의 분쇄과정을 거치지 않아도 되는 결과도 얻을 수 있었다. However, in curing the compound of the gel state in the above process, as the gel compound is removed from the drum and left to cure, the gel compound separated from the drum is chopped finely with a knife or the like and put into the grinder again. The result was that it was not necessary to go through several grinding processes to get chips of small particles.
상기와 같은 방법에 의한 기포의 제거는 컴파운드의 점도가 200푸아즈(poise) 이내에서는 기포를 찾아볼 수 없을 정도로 기포제거 효율이 우수하였다. Bubble removal by the method described above was excellent in the bubble removal efficiency so that no bubbles can be found when the viscosity of the compound within 200 poise (poise).
또한 액상의 컴파운드에 가하는 열은 경화가 이루어지는 상온 즉 25℃ 정도에서부터 컴파운드가 크게 손상되지 않는 80℃까지가 바람직하였으며 컴파운드의 점도에 따라 40℃ ∼ 60℃ 정도가 최적의 조건이었다. In addition, the heat applied to the liquid compound is preferably from room temperature, that is, about 25 ° C. to 80 ° C., in which the compound is not significantly damaged.
컴파운드의 점도에 따라 가열온도를 다르게 하는 이유는 점도가 높은 컴파운드는 점도가 낮은 컴파운드에 비하여 기포제거가 잘 이루어지지 않기 때문이다. The reason why the heating temperature is changed according to the viscosity of the compound is that a high viscosity compound does not perform bubble removal better than a low viscosity compound.
그런데 이러한 기포제거 시간을 컴파운드의 가열온도를 조절함으로써 단축시킬 수 있었다. However, this bubble removal time could be shortened by adjusting the heating temperature of the compound.
상기 과정에서 컴파운드가 투입된 드럼의 회전속도는 50rpm ∼ 500rpm이 바람직하였다. In the above process, the rotation speed of the compound-loaded drum was preferably 50 rpm to 500 rpm.
따라서, 본 발명에 사용되는 컴파운드경화장치(10)는, Therefore, the
불포화폴리에스테르수지와 무기충전제와 촉진제와 경화제와 안료가 혼합된 액상의 컴파운드가 투입되는 컴파운드투입공간(11a)을 갖는 드럼(11)과; A drum (11) having a compound injection space (11a) into which a compound of an unsaturated polyester resin, an inorganic filler, an accelerator, a curing agent, and a pigment are mixed;
상기 드럼(11)을 회전시켜 컴파운드투입공간(11a)에 투입된 컴파운드가 드럼(11)과 함께 회전되도록 하는 드럼회전수단(12)과; Drum rotating means (12) for rotating the drum (11) to allow the compound introduced into the compound injection space (11a) to rotate together with the drum (11);
상기 드럼(11)의 컴파운드투입공간(11a)에 열을 가하기 위한 발열수단(13);을 갖는다. And heating means (13) for applying heat to the compound injection space (11a) of the drum (11).
상기 드럼회전수단(12)으로는 도 2에서와 같이 모터와 벨트를 사용한 형태로 구현할 수 있고, 발열수단으로는 소정의 온도를 갖는 스팀을 공급하는 방법 등을 사용할 수 있다. The drum rotating means 12 may be implemented using a motor and a belt as shown in FIG. 2, and a method of supplying steam having a predetermined temperature may be used as the heating means.
상기와 같은 발열수단(13)은 발열온도의 조절이 가능하도록 하는 것이 바람 직하다.The heating means 13 as described above is preferably to enable the control of the heating temperature.
한편, 본 발명에 의하면 하나의 칩이 부분적으로 여러 색상을 갖도록 할 수 있다. Meanwhile, according to the present invention, one chip may be partially colored.
이를 위한 방법을 구체적으로 설명하면, 컴파운드제조단계에서 색소를 혼합하여 각각 색상이 다른 액상의 컴파운드를 제조한 후 컴파운드경화단계에서 소정의 색상을 갖는 액상의 컴파운드를 드럼(11)에 먼저 넣어 경화시킨 후 소정의 시간 간격으로 색상이 다른 컴파운드를 투입하여 경화시키는 것이다. In detail, the method for this purpose is prepared by mixing the pigments in the compound manufacturing step to prepare a liquid compound of different colors, and then, in the compound curing step, the liquid compound having a predetermined color is first put into the
상기와 같은 방법에 의하면 드럼(11)에 먼저 투입된 컴파운드는 회전하여 중앙부에 공간이 형성되는 도넛형상을 이루면서 경화하게 된다. According to the method as described above, the compound first introduced into the
이때, 회전하면서 경화하는 컴파운드의 내측 공간에 추가적으로 액상의 컴파운드를 투입하면 먼저 경화된 컴파운드가 바깥쪽에 위치하게 되고 추가적으로 투입된 컴파운드가 경화된 컴파운드의 내측에 위치되어 색상이 다른 컴파운드가 적층된 형태가 되는 도넛의 형상이 됨으로써 분쇄된 침은 여러 색상을 갖게 되는 것이다. In this case, when an additional liquid compound is added to the inner space of the compound to be cured while rotating, the first compound is placed on the outer side, and the additional compound is placed on the inside of the hardened compound to form a compound having different colors. The needles that are crushed by the shape of the donut have various colors.
본 발명의 칩 제조방법에 있어서, 컴파운드제조단계에서 조개껍데기의 부스러기와 같은 펄을 추가로 투입하여 혼합하면 종래의 인조대리석용 칩 제조방법을 통해 제조된 침보다 펄의 입체감이 살아난다. In the chip manufacturing method of the present invention, when the pearl is added and mixed in the compound manufacturing step, such as the crumbs of shells, the three-dimensional sense of pearl is survived than the saliva produced through the conventional method for manufacturing artificial marble chips.
본 발명을 통해 제조된 인조대리석용 칩을 사용한 인조대리석의 제조방법은 통상의 방법에 의하여 제조된 칩을 사용한 인조대리석의 제조방법과 같다. The method of manufacturing artificial marble using the artificial marble chip produced by the present invention is the same as the method of manufacturing artificial marble using the chip manufactured by a conventional method.
본 발명의 인조대리석용 칩의 제조방법에 의하면, 액상의 컴파운드를 경화시킬 때 컴파운드에 열을 가하면서 회전시켜 기포를 제거함으로써 기포 함유율이 낮은 인조대리석용 칩을 얻을 수 있다. According to the method for manufacturing the artificial marble chip of the present invention, when the liquid compound is cured, the artificial marble chip having a low bubble content can be obtained by rotating while heating the compound to remove bubbles.
따라서, 본 발명의 인조대리석용 칩을 사용하여 제조된 인조대리석은 천연대리석과 같은 질감이 보다 잘 표현되고, 칩의 깨짐 현상 및 이물질이 끼어 더러워지는 현상이 발생되지 않으며, 인조대리석을 성형함에 있어서 작업효율이 저하되지 않는다. Therefore, the artificial marble prepared using the artificial marble chip of the present invention is better expressed in the same texture as the natural marble, the cracking phenomenon of the chip and the phenomenon that the foreign matter is caught, the phenomenon does not occur, in molding the artificial marble Work efficiency does not decrease.
또한, 부분적으로 여러 색상을 갖는 칩을 제공할 수 있으며, 컴파운드 제조공정에 펄을 더 혼합할 경우 펄의 입체감이 살아난다.
In addition, it is possible to provide a chip having a plurality of colors partially, and when the pearl is further mixed in the compound manufacturing process, the three-dimensional appearance of the pearl survives.
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| KR920021465A (en) * | 1991-05-15 | 1992-12-18 | 윤영서 | Artificial colored stone and its manufacturing method |
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