KR100581241B1 - Image sensing module for mobile phone - Google Patents

Image sensing module for mobile phone Download PDF

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Publication number
KR100581241B1
KR100581241B1 KR1020050053839A KR20050053839A KR100581241B1 KR 100581241 B1 KR100581241 B1 KR 100581241B1 KR 1020050053839 A KR1020050053839 A KR 1020050053839A KR 20050053839 A KR20050053839 A KR 20050053839A KR 100581241 B1 KR100581241 B1 KR 100581241B1
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South Korea
Prior art keywords
housing
lens
image pickup
pickup device
camera module
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KR1020050053839A
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Korean (ko)
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강신홍
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강신홍
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Priority to KR1020050053839A priority Critical patent/KR100581241B1/en
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Publication of KR100581241B1 publication Critical patent/KR100581241B1/en
Priority to JP2006163558A priority patent/JP2007006475A/en
Priority to TW095121343A priority patent/TW200700892A/en
Priority to CNA2006100946201A priority patent/CN1885865A/en

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M2250/00—Details of telephonic subscriber devices
    • H04M2250/52—Details of telephonic subscriber devices including functional features of a camera

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  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Studio Devices (AREA)
  • Lens Barrels (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)

Abstract

본 발명은 경통이 없는 카메라모듈에 관한 것으로서, 카메라모듈을 구성하는 하우징과 덮개의 사출이 용이하고, 상기 하우징과 덮개 간 조립이 용이하며, 부품조립 시 렌즈/렌즈조립체와 촬상소자 간 초점이 정확하게 맞춰져 수평해상도가 향상되는 이동통신장치의 카메라모듈에 관한 것이다.The present invention relates to a camera module without a barrel, and is easy to inject the housing and cover constituting the camera module, easy assembly between the housing and the cover, the focus between the lens / lens assembly and the image pickup device when assembling parts accurately The present invention relates to a camera module of a mobile communication device, which is adapted to improve horizontal resolution.

본 발명에 따른 경통이 없는 카메라모듈은 연성회로기판에 와이어본딩된 촬상소자 와, 상기 촬상소자가 내부에 위치되도록 연성회로기판상에 고정되고 적외선으로부터 상기 촬상소자를 보호하는 적외선차단필터가 내장된 중공형의 하우징 과, 상기 적외선차단필터의 상방에 위치되도록 상기 하우징 내에 내장시킨 렌즈 또는 렌즈조립체 와, 상기 하우징의 상단면에 지지·고정되면서 상면 중앙에는 렌즈 홀이 형성된 덮개 를 포함한다.The barrelless camera module according to the present invention includes an image pickup device wire-bonded to the flexible circuit board, and an infrared cut-off filter fixed on the flexible circuit board so that the image pickup device is positioned therein and protecting the image pickup device from infrared rays. The housing includes a hollow housing, a lens or lens assembly embedded in the housing so as to be positioned above the infrared cut filter, and a cover in which a lens hole is formed in the center of the upper surface while being supported and fixed to the upper surface of the housing.

촬상소자, 렌즈, 경통, 하우징, 카메라모듈, 핸드폰, 조립성, 수평해상도 Image pickup device, lens, barrel, housing, camera module, mobile phone, assembly, horizontal resolution

Description

이동통신장치의 카메라모듈{Image sensing module for mobile phone}Camera sensing module of mobile communication device {Image sensing module for mobile phone}

도 1은 종래 카메라모듈의 단면을 나타낸 모형도.1 is a model showing a cross section of a conventional camera module.

도 2는 본 발명의 일 실시예에 따른 카메라모듈의 단면도.2 is a cross-sectional view of the camera module according to an embodiment of the present invention.

[도면 부호의 설명][Description of Drawing Reference]

1,11...촬상소자 2,12...하우징1,11 imaging device 2,12 housing

3,13...적외선차단필터 4,16a...렌즈3,13 Infrared cut filter 4,16a Lens

5...경통 10...연성회로기판5 ... Band 10 ... Flexible Circuit Board

15…렌즈 홀 16...렌즈조립체15... Lens Hole 16 ... Lens Assembly

17...지지턱 18...덮개17 Support jaw 18 Cover

19...스페이서 21...내부턱19 ... Spacer 21 ... Inner chin

22...라이너22 ... liner

본 발명은 경통이 없는 이동통신장치의 카메라모듈에 관한 것으로서, ⅰ)카메라모듈의 외장을 형성하는 하우징과 덮개의 사출이 용이하고 ⅱ)상기 하우징과 덮개 간 조립이 용이하며 ⅲ)부품조립 시 렌즈/렌즈조립체와 촬상소자 간 초점이 정확하게 맞춰져 수평해상도가 향상되는 이동통신장치의 카메라모듈에 관한 것이다.The present invention relates to a camera module of a mobile communication device without a barrel, i) easy injection of the housing and cover forming the exterior of the camera module, and ii) easy assembly between the housing and the cover, and iii) lens assembly. The present invention relates to a camera module of a mobile communication device in which a horizontal resolution is improved by accurately focusing a lens assembly and an image pickup device.

반도체기술과 IT기술이 발전함에 따라, 냉장고 등의 백색 가전에 인터넷 기능이 접목되거나 휴대폰 등의 이동통신장치에 카메라 기능이나 MP3 기능이 부가된 새로운 형태의 신제품이 속속 출시되고 있다. 특히, 휴대폰의 경우에는 디지털 카메라기능이 거의 필수적으로 제공되고 있는데, 휴대폰 자체가 나날이 경량화/소형화/박형화되고 있어 상기 휴대폰에 내장하는 카메라모듈도 이러한 추세에 맞게 초경량/초소형의 것이 요구되고 있다.With the development of semiconductor technology and IT technology, new types of new products are being introduced one after another, in which white functions such as refrigerators are combined with internet functions or camera functions and MP3 functions are added to mobile communication devices such as mobile phones. Particularly, in the case of a mobile phone, a digital camera function is almost provided, but since the mobile phone itself is becoming lighter, smaller, and thinner day by day, the camera module embedded in the mobile phone is also required to be extremely lightweight / miniature.

첨부된 도 1은 종래 휴대폰에 적용되던 카메라모듈의 일반적인 구성을 알아보기 위해 종방향으로 잘라 본 단면도로서, 동 도면에 잘 나타나 있듯이 종래 카메라모듈은 연성회로기판(FPCB)(10)에 얹혀져 와이어본딩된 촬상소자(1)가 적외선차단필터(IR cut-off filter)(3)를 내장한 하우징(2)에 의해 보호되고 렌즈(4)를 넣은 경통(5)이 하우징(2)의 상단 측에 나사결합됨으로써 구성된다.1 is a cross-sectional view cut in the longitudinal direction to find a general configuration of a camera module applied to a conventional mobile phone, and as shown in the drawing, a conventional camera module is mounted on a flexible printed circuit board (FPCB) 10 and wire-bonded. The image pickup device 1 is protected by a housing 2 incorporating an IR cut-off filter 3, and a barrel 5 into which the lens 4 is inserted is provided on the upper side of the housing 2. It is comprised by screwing.

그런데 이러한 종래 구성의 카메라모듈에 따르면 부품제작 시는 물론 부품조립 시 다음과 같은 문제가 있다.However, according to the camera module of the conventional configuration, there are the following problems when assembling parts as well as when manufacturing parts.

예컨대, 부품제작 시의 문제점으로 ①상기 하우징(2)의 상단 측 내면과 경통(5)의 외주면에 상호 체결을 위한 나사산이 가공되어야 하는데 이들 부품은 크기가 매우 작아 사출금형을 제작하기가 어려울 뿐 아니라 동 금형의 제작에 정밀가공이 요구되어 비용상승이 불가피하다는 단점이 있다. 또한, ②사출금형에서 부품을 꺼낼 때 나사산이 쉽게 파손되거나 변형되므로 불량률이 높다는 점, ③이와 같이 불량률이 높은 관계로 후공정의 조립업체에 부품을 조달하기 전 검수과정에 많은 인원이 배치되는 단점이 있다. 이러한 문제들은 모두 비용에 포함되므로 생산단가가 올라가게 되고, 따라서 시장에서의 가격경쟁력을 약화시키는 요인이 된다.For example, as a problem in manufacturing a part, ① threads for mutual fastening should be processed on the inner surface of the upper side of the housing 2 and the outer circumferential surface of the barrel 5, but these parts are very small in size, making it difficult to produce injection molds. However, there is a disadvantage in that cost increase is inevitable because precision processing is required for manufacturing the mold. In addition, ② the screw thread is easily broken or deformed when the part is removed from the injection mold, so the defect rate is high. ③ As such, the defect rate is high. Therefore, a large number of personnel are placed in the inspection process before procuring parts to the assembly company in the post-process. There is this. All of these problems are included in the cost, which leads to an increase in the production cost, thus weakening the price competitiveness in the market.

또한, 부품조립 시의 문제점으로는 ④2개의 부품 중 어느 하나를 다른 쪽에 돌려 넣는 나사체결 방식이므로 부품의 조립속도가 늦다는 점과 ⑤미소 크기의 나사산이 종종 엇물려 조립될 경우 경통 속의 렌즈와 촬상소자의 중심축(초점)이 불일치하여 수평해상도가 떨어지는 단점이 있다. 특히, 성능테스트 과정에서 초점이 일치하지 않는 것으로 판정된 카메라모듈은 전량 폐기처분되는데, 그 양이 전체 생산량의 약 30%에 달할 때도 있어 매우 큰 비용요인으로 작용하고 있다.In addition, the problem of assembling parts is ④ the screw fastening method of turning one of the two parts to the other side, the assembly speed of the parts is slow, and ⑤ the lens and the image in the barrel when the small thread is often interlaced There is a disadvantage in that the horizontal resolution is inferior due to mismatches in the central axis (focus) of the device. In particular, the camera module determined to be out of focus during the performance test is disposed of entirely, which is a huge cost factor when the amount reaches about 30% of the total output.

본 발명은 상술한 종래의 문제점을 개선하기 위해 안출된 것으로 하우징의 내면을 나사산이 없는 원주면으로 가공하고 상기 하우징의 내부에 렌즈 또는 렌즈조립체를 직접 조립해 넣은 후 동 하우징의 상단부를 렌즈 홀이 뚫린 덮개로 막음으로써, 상기 하우징과 덮개의 사출이 용이하고, 하우징과 덮개 간 조립이 용이하며, 부품조립 시 렌즈/렌즈조립체와 촬상소자 간 초점이 정확하게 맞춰져 수평해상도가 향상되는 이동통신장치의 카메라모듈을 제공함에 목적이 있다.The present invention has been made in order to improve the above-mentioned problems, and the inner surface of the housing is processed into a threadless circumferential surface, and the lens hole is formed at the upper end of the housing after directly assembling a lens or lens assembly into the housing. Blocked by a perforated cover, the injection of the housing and the cover is easy, the assembly between the housing and the cover is easy, when the assembly of the parts, the focus of the lens / lens assembly and the image pickup device to accurately focus the camera of the mobile communication device The purpose is to provide a module.

이러한 기술적 과제를 해결하기 위한 본 발명의 카메라모듈은 연성회로기판에 와이어본딩된 촬상소자 와, 촬상소자가 내부에 위치되도록 연성회로기판상에 고정되고 적외선으로부터 상기 촬상소자를 보호하는 적외선차단필터가 내장된 중공형의 하우징 과, 상기 적외선차단필터의 상방에 위치되도록 상기 하우징 내에 내장시킨 렌즈 또는 렌즈조립체 와, 상기 하우징의 상단에 지지·고정되면서 상면 중앙에는 렌즈 홀이 형성된 덮개 를 포함한다. 여기서, 렌즈조립체는 적어도 둘 이상의 렌즈와 상기 렌즈 사이에 끼워져 렌즈 간 거리를 확보하는 스페이서로 구성될 수 있으며, 렌즈/렌즈조립체가 하우징으로부터 이탈되거나 하우징 내에서 위치변동이 되지 않도록 링 형상의 캡(미도시)이 상기 렌즈/렌즈조립체의 내장 후 하우징 내에 추가로 끼워질 수 있다. 또한, 상기 렌즈/렌즈조립체와 촬상소자 간 거리를 조절하기 위한 라이너가 하우징의 내부턱과 렌즈/렌즈조립체 사이에 개재될 수 있다.The camera module of the present invention for solving this technical problem is an image pickup device wire-bonded to the flexible circuit board, and an infrared cut-off filter which is fixed on the flexible circuit board so that the image pickup device is located therein and protects the image pickup device from infrared rays. The housing includes a hollow housing, a lens or lens assembly embedded in the housing so as to be positioned above the infrared cut filter, and a cover in which a lens hole is formed in the center of the upper surface while being supported and fixed on the upper end of the housing. Here, the lens assembly may be composed of at least two lenses and a spacer which is sandwiched between the lens to secure the distance between the lenses, the ring-shaped cap (to prevent the lens / lens assembly from being separated from the housing or shifted in the housing) (Not shown) may be further fitted into the housing after the lens / lens assembly is embedded. In addition, a liner for adjusting the distance between the lens / lens assembly and the imaging device may be interposed between the inner jaw of the housing and the lens / lens assembly.

이하 첨부도면에 의거하여 본 발명의 일 실시예에 따른 이동통신장치의 카메라모듈에 대해 설명한다.Hereinafter, a camera module of a mobile communication device according to an embodiment of the present invention will be described with reference to the accompanying drawings.

실시예Example

첨부된 도 2는 본 발명의 일 실시예에 따른 카메라모듈의 단면도이다.2 is a cross-sectional view of the camera module according to an embodiment of the present invention.

도면에서, 연성회로기판(10)에 다이본딩된 촬상소자(11)는 상기 연성회로기판(10)과의 전기적 연결을 위해 와이어본딩된다. 이후, 상기 촬상소자(11)를 외부환경으로부터 격리하는 하우징(12)이 연성회로기판(10)에 얹혀져 접착제로 고정되는데, 상기 하우징(12)의 내부턱(21)에는 적외선차단필터(13)가 접착·고정되어 있어 동 필터에 의해 상기 촬상소자(11)로 들어가는 적외선이 차단된다. 또한, 내부턱(21)의 상면에는 제품별로 조금씩 달라지는 초점거리를 맞추기 위해 미리 여러 가지 두께별로 만들어 놓은 링 형상의 얇은 라이너(22)가 얹혀져 있고, 상기 라이너(22) 위에 전체 형상이 볼록렌즈에 유사하게 되도록 2개의 초소형 렌즈(16a)와 동 렌즈 사이에 끼워 둔 링 형태의 박막형 스페이서(19)로 이루어진 렌즈조립체(16)가 얹혀져 있다. 이와 같이 하여 상기 연성회로기판(10)에 하우징(12)의 몸통 하단이 고정되고, 상기 내부턱과 하우징 상단 사이의 몸통 상부측에 렌즈조립체가 내장되면 상기 하우징(12)의 개방된 상단에 덮개(18)를 덮는다. 청구항 1과 동 도면을 통해 알 수 있듯이, 상기 덮개(18)는 하우징(12)의 개방된 상단에 끼워져 결합위치가 고정되도록 하는 저면 쪽의 낮은 턱과 상기 하우징의 상단면에 지지되는 지지턱(17)을 가지고 있으며, 상면 중앙에는 렌즈 홀(15)이 뚫려 있다. 여기서, 부품 간 결합에는 접착제가 사용될 수 있다.In the drawing, the imaging device 11 die-bonded to the flexible circuit board 10 is wire-bonded for electrical connection with the flexible circuit board 10. Thereafter, the housing 12 isolating the image pickup device 11 from the external environment is mounted on the flexible circuit board 10 and fixed with an adhesive, and the infrared cut filter 13 is disposed on the inner jaw 21 of the housing 12. Is fixed and adhered, and the infrared rays entering the imaging device 11 are blocked by the same filter. In addition, the upper surface of the inner jaw 21 has a ring-shaped thin liner 22 made of various thicknesses in advance so as to adjust a focal length slightly different for each product, and the entire shape is formed on the liner 22 on the convex lens. To be similar, a lens assembly 16 composed of two ultra-small lenses 16a and a ring-shaped thin film spacer 19 sandwiched between the same lens is mounted. As such, when the lower end of the body of the housing 12 is fixed to the flexible circuit board 10, and the lens assembly is built in the upper part of the body between the inner jaw and the upper end of the housing, the cover is opened on the open upper end of the housing 12. Cover 18. As can be seen from the drawings and claim 1, the cover 18 is inserted into the open top of the housing 12, the lower jaw of the bottom side to secure the coupling position and the support jaw supported on the top surface of the housing ( 17) and the lens hole 15 is drilled in the center of the upper surface. Here, an adhesive may be used for joining parts.

이상과 같이 구성되는 본 실시예에 따르면, 하우징(12)과 덮개(18)의 내·외면에 나사산이 전혀 형성되지 않으므로 플라스틱 사출몰드로부터 이들 부품을 꺼내는 것이 용이하며 탈형과정에서의 부품손상을 방지할 수 있다. 또한, 하우징(12)과 덮개(18)의 결합이 끼워 맞춤식이므로 종래 나사체결방식에 비해 조립속도가 현저히 향상될 수 있다. 또한, 부품을 제조하는 과정에서 라이너(22)의 두께나 내부턱(21)의 두께를 조절하면, 렌즈조립체(16)와 촬상소자(11) 간 초점거리가 자동으로 맞춰지면서 초점까지 정확하게 일치하게 되어 조립불량에 따른 수평해상도의 저하를 방지할 수 있다.According to the present embodiment configured as described above, since no threads are formed on the inner and outer surfaces of the housing 12 and the cover 18, it is easy to take out these parts from the plastic injection mold, and prevent damage to the parts during the demolding process. can do. In addition, since the coupling of the housing 12 and the cover 18 is a fitting type, the assembly speed can be significantly improved as compared with the conventional screw fastening method. In addition, by adjusting the thickness of the liner 22 or the thickness of the inner jaw 21 during the manufacturing process of the part, the focal length between the lens assembly 16 and the image pickup device 11 is automatically adjusted to accurately match the focus. Therefore, it is possible to prevent a decrease in the horizontal resolution due to poor assembly.

이상과 같이, 본 발명에 따른 이동통신장치의 카메라모듈은 하우징과 덮개의 사출성형이 용이하고, 부품 간 조립이 매우 빠른 속도로 이루어지며, 부품조립과정에서 렌즈/렌즈조립체와 촬상소자 간 초점거리와 초점이 자동으로 정확하게 맞춰져 이미지의 수평해상도가 향상되는 장점이 있다. 또한, 부품의 불량률이 낮고 부품제조에 사용할 금형 등의 기계장치비가 절감되므로 시장에서의 가격경쟁력을 갖출 수 있다.As described above, the camera module of the mobile communication device according to the present invention is easy to injection molding the housing and the cover, the assembly between parts is made at a very high speed, the focal length between the lens / lens assembly and the image pickup device in the assembly process It has the advantage that the horizontal resolution of the image is improved by automatically and precisely focusing. In addition, since the defect rate of parts is low and the cost of machinery such as molds used for manufacturing parts is reduced, price competitiveness in the market can be achieved.

Claims (3)

연성회로기판에 와이어본딩된 촬상소자;An imaging device wire-bonded to the flexible circuit board; 상기 촬상소자가 내부에 포용될 수 있도록 연성회로기판에 접착·고정하는 중공형의 몸통 하단이 개방되고, 상기 촬상소자가 수광할 수 있도록 중공형의 몸통 상단이 개방되며, 수광을 위한 구멍이 중앙에 위치하는 형태로 상기 몸통의 내면으로부터 내부턱이 돌출되고, 상기 내부턱과 상단 사이의 몸통 상부측 내·외면이 매끈하게 된 하우징;The bottom of the hollow body for bonding and fixing to the flexible circuit board is opened so that the image pickup device can be embraced therein, the top of the hollow body is open for receiving the image pickup device, and the hole for receiving light is centered. and an internal jaw from the inner surface of the body protruding in the form which is located in, the body upper portion side of the inner and outer surface smooth, the housing between the inside and the top jaw; 상기 촬상소자를 적외선으로부터 보호하기 위해 상기 내부턱의 저면에 고정하는 적외선차단필터;An infrared ray blocking filter fixed to the bottom of the inner jaw to protect the image pickup device from infrared rays ; 상기 내부턱과 상단 사이의 몸통 상부측에 설치되되 적어도 둘 이상의 렌즈 사이에 스페이서가 끼워진 형태로 삽입·설치되는 렌즈조립체;A lens assembly installed on the upper body side between the inner jaw and the upper end, the lens assembly being inserted and installed in a form in which a spacer is inserted between at least two lenses ; 상기 내부턱과 렌즈조립체 사이에 개재된 라이너; 및A liner interposed between the inner jaw and the lens assembly; And 상기 하우징의 몸통 상단에 끼워 넣는 낮은 턱이 저면에 돌출되고, 상기 낮은 턱으로 둘러싸인 표면에 수광(受光)을 위한 렌즈 홀이 관통된 덮개;The lower jaw is put at the top of the body of the housing and projecting on the lower surface, a lens for receiving (受光) to the surface surrounded by the lower jaw hole through the cover; 를 포함하여 구성된 것을 특징으로 하는 이동통신장치의 카메라모듈.Camera module of a mobile communication device, characterized in that configured to include. 삭제delete 삭제delete
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100793919B1 (en) * 2006-10-31 2008-01-16 삼성전기주식회사 Camera module and manufacturing method thereof
KR20230018018A (en) * 2021-07-29 2023-02-07 동의대학교 산학협력단 System and method for provision of korean food information using artificial intelligence

Families Citing this family (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008245244A (en) 2007-02-26 2008-10-09 Sony Corp Imaging element package, imaging element module, lens barrel, and imaging device
US9843742B2 (en) 2009-03-02 2017-12-12 Flir Systems, Inc. Thermal image frame capture using de-aligned sensor array
US9208542B2 (en) 2009-03-02 2015-12-08 Flir Systems, Inc. Pixel-wise noise reduction in thermal images
US9674458B2 (en) 2009-06-03 2017-06-06 Flir Systems, Inc. Smart surveillance camera systems and methods
US10244190B2 (en) 2009-03-02 2019-03-26 Flir Systems, Inc. Compact multi-spectrum imaging with fusion
US9451183B2 (en) 2009-03-02 2016-09-20 Flir Systems, Inc. Time spaced infrared image enhancement
US9756264B2 (en) 2009-03-02 2017-09-05 Flir Systems, Inc. Anomalous pixel detection
US9635285B2 (en) 2009-03-02 2017-04-25 Flir Systems, Inc. Infrared imaging enhancement with fusion
US9986175B2 (en) 2009-03-02 2018-05-29 Flir Systems, Inc. Device attachment with infrared imaging sensor
US9235876B2 (en) 2009-03-02 2016-01-12 Flir Systems, Inc. Row and column noise reduction in thermal images
US9473681B2 (en) 2011-06-10 2016-10-18 Flir Systems, Inc. Infrared camera system housing with metalized surface
US9517679B2 (en) 2009-03-02 2016-12-13 Flir Systems, Inc. Systems and methods for monitoring vehicle occupants
US10757308B2 (en) 2009-03-02 2020-08-25 Flir Systems, Inc. Techniques for device attachment with dual band imaging sensor
US9948872B2 (en) 2009-03-02 2018-04-17 Flir Systems, Inc. Monitor and control systems and methods for occupant safety and energy efficiency of structures
US9998697B2 (en) 2009-03-02 2018-06-12 Flir Systems, Inc. Systems and methods for monitoring vehicle occupants
USD765081S1 (en) 2012-05-25 2016-08-30 Flir Systems, Inc. Mobile communications device attachment with camera
US9716843B2 (en) 2009-06-03 2017-07-25 Flir Systems, Inc. Measurement device for electrical installations and related methods
US9756262B2 (en) 2009-06-03 2017-09-05 Flir Systems, Inc. Systems and methods for monitoring power systems
US10091439B2 (en) 2009-06-03 2018-10-02 Flir Systems, Inc. Imager with array of multiple infrared imaging modules
US9292909B2 (en) 2009-06-03 2016-03-22 Flir Systems, Inc. Selective image correction for infrared imaging devices
US9819880B2 (en) 2009-06-03 2017-11-14 Flir Systems, Inc. Systems and methods of suppressing sky regions in images
US9843743B2 (en) 2009-06-03 2017-12-12 Flir Systems, Inc. Infant monitoring systems and methods using thermal imaging
US9706138B2 (en) 2010-04-23 2017-07-11 Flir Systems, Inc. Hybrid infrared sensor array having heterogeneous infrared sensors
US9207708B2 (en) 2010-04-23 2015-12-08 Flir Systems, Inc. Abnormal clock rate detection in imaging sensor arrays
US9848134B2 (en) 2010-04-23 2017-12-19 Flir Systems, Inc. Infrared imager with integrated metal layers
CN103875235B (en) 2011-06-10 2018-10-12 菲力尔系统公司 Nonuniformity Correction for infreared imaging device
US10079982B2 (en) 2011-06-10 2018-09-18 Flir Systems, Inc. Determination of an absolute radiometric value using blocked infrared sensors
US10051210B2 (en) 2011-06-10 2018-08-14 Flir Systems, Inc. Infrared detector array with selectable pixel binning systems and methods
US10389953B2 (en) 2011-06-10 2019-08-20 Flir Systems, Inc. Infrared imaging device having a shutter
US9058653B1 (en) 2011-06-10 2015-06-16 Flir Systems, Inc. Alignment of visible light sources based on thermal images
US9706137B2 (en) 2011-06-10 2017-07-11 Flir Systems, Inc. Electrical cabinet infrared monitor
EP2719166B1 (en) 2011-06-10 2018-03-28 Flir Systems, Inc. Line based image processing and flexible memory system
US9509924B2 (en) 2011-06-10 2016-11-29 Flir Systems, Inc. Wearable apparatus with integrated infrared imaging module
US9961277B2 (en) 2011-06-10 2018-05-01 Flir Systems, Inc. Infrared focal plane array heat spreaders
US10169666B2 (en) 2011-06-10 2019-01-01 Flir Systems, Inc. Image-assisted remote control vehicle systems and methods
EP2719167B1 (en) 2011-06-10 2018-08-08 Flir Systems, Inc. Low power and small form factor infrared imaging
US9235023B2 (en) 2011-06-10 2016-01-12 Flir Systems, Inc. Variable lens sleeve spacer
US9900526B2 (en) 2011-06-10 2018-02-20 Flir Systems, Inc. Techniques to compensate for calibration drifts in infrared imaging devices
US9143703B2 (en) 2011-06-10 2015-09-22 Flir Systems, Inc. Infrared camera calibration techniques
US10841508B2 (en) 2011-06-10 2020-11-17 Flir Systems, Inc. Electrical cabinet infrared monitor systems and methods
US9811884B2 (en) 2012-07-16 2017-11-07 Flir Systems, Inc. Methods and systems for suppressing atmospheric turbulence in images
US9973692B2 (en) 2013-10-03 2018-05-15 Flir Systems, Inc. Situational awareness by compressed display of panoramic views
US11297264B2 (en) 2014-01-05 2022-04-05 Teledyne Fur, Llc Device attachment with dual band imaging sensor
CN107222594B (en) * 2017-05-31 2020-07-10 Oppo广东移动通信有限公司 Camera assembly of electronic equipment and electronic equipment
CN108196416A (en) * 2018-02-27 2018-06-22 广东欧珀移动通信有限公司 Laser projection module, depth camera and electronic device
CN109788182B (en) * 2019-03-19 2020-11-03 维沃移动通信（杭州）有限公司 Mobile terminal

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100793919B1 (en) * 2006-10-31 2008-01-16 삼성전기주식회사 Camera module and manufacturing method thereof
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