KR100571514B1 - Chip picker of sawing sorter system - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip picker of a sawing sorter system, and more particularly, to a chip picker of a sawing sorter system in which a semiconductor package subjected to solder ball inspection and marking inspection is vacuum-adsorbed and placed on a tray. A plurality of motors; A driving pulley connected to the rotation shaft of the motor to rotate in both directions; A driven pulley positioned below the prime pulley and connected to the belt; First and second clamps coupled to left and right sides of the pulleys, respectively, to move up and down in opposite directions by rotation of the motor; A pad holder interlocked with each of the clamps to move up and down and open a vacuum line; And it provides a chip picker of the sawing sorter system comprising a vacuum pad coupled to the pad holder.

According to the present invention, since the driving force is obtained by the motor, accurate position control of the vacuum pad is possible.

Sawing Sorter System. Chip picker. motor. Timing belt.

Description

Chip picker of sawing sorter system

1 is a rear perspective view of a chip picker according to the present invention.

2 is a side view of the chip picker according to the present invention.

※ Explanation of code about main part of drawing ※

10: motor 20: prime pulley

30: driven pulley 40: timing belt

41: Left side 42: Right side

51: first clamp 52: second clamp

61, 62: connecting bar 71, 72: lifting block

81, 82: pad holder 81a, 82a: spring

91, 92: vacuum pad 110: vacuum line

120: guide block 130: sensor

131: support 132: sensor bar

The present invention relates to a chip picker of a sawing sorter system. More specifically, after a group-shaped semiconductor package is cut in units, a semiconductor package in which transfer and inspection are completed is classified into good and defective parts, and a tray is provided. It relates to a chip picker to be loaded in.

A manufacturing process of a semiconductor package will be described as a ball grid array package (BGA) using a tape wiring board as an example. Non-conductive epoxy resin adhesive is applied on top of the stripped tape wiring board in which a polyimide film has circuit circuit wiring, and semiconductor chips are attached to each package area and grouped into a plurality of package areas. Form a molding. Such a tape wiring board is manufactured as a semi-finished semiconductor chip package which is cut in a predetermined length unit and fixed to a carrier frame in order to facilitate handling. Subsequently, when the solder ball is attached to the bonding ball land portion exposed by the hole formed on the back surface of the tape wiring board and the adhesion is completed by the reflow process at high temperature, the semi-finished semiconductor package is cut by the sawing sorter system. Inspection, transfer and stacking operations are carried out continuously to manufacture the semiconductor package.

Looking at the configuration and operation of the sawing sorter system in detail, the semi-finished semiconductor package is supplied to the chuck of the cutting machine and cut with a cutting edge, the cut semiconductor package is absorbed and transferred to the reverse table and switched from the ball up state to the ball down state. After that, the ball inspection is performed on the ball vision inspection and placed on the buffer table, transferred to the turntable by the vision picker, and the marking surface of the semiconductor package is inspected by the marking vision. It is vacuum-adsorbed to the picker and sorted into good or bad trays.

The chip picker conventionally includes a plurality of air cylinders (for example, seven) and a cylinder rod, and an end of the cylinder rod has a pad holder and a vacuum pad opened with a vacuum line.

Since the conventional chip picker as described above is driven by an air cylinder, it is difficult to accurately control the position, so that the package is often damaged, and workability is poor. In addition, as is well known, air cylinders are frequently broken and have a short lifespan, and the replacement work is also very complicated, which causes a decrease in productivity.

The present invention has been made to solve the above problems, and an object of the present invention is to provide a chip picker of the sawing sorter system with a long position and accurate control by driving by a motor.

In order to solve the above technical problem, the present invention is a chip picker (chip picker) of a sawing sorter system for vacuum-sucking a semiconductor package that has been subjected to solder ball inspection and marking inspection to load on a tray, a plurality of motors; A driving pulley connected to the rotation shaft of the motor to rotate in both directions; A driven pulley positioned below the prime pulley and connected to the belt; First and second clamps coupled to the left and right sides of the belt based on the pulleys and vertically moved in opposite directions by rotation of the motor; A pad holder interlocked with each of the clamps to move up and down and open a vacuum line; And it provides a chip picker of the sawing sorter system comprising a vacuum pad coupled to the pad holder.

In particular, in the chip picker of the sawing sorter system of the present invention, the belt is preferably a timing belt.

In addition, the chip picker may have a spring inserted between the pad holder and the vacuum pad, and a sensor may be further added to measure and control the position of the pad holder.

Hereinafter, with reference to the accompanying drawings will be described the configuration and operation of an embodiment according to the present invention.

Referring to FIG. 1, in this embodiment, three motors 10, a driven pulley 20, a timing belt 40, and a driven pulley 30 are provided, and one pair of timing belts 40 is provided. It can be seen that the clamps 51 and 52, the connection bars 61 and 62, the lifting blocks 71 and 72, the pad holders 81 and 82, and the vacuum pads 91 and 92 are coupled to each other.

The motor 10 is a known means for providing a driving force, the driving pulley 20 is coupled to the rotation shaft which is the output shaft of the motor 10 is interlocked accordingly.

The driven pulley 30 is connected to the driving pulley 20 located above by a timing belt 40 having teeth formed on the rear surface thereof.

The clamps 51 and 52 are fixedly interlocked on the timing belt 40, and the left side 41 and the right side 42 of the timing belt based on the driven pulley 20 and the driven pulley 30. It is composed of a pair to couple to each. The clamps 51 and 52 are detachably fixed so that the fixing position can be changed as necessary.

The connecting bars 61 and 62 extend perpendicular to each of the pair of clamps 51 and 52.

The guide block 120 is provided with a guide hole and a bearing (not shown), and the connecting bars 61 and 62 are elevated along the guide hole. In addition, the bearing is preferably placed in the contact portion of the connecting bar (61, 62) and the guide block 120.

The lifting blocks 71 and 72 are screwed to the lower ends of the connecting bars 61 and 62 to be interlocked. Pad holders 81 and 82 are attached to one side of the lifting blocks 71 and 72. The pad holders 81 and 82 are provided with a vacuum line 110, and the bottom of the pad holders 81 and 82 are coupled with the vacuum pads 91 and 92. In addition, springs 81a and 82a are installed between the pad holders 81 and 82 and the vacuum pads 91 and 92. When the package is sucked or released by the springs 81a and 82a, the impact applied to the package can be alleviated.

Referring to FIG. 2, the support body 131 vertically placed at the rear of the lifting blocks 71 and 72 and the sensor bar 132 are formed on the support 131. The 'c' shaped sensor 130 is coupled. This is a means for grasping the position (height) of the vacuum pads 91 and 92 by measuring the position (height) of the lifting blocks 71 and 72, and controlling the exact position required for the work accordingly. By setting the working environment precisely with this position control, damage to the package can be prevented.

Referring again to the operation of this embodiment configured as described above with reference to Figure 1, when the motor 10 is rotated clockwise, the driven pulley 20, the timing belt 40 and the driven pulley 30 also clockwise accordingly Will be rotated. Accordingly, the first clamp 51 fixed to the belt left surface 41 is raised, and the second clamp 52 fixed to the belt right surface 42 is lowered. In addition, the connecting bar 61 extending vertically downward from the first clamp 51 also rises along the guide hole, and the lifting block 71, the pad holder 81, and the vacuum pad 91 which are linked thereto also rise. Done. On the contrary, the connecting bar extending downward from the second clamp 52 vertically descends along the guide hole, and the lifting block 72, the pad holder 82, and the vacuum pad 93 interlocked therewith are lowered.

In addition, when the motor 10 rotates counterclockwise, the first clamp 51 and the vacuum pad 91 connected thereto are lowered, and the second clamp 52 and the vacuum pad 92 connected thereto are raised. Will be.

By the chip picker operating as described above, the inspection is completed, the semiconductor package seated on the turntable is vacuum-sucked and transported, and then the good and bad parts are sorted and stacked on the tray.

According to the present invention, since the driving force is obtained by the motor, accurate position control of the vacuum pad is possible.

In addition, the service life is significantly improved due to the longer lifespan and higher lifting speed than the air cylinders.

Although the present invention has been described in detail only with respect to the described embodiments, it will be apparent to those skilled in the art that various modifications and changes are possible within the technical scope of the present invention, and such modifications and modifications belong to the appended claims.

Claims (4)

In the chip picker of the sawing sorter system which vacuum-adsorbs a semiconductor package which has undergone solder ball inspection and marking inspection and loads it on a tray, A plurality of motors; A driving pulley connected to the rotation shaft of the motor to rotate in both directions; A driven pulley positioned below the prime pulley and connected to the belt; First and second clamps coupled to the left and right sides of the belt based on the pulleys and vertically moved in opposite directions by rotation of the motor; A pad holder interlocked with each of the clamps to move up and down and open a vacuum line; And Chip picker of the sawing sorter system comprising a vacuum pad coupled to the pad holder. The method of claim 1, The belt picker of the sawing sorter system, characterized in that the belt is a timing belt. The method of claim 1, The chip picker, characterized in that the spring is placed between the pad holder and the vacuum pad. The method of claim 1, The chip picker is a chip picker of the sawing sorter system, characterized in that the sensor is further added to measure and control the position of the pad holder.

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