KR100568291B1 - A package manufacturing method for chip device - Google Patents

Abstract

The present invention is to provide a method for manufacturing a package of a chip component that can reduce the package size by minimizing the gap between the chip and the film during the package manufacturing by film lamination, the configuration is a plurality of chip components on a substrate Flip bonding at intervals; Arranging a film and a rubber on the upper surface of the substrate on which the chip component is flip-bonded, and then laminating the film on the chip component and the surface of the substrate by applying air at a predetermined pressure; Removing the rubber and forming a cutting line on the substrate; Forming a metal shield layer on an upper surface of the laminated film; And cutting the substrate on which the metal shield layer is formed along a cutting line to separate the substrate into individual packages.

Chip Component, Laminating, Air, Film, Thermosetting Resin

Description

A package manufacturing method for chip device             

1 is a process chart showing a conventional chip component package manufacturing method.

2 is a view showing a laminating state in the conventional method.

3 is a flowchart schematically illustrating a method of manufacturing a chip component package according to the present invention.

4 is a flowchart illustrating a method of manufacturing a chip component package according to the present invention in detail.

Explanation of symbols on the main parts of the drawings

41: substrate

42: chip parts

43: thermosetting resin

44: rubber

45: cutting line

46: metal shield layer

The present invention relates to a chip component package manufacturing method, and more particularly, to a package manufacturing method of a chip component that can reduce the package size by minimizing the gap between the chip and the film in the package manufacturing by laminating.

As the communication industry develops, wireless communication products are gradually becoming smaller, higher quality and more versatile. In accordance with this trend, miniaturization and multifunctionality are also required for components used in wireless communication products, such as filters and duplexers.

These components are implemented as saw devices, FBAR devices, and the like. Such components, for example, the saw element, because the characteristics of the element are determined, such as the electrode width, length, spacing, etc. of the IDT electrode, if the IDT electrode is damaged or foreign matter of a small size such as dust or dust The characteristics will change. Therefore, a package structure for protecting such components to the external environment is required.

As a method of manufacturing a package of chip components, a method of laminating a ceramic sheet, a method of laminating a film (thermosetting resin), and the like have been proposed, of which a laminating method is more advantageous for miniaturization.

1 is a process chart showing a package manufacturing method using a conventional film, referring to this, the package manufacturing of a conventional chip component is performed as follows.

First, as shown in FIG. 1A, a plurality of chip components 12 are arranged in a plurality of rows and columns at regular intervals on a substrate 11 having a surface area of a predetermined size to flip bonding. do.

As shown in FIG. 1B, the film 13 is laminated on the upper surface of the substrate 11 on which the plurality of chip components 12 are flip-bonded. At this time, the film used for a laminating process consists of a thermosetting or plastic resin. At this time, in the laminating process, the film 13 is placed on the upper surface of the substrate 11 on which the chip component 12 is flip-bonded, a rubber is placed thereon to protect the film, and the upper part is mechanically pressed. Is done. The laminated film 13 is cured through curing or the like to improve hardness.

As such, when laminating of the film 13 is completed, as shown in (c) of FIG. 1, after forming the cutting line 14 on the substrate 11, as shown in (d). Likewise, the metal shield layer 15 is formed on the entire upper portion of the film 13. The cutting line 14 is formed between the chip parts 12.

Finally, the substrate 11 is cut along the formed cutting line 14 to complete a plurality of chip component packages.

However, according to the conventional package manufacturing method as described above, in the laminating step, the film 13 is not closely contacted at right angles at the portion where the chip component 12 and the substrate 11 are connected, and draws a gentle curve.

More specifically, in the case of mechanically laminating the film 13, as shown in FIG. 2, the smooth curve of the film 13 at the edge portion where the side of the chip component 12 and the substrate 11 extend. Therefore, the section b in which the film 13 and the substrate 11 are not in close contact with each other appears. That is, the film 13 is joined to the substrate 11 from a point apart from the side of the chip component 12 by b.

In the package using the film, the bonding portion of the film 13 and the substrate 11 must be maintained at a predetermined value or more to stably protect the chip component 12 from the external environment.

Therefore, according to the package manufacturing method using the conventional film, the size of the package is increased by the sum of the non-bonded region b and the basic bonding section of the substrate 11 in the size of the chip component 12.

That is, since the film 13 is not completely in contact with the substrate 11 from the sidewall of the chip component 11 as described above, there is a problem that unnecessary size increase occurs.

In addition, since the distance a between the chip parts 12 arranged on the substrate 11 becomes wider in proportion to the non-bonded area b, the number of chip parts that can be packaged at the same time is reduced by that much.

The present invention has been proposed to solve the above-mentioned conventional problems, and an object thereof is to provide a method of manufacturing a package of chip components, which can reduce the package size by minimizing the gap between the chip and the film when manufacturing the package by film lamination. It is.

As a constitutional means for achieving the above object of the present invention, the chip component package manufacturing method of the present invention,

Flip bonding a plurality of chip components on a substrate at regular intervals;

Arranging a film and a rubber on the upper surface of the substrate on which the chip component is flip-bonded, and then laminating the film on the chip component and the substrate surface by applying air at a predetermined pressure;

Removing the rubber and forming a cutting line on the substrate;

Forming a metal shield layer on an upper surface of the laminated film; And

And cutting the substrate on which the metal shield layer is formed along a cutting line to separate the substrate into individual packages.

In the method of manufacturing a package of chip components according to the present invention, the pressure of air in the laminating step is preferably 0.3 to 1.5 MPa, more preferably 1 Mpa.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description and the annexed drawings, detailed descriptions of well-known functions and configurations that may unnecessarily obscure the subject matter of the present invention will be omitted.

3 is a flowchart for sequentially explaining a package manufacturing method according to the present invention.

Referring to FIG. 3, in the package manufacturing method of the present invention, the step of flip-bonding a chip component on a substrate (301), the chip component is arranged on the top surface of the substrate on which the chip component is flip-bonded, and then in a predetermined order. Laminating the film by applying pressure air (302), removing the rubber and forming a cutting line on the substrate (303), and forming a metal shield layer on the upper surface of the laminating film 304, and dicing the substrate along a cutting line to separate the single package into single packages 305.

The package manufacturing method of the present invention described above has a technical difference from the prior art in the step 302 of laminating the film on the surface of the chip component and the substrate. That is, by the air press method of injecting air of a predetermined pressure rather than the mechanical press method in the laminating step 302, the film can be brought into close contact with the chip part / substrate more completely than in the prior art. . In addition to the other steps, the flip bonding 301, the cutting line formation 303, the metal shield layer formation 304 and separation 305 may be used a generally known process.

Hereinafter, each step of the above-described package manufacturing method of the present invention will be described in more detail with reference to the process diagram shown in FIG. 4.

In the method for packaging a chip component according to the present invention, a substrate 41 having a surface area having a predetermined size is provided in the same manner as a general method, and a plurality of chip components 42 are arranged in a plurality of rows and columns on the substrate 41. It is arranged and flip bonded. 4A is a flowchart of this flip bonding step 301.

In the chip component 42, bump balls are formed on internal input / output electrode pads, and the bump balls are directly bonded to the substrate 41, and the chip components 42 and the substrate 41 are formed by the bump balls. There is a predetermined gap therebetween, and the chip substrate (not shown) of the chip component 42 serves as a roof of the package.

In addition, as the lower packaging means, the substrate 41 is usually made of a non-conductive material such as ceramic or dielectric, and a circuit pattern for electrical connection with the chip component 42 is formed as necessary. Bump balls of component 42 are bonded onto the formed circuit pattern.

Next, as shown in FIG. 4B, the film 43 and the rubber 44 are sequentially disposed on the upper surface of the substrate 41 on which the chip component 42 is flip-bonded, and then, at a predetermined pressure. Air is applied to bring the film 43 into close contact with the surface of the chip component 42 and the substrate 41. At this time, the rubber 44 is to prevent damage to the film 43 and the chip component 42 during the laminating process, and is made of a flexible material such as silicon, and is removed after lamination is completed.

In the laminating step 302 as described above, the pressure of the air for pressurization is in the range of 0.3 to 1.5 MPa, preferably 1 Mpa. The air pressure range is calculated by considering the thickness of the film 43 and the thickness of the rubber 44 which are generally used. This laminating process takes place in the temperature range of about 150 ~ 200 ℃.

When laminating by air press as described above, as shown in Fig. 4 (c), the film 43 is in close contact with the chip part 42 and the substrate 41 almost completely.

In particular, the film 43 is bonded in a nearly vertical form at the edge portion leading to the substrate 41 from the side of the chip component 42, so that the bonding of the film 43 and the substrate 41 is performed by the chip component ( Begin at 42). In this case, the non-joint section b shown in FIG. 2 is much reduced as compared with the conventional one, and the distance between the chip components 42 can be narrowed by that much. In addition, the size of the package can be reduced by that amount.

In addition, by improving the bonding area between the film 43 and the substrate 41 than before, it is possible to ensure the reliability of the product.

The film 43 may be made of the same thermosetting resin as in the conventional laminating process.

In addition, as in the conventional method of manufacturing a package using film laminating, the laminated film 43 is in close contact with the aero substrate 41 and the chip part 42 at a predetermined pressure. Hardening can be improved by hardening (43).

By this laminating process, the flip bonded chip part 42 is surrounded by the substrate 41 and the film 43 to be sealed from the outside. It is possible to prevent foreign matter from penetrating and deteriorating the characteristics of the chip component 42.

Next, as shown in FIG. 4D, after the rubber 44 is removed, a cutting line 45 for separating the plurality of chip components 42 is formed on the substrate 41. The cutting line 45 may be formed by a laser or dicing or etching process, and is formed on the substrate 41 between the chip parts 42.

When the cutting line 45 is formed as described above, as shown in FIG. 4E, the metal shield layer 46 is formed on the laminated film 43. The metal shield layer 46 may protect the film 43, and may protect the film 43 and the chip component 42 from physical stimuli.

As described above, after the metal shield layer 46 is formed, the individual packages are separated along the cutting line 45. 4 (f) shows a cut state. The package separation process may be performed by a dicing or etching process.

In addition, the above-mentioned description and drawings are only for explaining embodiment of the package manufacturing method by this invention, and do not limit the scope of the present invention. Accordingly, the present invention is not limited to the above and various modifications can be made without departing from the scope of the present invention.

According to the above, the method for manufacturing a package of the present invention may improve the adhesion between the laminated film and the chip component in manufacturing the package of the chip component using a laminating process, and as a result, the flip-bonded chip component By minimizing the section where the film falls off the substrate in the area leading from the side to the substrate, it provides an excellent effect that can further reduce the package size.

In addition, the present invention is that the bonding between the laminated film and the substrate is made closer to the chip component, so that when the flip bonding of a plurality of chip components on the package substrate in the package manufacturing process, the spacing between the chip components is narrower than before. As a result, by increasing the number of the chip components flip-bonded on the same substrate, there is an excellent effect that can improve the productivity of the package manufacturing process.

Claims (6)

Flip bonding a plurality of chip components on a substrate at regular intervals; Arranging a film and a rubber on the upper surface of the substrate on which the chip component is flip-bonded, and then laminating the film on the chip component and the substrate surface by applying air at a predetermined pressure; Removing the rubber and forming a cutting line on the substrate; Forming a metal shield layer on an upper surface of the laminated film; And And cutting the substrate on which the metal shield layer is formed along a cutting line to separate the substrate into individual packages. The method of claim 1, wherein the film A package manufacturing method for a chip component comprising a thermosetting resin. The method of claim 1, The rubber is a package manufacturing method of the chip component, characterized in that made of a flexible material. According to claim 1, wherein the pressure of the air in the laminating step is Package manufacturing method of the chip component, characterized in that 0.3 ~ 1.5 MPa. The pressure of the air according to claim 4 A package manufacturing method for chip parts, characterized in that 1 Mpa. The method of claim 1, The method of claim 1, further comprising curing the laminated film.

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