KR100564669B1 - 금속화 필름콘덴서용 증착필름및 그 제조방법 - Google Patents
금속화 필름콘덴서용 증착필름및 그 제조방법 Download PDFInfo
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- KR100564669B1 KR100564669B1 KR1020040060059A KR20040060059A KR100564669B1 KR 100564669 B1 KR100564669 B1 KR 100564669B1 KR 1020040060059 A KR1020040060059 A KR 1020040060059A KR 20040060059 A KR20040060059 A KR 20040060059A KR 100564669 B1 KR100564669 B1 KR 100564669B1
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- deposited
- metal
- film
- plastic film
- capacitor
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- 238000000034 method Methods 0.000 title claims description 7
- 230000008020 evaporation Effects 0.000 title 1
- 238000001704 evaporation Methods 0.000 title 1
- 239000002985 plastic film Substances 0.000 claims abstract description 65
- 229920006255 plastic film Polymers 0.000 claims abstract description 65
- 239000003990 capacitor Substances 0.000 claims abstract description 56
- 230000008021 deposition Effects 0.000 claims abstract description 35
- 239000011104 metalized film Substances 0.000 claims abstract description 34
- 239000002184 metal Substances 0.000 claims abstract description 30
- 229910052751 metal Inorganic materials 0.000 claims abstract description 30
- 239000010408 film Substances 0.000 claims abstract description 25
- 238000004519 manufacturing process Methods 0.000 claims abstract description 22
- QNRATNLHPGXHMA-XZHTYLCXSA-N (r)-(6-ethoxyquinolin-4-yl)-[(2s,4s,5r)-5-ethyl-1-azabicyclo[2.2.2]octan-2-yl]methanol;hydrochloride Chemical compound Cl.C([C@H]([C@H](C1)CC)C2)CN1[C@@H]2[C@H](O)C1=CC=NC2=CC=C(OCC)C=C21 QNRATNLHPGXHMA-XZHTYLCXSA-N 0.000 claims abstract description 17
- 238000000151 deposition Methods 0.000 abstract description 40
- 238000001465 metallisation Methods 0.000 abstract description 3
- 238000000059 patterning Methods 0.000 abstract description 3
- 238000009413 insulation Methods 0.000 description 6
- -1 polypropylene Polymers 0.000 description 5
- 238000000926 separation method Methods 0.000 description 5
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007937 lozenge Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000000489 vacuum metal deposition Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/33—Thin- or thick-film capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/14—Protection against electric or thermal overload
- H01G2/16—Protection against electric or thermal overload with fusing elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/14—Organic dielectrics
- H01G4/18—Organic dielectrics of synthetic material, e.g. derivatives of cellulose
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/32—Wound capacitors
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
Claims (5)
- 유전체로써 플라스틱필름의 양면 또는 한면에 증착금속을 증착하고, 이 증착금속을 증착하지 않는 부분으로 분리되고 이것들은 좁은 면적의 휴즈부로 각각의 변들이 연결되도록 되어 있는 마름모꼴 분할전극의 금속증착 플라스틱필름으로의 패턴형상을 나타내는 금속화필름 콘덴서에 있어서,상기 마름모꼴 분할 전극의 치수는 금속증착 플라스틱필름의 폭방향보다 길이방향으로 더 긴 마름모 모양의 형상이고, 상기 금속증착 플라스틱필름에서 길이방향으로 연속해서 증착되지 않는 마진부와, 이 마진부위의 반대부분에 마름모 모양의 길이방향 치수간격으로 휴즈부를 갖는 구조를 포함한 것을 특징으로 하는 금속화 필름콘덴서용 증착필름.
- 유전체로써 플라스틱필름의 양면 또는 한면에 증착금속을 증착하고, 이 증착금속을 증착하지 않는 부분으로 분리되고 이것들은 좁은 면적의 휴즈부로 각각의 변들이 연결되도록 되어 있는 마름모꼴 분할전극의 금속증착 플라스틱필름으로의 패턴형상을 나타내는 금속화 필름콘덴서에 있어서,상기 마름모꼴 분할 전극의 치수는 금속증착 플라스틱필름의 폭방향보다 길이방향으로 더 긴 마름모 모양의 형상이고, 상기 금속증착 플라스틱필름의 폭치수에 따라 폭방향으로의 분할전극은 2 개 - 15개의 구조를 갖는 것을 특징으로 하는 금속화 필름콘덴서용 증착필름의 제조방법.
- 제 2 항에 있어서,상기 금속증착 플라스틱필름에서 길이방향으로 연속해서 증착되지 않는 마진부와, 이 마진부위의 반대부분에 마름모 모양의 길이방향 치수간격으로 휴즈부를 갖는 구조를 더 포함하고, 이 휴즈부의 갯수는 1 개에서 10개인 것을 특징으로 하는 금속화 필름콘덴서용 증착필름의 제조방법.
- 제 2 항 또는 제 3 항에 있어서,상기 마름모 모양의 분할전극에서 길이방향의 치수는 약 20 - 40mm이고 폭방향의 치수는 약 5 - 20mm인 것을 특징으로 하는 금속화 필름콘덴서용 증착필름의 제조방법.
- 제 2 항 또는 제 3 항에 있어서,상기 분할전극의 증착저항은 2- 20 옴으로 균일이거나, 상기 마진부의 끝단부위를 0.5 - 10 옴으로 하고 나머지는 2 - 20 옴으로 하는 것을 특징으로 하는 금속화 필름콘덴서용 증착필름의 제조방법.
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KR1020040060059A KR100564669B1 (ko) | 2004-07-30 | 2004-07-30 | 금속화 필름콘덴서용 증착필름및 그 제조방법 |
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KR1020040060059A KR100564669B1 (ko) | 2004-07-30 | 2004-07-30 | 금속화 필름콘덴서용 증착필름및 그 제조방법 |
Related Child Applications (1)
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KR20-2004-0021813U Division KR200366947Y1 (ko) | 2004-07-30 | 2004-07-30 | 금속화 필름콘덴서용 증착필름 |
Publications (2)
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KR20060011295A KR20060011295A (ko) | 2006-02-03 |
KR100564669B1 true KR100564669B1 (ko) | 2006-03-31 |
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Families Citing this family (2)
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KR101429921B1 (ko) * | 2008-04-22 | 2014-08-13 | 엘지디스플레이 주식회사 | 액정표시장치 |
KR101106982B1 (ko) * | 2010-01-27 | 2012-01-25 | 주식회사 뉴인텍 | 증착 필름 및 이를 사용한 필름 커패시터 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10144563A (ja) | 1996-11-08 | 1998-05-29 | Matsushita Electric Ind Co Ltd | 金属化フィルムコンデンサ |
JPH10149939A (ja) | 1996-11-19 | 1998-06-02 | Matsushita Electric Ind Co Ltd | 積層型金属化フィルムコンデンサ |
JP2003338422A (ja) | 2002-05-22 | 2003-11-28 | Matsushita Electric Ind Co Ltd | 金属化フィルムコンデンサとその製造方法 |
JP2004095605A (ja) | 2002-08-29 | 2004-03-25 | Matsushita Electric Ind Co Ltd | 金属化フィルムコンデンサとその製造方法および金属化フィルムコンデンサを用いたインバータ装置 |
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- 2004-07-30 KR KR1020040060059A patent/KR100564669B1/ko active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10144563A (ja) | 1996-11-08 | 1998-05-29 | Matsushita Electric Ind Co Ltd | 金属化フィルムコンデンサ |
JPH10149939A (ja) | 1996-11-19 | 1998-06-02 | Matsushita Electric Ind Co Ltd | 積層型金属化フィルムコンデンサ |
JP2003338422A (ja) | 2002-05-22 | 2003-11-28 | Matsushita Electric Ind Co Ltd | 金属化フィルムコンデンサとその製造方法 |
JP2004095605A (ja) | 2002-08-29 | 2004-03-25 | Matsushita Electric Ind Co Ltd | 金属化フィルムコンデンサとその製造方法および金属化フィルムコンデンサを用いたインバータ装置 |
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KR20060011295A (ko) | 2006-02-03 |
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