KR100560672B1 - surface treated copper foil and the preparation method thereof - Google Patents

Abstract

In the present invention, copper or copper alloy substrate (10); And at least iron (Fe), which is formed on one surface 20 or both surfaces 20 and 21 of the substrate 10, and simultaneously has the effects of rough plating and barrier layer formation. Plating layer 30; Disclosing the surface-treated copper foil, characterized in that it comprises, and further comprising providing a copper or copper alloy substrate (10) (S100); And electroplating one side surface 20 or both side surfaces 20 and 21 of the substrate 10 with an electrolyte solution containing copper, cobalt, iron, and nickel (S300). The manufacturing method of a processed copper foil is disclosed. According to the high-performance PCB and FPC of the present invention, as well as low roughness surface-treated copper foil used in various shielding materials for EMI shielding of display products such as PDP, and the manufacturing method thereof, the effects of rough plating and barrier layer formation are simultaneously achieved. It is possible to form one plating layer, which simplifies the process to improve productivity, and it is not glossy, does not have black particles, and has excellent etching resistance, oxidation resistance, heat resistance and chemical resistance, and high peel strength. The effect which can obtain the low roughness surface-treated copper foil which has a black plating layer is achieved.

Electroplating, Copper Foil, Blackening, Plating Layer, Rough Plating, Barrier Layer, Shield Material, Low Light

Description

Surface treated copper foil and the preparation method

1 is a cross-sectional schematic diagram showing a conventional surface-treated copper foil,

2 is a flowchart showing a manufacturing process of a conventional surface-treated copper foil;

3 is a flow chart showing a manufacturing process of the surface-treated copper foil according to an embodiment of the present invention,

4 is a schematic view showing a plating layer formed on one surface of a substrate according to an embodiment of the present invention;

5 is a schematic view showing plating layers formed on both surfaces of a substrate according to one embodiment of the present invention;

6 is a sectional schematic view showing a surface-treated copper foil according to one embodiment of the present invention;

7 is a SEM image of the surface according to Example 1 of the present invention,

8 is a surface SEM photograph according to Example 2 of the present invention.

* Brief description of the major symbols in the drawings *

10: base material 20: one side of the base material

21: other side of substrate 30: plating layer

40: chromate layer

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface-treated copper foil and a method of manufacturing the same, and in particular, mainly to a printed circuit board (PCB), a flexible printed circuit board (FPC), or in particular a display product such as a PDP (EMI). ElectroMagnetic Interference) Copper foil used in various kinds of shielding materials for shielding and manufacturing method thereof have the advantages of rough plating treatment and barrier layer formation without performing two processes of rough plating treatment and barrier layer formation. It is possible to form a plating layer of one layer to be achieved at the same time, thereby improving process efficiency and productivity, while improving etching resistance, oxidation resistance, heat resistance and chemical resistance at the time of fine pattern formation, and having good peeling strength, in particular, shielding material. In the surface-treated copper foil which has a matte black plating layer which black particle | grains do not adhere so that use for the sintering is suitable, and its manufacturing method It is about.

Recently, plasma display panels (PDPs), which are easy to see by self-luminescence, have a wide viewing angle, large screens, and fast driving speeds, are rapidly being applied to multimedia display devices.

Such a PDP is a display device using gas discharge, and excites a gas enclosed in a tube by discharge to generate a line spectrum having a broad wavelength from the ultraviolet region to the near infrared region.

That is, a phosphor is disposed in the tube of the PDP, and the phosphor is excited by the line spectrum of the ultraviolet region to generate light in the visible region, and a part of the line spectrum of the near infrared region is emitted from the surface glass of the PDP to the outside of the tube.

However, the wavelength of this near-infrared region is close to the wavelength (800 nm to 1000 nm) used for remote control devices and optical communications, and eventually causes malfunction if the devices operate near the PDP. Therefore, electromagnetic waves harmful to the human body, such as microwave or ultra low frequency, are generated. Therefore, an electromagnetic shielding material is required in order to prevent malfunction of the device and harmful effects to the human body due to such electromagnetic waves.

However, the shielding material for display products such as PDP should not only have an electromagnetic shielding effect, but also have an appropriate light transmitting property so that the image reproducing part image can be seen through the electromagnetic shielding material.

To this end, there is a method of forming a fine pattern having an opening using a conductive metal on a glass or transparent resin plate to secure light transmittance along with the effect of electromagnetic shielding. One of many conductive metal layers is copper foil.

However, when the pattern of the conductive metal layer has metallic luster, the light emitted from the PDP display screen of the metal layer is reflected on the shield plate and returned to the display screen, or light from outside is incident on the display screen by the smoothing of the PDP display screen. When the incident light is reflected.

For this reason, the light transmittance of the shield plate is lowered and the visibility of the display screen is deteriorated. To solve this problem, a method of blackening the surface of the copper foil, for example, an insulating oxide film having a black color on the surface of the copper foil, Techniques for forming conductive oxide films, chemical conversion films, and electroplating layers have been used.

However, the insulating oxide film has a disadvantage of being non-conductive, and the conductive oxide film has a disadvantage in that it is difficult to completely blacken, and in the case of the chemical film, there is a disadvantage that the conductivity is uneven and high temperature processing is required. In the case of forming a black electroplating layer, there is an advantage of easy conductivity and processability, but has a disadvantage of easy gloss.

Therefore, it is polite to increase the visibility of the shielding material of the display product by forming a matte black electroplating layer that does not have black particles on the surface of the copper foil, and at the same time, a fine pattern of several tens of micrometers should be formed to increase the opening ratio of the shielding material. Therefore, copper foil surface roughness should be small, the etching resistance, oxidation resistance, heat resistance and chemical resistance should be excellent, and also the peel strength should not be lowered also requires properties.

On the other hand, in general, the electrolytic copper foil is made of a continuous foil in a copper sulfate solution by a continuous electrolytic electrodeposition (raw foil), and the rough plating treatment to form a copper nodule (copper nodule) on the surface of the brother to improve the adhesion with the plate After forming a barrier layer on the roughened surface, an electrolytic chromate was used to obtain an electrolytic copper foil. The type, amount, and plating conditions of the copper foil were used to obtain the electrolytic copper foil. You can adjust the characteristics and colors.

BRIEF DESCRIPTION OF THE DRAWINGS It is sectional schematic drawing which shows the conventional surface treatment copper foil, and FIG. 2 is a flowchart which shows the method of manufacturing the conventional surface treatment copper foil.

As shown in FIG. 1, when a cross section of a conventional surface-treated copper foil is examined, a nodule 2 is formed on the substrate 1 by rough plating, and a barrier layer 3 is formed on the nodule 2. It can be seen that the chromate layer 4 is formed on the barrier layer 3.

That is, as shown in Figure 2, in order to manufacture a conventional surface-treated copper foil, first, to make a brother foil to be bonded to the insulating substrate by a continuous electrolytic electrodeposition method in a copper sulfate solution (S10), if necessary After activating the surface to be surface-treated by removing copper oxide formed on the surface (S20), roughening treatment (S30) is performed to improve mechanical adhesion with the insulating substrate, and then roughening to improve chemical bonding strength. The metallization treatment S40 is performed on the treated surface to form the barrier layer 3. And, if necessary, the chromate layer 4 is formed by electrolytic chromate rust prevention treatment (S50) for corrosion prevention.

Rough plating treatment (S30) is performed to form the nodule (2) is a roughening process (roughening process), which forms a nodule (nodule) through the electroplating on the surface of the copper foil, this nodule is the surface of the copper foil It forms irregularities in the surface to increase the surface roughness.

The metal plating treatment (S40) is to form a barrier layer (3) by applying a dissimilar metal on the surface of the copper foil after the roughening treatment, as the dissimilar metals that have been used to form the barrier layer (4) Zinc, chromium, brass, nickel, cobalt, molybdenum, tungsten, tin, and the like are used as alloys, and two or more of these metals may be used simultaneously. Electrolytic plating has been mainly used as a method of coating such dissimilar metals and alloys on copper foil.

As the surface treatment method of the specific electrolytic copper foil for achieving such surface blackening, the following techniques are proposed, for example.

Japanese Patent Application Laid-Open No. 52-145769 realized black through Cu-Ni rough plating, which is excellent in heat-peeling strength, oxidation resistance, and hydrochloric acid resistance, and difficult to etch in alkaline etching solution, and has a 150-micrometer pitch circuit width. There is a problem that a non-etching portion occurs when forming the following fine pattern.

Japanese Patent Laid-Open No. 63-2158 has good results in etching, alkali etching and hydrochloric acid resistance through Cu-Co rough plating, but it is difficult to realize completely black in oxidation resistance. Have

In addition, Japanese Patent Application Laid-Open No. 4-096395, Japanese Patent Application Laid-Open No. 4-096394, Japanese Patent Application Laid-Open No. 4-096393, and the like, have a heat-peeling strength and etching resistance through co-Ni treatment after rough plating treatment. Although an excellent roughening technique has been proposed, it requires two processes of rough plating treatment and barrier layer treatment, and thus has a disadvantage in that productivity is low.

Accordingly, the present invention has been made to solve the above problems,

An object of the present invention is excellent in etching resistance, oxidation resistance, heat resistance and chemical resistance in a low-light copper foil and its manufacturing method that can be used in high performance PCB and FPC as well as shielding material for EMI shielding of display products such as PDP. Very fine, having high peeling strength, no black particles, and realizing the same effect as that of rough plating and barrier layer formation without performing two processes of rough plating and barrier layer formation. It is to provide a matte black surface-treated copper foil and a method for producing the same, which achieves a predetermined surface roughness while increasing productivity by forming a plating layer of one layer embodying a nodule.

The object of the present invention as described above, copper or copper alloy substrate (10); And at least iron (Fe), which is formed on one surface 20 or both surfaces 20 and 21 of the substrate 10, and simultaneously has the effects of rough plating and barrier layer formation. It is achieved by the surface-treated copper foil characterized by including the plating layer (30).

The plating layer 30 is preferably made of copper-cobalt-nickel (Cu-Co-Fe-Ni), and the plating layer 30 is a plating layer 30 having a thickness of 1 μm or less. It is preferred that the content is copper 1-4 mg / m ² , cobalt 1,000-2,000 mg / m ² , iron 300-600 mg / m ² and nickel 7-15 mg / m ² , the content of copper 2-3 mg / m ² , cobalt 1,100 ~ 1500 mg / m ² , iron 400 ~ 550 mg / m ² and nickel 10 ~ 13 mg / m ² It is more preferable, wherein the plating layer 30, about 0.1 ~ 2㎛ It is desirable to have a nodule having an average cross-sectional width and an average height of about 0.1-1 μm.

The object of the present invention as described above, furthermore, providing a copper or copper alloy substrate (10) (S100); And electroplating one side surface 20 or both side surfaces 20 and 21 of the substrate 10 with an electrolyte solution containing copper, cobalt, iron, and nickel (S300). It is achieved by the manufacturing method of processed copper foil.

And, the S300 is a copper concentration of 0.1 to 2.0 g / L, cobalt concentration of 0.1 to 10.0 g / L, iron concentration of 0.1 to 6.0 g / L and nickel concentration of 0.02 to 2.0 g / L It is preferable to use an electrolyte solution, and the S300 is preferably electrolytically treated under the conditions of an electrolyte temperature of 20 to 50 ° C., a pH of 0.5 to 6, a treatment time of 2 to 30 seconds, and a cathode current density of 0.5 to 20 A / dm ² . In the S300, the copper concentration is 0.2-1.0 g / L, the cobalt concentration is 3.0-9.0 g / L, the iron concentration is 1.5-4.0 g / L and the nickel concentration is 0.1-1.5 g / L. More preferably, the S300 is more preferably electrolytically treated under the conditions of the temperature of the electrolyte solution 30 ~ 40 ℃, pH 1 ~ 3, treatment time 5 ~ 20 seconds, cathode current density 2 ~ 15 A / dm ² . In addition, the S300, it is preferable to use a direct current and / or pulse current during electroplating.

Hereinafter, the surface-treated copper foil which concerns on this invention, and its manufacturing method are demonstrated in detail.

The surface-treated copper foil according to the present invention and a method of manufacturing the same, without performing two processes of rough plating treatment and barrier layer formation, can realize an electrodeposition layer made of uniform and fine particles including iron, one layer plating layer Based on the technical idea that the production process is simplified while having an appropriate surface roughness, while carrying out the electroplating process for forming, the electrolyte containing copper, cobalt, iron and nickel is simultaneously used, in particular, It is applied at a concentration, and in particular, electroplating is carried out under predetermined treatment conditions, and thus has excellent etching resistance, oxidation resistance, heat resistance and chemical resistance, high peel strength, matteness, and black particles in low roughness copper foil. It is based on the technical idea that it will not be.

3 is a flowchart illustrating a method of manufacturing a surface-treated copper foil according to an embodiment of the present invention.

The surface-treated copper foil according to the present invention and a method for manufacturing the same are a manufacturing method of a low-light copper foil that can be used in various materials such as high-performance PCB, FPC and PDP shielding shield for EMI, first of all, copper or copper alloy substrate 10 It will be provided (S100).

Then, if necessary, as shown in FIG. 3, the copper oxide generated on the surface of the brother foil is removed to activate the surface to be surface treated (S200).

Next, on one surface 20 or both surfaces 20 and 21 of the substrate 10, an electrolyte solution containing copper, cobalt, iron, and nickel is provided to form a plating layer, and the substrate is treated at a predetermined temperature and treatment. Electroplating treatment on the substrate through time, cathode current density, current conditions (S300).

At this time, it is preferable that the electrolyte solution contains 0.1-2.0 g / L copper, 0.1-10.0 g / L cobalt, 0.1-6.0 g / L iron, and 0.02-2.0 g / L nickel.

Among the components of the plating layer, cobalt and nickel have characteristics of improving heat peel strength and oxidation resistance, hydrochloric acid resistance, and etching resistance.

The concentration of cobalt in the electrolyte is preferably 0.1 to 10.0 g / L. In the range of 0.1 g / L or less, the processing time is long, resulting in low productivity and low current efficiency. There is a disadvantage that does not reach dark black.

The concentration of nickel in the electrolyte is preferably 0.02 to 2.0 g / L. In the range of 0.02 g / L or less, the processing time is long, resulting in low productivity and low current efficiency. .

Among the components of the plating layer, iron evenly distributes the particles to be plated, and has a property of reducing the roughness and suppressing the metal gloss of the plating layer through the role of ultra-nodal treatment so that the existing two processes can be solved as one.

The iron concentration in the electrolyte is preferably 0.02 to 2.0 g / L. In the range of 0.02 g / L or less, the processing time is long, resulting in low productivity, low current efficiency, glossiness, and black plating at a concentration of 2.0 g / L or more. The problem is that particles are buried.

On the other hand, when the electrolyte solution containing an electrolyte containing 0.2 ~ 1.0 g / L, cobalt 3.O ~ 9.0 g / L, iron 1.5 ~ 4.0 g / L, nickel 0.1 ~ 1.5 g / L as the electrolyte solution, It becomes especially preferable in terms of a matte effect.

Conditions for the electrolytic treatment in the electrolytic treatment process are liquid temperature of 20 to 50 ℃, pH of 0.5 to 6, treatment time of 2 to 30 seconds, cathode current density of 0.5 to 20 A / dm ² , etching resistance, oxidation resistance Preferable in terms of heat resistance, chemical resistance, surface roughness, blackness, black particles, matte, etc., liquid temperature 30-40 ℃, pH 1-3, treatment time 5-20 seconds, cathode current density 2 Having an electrolytic treatment condition of ˜15 A / dm ² , it is also more preferable in terms of blackness and matte effect.

In addition, it is possible to use a general direct current as the current for forming the plating layer, and the use of a pulse rectifier capable of supplying a pulse current helps to form an electrodeposition layer made of uniform and fine particles, thereby providing a matte finish with no black particles. It is more effective in forming a deep plating layer.

After the formation of the plating layer, it is preferable to perform the electrolytic chromate rust prevention treatment, as shown in FIG.

Hereinafter, the surface-treated copper foil according to an embodiment of the present invention will be described in detail.

According to the above-described method for producing copper foil, the surface-treated copper foil has a plating layer of one layer containing at least one iron (Fe), which simultaneously serves as a barrier layer by forming a barrier layer and a nodule by rough plating. One layer plating layer made of copper-cobalt-iron-nickel (Cu-Co-Fe-Ni) on one side surface 20 or both surfaces 20 and 21 of the copper or copper alloy substrate 10 as having Is formed.

4 is a schematic view showing a plating layer formed on one surface of the substrate according to an embodiment of the present invention, Figure 5 is a schematic view showing a plating layer formed on both surface of the substrate according to an embodiment of the present invention.

As shown in Figs. 4 and 5, one layer of plating layer 30 is formed on the surfaces 20 and 21 of the substrate 10, and an ultra-fine nodule treatment is achieved on the plating layer 30. .

The plating layer 30 is made of copper, cobalt, iron and nickel, and the overall thickness of the plating layer 30 is about 1 μm or less, which is suitable even when used for high density wiring.

At this time, in the plating layer 30, in the case of the preferred electrolyte solution conditions and electrolytic treatment conditions, the content is 1 to 4 mg / m ² of copper, 1,000 to 2,000 mg / m ² of the cobalt, Iron is 300-600 mg / m ² and the nickel is 7-15 mg / m ² . In this content range, the formation of a black plating layer that is matte and free of black particles is preferable, and has excellent etching resistance, chemical resistance, heat resistance, oxidation resistance, high peel strength, and is preferable in surface roughness and the like.

In addition, in the plating layer 30, the content is more preferably 2 to 3 mg / m ² and 1,100 to 1,500 mg / m ² of copper, depending on the more preferable electrolyte solution conditions and electrolytic treatment conditions. The iron is 400 to 550 mg / m ² , and the nickel is 10 to 13 mg / m ^2. In such a content range, the matte effect is particularly increased or more preferable in the light that the blackness is increased.

The surface roughness Rz becomes 2.0 micrometers or less by the said plating layer 30 comprised in this way.

6 is a cross-sectional schematic view showing a surface-treated copper foil according to one embodiment of the present invention.

As shown in FIG. 6, on the substrate 10, one layer of the plating layer 30 is formed, and the microscopic nodule treatment effect occurs in the one layer of the plating layer 30, which is included in the plating layer 30. It is made of iron, and not only the particles to be plated are uniformly dispersed, but also low roughness is achieved, and the metal gloss of the plating layer is suppressed.

The nodule formed in the plating layer 30 preferably has an average cross-sectional width of approximately 0.1-2 μm and an average height of approximately 0.1-1 μm.

Then, if necessary, as illustrated in FIG. 6, the chromate layer 40 may be formed by the rust prevention treatment with the rust preventive solution.

As described above, when the plating layer of one layer containing copper-cobalt-iron-nickel is formed with an electrolyte solution containing copper, cobalt, iron, and nickel, the plating layer is subjected to the rough plating treatment without a separate rough plating treatment. It is possible to play the role of the nodule layer and the barrier layer at the same time to reduce the production process.

And by forming the plating layer of one layer containing such a copper-cobalt-iron-nickel, the copper foil which is excellent in etching property, excellent in oxidation resistance, heat resistance, and chemical resistance, and showing high peeling strength can be obtained.

In addition, the plating layer according to the present invention exhibits a matte dark black color, black plating particles are not buried, and can realize a low roughness of 2.O μm or less, and is used for copper foil used for shielding materials for EMI shielding of display products such as PDPs. Therefore, it is possible to solve the visibility problem, it is possible to implement a low-light copper foil to facilitate the formation of a fine pattern when manufacturing high-performance PCB and FPC.

The formation process of the matte black plating layer in which the black particles do not appear is not only possible for the electrolytic copper foil, but also for the rolled copper foil which has undergone the degreasing process for removing the rolled oil.

Hereinafter, the present invention will be described in more detail by explaining preferred embodiments of the present invention. However, the present invention is not limited to the following examples, and various forms of embodiments can be implemented within the scope of the appended claims, and the following examples are only common to those skilled in the art to complete the present disclosure. It is intended to facilitate the implementation of the invention to those with knowledge.

Example 1

In Example 1, a plating surface treatment containing copper-cobalt-iron-nickel was performed under the following electrolyte composition and treatment conditions.

The electrolyte solution composition was 0.4 g / L of copper (metal copper), 4.Og / L of cobalt (metal cobalt), 2.Og / L of iron (metal iron), and 0.2 g / L of nickel (metal nickel).

Electrolytic treatment conditions were the plating process in the same manner as described above with a liquid temperature of 35 ° C., a treatment time of 20 seconds, a cathode current density of 10 A / dm ² , and a pH of 1.75 or less.

Such a plated layer formed according to the content in the components of the further plating treatment, the results, the average value was measured 5 times, copper 2.4mg / m ^2, cobalt 1159.7mg / m ^2, an iron 418.5mg / m ^2, nickel 10.5mg / m ² was.

7 is a SEM photograph showing the surface of copper foil according to the first embodiment.

Example 2

In Example 2, plating surface treatment containing copper-cobalt-iron-nickel was performed under the following electrolyte composition and electrolytic treatment conditions.

The electrolyte composition was 0.8 g / L of copper (metal copper), 7.0 g / L of cobalt (metal cobalt), 3.0 g / L of iron (metal iron), and 1.0 g / L of nickel (metal nickel).

Electrolytic treatment conditions were liquid temperature 35 ℃, treatment time 10 seconds, cathode current density 15A / dm ² , The plating treatment was performed in the same manner as described above with a pH of 1.75 or less.

As a result of measuring five times the component content in one plating layer formed by such a plating treatment, the average value was copper 2.8 mg / m ² , cobalt 1417.6 mg / m ² , iron 511.5 mg / m ² , and nickel 12.9 mg / m. ² was.

8 is a SEM photograph showing the surface of copper foil according to the second embodiment.

According to the high-performance PCB and FPC of the present invention, as well as low roughness surface treated copper foil used in various shielding materials for EMI shielding of display products such as PDP, and the manufacturing method thereof, two processes of rough plating process and barrier layer formation as before It is possible to form a plating layer of one layer which simultaneously achieves the effect of rough plating treatment and barrier layer formation without performing the process, which simplifies the process to improve productivity, and does not have glossiness and no black particles. The effect of obtaining the low roughness copper foil which has the dark black plating layer which is excellent in etching property, oxidation resistance, heat resistance, and chemical-resistance, and shows high peeling strength is achieved.

Although the present invention has been described in connection with the above-mentioned preferred embodiments, it is possible to make various modifications or variations without departing from the spirit and scope of the invention. Accordingly, the appended claims will cover such modifications and variations as fall within the spirit of the invention.

Claims (11)

Copper or copper alloy base material 10; And Cu-Co-Fe-Ni, which is formed on one surface 20 or both surfaces 20 and 21 of the substrate 10 and has the effects of rough plating and barrier layer formation at the same time. Surface-treated copper foil, comprising; one layer of a plating layer (30) consisting of. delete The method of claim 1, wherein the plating layer 30, A plating layer 30 having a thickness of 1 μm or less, the content of which is copper 1 to 4 mg / m ² , cobalt 1,000 to 2,000 mg / m ² , iron 300 to 600 mg / m ^2, and nickel 7 to 15 mg / m ² . Surface-treated copper foil, characterized in that. The method of claim 3, wherein the plating layer 30, The surface-treated copper foil whose content is copper 2-3 mg / m <^2> , cobalt 1,100-1,500 mg / m <^2> , iron 400-550 mg / m <^2>, and nickel 10-13 mg / m <^2> . The plating layer 30 according to any one of claims 1, 3, and 4, It has a nodule which has an average cross section width of 0.1-2 micrometers, and an average height of 0.1-1 micrometer, The surface-treated copper foil characterized by the above-mentioned. Providing a copper or copper alloy base 10 (S100); And Electroplating the one surface 20 or both surfaces 20, 21 of the substrate 10 with an electrolyte solution containing copper, cobalt, iron and nickel (S300); Method of manufacturing copper foil. The method of claim 6, wherein S300, It is characterized by using an electrolytic solution having a copper concentration of 0.1 to 2.0 g / L, a cobalt concentration of 0.1 to 10.0 g / L, an iron concentration of 0.1 to 6.0 g / L, and a nickel concentration of 0.02 to 2.0 g / L. The manufacturing method of the surface-treated copper foil to make. The method of claim 7, wherein the S300, It is characterized by using an electrolyte having a copper concentration of 0.2-1.0 g / L, a cobalt concentration of 3.0-9.0 g / L, an iron concentration of 1.5-4.0 g / L, and a nickel concentration of 0.1-1.5 g / L. Method of manufacturing surface-treated copper foil. The method of claim 7, wherein the S300, A method for producing a surface-treated copper foil characterized by electrolytic treatment at a temperature of 20 to 50 ° C., a pH of 0.5 to 6, a treatment time of 2 to 30 seconds, and a cathode current density of 0.5 to 20 A / dm ² . The method of claim 8, wherein S300, The manufacturing method of the surface-treated copper foil characterized by electrolytic treatment on the conditions of 30-40 degreeC of electrolyte solution, pH 1-3, treatment time 5-20 second, and cathode current density of 2-15 A / dm <^2> . The method according to any one of claims 6 to 10, wherein S300, Surface treatment copper foil and its manufacturing method characterized by using a direct current, a pulse current or direct current and a pulse current at the time of electroplating.

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