KR100555806B1 - Air-cooling apparatus for semiconductor element - Google Patents

Abstract

The present invention improves the flow of air that is blown by a blower fan and flows around a heat emitting fin of a heat radiating means, so that an air-cooled cooling device for a semiconductor device can realize enhanced cooling performance with a blower fan having a small capacity. An air induction pipe having an inlet and an outlet part and a venturi tube shape having a narrow center part; Air inlet means for introducing external air into the air induction pipe; And air is introduced from the air induction pipe, and provides an air-cooled cooling device for a semiconductor device comprising a heat radiation means for absorbing heat from the heat source to radiate heat.

Blower fan, air induction pipe, heat sink member, heat radiation fin

Description

Air-cooled chiller for semiconductor device {AIR-COOLING APPARATUS FOR SEMICONDUCTOR ELEMENT}             

1A is a perspective view of a conventional CPU cooling device.

1B is a front view of FIG. 1A;

FIG. 1C is a cross sectional view along line AA ′ in FIG. 1B; FIG.

Figure 2 is a perspective view showing one embodiment configuration of an air-cooled cooling device for a semiconductor device according to the present invention.

Figure 3 is an exploded perspective view of the air-cooled cooling device for a semiconductor device according to the present invention shown in FIG.

Figure 4a is a plan view showing an embodiment configuration of a heat dissipation means that is the main part of the present invention.

4B is a front view of FIG. 4A.

4C is a side view of FIG. 4A.

Figure 5a is a plan view showing another embodiment of the heat dissipation means that is the main part of the present invention.

Fig. 5B is a front view of Fig. 5A.

Figure 6a is a plan view showing another embodiment of the heat dissipation means that is the main part of the present invention.

Fig. 6B is a front view of Fig. 6A.                 

Figure 7 is a state diagram showing the operating state of the air-cooled cooling device for semiconductor devices according to the present invention.

* Explanation of symbols for main parts of the drawings

210: blower fan 220: air induction pipe

221: first flange 222: second flange

230: heat dissipation means 231: heat sink member

232: spine heat radiation fin 233: rib heat radiation fin

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling device for cooling semiconductor elements such as a central processing unit (hereinafter referred to as a CPU), a graphics processor, and a chipset mounted on a computer. The present invention relates to an air-cooled cooling device for a semiconductor device that improves the flow of air flowing around a heat emitting fin of a heat dissipation means, so that an improved cooling performance can be realized even with a small blower fan.

In general, a computer has a plurality of operating elements made of semiconductors therein, which are electrically operated and thus generate a lot of heat during their operation and exhibit heat-vulnerable properties due to their device characteristics. In particular, the CPU, which is a key component of the computer, is sensitive to the operating characteristics due to heat, and therefore, the processing speed may be reduced, the system may crash, or the CPU itself may be damaged at high temperatures. According to the heat and the surrounding heat should be released to the outside. Moreover, with the development of the information society, the demand for computers capable of processing large amounts of data at a rapid rate continues to increase, and the high performance of CPUs to meet the demands of such consumers is rapidly increasing. Increasing the cooling efficiency of the device is a very important problem.

As the conventional CPU cooling apparatus, air-cooling and fluid-cooling are mainly used. Among them, air-cooling cooling apparatuses used in general personal computers are shown in FIGS. 1A and 1C.

1A to 1C, the conventional CPU cooling apparatus and the heat dissipation means 110 in surface contact with the surface of the core 101a of the CPU 101 so as to absorb the operating heat of the computer CPU (101) It is largely composed of a blowing fan 120 installed adjacent to one side of the heat dissipation means (110). Here, the heat dissipation means 110 is composed of a heat sink 111 made of a material and form having a predetermined heat absorption capacity, and a plurality of heat dissipation fins 112 extending in a vertical direction from the surface of the heat sink 111. do.

Looking at the cooling process of the CPU by the conventional CPU cooling device configured as described above, the driving heat of the CPU 101 is absorbed by the heat sink 111 by heat conduction, the heat absorbed by the heat sink 111 is It is discharged to the outside through the heat dissipation fins 112 to lower the temperature of the CPU, and the air blown by the driving of the blower fan 120 flows around the heat dissipation fins 112 to activate heat exchange to increase the cooling efficiency. do.

However, the conventional CPU cooling device as described above has the following problems in that the cooling fan 120 for simply circulating air is added to the passive cooling method of releasing the operating heat of the CPU through the heat radiation fins 112. There is this.

First, since the connection portion of the heat dissipation fin 112 and the heat sink 111 is formed vertically, the air blown by the blower fan 120 and introduced between the heat dissipation fins 112 as shown in FIG. It hits the surface of the (111) and shows a flow as shown by the arrow B, due to the turbulence and vortex generated thereby the relative velocity of air relative to the surface of the heat radiation fins 112 is formed to form a portion that is 0 or significantly reduced, There is a problem that the air is stagnant portion is formed between the 112 to reduce the cooling efficiency.

Second, since most of the heat generated by the CPU 101 is generated in the core 101a portion disposed at the center thereof, the most intensive cooling portion is to be the central portion of the CPU 101. The blower fan 120 The blowing force of) decreases toward the center due to the linear velocity that decreases toward the center direction, and furthermore, since the driving motor is mounted in the center of the blowing fan 120 to restrict the flow of air, the heat dissipation means 110 Almost no air flows between the heat dissipation fins 111 positioned at the center of the bottom part, so that the cooling performance of the portion in which the core 101a is mounted is the lowest.

Third, in order to increase the cooling performance of the conventional CPU cooling apparatus, the driving speed of the blower fan must be increased. When the driving speed of the blower fan is increased, the air flow rate is increased, but turbulence is increased from the acceleration point of the air. These turbulences are endothermic due to their high energy values, so the effect of enhancing cooling performance is insignificant. Furthermore, energy consumption and noise generation are aggravated by the installation of a large blower fan. .

Accordingly, the present invention has been made to solve the above problems, and naturally the air blown by the blower fan to the center of the heat dissipation means by using a venturi tube type inlet and outlet side wide and narrow central portion It is an object of the present invention to provide an air-cooled cooling device for a semiconductor device that is concentrated and efficiently introduced so that the core portion of the semiconductor device can be cooled effectively.

In addition, the present invention in the heat dissipation means including a heat sink and a heat sink and a fin extending in the longitudinal direction and a rib fin formed in the transverse direction perpendicular to the spine pin so that the end of the heat dissipation fin and the inner surface of the induction pipe adjacent to each other. To form a closed channel in line with the shape of the heat sink combined with the induction pipe, and to form a pipeline through which air carried by the blowing fan flows smoothly therebetween. Another object of the present invention is to provide an air-cooled cooling device for semiconductor devices capable of increasing the cooling efficiency.

In order to achieve the above object, the present invention provides an air induction pipe having a venturi tube shape having a wide inlet portion and an outlet portion and a narrow central portion; Air inlet means for introducing external air into the air induction pipe; And air is introduced from the air induction pipe, and provides an air-cooled cooling device for a semiconductor device comprising a heat radiation means for absorbing heat from the heat source to radiate heat.

The above objects, features and advantages will become more apparent from the following detailed description taken in conjunction with the accompanying drawings. Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Figure 2 is a perspective view showing an embodiment configuration of an air-cooled cooling device for a semiconductor device according to the present invention, Figure 3 is an exploded perspective view thereof.

As shown in FIG. 2 and FIG. 3, the air-cooled cooling apparatus for a semiconductor device of the present invention includes first and second flanges 221 and 222 at both ends thereof, and the inlet and outlet sides thereof are wide and the center portion thereof is wide. An air induction tube 220 in the form of a narrow venturi tube; It is coupled to the first flange 221 of the air induction pipe 220, the bottom surface is disposed so as to be in contact with the top of a semiconductor device (not shown) such as a computer CPU or graphics processor to absorb the operating heat of the semiconductor device And heat dissipation means 230 for dissipating heat; Coupled to the second flange 222 of the air induction pipe 220, by blowing the outside air to the heat dissipation means 230 through the air induction pipe 220 to the blowing fan 210 to promote heat exchange It is composed.

In this embodiment, the combination of the air induction pipe 220, the blowing fan 210 and the heat dissipation means 230 is made through a plurality of bolts 240. To this end, a plurality of fastening holes 221a and 222a into which the bolts 240 are inserted are formed in the first and second flanges 221 and 222 of the air induction pipe 220, respectively. The fastening hole 230a corresponding to the fastening hole 221a of the first flange 221 is formed, and the blowing fan 210 corresponds to the fastening hole 222a of the second flange 222. The fastening hole 210a is formed.

4A to 4C are plan, front and side views of the heat dissipation means 230, respectively.

3 and 4A to 4C, the heat dissipation means 230 has a plate-shaped heat sink member 231 whose bottom surface is in surface contact with the core portion of the semiconductor element to absorb operating heat of the semiconductor element. Wow; A spine heat dissipation fin 232 formed upright in the center of the upper surface of the heat sink member 231; It extends in the vertical direction from both sides of the spine heat radiating fin 232, the upper portion is inserted into the inside of the air induction pipe 220 and the lower portion is exposed to the outside heat exchange with the air supplied by the blowing fan 210 Rib heat radiation fins 233 arranged at a predetermined interval to the; It is provided in a predetermined position on the outer end of the heat sink member 231, it is composed of a clip ring 234 is mounted a clip for coupling with the semiconductor socket.

In the present embodiment, the upper both side ends of the rib heat dissipation fin 233 is made of a shape cut in a predetermined curvature according to the shape of the induction pipe 220 to be adjacent to the inner surface of the air induction pipe 220, The lower portion of the rib heat dissipation fin 233 exposed to the outside extends to the outer end of the heat sink member 231 to discharge the air introduced through the blowing fan 210 to both sides. Accordingly, a plurality of separate air transfer pipes are formed between the inner circumferential surface of the air induction pipe 220 and the spinal heat dissipation fin 232 and the plurality of rib heat dissipation fins 233. In addition, both ends of the bottom of the spine heat radiating fin 232 and the bottom outer end of the rib radiating fin 233a disposed at the outermost both ends of the plurality of rib radiating fins 233 for a smooth flow of air through the air transfer pipe are predetermined. Comprising a curved surface of the curvature is made in a gradient shape, the spine heat radiation fins 232 and the rib heat radiation fins 233 is formed in a shape thinner than the top.

Looking at the detailed function and operation of each component in an embodiment of the air-cooled cooling device for a semiconductor device of the present invention as described above are as follows.

FIG. 7 is a cross-sectional view showing a state where the air cooling system for semiconductor elements of the present embodiment is mounted on the CPU 101. FIG. The operating heat of the CPU 101 is absorbed by the heat sink member 231 by heat conduction and is conducted to the spine radiating fin 232 and the sternum radiating fin 233. In this state, when the blower fan 210 is operated, external cooling air flows into the air induction pipe 220, and the spine heat radiating fin 232 and the rib heat radiating fin 233 of the heat radiating means 230 and air. Heat is absorbed while flowing through an independent pipe line formed by the inner wall surface of the induction pipe 220.

At this time, since the inlet side of the air induction pipe 220 has a smaller cross-sectional area, the air supplied by the blowing fan 210 may be concentrated to the center of the heat dissipation means 230, and the outlet side thereof has a cross-sectional area. Since the air flow rate is slowed down because the structure is getting larger, the expanded air is heated by the spine heat radiating fin 232 and the rib heat radiating fin 233 to smoothly flow out. In addition, most of the air transported by the heat dissipation fan 210 is a laminar flow along the pipeline consisting of the spine heat dissipation fin 232 and the rib heat dissipation fin 233 of the heat dissipation means 230 and the inner wall surface of the air induction pipe 220. As it flows stably in a state of absorbing heat continuously, the energy use efficiency and cooling efficiency for driving the heat radiating fan are increased.

In addition, since both ends of the bottom of the spinal heat radiating fin 232 constitute a gradient with a predetermined curvature, not only the air flows smoothly, but also the heat directly contacting the core 101a of the CPU 101 due to the gradient portion. The volume of the central portion of the sink member 231 is increased to increase initial absorption of heat generated by concentrating on the central portion.

On the other hand, although not shown, the radius of curvature of the inclined surface formed on the lower end of the spine heat radiating fin 232 and the connection portion of the heat sink member 231 becomes larger toward the center of the heat sink member 231, so that the heat dissipation area is wider toward the center. You can also have.

5A and 5B show another embodiment configuration of a heat dissipation means that is a main part of a cooling device for a semiconductor device according to the present invention, and is substantially the same as the above-described embodiment, but additionally, the plurality of rib heat dissipation fins. The example provided with the some auxiliary heat radiation fin 235 extended in the direction perpendicular | vertical from the outer end of each rib heat radiation fin 233a arrange | positioned at the outermost both ends in 233 is shown. This is to expand the heat dissipation area and stabilize the flow of cooling air by the auxiliary heat dissipation fins 235 disposed at predetermined intervals, and is the same as the above-described embodiment except for the auxiliary heat dissipation fins 235. Since it has a configuration, detailed description thereof will be omitted.

On the other hand, the shape and configuration of the heat dissipation means in the cooling device for a semiconductor device of the present invention is not limited by the above-described embodiment, one side of the air induction pipe 220 is inserted into the air by the blowing fan 210 The induction pipe 220 may be formed in various forms to form an air line for homogeneously flowing the cooling air flowing in. That is, the heat dissipation fin of the heat dissipation means may be composed of a radial arrangement and a spherical arrangement as well as the linear arrangement as described above.

6A and 6B are a plan view and a side view showing an example in which the heat dissipation means, which is a main part of the present invention, has a radial structure, and the heat dissipation means 240 according to the present embodiment has a bottom surface thereof in surface contact with the core portion of the semiconductor element. A plate-shaped heat sink member 241 for absorbing operating heat of the element; Is formed in a radial arrangement upright from the upper surface of the heat sink member 241, the upper portion is inserted into the inside of the air induction pipe 220 and the lower portion is exposed to the outside, of the air induction pipe 220 It is composed of a plurality of radial heat dissipation fins 242 forming a predetermined pipe so that the air supplied by the blowing fan 210 flows in a uniform laminar flow between the inner wall surface.

In the present embodiment, the upper outer end of each of the radial radiating fins 242 is formed in a shape cut in a predetermined curvature according to the shape of the induction pipe 220 to be adjacent to the inner surface of the air induction pipe 220. The lower portion of the radial radiating fin 242 exposed to the outside extends to the radially outer end of the heat sink member 241 to discharge the air introduced through the blowing fan 210 in the radial direction. Accordingly, a plurality of separate air transfer pipes are formed between the inner circumferential surface of the air induction pipe 220 and the radial heat dissipation fins 242. In addition, the lower end of the radial radiating fin 242 is formed in a gradient shape to form a curved surface of a predetermined curvature for the smooth flow of air through the air transfer pipe.

In the cooling device for a semiconductor device of the present embodiment as described above, by allowing the air transferred by the blowing fan 210 to flow stably through the air transfer pipe consisting of the radial radiating fin 242 and the air induction pipe 220, As in one embodiment, it is possible to effectively use the driving energy of the blowing fan.

On the other hand, although not shown, the radius of curvature of the inclined surface formed on the lower end of the radial radiating fin 242 and the connection portion of the heat sink member 241 becomes larger toward the center of the heat sink member 241 so that the heat dissipation area is wider toward the center. You can also have.

The present invention described above is not limited to the above-described embodiments and the accompanying drawings, and various substitutions, modifications, and changes are possible in the art without departing from the technical spirit of the present invention. It will be clear to those of ordinary knowledge.

According to the present invention as described above has the following effects.

(A) The air blown by the blower fan is naturally concentrated and efficiently supplied to the core part of the semiconductor element by the venturi tube-type induction pipe, and is efficiently transported by the heat dissipation fin and the inner surface of the induction pipe. Since it is smoothly transferred through the pipe, it is possible to efficiently use the cooling air supplied by the blower fan, thereby increasing the cooling efficiency of the semiconductor device.

(B) Since the connection part between the heat sink fin and the heat sink member is smoothly connected to form a curved surface, the air flow around the heat sink fin is maintained in a laminar flow state, so that the cooling efficiency is increased by the cooling air, and the heat sink directly contacts the core part of the semiconductor element. By increasing the volume of the center of the member, that is, inducing more wind in the center of the heat sink, the initial absorption of heat generated is enhanced.

(C) The smooth air flow and the large amount of air flow induced in the center of the main heating part of the semiconductor device allow the use of a small, low speed fan for quiet operation and low power consumption. The low speed fan and the closed heat sink double the heat transfer effect by keeping the cooling air flow in laminar flow.

Claims (10)

delete delete delete An air induction pipe having a venturi tube shape having a wide inlet portion and an outlet portion and a narrow central portion; Air inlet means for introducing external air into the air induction pipe; And A heat radiating means for absorbing and radiating heat from the semiconductor element, The heat dissipation means, A heat sink member whose bottom surface is connected to the semiconductor element to absorb operating heat of the semiconductor element; The upper portion is formed to be upright on the upper surface of the heat sink member so that the upper portion is inserted into the inside of the air induction pipe, the upper outer end inserted into the air induction pipe has a shape corresponding to the shape of the inner surface of the induction pipe to guide the air To form a plurality of air conveying pipes through which the air supplied by the blowing fan is transferred between the inner surface of the tube, and includes a plurality of heat radiation fins for radiating heat conducted from the heat sink member, The lower end of the heat dissipation fin and the connection portion of the heat sink member are formed with an inclined surface having a predetermined curvature, and the radius of curvature of the inclined surface is increased toward the center of the heat sink member so that the heat dissipation area is increased toward the center. Air-cooled chiller for semiconductor device. The method of claim 4, wherein The heat dissipation fin is an air-cooled cooling device for a semiconductor device is formed thinner than the thickness of its upper end. The method according to claim 4 or 5, The heat dissipation fin A spine heat dissipation fin formed upright in the center of the upper surface of the heat sink member; A plurality of ribs extending in a vertical direction from both sides of the spine heat radiating fin, the upper portion is inserted into the inside of the air induction pipe and the lower portion is exposed to the outside and arranged at predetermined intervals to exchange heat with the air supplied by the blowing fan. Air-cooled cooling device for a semiconductor device comprising a heat radiating fin. The method of claim 6, And a plurality of auxiliary heat dissipation fins extending in a vertical direction from an outer end of the rib heat dissipation fins disposed at the outermost ends of the plurality of rib heat dissipation fins. The method according to claim 4 or 5, And a heat dissipation fin formed in a radial arrangement upright from an upper surface of the heat sink member. The method of claim 4, wherein And a clip ring provided at a predetermined position at an outer end of the heat sink member and having a clip mounted thereon for coupling with the semiconductor socket. The method of claim 4, wherein An air-cooled cooling device for semiconductor elements, wherein the heat sink member has a plate shape.

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