KR100542862B1 - A Cooling apparatus for thermal exchang use in semiconductor manufacturing equipment - Google Patents

A Cooling apparatus for thermal exchang use in semiconductor manufacturing equipment Download PDF

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KR100542862B1
KR100542862B1 KR1020030066668A KR20030066668A KR100542862B1 KR 100542862 B1 KR100542862 B1 KR 100542862B1 KR 1020030066668 A KR1020030066668 A KR 1020030066668A KR 20030066668 A KR20030066668 A KR 20030066668A KR 100542862 B1 KR100542862 B1 KR 100542862B1
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heat exchange
plate
heat
semiconductor manufacturing
manufacturing equipment
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KR20050030357A (en
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양성철
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(주)팀코리아
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/302—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements characterised by the form or geometrical disposition of the individual elements
    • G09F9/3026—Video wall, i.e. stackable semiconductor matrix display modules

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Abstract

제1 열교환탱크를 통과하는 유체 온도를 열전소자들(Feltier)에 의해 일정온도로 유지하는 열교환판; 상기 열교환판의 일면에 결합되어 열을 외부로 방출하는 제2 열교환탱크를 구비한 반도체 제조 장비의 열교환용 냉각 장치에 있어서, 상기 열교환판은 상기 열전소자들이 안착될 수 있는 개구부를 가지며, 상기 열전소자들이 전기적으로 연결되는 회로 배선층이 형성된 플레이트; 상기 플레이트의 상하면에 적층되어 상기 열전소자의 전자 이동에 의한 열을 전도하는 제1, 2열전도판; 상기 열전소자를 외부로부터 보호하기 위하여 상기 제1, 2열전도판 사이의 외부공간 테두리를 밀봉하는 실리콘층; 상기 제1, 2열전도판의 외측면에 각각 형성된 제1, 2산화방지막; 및 상기 제1, 2산화방지막 위에 장착된 제1, 2방열판으로 구성된 반도체 제조장비의 열교환용 냉각장치가 제공된다. A heat exchange plate which maintains a fluid temperature passing through the first heat exchange tank at a constant temperature by thermoelectrics (Feltier); In the cooling device for heat exchange of the semiconductor manufacturing equipment having a second heat exchange tank coupled to one surface of the heat exchange plate for dissipating heat to the outside, the heat exchange plate has an opening in which the thermoelectric elements can be seated, the thermoelectric A plate formed with a circuit wiring layer to which the elements are electrically connected; First and second thermal conductive plates stacked on upper and lower surfaces of the plate to conduct heat by electron movement of the thermoelectric element; A silicon layer sealing an outer space edge between the first and second thermal conductive plates to protect the thermoelectric element from the outside; First and second antioxidant films formed on outer surfaces of the first and second thermal conductive plates, respectively; And a first and second heat dissipation plate mounted on the first and second anti-oxidation films.

열교환판, 열전소자, 산화방지막, 유체펌프, 열교환 장치, 반도체 제조장비, 인쇄회로기판Heat exchanger plate, thermoelectric element, antioxidant film, fluid pump, heat exchanger, semiconductor manufacturing equipment, printed circuit board

Description

반도체 제조장비의 열교환용 냉각장치{A Cooling apparatus for thermal exchang use in semiconductor manufacturing equipment}A cooling apparatus for thermal exchanging in semiconductor manufacturing equipment

도 1은 종래기술에 따른 반도체 제조장비의 열교환용 냉각장치를 나타낸 사시도;1 is a perspective view showing a cooling device for heat exchange of semiconductor manufacturing equipment according to the prior art;

도 2는 도 1에 도시된 열교환용 냉각장치의 열교환판을 나타낸 단면도; 2 is a cross-sectional view showing a heat exchange plate of the heat exchange cooling device shown in FIG. 1;

도 3은 본 발명의 바람직한 실시예에 따른 반도체 제조장비의 열교환용 냉각장치를 나타낸 사시도; 3 is a perspective view showing a cooling device for heat exchange of semiconductor manufacturing equipment according to a preferred embodiment of the present invention;

도 4는 본 발명의 바람직한 실시예에 따른 열교환용 냉각장치의 열교환판을 나타낸 분해 사시도; 및Figure 4 is an exploded perspective view showing a heat exchange plate of the cooling device for heat exchange according to a preferred embodiment of the present invention; And

도 5는 도 3에 도시된 열교환판의 부분 단면도이다. 5 is a partial cross-sectional view of the heat exchanger plate shown in FIG. 3.

*도면의 주요 부분에 대한 부호의 설명* * Description of the symbols for the main parts of the drawings *

200...열교환 냉각장치 210...제1 열교환탱크200 ... heat exchange chiller 210 ... first heat exchange tank

220...제2 열교환탱크 230...제3 열교환탱크 220 ... 2nd heat exchange tank 230 ... 3rd heat exchange tank

240...제1 열교환판 250...제2 열교환판240 ... first heat exchanger plate 250 ... second heat exchanger plate

241...인쇄회로기판 242...열전소자241 printed circuit boards 242 ...

243...실리콘층 244...제1 열전도판243.Silicone layer 244 ... First heat conduction plate

245...제2 열전도판 246...제1 산화방지막245 2nd heat conduction plate 246 1st antioxidant film

247...제2 산화방지막 248...제1 방열판247 ... 2nd antioxidant 248 ... 1st heat sink

본 발명은 반도체 제조장비의 열교환용 냉각 장치에 관한 것으로서, 보다 상세하게는 유체 저장 탱크에 저장되어 있는 유체가 펌프에 의해 펌핑되어 유로를 순환할 때 반도체 제조 장비와 열교환된 상기 유체의 온도를 일정치 이하로 유지하는 반도체 제조장비의 열교환용 냉각 장치에 관한 것이다.The present invention relates to a cooling device for heat exchange of semiconductor manufacturing equipment, and more particularly to the temperature of the fluid heat exchanged with the semiconductor manufacturing equipment when the fluid stored in the fluid storage tank is pumped by the pump to circulate the flow path. The present invention relates to a cooling device for heat exchange of semiconductor manufacturing equipment held below stationary.

일반적으로, 반도체 제조공정에서는 집적회로의 기판인 웨이퍼 상에 금속배선의 증착이나 막의 식각 또는 패턴을 노광하는 공정을 진행하게 된다. 그러한 공정 등을 수행하는 반도체 제조장비들에는 웨이퍼 온도를 일정하게 유지하거나 장비의 국부를 일정한 온도로 유지시키기 위해 열교환용 냉각장치가 구비된다. In general, in the semiconductor manufacturing process, a process of depositing a metal wiring or etching a film or pattern is exposed on a wafer which is a substrate of an integrated circuit. Semiconductor manufacturing equipment that performs such a process or the like is equipped with a cooling device for heat exchange to maintain a constant wafer temperature or a local portion of the equipment.

이와 관련된 반도체 제조장비에 이용되는 열교환용 냉각장치에 대해 설명하면 다음과 같다. 도 1은 반도체 제조 장비에 이용되는 종래 열교환용 냉각장치를 나타낸 사시도이며, 도 2는 도 1의 단면도이다. 도 1과 도 2에 도시된바와 같이, 반도체 제조장비에 이용되는 종래의 열교환용 냉각장치(100)는 반도체 제조 장비인 열원과 열접촉되어 순환되는 유체가 통과하는 제1 열교환탱크(110); 상기 제1 열교환탱크(110)의 양면에 열교환면이 각각 결합되어 상기 제1 열교환탱크(110)를 통과하는 유체 온도를 일정치 이하로 유지하시키는 제1, 2 열교환판(140,150); 상기 제1, 2 열교환판(140,150)의 발열면에 각각 결합되어 상기 제1, 2 열교환판(140,150)에서 발생하는 열을 외부로 방출하는 제2,3 열교환탱크(120,130)로 구성된다.Referring to the heat exchange cooling device used in the semiconductor manufacturing equipment related to this. 1 is a perspective view showing a conventional heat exchange cooling device used in semiconductor manufacturing equipment, Figure 2 is a cross-sectional view of FIG. As shown in FIG. 1 and FIG. 2, a conventional heat exchange cooling device 100 used in semiconductor manufacturing equipment includes a first heat exchange tank 110 through which a fluid circulated in thermal contact with a heat source that is a semiconductor manufacturing equipment passes; First and second heat exchange plates 140 and 150 coupled to both sides of the first heat exchange tank 110 to maintain a fluid temperature passing through the first heat exchange tank 110 at a predetermined value or less; It is composed of second and third heat exchange tanks (120, 130) coupled to the heat generating surfaces of the first and second heat exchange plates (140, 150), respectively, to discharge heat generated from the first and second heat exchange plates (140, 150) to the outside.

상기 제1 열교환탱크(110)에 각각 열교환면이 결합되어 있는 제1,2열교환판(140,150)은 서로 동일한 구조를 가진다.The first and second heat exchange plates 140 and 150 having the heat exchange surfaces respectively coupled to the first heat exchange tank 110 have the same structure.

상기 제1 열교환판(140)은 열전도성 금속(Al) 등으로 형성되어 열도체의 역할을 하는 제1, 2열전도판(144,145); 상기 제1, 2 열전도판(144,145)사이에 직렬 상태로 배열된 다수개의 열전소자(Feltier;142); 상기 다수 열전소자(142)를 수분으로부터 보호하기 위하여 상기 제1, 2 열전도판(144,145) 사이의 외부공간 테두리를 밀봉하는 실리콘층(143); 상기 제1, 2열전도판(144,145) 위에 적층되어 산화를 방지하기 위한 제1, 2산화방지막(146,147); 및 상기 제1, 2산화방지막(146,147)위에 장착된 제1, 2방열판(148,149)으로 구성되며, 상기 제1, 2산화방지막(146,147)은 금속 메탈(Al2O3) 등을 제1, 2열전도판(144,145) 위에 산화시켜 형성한다.The first heat exchange plate 140 is formed of a thermally conductive metal (Al) or the like, the first and second thermal conductive plates 144 and 145 serving as thermal conductors; A plurality of thermoelectric elements (Feltier) 142 arranged in series between the first and second thermal conductive plates 144 and 145; A silicon layer 143 sealing an outer space edge between the first and second thermal conductive plates 144 and 145 to protect the plurality of thermoelectric elements 142 from moisture; First and second antioxidant films 146 and 147 stacked on the first and second heat conductive plates 144 and 145 to prevent oxidation; And the first, second, and consists of a first and second heat sinks (148 149) mounted on the oxidation preventing layer (146 147), the first and a 2-oxide film (146 147) is a metal-metal (Al 2 O 3) 1, It is formed by oxidizing on the two thermal conductive plates (144, 145).

상기와 같은 구조에 의하면 제1, 2 열교환판(140,150)에서 다수개의 열전소자(142)를 전기적으로 연결하여 제1 열전도판(144) 위에 안착시킬 때 상기 다수개의 열전소자(142)를 정확한 위치에 배열하기가 곤란하여 작업 수율이 떨어지는 문제점이 있다, 또한, 상기 다수개의 열전소자(142)를 수분으로부터 보호하기위하여 상기 제1, 2 열전도판(144,145)의 테두리를 밀봉하는 실리콘층(143)의 재료로 사용되는 실리콘은 통풍성과 흡기성을 가지고 있어서 외부의 습기를 효과적으로 차단할 수 없고, 또한, 상기 실리콘이 굳어지면서 균열이 발생하기 때문에 외부에서 유입 되는 습기를 차단할 수 없어 열전소자(142)가 파괴되는 문제점이 있었다. According to the above structure, when the plurality of thermoelectric elements 142 are electrically connected to each other in the first and second heat exchange plates 140 and 150 to be seated on the first thermal conductive plate 144, the plurality of thermoelectric elements 142 are correctly positioned. There is a problem in that the work yield is difficult because it is difficult to arrange in the present invention, and the silicon layer 143 sealing the edges of the first and second heat conductive plates 144 and 145 to protect the plurality of thermoelectric elements 142 from moisture. Since the silicon used as a material of the air permeability and air intake is not able to effectively block external moisture, and the silicon is hardened and cracks are generated, the thermal element 142 is not able to block moisture from entering the outside. There was a problem that was destroyed.

따라서, 본 발명은 상기와 같은 제반 결점을 해소하기 위하여 안출된 것으로서, 본 발명의 목적은 열교환판의 열전소자가 습기에 의해서 파괴되는 것을 방지할 수 있는 열교환용 냉각 장치를 제공하는데 있다.Accordingly, the present invention has been made to solve the above-mentioned drawbacks, and an object of the present invention is to provide a cooling device for heat exchange that can prevent the thermoelectric element of the heat exchanger plate from being destroyed by moisture.

본 발명의 다른 목적은 열전도판상에 정확하게 열전소자가 안착되도록 하여 제조 수율을 향상시키는 열교환용 냉각장치를 제공하는데 있다. Another object of the present invention is to provide a cooling device for heat exchange which improves the production yield by allowing a thermoelectric element to be accurately mounted on a heat conduction plate.

본 발명에 의하면, 제1 열교환탱크를 통과하는 유체 온도를 열전소자들(Feltier)에 의해 일정온도로 유지하는 열교환판; 상기 열교환판의 일면에 결합되어 열을 외부로 방출하는 제2 열교환탱크를 구비한 반도체 제조 장비의 열교환용 냉각 장치에 있어서, 상기 열교환판은 상기 열전소자들이 안착될 수 있는 개구부를 가지며, 상기 열전소자들이 전기적으로 연결되는 회로 배선층이 형성된 플레이트; 상기 플레이트의 상하면에 적층되어 상기 열전소자의 전자 이동에 의한 열을 전도하는 제1, 2열전도판; 상기 열전소자를 외부로부터 보호하기 위하여 상기 제1, 2열전도판 사이의 외부공간 테두리를 밀봉하는 실리콘층; 상기 제1, 2열전도판의 외측면에 각각 형성된 제1, 2산화방지막; 및 상기 제1, 2산화방지막 위에 장착된 제1, 2방열판으로 구성된 반도체 제조장비의 열교환용 냉각장치가 제공된다.According to the present invention, a heat exchange plate for maintaining a fluid temperature passing through the first heat exchange tank at a constant temperature by the thermoelements (Feltier); In the cooling device for heat exchange of the semiconductor manufacturing equipment having a second heat exchange tank coupled to one surface of the heat exchange plate for dissipating heat to the outside, the heat exchange plate has an opening in which the thermoelectric elements can be seated, the thermoelectric A plate formed with a circuit wiring layer to which the elements are electrically connected; First and second thermal conductive plates stacked on upper and lower surfaces of the plate to conduct heat by electron movement of the thermoelectric element; A silicon layer sealing an outer space edge between the first and second thermal conductive plates to protect the thermoelectric element from the outside; First and second antioxidant films formed on outer surfaces of the first and second thermal conductive plates, respectively; And a first and second heat dissipation plate mounted on the first and second anti-oxidation films.

본 발명에 있어서, 상기 플레이트는 절연성의 수지로 이루어진 것이 바람직 하다. In the present invention, the plate is preferably made of an insulating resin.

본 발명에 있어서, 상기 절연성 수지는 인쇄회로기판인 것이 바람직하다. In the present invention, the insulating resin is preferably a printed circuit board.

본 발명에 있어서, 상기 플레이트에 형성된 개구부의 높이는 열전소자의 두께와 같은 것이 바람직하다. In the present invention, the height of the opening formed in the plate is preferably equal to the thickness of the thermoelectric element.

이하, 첨부된 도면을 참조하면서 본 발명의 바람직한 실시예에 대하여 보다 상세히 설명하기로 한다.Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

도 3은 본 발명의 바람직한 실시예에 따른 반도체 제조장비의 열교환용 냉각장치를 나타낸 절개사시도이며, 도 4는 본 발명의 바람직한 실시예에 따른 열교환용 냉각장치의 열교환판을 나타낸 분해 사시도이며, 도 5는 도 4에 도시된 열교환판의 부분 단면도이다.3 is a cutaway perspective view showing a heat exchange cooling apparatus of a semiconductor manufacturing apparatus according to a preferred embodiment of the present invention, Figure 4 is an exploded perspective view showing a heat exchange plate of the heat exchange cooling apparatus according to a preferred embodiment of the present invention, 5 is a partial cross-sectional view of the heat exchanger plate shown in FIG. 4.

도 3 내지 도 5에 도시된 바와 같이, 본 발명의 바람직한 실시예에 따른 열교환용 냉각장치(200)는 제1,2 열교환판(240,250)이 동일한 구조를 가진다.As shown in FIGS. 3 to 5, in the heat exchange cooling apparatus 200 according to the preferred embodiment of the present invention, the first and second heat exchange plates 240 and 250 have the same structure.

상기 제1 열교환판(240)은 다수개의 열전소자(Feltier;242)가 전기적으로 연결되는 회로 배선층(241a)이 형성됨과 동시에 상기 열전소자(242)가 실장 되도록 개구부(241b)의 형상을 가진 실장면이 형성되어 열전소자(242)를 충격으로부터 보호함과 동시에 제1,2 열전도판(244,245)과 기밀하게 면결합되어 외부로부터 유입되는 습기를 차단시키는 인쇄회로기판(241); 상기 인쇄회로기판(241)의 상하면에 적층되어 열을 전도하는 제1, 2열전도판(244,245); 상기 다수개의 열전소자(242)를 외부와 차단시키기 위하여 상기 제1, 2 열전도판(244,245)사이의 외부공간 테두리를 밀봉하는 실리콘층(243); 상기 제1, 2열전도판(244,245) 위에 적층되어 산화를 방지하는 제1, 2산화방지막(246,247); 및 상기 제1, 2산화방지막(246,247) 위에 장착된 제1, 2방열판(248,249)으로 구성되어 있는데, 상기 인쇄회로기판(241)에 형성된 실장면(241b)은 열전소자(242)가 완전히 삽입되도록 개구부(241b)의 높이를 설정하는 것이 바람직하다. 그 이유는 인쇄회로기판(241)과 제1, 2열전도판(244,245)이 면접촉을하여 외부로부터 공급되는 충격에 의해서 열전소자(242)가 파괴되는 것을 방지하고, 또한, 상기 인쇄회로기판(241)의 측면부와 제1, 2열전도판(244,245)의 상하면에 의해 형성된 격벽에 의해서 실리콘층(243)을 통과한 습기를 차단하여 열전소자(242)가 전기적으로 쇼트되어 파괴되는 것을 방지한다. The first heat exchange plate 240 has a seal having a shape of an opening 241b such that a circuit wiring layer 241a through which a plurality of thermoelectric elements 242 are electrically connected is formed and the thermoelectric element 242 is mounted. A printed circuit board 241 that protects the thermoelectric element 242 from an impact and at the same time is hermetically bonded to the first and second thermal conductive plates 244 and 245 to block moisture introduced from the outside; First and second thermal conductive plates 244 and 245 stacked on upper and lower surfaces of the printed circuit board 241 to conduct heat; A silicon layer 243 sealing an outer space edge between the first and second thermal conductive plates 244 and 245 to block the plurality of thermoelectric elements 242 from the outside; First and second anti-oxidation films 246 and 247 stacked on the first and second heat conductive plates 244 and 245 to prevent oxidation; And first and second heat dissipation plates 248 and 249 mounted on the first and second anti-oxidation films 246 and 247. The mounting surface 241 b formed on the printed circuit board 241 is completely inserted into the thermoelectric element 242. It is preferable to set the height of the opening portion 241b as much as possible. The reason is that the printed circuit board 241 and the first and second thermal conductive plates 244 and 245 are in surface contact to prevent the thermoelectric element 242 from being destroyed by an impact supplied from the outside, and the printed circuit board ( Moisture passing through the silicon layer 243 is blocked by barrier ribs formed by the side portions of the 241 and the upper and lower surfaces of the first and second thermal conductive plates 244 and 245 to prevent the thermal element 242 from being electrically shorted and destroyed.

한편, 상기 인쇄회로기판(241)은 다수개의 열전소자(242)를 보호하고 안착시키기 위한 예시적 기판으로서 절연성의 합성수지로 이용되어도 좋다.The printed circuit board 241 may be used as an insulating synthetic resin as an exemplary substrate for protecting and seating a plurality of thermoelectric elements 242.

상기한 바와 같은 실시예를 가진 반도체 제조장비의 열교환용 냉각장치를 상세히 기술하면 다음과 같다. Referring to the cooling device for heat exchange of the semiconductor manufacturing equipment having an embodiment as described above in detail as follows.

본 발명의 바람직한 실시예에 대한 열교환용 냉각장치(200)는, 반도체 제조 장비인 열원과 결합되어 유체가 유입구(210a)로 유입되고 배출구로 배출되어 순환되는 제1 열교환탱크(210)의 양면에 제1, 2 열교환판(240,250)의 열교환면을 각각 결합한 후 상기 제1, 2열교환판(240,250)의 방열면에 열교환용 유체가 순환되는 유입구(220a,230a)와 배출구(220b, 230b;도면에 생략됨)가 각각 형성된 제2, 3 열교환탱크(220,230)를 결합하고, 상기 제1, 2열교환판(240,250)과 각각 결합되는 제 1, 2, 3열교환탱크(210,220,230)의 경계 외주면를 기밀하게 밀봉하여 구성된다.Cooling apparatus 200 for heat exchange according to a preferred embodiment of the present invention, coupled to the heat source is a semiconductor manufacturing equipment, the fluid is introduced into the inlet (210a) and discharged to the discharge port on both sides of the first heat exchange tank (210) After combining the heat exchange surfaces of the first and second heat exchange plates 240 and 250, respectively, the inlet ports 220a and 230a and the outlet ports 220b and 230b through which heat exchange fluid is circulated on the heat dissipating surfaces of the first and second heat exchange plates 240 and 250; And the second and third heat exchange tanks 220 and 230 formed thereon, respectively, and the boundary outer circumferential surfaces of the first, second and third heat exchange tanks 210, 220 and 230 coupled to the first and second heat exchange plates 240 and 250, respectively, are hermetically sealed. It is constructed by sealing.

상기와 같이 구성된 냉각장치(200)를 이용하여 상기 제1 열교환탱크(210)로 순환되는 유체의 온도를 일정치 이하로 유지시키기 위하여 제1, 2열교환판(240,250)의 인쇄회로기판(241)에 실장되어 있는 다수개의 열전소자(242)에 전원을 공급하면, 상기 열전소자(242)의 전자 이동 방향을 따라 열의 이동이 이루어진다. 따라서, 열은 상기 제1 열교환탱크(210)로부터 제2,3열교환탱크(220,230)로 전달된다. Printed circuit board 241 of the first and second heat exchange plates 240 and 250 to maintain the temperature of the fluid circulated to the first heat exchange tank 210 below a predetermined value by using the cooling device 200 configured as described above. When power is supplied to a plurality of thermoelectric elements 242 mounted on the substrate, heat is moved along the electron moving direction of the thermoelectric elements 242. Therefore, heat is transferred from the first heat exchange tank 210 to the second and third heat exchange tanks 220 and 230.

상기 제1 열교환탱크(210)는 열전소자(242)의 열교환에 의하여 항시 유체의 온도를 일정한 값으로 제어할 수 있다. 또한, 상기 제1 열교환탱크(210)에서 제1, 2열교환판(240,250)으로 전달된 열은 상기 제2, 3열교환탱크(220,230)를 순환하는 유체와 열교환되어 외부로 방출되므로 반도체 제조 장비의 온도를 항시 일정치 이하로 유지할 수 있다.The first heat exchange tank 210 may always control the temperature of the fluid to a constant value by heat exchange of the thermoelectric element 242. In addition, since the heat transferred from the first heat exchange tank 210 to the first and second heat exchange plates 240 and 250 is exchanged with the fluid circulating through the second and third heat exchange tanks 220 and 230, the heat is discharged to the outside of the semiconductor manufacturing equipment. The temperature can be kept below a certain value at all times.

전술한 바와 같이, 본 발명의 바람직한 실시예에 대하여 설명하였으나, 청구범위에서 설명하는 바와 같이 다양한 치환, 변경 및 부가가 가능하다는 것은 당해 기술 분야에서 통상의 지식을 가진 자에게 자명하다 할 것이다. As described above, although preferred embodiments of the present invention have been described, it will be apparent to those skilled in the art that various substitutions, changes, and additions are possible as described in the claims.

따라서, 본 발명에 의하면, 반도체 제조 장비의 열교환용 냉각장치의 열전소자를 수분으로부터 보호함으로써, 상기 냉각장치의 수명을 연장시킬 수 있다.Therefore, according to the present invention, the lifetime of the cooling device can be extended by protecting the thermoelectric element of the heat exchange cooling device of the semiconductor manufacturing equipment from moisture.

또는, 규칙적으로 배열된 개구부를 가진 인쇄회로기판을 이용하여 열전소자를 안착시킴으로써, 제조작업의 능률을 향상시킬 수 있다.
Alternatively, the efficiency of the manufacturing operation can be improved by mounting the thermoelectric element using a printed circuit board having regularly arranged openings.

Claims (4)

제1 열교환탱크를 통과하는 유체 온도를 열전소자들(Feltier)에 의해 일정온도로 유지하는 열교환판; 상기 열교환판의 일면에 결합되어 열을 외부로 방출하는 제2 열교환탱크를 구비한 반도체 제조 장비의 열교환용 냉각 장치에 있어서, 상기 열교환판은A heat exchange plate which maintains a fluid temperature passing through the first heat exchange tank at a constant temperature by thermoelectrics (Feltier); In the cooling device for heat exchange of the semiconductor manufacturing equipment having a second heat exchange tank coupled to one surface of the heat exchange plate for dissipating heat to the outside, the heat exchange plate 상기 열전소자들이 안착될 수 있는 개구부를 가지며, 상기 열전소자들이 전기적으로 연결되는 회로 배선층이 형성된 플레이트; A plate having an opening in which the thermoelectric elements are seated and a circuit wiring layer to which the thermoelectric elements are electrically connected; 상기 플레이트의 상하면에 적층되어 상기 열전소자의 전자 이동에 의한 열을 전도하는 제1, 2열전도판; First and second thermal conductive plates stacked on upper and lower surfaces of the plate to conduct heat by electron movement of the thermoelectric element; 상기 열전소자를 외부로부터 보호하기 위하여 상기 제1, 2열전도판 사이의 외부공간 테두리를 밀봉하는 실리콘층; A silicon layer sealing an outer space edge between the first and second thermal conductive plates to protect the thermoelectric element from the outside; 상기 제1, 2열전도판의 외측면에 각각 형성된 제1, 2산화방지막; 및 First and second antioxidant films formed on outer surfaces of the first and second thermal conductive plates, respectively; And 상기 제1, 2산화방지막 위에 장착된 제1, 2방열판으로 구성된 것을 특징으로 하는 반도체 제조장비의 열교환용 냉각장치.Cooling device for heat exchange of the semiconductor manufacturing equipment, characterized in that consisting of the first, second heat sink mounted on the first and second antioxidant film. 제1 항에 있어서, 상기 플레이트는 절연성의 수지로 이루어진 것을 특징으로 하는 반도체 제조장비의 열교환용 냉각장치.The apparatus of claim 1, wherein the plate is made of an insulating resin. 제2 항에 있어서, 상기 절연성 수지는 인쇄회로기판인 것을 특징으로 하는 열교환용 냉각장치.The cooling device for heat exchange according to claim 2, wherein the insulating resin is a printed circuit board. 제1 항에 있어서, 상기 플레이트에 형성된 개구부의 높이는 열전소자의 두께와 같은 것을 특징으로 하는 반도체 제조장비의 열교환용 냉각장치. The apparatus of claim 1, wherein a height of the opening formed in the plate is equal to a thickness of a thermoelectric element.
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KR20220054081A (en) 2020-10-23 2022-05-02 주식회사 글로벌스탠다드테크놀로지 Moisture condensation preventing apparatus of temperature control module

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KR100756535B1 (en) * 2006-05-26 2007-09-10 김성완 Heat radiator structure using pcb manufacturing method and thermoelectric semiconductor structure united by heat radiator thereof
KR101373236B1 (en) * 2008-02-19 2014-03-11 한라비스테온공조 주식회사 A Heat Exchanger using Thermoelectric Modules
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KR20180125219A (en) 2017-05-15 2018-11-23 주식회사 글로벌스탠다드테크놀로지 Condensation protecting system for temperature control module
KR20220054081A (en) 2020-10-23 2022-05-02 주식회사 글로벌스탠다드테크놀로지 Moisture condensation preventing apparatus of temperature control module

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