KR100529298B1 - Dc 바이어스를 이용한 리모트 플라즈마 원자층 증착 장치 - Google Patents
Dc 바이어스를 이용한 리모트 플라즈마 원자층 증착 장치 Download PDFInfo
- Publication number
- KR100529298B1 KR100529298B1 KR10-2003-0017385A KR20030017385A KR100529298B1 KR 100529298 B1 KR100529298 B1 KR 100529298B1 KR 20030017385 A KR20030017385 A KR 20030017385A KR 100529298 B1 KR100529298 B1 KR 100529298B1
- Authority
- KR
- South Korea
- Prior art keywords
- remote plasma
- reaction chamber
- bias
- source gas
- shower head
- Prior art date
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45544—Atomic layer deposition [ALD] characterized by the apparatus
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45527—Atomic layer deposition [ALD] characterized by the ALD cycle, e.g. different flows or temperatures during half-reactions, unusual pulsing sequence, use of precursor mixtures or auxiliary reactants or activations
- C23C16/45536—Use of plasma, radiation or electromagnetic fields
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
- C23C16/45565—Shower nozzles
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Plasma & Fusion (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
Description
Claims (5)
- 내부 공간을 갖는 반응실;상기 반응실의 내부 공간의 일측에 배치되고 박막 형성을 위한 기판이 안치되는 기판 지지대;상기 반응실의 외측에 설치되어 상기 반응실 내부 공간으로 리모트 플라즈마를 공급하기 위한 리모트 플라즈마 발생부;상기 리모트 플라즈마 발생부에서 발생하는 플라즈마의 이온과 전자의 에너지를 조절할 수 있는 DC 바이어스부; 및상기 반응실 내부로 박막 형성을 위한 소오스 가스를 공급하는 소오스 가스 공급부를 포함하는 것을 특징으로 하는 DC 바이어스를 이용한 리모트 플라즈마 원자층 증착 장치.
- 제1항에 있어서, 상기 소오스 가스를 상기 반응실의 내부 공간으로 유입시키기 위한 캐리어 가스를 공급하는 캐리어 가스 공급부를 더 포함하고, 상기 리모트 플라즈마 발생부는 캐리어 가스 공급부와 연통된 것을 특징으로 하는 DC 바이어스를 이용한 리모트 플라즈마 원자층 증착 장치.
- 제2항에 있어서, 상기 DC 바이어스부는 상기 캐리어 가스 공급부에 설치된 것을 특징으로 하는 DC 바이어스를 이용한 리모트 플라즈마 원자층 증착 장치.
- 제2항에 있어서, 상기 소오스 가스 공급부는 샤워헤드를 포함하고, 상기 샤워헤드는 상기 캐리어 가스 공급부와 연결되어 있어, 상기 리모트 플라즈마가 상기 기판 측에 샤워 헤드 타입으로 제공되는 것을 특징으로 하는 DC 바이어스를 이용한 리모트 플라즈마 원자층 증착 장치.
- 제4항에 있어서, 상기 샤워헤드는 상기 소오스 가스를 상기 반응실 내부로 분사하기 위한 분사홀과, 상기 분사홀과 별개로 상기 리모트 플라즈마를 공급하기 위한 관통홀을 구비하여, 상기 소오스 가스가 상기 리모트 플라즈마와 분리된 경로로 상기 기판 측에 샤워 헤드 타입으로 제공되는 것을 특징으로 하는 DC 바이어스를 이용한 리모트 플라즈마 원자층 증착 장치.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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KR10-2003-0017385A KR100529298B1 (ko) | 2003-03-20 | 2003-03-20 | Dc 바이어스를 이용한 리모트 플라즈마 원자층 증착 장치 |
Applications Claiming Priority (1)
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KR10-2003-0017385A KR100529298B1 (ko) | 2003-03-20 | 2003-03-20 | Dc 바이어스를 이용한 리모트 플라즈마 원자층 증착 장치 |
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KR20040082738A KR20040082738A (ko) | 2004-09-30 |
KR100529298B1 true KR100529298B1 (ko) | 2005-11-17 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20210384040A1 (en) * | 2018-09-17 | 2021-12-09 | Applied Materials, Inc. | Methods for depositing dielectric material |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006014034A1 (en) * | 2004-08-04 | 2006-02-09 | Industry-University Cooperation Foundation Hanyang University | Remote plasma atomic layer deposition apparatus and method using dc bias |
KR100936995B1 (ko) * | 2007-12-06 | 2010-01-15 | 한양대학교 산학협력단 | 박막 형성방법 |
KR102074346B1 (ko) * | 2017-09-19 | 2020-02-06 | 서울과학기술대학교 산학협력단 | 리모트 플라즈마를 이용한 원자층 증착 시스템 |
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2003
- 2003-03-20 KR KR10-2003-0017385A patent/KR100529298B1/ko active IP Right Grant
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20210384040A1 (en) * | 2018-09-17 | 2021-12-09 | Applied Materials, Inc. | Methods for depositing dielectric material |
US11631591B2 (en) * | 2018-09-17 | 2023-04-18 | Applied Materials, Inc. | Methods for depositing dielectric material |
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KR20040082738A (ko) | 2004-09-30 |
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