KR100526001B1 - LCD module - Google Patents

LCD module Download PDF

Info

Publication number
KR100526001B1
KR100526001B1 KR1019980031329A KR19980031329A KR100526001B1 KR 100526001 B1 KR100526001 B1 KR 100526001B1 KR 1019980031329 A KR1019980031329 A KR 1019980031329A KR 19980031329 A KR19980031329 A KR 19980031329A KR 100526001 B1 KR100526001 B1 KR 100526001B1
Authority
KR
South Korea
Prior art keywords
bonding
groove
drive
lcd module
lcd
Prior art date
Application number
KR1019980031329A
Other languages
Korean (ko)
Other versions
KR20000010429A (en
Inventor
이세원
유승락
Original Assignee
삼성전자주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전자주식회사 filed Critical 삼성전자주식회사
Priority to KR1019980031329A priority Critical patent/KR100526001B1/en
Publication of KR20000010429A publication Critical patent/KR20000010429A/en
Application granted granted Critical
Publication of KR100526001B1 publication Critical patent/KR100526001B1/en

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13458—Terminal pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Landscapes

  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)

Abstract

본 발명은 엘시디 모듈에 관한 것으로, ACF에 의해 상호 부착되는 드라이브 IC의 본딩 리드와 TFT 기판의 본딩 패드 중에서 적어도 어느 하나에 소정 형상을 갖는 홈을 형성하여 접착면적을 증가시킴으로써 접착력 향상에 따른 제품의 신뢰성 향상을 기대할 수 있다.The present invention relates to an LCD module, which forms a groove having a predetermined shape in at least one of a bonding lead of a drive IC and an bonding pad of a TFT substrate, which are attached to each other by an ACF, thereby increasing an adhesive area of the product. Reliability improvement can be expected.

Description

엘시디 모듈LCD module

본 발명은 엘시디 모듈에 관한 것으로, 더욱 상세하게는 본딩 영역에 홈을 형성하여 본딩 영역의 표면적을 증가시킴으로써 접착력을 향상시킬 수 있도록 한 엘시디 모듈에 관한 것이다.The present invention relates to an LCD module, and more particularly to an LCD module that can improve the adhesive force by forming a groove in the bonding area to increase the surface area of the bonding area.

일반적으로, 엘시디(LCD) 패널은 엘시디 모듈 제작시, 박형 구조를 가지면서도 전체 엘시디 모듈 면적에 대한 엘시디 패널의 유효 표시면적 비율을 가능한 확대시켜 주기 위하여, 엘시디 패널의 TFT(thin film transistor) 기판과 반도체 칩(또는 드라이브 IC)을 탭 실장 기술을 적용하여 전기적으로 연결해 주고 있다.In general, LCD panels have a thin structure when manufacturing LCD modules, and have a thin film transistor (TFT) substrate of LCD panels in order to increase the effective display area ratio of the LCD panel to the total LCD module area as much as possible. Semiconductor chips (or drive ICs) are electrically connected using tap mounting technology.

탭 실장 기술은 크게 엘시디 패널에 드라이브 IC를 접속하는 공정과 드라이브 IC를 인쇄회로기판에 접속하는 공정으로 나뉘어지며, 이때 가장 일반적으로 사용되는 접속 방식으로는 이방성 도전 필름(ACF:anisotropic conductive film)를 이용한 본딩 방식과 납을 이용한 솔더링(soldering) 방식 두가지를 들 수 있다.Tap mounting technology is largely divided into the process of connecting the drive IC to the LCD panel and the process of connecting the drive IC to the printed circuit board, the most commonly used connection method is an anisotropic conductive film (ACF) There are two types of bonding method and a soldering method using lead.

이중, 대량 생산에 적용가능하여 널리 쓰이고 있는 ACF 본딩 방식은 엘시디 패널에 ACF를 가압착한 후에 드라이브 IC를 얼라인하고, 히터 툴(heater tool)을 구성하는 폭이 넓은 헤드(head)로 다시 열 압착하여 엘시디 패널과 드라이브 IC를 본딩한다.Among these, ACF bonding method, which is widely used for mass production, aligns the drive IC after pressing ACF to the LCD panel, and thermally compresses it back to the wide head which constitutes a heater tool. Bond the LCD panel with the drive IC.

하지만, 이러한 ACF 본딩 방식으로 인해 여러 가지의 문제점이 발생하였으며, ACF 본딩의 접착력이 기존의 솔더링 보다 낮아 엘시디 패널을 핸들링할 경우, 본딩 영역에서 리드 오픈이 발생하는 문제점이 있었다.However, various problems have arisen due to the ACF bonding method, and when the LCD panel is handled lower than the conventional soldering, there is a problem in that lead open occurs in the bonding area.

이러한 문제점을 해결하기 위해서 일정한 기준치의 접착력을 유지할 수 있도록 하기 위해 본딩 리드의 폭을 증가시켰지만, 이러한 본딩 리드의 폭 증가는 엘시디 패널의 외곽 크기의 증가를 가져왔다.In order to solve this problem, the width of the bonding lead is increased in order to maintain the adhesion of a predetermined reference value, but the increase in the width of the bonding lead has resulted in an increase in the outer size of the LCD panel.

따라서, 본 발명의 목적은 ACF 본딩의 접착력를 강화할 수 있도록 하는데 있다.Accordingly, it is an object of the present invention to enhance the adhesion of ACF bonding.

본 발명의 다른 목적은 다음의 상세한 설명 및 첨부된 도면으로부터 보다 명확해질 것이다.Other objects of the present invention will become more apparent from the following detailed description and the accompanying drawings.

이와 같은 목적을 달성하기 위해서 본 발명은 TFT 기판의 본딩 패드와 드라이브 IC의 본딩 리드 가운데 적어도 어느 하나에 소정 형상을 갖는 홈을 형성하여 접착면적을 증가시킴으로써 접착력을 향상시킬 수 있도록 한다.In order to achieve the above object, the present invention can improve the adhesive force by forming a groove having a predetermined shape in at least one of the bonding pad of the TFT substrate and the bonding lead of the drive IC.

이때, 홈은 반구형상 또는 단면이 'V' 형상으로 형성될 수 있다.In this case, the groove may be formed in a hemispherical shape or cross section 'V' shape.

이하 첨부된 도면을 참조하여 본 발명의 기술에 따른 실시예에 의한 엘시디 모듈을 살펴보면 다음과 같다.Hereinafter, an LCD module according to an embodiment of the present disclosure will be described with reference to the accompanying drawings.

도 1에 도시된 바와 같이, TFT 기판(10)상에 C/F 기판(12)이 탑재되어 이루어진 엘시디 패널(14)이 위치해 있고, TFT 기판(10)의 일측에 인쇄회로기판(16)이 근접하여 위치하며, TFT 기판(10)과 인쇄회로기판(16)에 드라이브 IC(18)가 위치하여 TFT 기판(10)과 인쇄회로기판(16)을 전기적으로 연결한다.As shown in FIG. 1, an LCD panel 14 including a C / F substrate 12 is mounted on a TFT substrate 10, and a printed circuit board 16 is disposed on one side of the TFT substrate 10. The drive IC 18 is positioned on the TFT substrate 10 and the printed circuit board 16 to electrically connect the TFT substrate 10 and the printed circuit board 16.

여기서, 인쇄회로기판과 TFT 기판의 결합 상태를 도 2를 참조하여 살펴보면 다음과 같다.Here, the coupling state of the printed circuit board and the TFT substrate will be described with reference to FIG. 2.

TFT 기판(10)의 상부면에 본딩 패드(20)가 형성되고, 본딩 패드(20)에 대응하여 상부에는 드라이브 IC(18)의 베이스 필름(22)에 형성된 본딩 리드(24)가 위치하며, 본딩 패드(20)와 본딩 리드(24) 사이에 ACF(26)가 위치하여 본딩 패드(20)와 본딩 리드(24)를 상호 접착한다.Bonding pads 20 are formed on the upper surface of the TFT substrate 10, bonding leads 24 formed on the base film 22 of the drive IC 18 are positioned on the upper side corresponding to the bonding pads 20. An ACF 26 is positioned between the bonding pad 20 and the bonding lead 24 to bond the bonding pad 20 and the bonding lead 24 to each other.

ACF(26)는 일반적으로 접착레진(28)내에 도전성 볼들(30)이 첨가되어 이루어진다.The ACF 26 is generally made by adding conductive balls 30 to the adhesive resin 28.

본딩 리드(24)의 접착면에는 단면형상이 'V' 형상으로 이루어진 홈들(32)이 연속적으로 복수개 형성된다.On the bonding surface of the bonding lead 24, a plurality of grooves 32 having a cross-sectional shape of 'V' shape are continuously formed.

이때, 홈(32)은 반도체 제조 공정 가운데 하나인 리소그래피 공정을 통해 형성될 수 있으며, 솔 모양의 도구로 본딩 리드(24) 또는 본딩 패드(20)의 표면을 쓸어서 홈(32)을 형성할 수도 있다.In this case, the groove 32 may be formed through a lithography process, which is one of semiconductor manufacturing processes, and the groove 32 may be formed by sweeping the surface of the bonding lead 24 or the bonding pad 20 with a brush-shaped tool. have.

이렇게 본딩 리드(24)의 접착면에 홈(32)이 형성되어 ACF(26)에 대한 본딩 리드(24)의 접착면적이 증가됨으로써 접착력 향상을 기대할 수 있으며, 접착력 향상에 따라 제품의 신뢰성이 향상된다.Thus, the groove 32 is formed on the bonding surface of the bonding lead 24, so that the bonding area of the bonding lead 24 to the ACF 26 can be increased, and thus the adhesion strength can be expected to be improved. do.

또한, 도 3에 도시된 바와 같이, 드라이브 IC(34)의 베이스 필름(38)에 형성된 본딩 리드(36)의 접착면과 TFT 기판(40)의 본딩 패드(42)의 접착면에 각각 단면 형상이 'V' 형상으로 이루어진 홈들(44)이 연속적으로 복수개 형성된다.In addition, as shown in FIG. 3, the cross-sectional shape is respectively formed on the bonding surface of the bonding lead 36 formed on the base film 38 of the drive IC 34 and the bonding surface of the bonding pad 42 of the TFT substrate 40. A plurality of grooves 44 having the 'V' shape are formed in succession.

이렇게 드라이브 IC(34)의 베이스 필름(38)에 형성된 본딩 리드(36)와 TFT 기판(40)의 본딩 패드(42)에 각각 홈들(44)을 형성함으로써 상기에서 언급한 실시예보다 접착면적이 증가하여 보다 나은 접착력의 향상을 기대할 수 있다.Thus, the grooves 44 are formed in the bonding leads 36 formed on the base film 38 of the drive IC 34 and the bonding pads 42 of the TFT substrate 40, respectively, so that the adhesion area is larger than the above-mentioned embodiment. Increasingly, better adhesion can be expected.

또한, 도 4에 도시된 바와 같이, TFT 기판(46)의 본딩 패드(48)의 접착면에 반구형상의 홈들(50)이 복수개 형성된다.In addition, as shown in FIG. 4, a plurality of hemispherical grooves 50 are formed on the adhesive surface of the bonding pad 48 of the TFT substrate 46.

이때, 홈(50)의 직경은 ACF(52)의 도전성 볼들(54)의 직경과 동일하게 이루어지며, 홈(50)의 깊이는 압축되는 길이까지 고려하여 도전성 볼들(54)의 평균지름의 1/3 깊이로 이루어진다.At this time, the diameter of the groove 50 is made the same as the diameter of the conductive balls 54 of the ACF 52, the depth of the groove 50 in consideration of the length to be compressed 1 of the average diameter of the conductive balls 54 / 3 depth.

이렇게 TFT 기판(46)의 본딩 패드(48)에 반구형상의 홈들(50)을 형성함으로써 접착면적이 넓어져 종래보다 나은 접착력의 향상을 기대할 수 있다.By forming the hemispherical grooves 50 in the bonding pads 48 of the TFT substrate 46 as described above, the adhesion area is widened, and thus the improvement of the adhesion strength can be expected.

한편, 반구형상의 홈을 본딩 패드 뿐만 아니라 드라이브 IC의 베이스 필름에 형성된 본딩 리드에도 형성함으로써 접착력을 더 높일 수 있다.On the other hand, by forming the hemispherical groove not only in the bonding pad but also in the bonding lead formed in the base film of the drive IC, the adhesive force can be further increased.

이상에서 살펴본 바와 같이 본 발명은 ACF에 의해 상호 부착되는 드라이브 IC의 베이스 필름에 형성된 본딩 리드와 TFT 기판의 본딩 패드 중에서 적어도 어느 하나에 소정 형상을 갖는 홈을 형성하여 접착면적을 증가시킴으로써 접착력 향상되어 제품의 신뢰성이 향상되는 효과가 있다.As described above, the present invention provides improved adhesion by forming a groove having a predetermined shape in at least one of a bonding lead formed in a base film of a drive IC attached to each other by an ACF and a bonding pad of a TFT substrate. The reliability of the product is improved.

도 1은 본 발명의 기술에 따른 실시예에 의한 엘시디 패널을 나타낸 사시도.1 is a perspective view showing an LCD panel according to an embodiment of the present invention.

도 2는 도 1의 Ⅱ-Ⅱ를 나타낸 단면도.FIG. 2 is a cross-sectional view illustrating II-II of FIG. 1. FIG.

도 3은 도 1의 Ⅱ-Ⅱ의 다른 변형예를 나타낸 단면도.3 is a cross-sectional view showing another modification of II-II in FIG. 1;

도 4는 도 1의 Ⅱ-Ⅱ의 또 다른 변형예를 나타낸 단면도.4 is a cross-sectional view showing still another modification of II-II in FIG. 1;

Claims (3)

엘시디 패널;LCD panel; 상기 엘시디 패널의 일측에 위치하는 인쇄회로기판;A printed circuit board located at one side of the LCD panel; 상기 엘시디 패널과 상기 인쇄회로기판을 전기적으로 연결하는 드라이브 IC의 베이스 필름을 포함하며,It includes a base film of the drive IC for electrically connecting the LCD panel and the printed circuit board, 이방성 도전 필름(ACF)에 의해 상호 접착되는 상기 베이스 필름의 본딩 리드들과 상기 엘시디 패널의 본딩 패드들의 적어도 어느 하나에 소정 형상을 갖는 홈들이 형성되는 것을 특징으로 하는 엘시디 모듈.An LCD module, wherein grooves having a predetermined shape are formed in at least one of the bonding leads of the base film and the bonding pads of the LCD panel bonded to each other by an anisotropic conductive film (ACF). 제 1 항에 있어서, 상기 홈은 반구 형상인 것을 특징으로 하는 엘시디 모듈.The LCD module of claim 1, wherein the groove has a hemispherical shape. 제 1 항에 있어서, 상기 홈은 단면형상이 'V' 형상인 것을 특징으로 하는 엘시디 모듈.The LCD module of claim 1, wherein the groove has a 'V' shape in cross section.
KR1019980031329A 1998-07-31 1998-07-31 LCD module KR100526001B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019980031329A KR100526001B1 (en) 1998-07-31 1998-07-31 LCD module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019980031329A KR100526001B1 (en) 1998-07-31 1998-07-31 LCD module

Publications (2)

Publication Number Publication Date
KR20000010429A KR20000010429A (en) 2000-02-15
KR100526001B1 true KR100526001B1 (en) 2006-02-08

Family

ID=19546109

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019980031329A KR100526001B1 (en) 1998-07-31 1998-07-31 LCD module

Country Status (1)

Country Link
KR (1) KR100526001B1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100742376B1 (en) * 2005-09-30 2007-07-24 삼성에스디아이 주식회사 Pad area and Method for fabricating the same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR920014377A (en) * 1990-12-21 1992-07-30 이헌조 IC mounting method for driving LCD panel
KR950012121A (en) * 1993-10-29 1995-05-16 이헌조 Driving IC Bonding Structure of LCD
KR970058434A (en) * 1995-12-29 1997-07-31 김광호 Bonding pad of printed circuit board (PCB) in LCD display device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR920014377A (en) * 1990-12-21 1992-07-30 이헌조 IC mounting method for driving LCD panel
KR950012121A (en) * 1993-10-29 1995-05-16 이헌조 Driving IC Bonding Structure of LCD
KR970058434A (en) * 1995-12-29 1997-07-31 김광호 Bonding pad of printed circuit board (PCB) in LCD display device

Also Published As

Publication number Publication date
KR20000010429A (en) 2000-02-15

Similar Documents

Publication Publication Date Title
KR100323052B1 (en) Liquid crystal display device having an ic chip mounted on a narrow film wiring board
US5367435A (en) Electronic package structure and method of making same
US7208835B2 (en) Integrated circuit package and assembly thereof
US5959356A (en) Solder ball grid array carrier package with heat sink
US5329423A (en) Compressive bump-and-socket interconnection scheme for integrated circuits
US4581680A (en) Chip carrier mounting arrangement
KR100699823B1 (en) Low cost type flexible film package module and method for fabricating thereof
EP1427016A3 (en) Semiconductor device and circuit board mounted with the same
WO2003017324A8 (en) Structure and method for fabrication of a leadless chip carrier with embedded inductor
KR970066683A (en) Liquid crystal device, manufacturing method and electronic device of liquid crystal device
EP0880175A2 (en) Thin power tape ball grid array package
US5731636A (en) Semiconductor bonding package
US6519020B1 (en) Liquid crystal display module, using a flexible printed circuit board with enhanced thermocompression characteristics
EP0878840A4 (en) Connecting structure of semiconductor element, liquid crystal display device using the structure, and electronic equipment using the display device
JP2004507115A (en) High reliability interposer for low cost and high reliability applications
US6802930B2 (en) Method of making a laminated structure
JP2753696B2 (en) Automatic bonding structure of semiconductor package tape
KR100526001B1 (en) LCD module
CN100416343C (en) Structure for increasing reliability of metal connecting line
JPH10308413A (en) Electronic component and electronic component mount module
JPH05173166A (en) Liquid crystal display device
US6608387B2 (en) Semiconductor device formed by mounting semiconductor chip on support substrate, and the support substrate
JPH0612614Y2 (en) Circuit board unit
WO1998048449A3 (en) Flip chip and chip scale package
KR100568508B1 (en) LCD Display

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20111017

Year of fee payment: 7

LAPS Lapse due to unpaid annual fee