KR100525228B1 - Fabricating method of printed circuit board equipping optical waveguide - Google Patents

Abstract

According to the present invention, in the process of manufacturing a printed circuit board into which a plurality of optical waveguides are inserted, printing using an optical waveguide for preventing occurrence of positional deviation between each layer of the printed circuit board and the optical waveguide or the optical waveguides using a fixing part. The present invention relates to a circuit board manufacturing method.

In the method of manufacturing a printed circuit board having an optical waveguide according to the present invention, an optical waveguide, a method of processing a reference hole in a substrate and a prepreg, respectively, and processing a window in an optical waveguide insertion substrate for inserting and fixing the optical waveguide. Stage 1; The optical waveguide is inserted into the reference hole of the optical waveguide, the substrate and the prepreg, and the optical waveguide is inserted into the optical waveguide insertion substrate, thereby preliminary laying up the substrate for the optical waveguide, the substrate, the prepreg and the optical waveguide insertion. A second step of doing; A third step of performing a compression process using a press on the layers including the optical waveguide, the substrate, the prepreg, and the optical waveguide insertion substrate; And a fourth step of performing a trim process including deburring and desmear to remove the fixing part and to remove various contaminants and foreign substances generated in the fixing part removing part. Characterized in that.

Description

Fabrication method of printed circuit board equipping optical waveguide

The present invention relates to a method for manufacturing a printed circuit board having an optical waveguide, and more particularly, to each layer of the printed circuit board and the optical waveguide using a fixing part in the process of manufacturing a printed circuit board into which a plurality of optical waveguides are inserted. Another aspect of the present invention relates to a method of manufacturing a printed circuit board having an optical waveguide for preventing occurrence of positional deviation between optical waveguides.

In general, a printed circuit board (PCB) is mounted on a plate made of phenol resin or epoxy resin by dense and mounting many parts, and a circuit connecting each part is fixed by pressing the surface of the resin plate. It means a circuit board.

The printed circuit board is formed by attaching a thin plate of copper or the like to one surface of a phenolic resin insulating plate or an epoxy resin insulating plate, and then etching it according to the wiring pattern of the circuit to form a necessary circuit, and mounting holes for mounting parts. It is manufactured by drilling, and classified into single-sided board, double-sided board, and multi-layered board according to the number of wiring circuit surfaces. The more layers, the more excellent the mounting force of the parts is used for high-precision products.

Conventionally, when manufacturing a printed circuit board, a circuit pattern is formed on a copper plate to form an inner layer and an outer layer of a printed circuit board. However, recently, a polymer and a glass fiber are formed. A printed circuit board having an optical waveguide capable of transmitting and receiving signals with light is manufactured.

A printed circuit board having such an optical waveguide is a mixture of electrical signals and optical signals, so that high-speed data communication within the same substrate may be interfacing to optical signals, and data may be stored and converted between optical signals and electrical signals. It refers to a printed circuit board in which an optical waveguide is inserted in a state where a circuit pattern is formed, and as a large amount of data communication is required, a printed circuit board having a plurality of optical waveguides is required.

1 is a cross-sectional view of a printed circuit board having a conventional optical waveguide.

As shown in FIG. 1, a conventional printed circuit board having an optical waveguide includes a plurality of layers 110 and 120, an optical waveguide 130, or an optical waveguide 130 when the optical waveguide 130 is inserted. Since there is no support that becomes the reference 111, 121, 131 between the optical waveguides 130, a positional deviation occurs between the layers 110 and 120 and the optical waveguides 130 or the optical waveguides 130 during the manufacturing process. There was this.

Due to positional deviations between the layers 110 and 120 and the optical waveguide 130 or the optical waveguide 130 of the printed circuit board, a vertical cavity surface emitting laser (VCSEL) and a photo-diode (PDSEL) mounted in a subsequent process Since it is difficult to align the optical elements such as), optical transmission loss due to positional deviation between photons is large.

SUMMARY OF THE INVENTION The present invention has been made in an effort to provide a method of manufacturing a printed circuit board having an optical waveguide for preventing occurrence of positional deviation between each layer of the printed circuit board and an optical waveguide or optical waveguides.

In order to solve the above technical problem, a method for manufacturing a printed circuit board having an optical waveguide according to the present invention is an optical waveguide including a plurality of optical fibers, each processing a reference hole in the substrate and prepreg, the optical waveguide A first step of processing a window in an optical waveguide insertion substrate for insertion and fixation of the optical waveguide; The optical waveguide is inserted into the reference hole of the optical waveguide, the substrate and the prepreg, and the optical waveguide is inserted into the optical waveguide insertion substrate, thereby preliminary laying up the substrate for the optical waveguide, the substrate, the prepreg and the optical waveguide insertion. a second step of laying up; A third step of performing a compression process using a press on the layers including the optical waveguide, the substrate, the prepreg, and the optical waveguide insertion substrate; And a fourth step of performing a trim process including deburring and desmear to remove the fixing part and to remove various contaminants and foreign substances generated in the fixing part removing part. Characterized in that.

Preferably, the fixing part of the method for manufacturing a printed circuit board having an optical waveguide according to the present invention is at least one of a pin, a rivet, and a pin mounted spring.

The substrate of the method of manufacturing a printed circuit board having an optical waveguide according to the present invention preferably includes copper clad lamination (CCL) and resin coated copper (RCC).

At least one of the substrate, the prepreg, the optical waveguide, and the optical waveguide insertion substrate of the method for manufacturing a printed circuit board having an optical waveguide according to the present invention may detect X-rays for precise processing and precise position alignment. It is preferred that a target image for alignment is formed.

The process of processing the reference hole of the substrate, the prepreg and the optical waveguide of the first step of the method for manufacturing a printed circuit board having the optical waveguide according to the present invention comprises using the drill bit to drill the reference hole. It is preferable to process.

In the process of processing the window of the optical waveguide insertion substrate of the first step of the method of manufacturing a printed circuit board having the optical waveguide according to the present invention, it is preferable to process the window by using a router bit. Do.

In the removing of the fixing part of the fourth step of the method of manufacturing a printed circuit board having the optical waveguide according to the present invention, it is preferable to remove the fixing part by using a router bit.

Hereinafter, a method of manufacturing a printed circuit board having an optical waveguide according to the present invention will be described in detail.

2A to 2F are cross-sectional views of a method of manufacturing a printed circuit board having an optical waveguide using pins according to an embodiment of the present invention.

In the manufacturing method using a pin according to the present invention, a drill bit 210 is applied to a substrate 110, a prepreg 120, and an optical waveguide 130 to a reference 111, 121, and 131, respectively. The reference hole is processed (FIG. 2A). On the other hand, a window is processed using a router bit 220 on the optical waveguide insertion substrate 140 for inserting and fixing the optical waveguide 130 (FIG. 2B).

Here, the substrate 110 and the optical waveguide insertion substrate 140 may include copper clad lamination (CCL), resin coated copper (RCC), or the like.

The prepreg 120 is a sheet-like material that is hardened to a semi-cured state by infiltrating a thermosetting resin into a base material such as glass fiber, and is formed between the substrate 110 and the optical waveguide 130 or the substrates 110. Used for bonding.

The optical waveguide 130 uses a plurality of optical fibers inserted for interfacing with optical signals.

The substrate 110, the prepreg 120, the optical waveguide 130, and the optical waveguide insertion substrate 140 may precisely process the reference hole and the window, and perform precise position alignment between layers stacked in a subsequent process. It is preferable to use the one formed with the target image for alignment that can detect the X-rays.

When the reference hole and the window are processed, the pin 310 is inserted into the reference hole of the substrate 110, the prepreg 120, and the optical waveguide 130, and the optical waveguide is inserted into the optical waveguide insertion substrate 140. 130 is inserted to pre-lay the substrate 110, the prepreg 120, the optical waveguide 130 and the optical waveguide insertion substrate 140 (FIG. 2C).

When the pins 310 are inserted into all the reference holes by preliminary layup, a compression process is performed using the press 400 to form a printed circuit board having an optical fiber (FIG. 2D).

Removing the pin 310 of the printed circuit board having the formed optical fiber by using the router bit 220, and to remove various contamination and foreign substances generated in the pin 310 removal portion of the process of removing the pin 310 In order to perform a trim process such as deburring and desmear (FIG. 2E), a printed circuit board having an optical waveguide according to the present invention is manufactured (FIG. 2F).

3A to 3F are cross-sectional views of a method of manufacturing a printed circuit board having an optical waveguide using rivets according to another embodiment of the present invention.

In the manufacturing method using the rivet according to the present invention, the drill holes 210 are used in the substrate 110, the prepreg 120, and the optical waveguide 130 to process the reference holes in the references 111, 121, and 131, respectively. (FIG. 3A). On the other hand, the window is processed using the router bit 220 on the optical waveguide insertion substrate 140 for inserting and fixing the optical waveguide 130 (FIG. 3B).

Here, the substrate 110 and the optical waveguide insertion substrate 140 may include copper clad lamination (CCL), resin coated copper (RCC), or the like.

The prepreg 120 is a sheet-like material that is hardened to a semi-cured state by infiltrating a thermosetting resin into a base material such as glass fiber, and is formed between the substrate 110 and the optical waveguide 130 or the substrates 110. Used for bonding.

The optical waveguide 130 uses a plurality of optical fibers inserted for interfacing with optical signals.

The substrate 110, the prepreg 120, the optical waveguide 130, and the optical waveguide insertion substrate 140 may precisely process the reference hole and the window, and perform precise position alignment between layers stacked in a subsequent process. It is preferable to use the one formed with the target image for alignment that can detect the X-rays.

When the reference hole and the window are processed, the rivets 321 and 322 are inserted into the reference hole of the substrate 110, the prepreg 120 and the optical waveguide 130, and the optical waveguide is inserted into the substrate 140 for optical waveguide insertion. The waveguide 130 is inserted to preliminarily lay up the substrate 110, the prepreg 120, the optical waveguide 130, and the optical waveguide insertion substrate 140 (FIG. 3C).

When the rivets 321 and 322 are inserted into all the reference holes by preliminary layup, the compression process using the press 400 is performed to form the printed circuit board 110 having the optical fiber (FIG. 3D).

The rivets 321 and 322 of the printed circuit board 110 having the formed optical fiber are removed using the router bits 220 and the rivets 321 and 322 are removed in the process of removing the rivets 321 and 322. Performing a trimming process such as deburring and desmear to remove various contaminants and debris generated (FIG. 3E) produces a printed circuit board having an optical waveguide according to the present invention (FIG. 3F).

The manufacturing method using the rivets 321 and 322 as the fixing part uses a smaller fixing device and a dismantling device than the case of using the pin 310 of FIG. 2, thereby simplifying the manufacturing process.

4A to 4F are cross-sectional views of a method of manufacturing a printed circuit board having an optical waveguide using a pin mounted spring according to another embodiment of the present invention.

The manufacturing method using the spring-loaded pin according to the present invention is based on the reference (111, 121, 131) using the drill bit 210 in the substrate 110, prepreg 120 and optical waveguide 130, respectively The hole is machined (FIG. 4A). On the other hand, the window is processed using the router bit 220 on the optical waveguide insertion substrate 140 for inserting and fixing the waveguide (FIG. 4B).

Here, the substrate 110 and the optical waveguide insertion substrate 140 may include copper clad lamination (CCL), resin coated copper (RCC), or the like.

The prepreg 120 is a sheet-like material that is hardened to a semi-cured state by infiltrating a thermosetting resin into a base material such as glass fiber, and is formed between the substrate 110 and the optical waveguide 130 or the substrates 110. Used for bonding.

The optical waveguide 130 uses a plurality of optical fibers inserted for interfacing with optical signals.

The substrate 110, the prepreg 120, the optical waveguide 130, and the optical waveguide insertion substrate 140 may precisely process the reference hole and the window, and perform precise position alignment between layers stacked in a subsequent process. It is preferable to use the one formed with the target image for alignment that can detect the X-rays.

When the reference hole and the window are processed, a spring-loaded pin 330 is inserted into the reference hole of the substrate 110, the prepreg 120 and the optical waveguide 130, and the optical waveguide insertion substrate 140 is inserted. The optical waveguide 130 is inserted into the substrate, and the substrate 110, the prepreg 120, the optical waveguide 130, and the optical waveguide insertion substrate 140 are preliminarily laid up (FIG. 4C).

When the spring-mounted pins 330 are inserted into all the reference holes by preliminary layup, a compression process using the press 400 is performed to form a printed circuit board 110 having an optical fiber (FIG. 4D). .

Spring-loaded pins 330 in the process of removing the spring-loaded pin 330 of the printed circuit board having the formed optical fiber by using the router bit 220, and removing the spring-loaded pin 330. When a trimming process such as deburring and desmearing is performed to remove various contaminants and debris generated in the removal portion (FIG. 4E), a printed circuit board having an optical waveguide according to the present invention is manufactured (FIG. 4F).

The manufacturing method using the spring-loaded pin 330 can freely adjust the height of the spring-loaded pin 330 in the compression process (Fig. 4d), it is possible to adjust the stacking height of the substrate 110 of various sizes There is an advantage.

Although the present invention has been described above, it is only an embodiment, and it will be apparent to those skilled in the art that various changes and modifications can be made without departing from the technical spirit of the present invention. However, it will be apparent from the following claims that they fall within the scope of the invention.

As described above, the method of manufacturing a printed circuit board having an optical waveguide according to the present invention uses a plurality of optical waveguides using fixing parts such as pins, rivets, and pin mounted springs. Since a support is provided as a reference for the printed circuit board to be inserted, position alignment does not occur between each layer of the printed circuit board and the optical waveguide or the optical waveguides, thereby enabling precise alignment.

In addition, the method of manufacturing a multilayer printed circuit board having an optical waveguide according to the present invention can precisely align the optical waveguides, and thus, optical devices such as a vertical cavity surface emitting laser (VCSEL) and a photo-diode (PD), which will be mounted thereafter. Can be precisely placed, thereby preventing optical transmission loss due to positional deviation among photons.

1 is a cross-sectional view of a printed circuit board having a conventional optical waveguide.

2A to 2F are cross-sectional views of a method of manufacturing a printed circuit board having an optical waveguide using a pin according to an embodiment of the present invention.

3A to 3F are cross-sectional views of a method of manufacturing a printed circuit board having an optical waveguide using a rivet according to another embodiment of the present invention.

4A to 4F are cross-sectional views of a method of manufacturing a printed circuit board having an optical waveguide using a pin mounted spring according to another embodiment of the present invention.

* Description of the symbols for the main parts of the drawings *

110: substrate 111: reference of the substrate

120: prepreg 121: criteria of the prepreg

130: optical waveguide 131: reference of the optical waveguide

132: optical fiber 140: substrate for optical waveguide insertion

210: drill bit 220: router bit

310: pin 321, 322: rivet

330: spring loaded pin 400: press

Claims (7)

An optical waveguide including a plurality of optical fibers, a first step of processing a reference hole in a substrate and a prepreg, and processing a window in an optical waveguide insertion substrate for inserting and fixing the optical waveguide; The optical waveguide is inserted into the reference hole of the optical waveguide, the substrate and the prepreg, and the optical waveguide is inserted into the optical waveguide insertion substrate. a second step of laying up; A third step of performing a compression process using a press on the layers including the optical waveguide, the substrate, the prepreg, and the optical waveguide insertion substrate; And And a fourth step of performing a trim process including deburring and desmear to remove the fixing part and to remove various contaminants and foreign substances generated in the fixing part removing part. A printed circuit board manufacturing method comprising an optical waveguide, characterized in that the. The method of claim 1, The fixing unit is a printed circuit board manufacturing method having an optical waveguide, characterized in that at least one of a pin (rivet), rivet (rivet), a spring (pin mounted spring). The method of claim 1, The substrate is a printed circuit board manufacturing method having an optical waveguide, characterized in that it comprises a copper clad lamination (CCL) and Resin Coated Copper (RCC). The method of claim 1, At least one of the substrate, the prepreg, the optical waveguide, and the optical waveguide insertion substrate is provided with an alignment target image for detecting X-rays for precise processing and precise position alignment. A printed circuit board manufacturing method comprising a waveguide. The method of claim 1, The process of processing the reference hole of the substrate, the prepreg and the optical waveguide of the first step is to manufacture the printed circuit board having an optical waveguide, characterized in that for processing the reference hole using a drill bit (drill bit). Way. The method of claim 1, The process of processing the window of the optical waveguide insertion substrate of the first step is to process the window using a router bit (router bit) characterized in that the printed circuit board manufacturing method having an optical waveguide. The method of claim 1, The removing of the fixing part of the fourth step includes removing the fixing part by using a router bit.