KR100524593B1 - Organic EL vacuum depositon apparatus using thermal heating source - Google Patents

Abstract

The present invention relates to a vacuum deposition apparatus for an organic EL display device using a heat medium heating source; In constructing a vacuum deposition apparatus for an EL display device; The vacuum deposition apparatus constitutes a heat fluid circuit as a heating means for heating and depositing a sample in a vacuum chamber, and heats and deposits a sample by a heat medium heating source portion heated by the heat fluid circuit. The part (H) is connected to the heat medium circulation circuit (C) outside the vacuum chamber and is supplied while continuously controlling the heating medium (LF) to be heated, and the heat medium heating source (H) is evaporated slits long cut to the side. The elongated tubular shape having the outline 60 has a long length, and the deposition slits 50 are openings through which the sample M introduced into the inner sample holding portion 61 is dissipated, and the heating medium LF is disposed therein. Circulating path 62 where the circulation path circulates is a solid body in which a pipe receptor or a pipe circulation arc disposed in a zigzag shape or the like is processed, and the heat medium heating source portion H is inlined at an installation site of a manufacturing plant. Along with the pipe connection circuit, the heat medium circulation circuit (C) is configured, and the heat medium circulation circuit (C) is heated by introducing a heater (HT) such as a fluid line (T) and a heater in tube to be circulated. Heating tank (TK) for heating medium (LF), filter (FT) for removing impurities, circulation pump (P), temperature controller (TC), temperature sensor (S1, S2), control valve (V1, V2), etc. It is provided with a control member.

Description

Organic EL vacuum depositon apparatus using thermal heating source

The present invention relates to a vacuum deposition apparatus for an organic EL display device of the thermal heating source method, and more particularly, to a deposition apparatus having a configuration capable of improving productivity and quality by being put into various deposition processes during an organic EL manufacturing process. It is about giving.

Among the semiconductor devices, an EL (Electro Luminescence) display device as one of the display devices is a display device developed as a liquid crystal display (LCD), an EL, a PDP or the like as one of the flat display devices. In addition, as one of the important display devices to meet the requirements of HDTV, etc., which is expected to be realized in the future, EL has an ideal structure with limited heat generation since it is composed of a completely solid film unlike other planar devices. Due to the advantages of its own cold-emitting type, it is widely spotlighted, and the actual demand in the industry is also exploding.

Therefore, productivity and yield rate in the production of such an EL element are very important technical aspects.

The conventional EL display element has a transparent electrode, a dielectric layer, a fluorescent layer, and an insulating layer, which are sequentially formed on a substrate of a substrate, which is a substrate. As the voltage of the volt is applied between the transparent electrode and the metal electrode by alternating current, the principle of emitting light from the fluorescent layer is used.

After the insulating layer is deposited by sputtering or chemical vapor deposition (CVD), the metal electrode is formed by etching a position where the metal electrode is to be formed by a reactive ion etching (RIE) method or a sputtering etching method.

Therefore, in order to manufacture the EL display device, a vapor deposition technique is indispensable, and various kinds of vapor deposition apparatuses have been devised to meet these demands.

For example, an electron beam deposition apparatus, an effusion cell deposition apparatus, a thermal evaporation deposition apparatus, and the like may be used. In such a conventional configuration, a sample charged into a deposition chamber may be locally heated. An electron gun or a heater is provided.

Therefore, after exhausting the sample, the process of releasing the vacuum and reloading the sample is indispensable. Therefore, the vacuum degree due to the reloading of the sample (that is, the vacuum breakdown) and the formation of the re-vacuum-release of the vacuum degree are required. Due to the cyclical operation, the production time is shortened and the yield is lowered. Also, defects are likely to occur due to the impurities deposited on the glass substrate due to the inflow of external impurities into the chamber caused by the frequent loading of the sample. I had.

This is because the size of the heat source that can be heated by the electron beam or the heater is basically limited, but this is due to the small amount of the sample to be introduced.

In addition, in order to fit the operating environment of a heated heater or an electron beam, the chamber must be molded as a high withstand pressure chamber, and thus, the deposition apparatus itself is very expensive, and therefore, a significant limitation is imposed on the size of the glass substrate to be introduced. This is the biggest reason for increasing the production cost of the display device which is gradually increasing in size.

In addition, this deposition environment is disadvantageous for organic samples that are extremely vulnerable to thermal impact, and the quality of the glass substrate produced as a lot due to the variation in deposition angle with time evaporation of the sample. , Resistivity, transmittance film thickness, etc. are different, respectively, and had a difficult problem in quality control.

In view of the above problems, a vacuum deposition apparatus for an organic EL display device using the heat medium heating source of the present invention;

In constructing a vacuum deposition apparatus for an EL display device;

The vacuum deposition apparatus comprises a heat fluid circuit as a heating means for heating and depositing a sample in a vacuum chamber, and heats and deposits a sample by a heat medium heating source part heated by the heat fluid circuit. .

Another feature of the present invention is that the heat medium heating source portion (H) is supplied while continuously controlling the temperature of the heating medium (LF) that is heated in connection with the heat medium circulation circuit (C) outside the vacuum chamber.

Another feature of the invention is; The heat medium heating source (H) is a substantially long tubular shape having a deposition slits 60 cut in a long side, and the deposition slits 60 are a sample introduced into the sample set portion 61 therein. (M) is an opening to be dissipated,

The circulation path 62 in which the heating medium LF circulates in the inner side is a solid body in which a pipe receptor or a pipe circulation arc is disposed in a zigzag shape or the like.

Another important feature of the present invention is that the nozzle gap is further provided so that the opening gap d of the deposition slits 60 can be adjusted, and the opening value of the nozzle angle of the nozzle device is the temperature control part TC of the fluid circuit part. Is performed in collaboration with

In addition, the heat medium heating source unit (H) together with the inlined pipe connection circuit installed in the installation site of the manufacturing plant, constitutes the heat medium circulation circuit (C),

The heat medium circulation circuit (C) is a heating tank (TK) for heating a heating medium (LF) circulated by a heater (HT) such as a fluid line (T), a heater in tube,

By providing a control member such as a filter FT for removing impurities, a circulation pump P, a temperature controller TC, a temperature sensor S1, S2, a control valve V1, V2, or the like,

Maintaining a constant heating temperature by controlling the heating temperature set by the temperature control unit TC and the present temperature, flow rate, flow rate, etc. as the data transmission and control program of the member describes the basic control configuration of the present invention.

Along with the accompanying drawings, the basic construction concept and method of the vacuum deposition apparatus for an organic EL display device using the heat medium heating source of the present invention will be described in detail for the problems of the conventional construction.

1 is a schematic configuration diagram of a vacuum deposition apparatus for an EL display device of a conventional electron beam, FIG. 2 is a schematic configuration diagram of a vacuum deposition apparatus of a conventional diffusion cell method, and FIG. 3 is a vacuum of a conventional thermal diffusion diffusion method. A schematic configuration diagram of a vapor deposition apparatus describes a conventional technology,

Fig. 4A is a configuration explanatory diagram showing the construction of a chamber portion in a vacuum deposition apparatus for an organic EL display device using the heat medium heating source of the present invention, Fig. 4B is a perspective view of an exemplary configuration showing the heat medium heating source portion, and Fig. 5 is A main part of the present invention will be described as a fluid circuit diagram for supplying a heat source to a heat medium heating source portion.

In the vacuum evaporation apparatus for the organic EL display device of the heat medium heating method of the present invention, the basic principle and concept are the scope of their rights, and specific dimensional specifications, detailed fluid, and thermodynamic detailed considerations are conventional techniques and thus are not mentioned.

1 is a schematic configuration of a vacuum deposition apparatus for an EL display device of a conventional electron beam type, and is loaded with a glass substrate so as to be controlled as a stop shutter 3 rotating as a stepping motor 2 inside a chamber 1. It is difficult to maintain the vacuum tightness of the shaft of the stepping motor 2, and the configuration and control of the electron gun 4 for the electron beam dissipation are very complicated, and the vacuum degree suitable for dissipating the electron beam is maintained in the chamber 1. The above-mentioned problems are difficult to do.

FIG. 2 is a schematic configuration of a vacuum deposition apparatus of a conventional diffusion cell type, and includes a diffusion cell 11 and a shutter array 12 at an end of a diffusion cell 11 that charge a plurality of organic samples inside a high pressure vacuum chamber 10. As a constitution having a), the vacuum chamber 10 also has the problem of limiting the size of the vacuum chamber 10 in order to maintain a high vacuum degree.

FIG. 3 illustrates a structure in which a sample injected onto a plurality of heaters 21 placed inside the chamber 20 of the schematic thermal vapor deposition apparatus of the conventional thermal diffusion diffusion method is diffused and deposited on the glass substrate 21. do. Even in such a configuration, the size of the chamber is very limited, and the amount of input per sample of the sample injected into the heater 21 and dissipated is limited.

The vacuum evaporation apparatus for the organic EL display device of the heat medium heating source method of the present invention is capable of injecting a large amount of sample in consideration of the above-described problems, and employs a heating method by a fluid circuit capable of performing deposition at a relatively low vacuum degree. The branch provides a device.

Fig. 4A is a structural explanatory diagram showing the structure of the chamber portion in the EL deposition element vacuum deposition apparatus using the heat medium source of the present invention, and includes a conventional apparatus such as a shutter 51 inside the chamber 50,

The lower part is provided with a plurality of heating medium source (H),

The heat medium heating source portion H is connected to the heat medium circulation circuit C for circulating, heating, and regenerating the exemplary heating medium LF as shown in FIG.

As the heat medium heating source portion H shows one exemplary configuration in FIG. 4B,

It has a substantially long tubular shape with laterally elongated deposition slits 60. The deposition slits 60 serve as a window through which the sample M injected into the inner portion of the sample setter 61 is dissipated, and more preferably, the gap d of the deposition slits 60 can be adjusted. It is preferable to have a slitting nozzle apparatus (not shown) which rotates in the direction of the arrow, that is, circumferentially.

Such a change in the nozzle angle may be automatically changed in cooperation with the temperature control unit TC described later.

The heat medium heating source portion H is made of a corrosion-resistant, heat-resistant metal, and the circulation path 62 through which the heating medium LF circulates is disposed in a zig-zag shape and the like with a high thermal conductivity efficiency.

The circulation path 62 may be a solid flow path in which the pipe bent body or the heat medium heating source part H inserted into the heat medium heating source part H is a solid body, and the pipe bending path is processed.

The heat medium heating source portion (H) constitutes an inlined pipe connection circuit installed at the installation site of the manufacturing plant and is a fluid passage (T) circulating between the heat medium heating source portion (H) and the heating tank (TK). Fluid connection.

Inside the heating tank TK, a heater HT, such as a heater in tube, is introduced to serve to heat the circulating heating medium LF, and is insulated as a heat insulating material SH. The heating medium LF is commercialized by drawing various kinds of materials, and a high viscosity, a heat absorption rate, a heat retention rate, and a low modification rate may be selected and used.

At the discharge end side of the heating medium LF, the impurities in the large-capacity heating tank TK are filtered through the filter FT, and the fluid line T is circulated by the circulation pump P.

On the fluid line T, there are a plurality of control valves such as temperature control unit TC, temperature sensors S1 and S2, control valves V1 and V2. The data from the temperature sensors S1 and S2 is fed back to the temperature controller TC, and the temperature controller TC automatically opens the control valves V1 and V2 in consideration of the set temperature, the present temperature, the flow rate, and the flow rate. It is preferred to be programmed to control.

Therefore, the temperature control unit TC, the temperature sensors S1 and S2, the control valves V1 and V2, and the heater HT are not independent components, but are connected to each other and are fed back to process a constant heating medium. It should be programmed to operate in a manner that maintains the temperature of the (LF) and minimizes temperature fluctuations.

The heat medium heating source portion H in the vacuum deposition apparatus for an organic EL display device using the heat medium heating source of the present invention described above is easier to control than the conventional electron beam, heater and the like, and can maintain the temperature of the heating portion uniformly. Has the advantage. In addition, even if the sample is reduced by vacuum deposition, the nozzle configuration such as a slitting nozzle device is further provided to maintain a constant angle of scattering, thereby having an effect of homogenizing the quality of the products in the lot.

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In addition, the heating medium (LF) in the heating tank (TK) has the advantage that the heat storage is possible to some extent because it can be heated while maintaining a constant temperature using a cheap midnight electricity and can also be used during the day as residual heat to reduce the raw material cost.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic configuration diagram of a vacuum deposition apparatus for an EL display device of a conventional electron beam type.

2 is a schematic configuration diagram of a conventional diffusion cell type vacuum deposition apparatus for an EL display element.

3 is a schematic configuration diagram of a vacuum deposition apparatus of a heat-diffusion method for a conventional EL display element.

Fig. 4A is a structural explanatory diagram showing the structure of a chamber portion in a vacuum deposition apparatus for organic EL display elements using the heat medium heating source of the present invention.

4B is a perspective view of an exemplary configuration showing a heat medium heating source portion.

5 is a heat medium fluid circuit portion for supplying a heat source to the heat medium heating source portion.

* Explanation of symbols used in the main part of the drawing *

H: Heating medium sauce

C: heating cycle

LF: heating medium

T: fluid line

HT: heater

FT: filter

P: circulation pump

TC: temperature control unit

S1, S2: temperature sensor

V1, V2: control valve

Claims (5)

In a vacuum deposition apparatus, a heating fluid LF circulates as a heating means for heating and depositing a sample in a vacuum chamber, and the sample is heated by a heat medium heating source part heated by the thermal fluid circuit. A vacuum evaporation apparatus for an organic EL display element of a heat medium heating source type which heats and deposits; The heating medium source (H) is a substantially long tubular shape having the elongated incision slit (60) and the evaporation slit (50) is a sample introduced into the sample set portion 61 of the inside (M) is an opening to be dissipated, The vapor deposition path for the organic EL display device of the heat medium heating source type, characterized in that the circulation path 62 through which the heating medium LF circulates inside is a solid body processed from a pipe receptor or a pipe circulation hose disposed in a zigzag shape or the like. Device. delete delete The method of claim 1, The open gap d of the deposition slits 60 is further provided with a nozzle device to adjust, and the opening value of the nozzle angle of the nozzle device is performed in cooperation with the temperature control unit TC of the fluid circuit unit. Vacuum deposition apparatus for organic EL display element of the heat medium heating source system. delete