KR100475168B1 - Laminating Apparatus of Substrate - Google Patents

Abstract

The present invention relates to a substrate bonding apparatus in which guide grooves are formed on the surfaces of the first and second surface plates of the substrate bonding apparatus to minimize adhesion failure caused by foreign matter.

The substrate bonding apparatus according to the present invention includes a first surface plate on which any one of two substrates is seated, a second surface plate on which the other one of the two substrates is seated, and the first surface plate and the second surface plate to allow foreign substances to be inserted therein. It is provided with a guide groove formed in the form of a grid line on the surface.

By such a configuration, the substrate bonding apparatus according to the present invention forms a guide groove through which foreign matter can be inserted on the surface of the bonding table on which the upper and lower substrates are seated, thereby preventing the phenomenon of pressing by the spacer at the site where the foreign matter remains. You can prevent it. In addition, the productivity is greatly improved by preventing the crushing phenomenon caused by the spacer by the foreign matter.

Description

Substrate Bonding Device {Laminating Apparatus of Substrate}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for manufacturing a liquid crystal display device, and more particularly, to a substrate bonding apparatus for minimizing adhesion failure caused by foreign matter by forming guide grooves on the surfaces of the first and second surface plates of the substrate bonding apparatus.

A liquid crystal display displays an image by adjusting a transmission amount of a light beam to correspond to an image signal. To this end, the liquid crystal panel is composed of a plurality of liquid crystal cells arranged in an m × n matrix and a plurality of control switches, that is, thin film transistors, for switching image signals to be supplied to each of the liquid crystal cells. .

The manufacturing process of the active matrix liquid crystal display device is divided into substrate cleaning, substrate patterning, alignment film formation, substrate bonding / liquid crystal injection, and mounting process. In the substrate cleaning process, foreign substances on the substrates are removed by using a cleaning agent before and after patterning of the upper and lower substrates. In the substrate patterning process, the upper substrate is patterned and the lower substrate is patterned. A color filter, a common electrode, a black matrix, and the like are formed on the upper substrate. Signal lines such as data lines and gate lines are formed on the lower substrate, and TFTs are formed at intersections of the data lines and gate lines. A pixel electrode is formed in the pixel region connected between the data line and the gate line. In the substrate bonding / liquid crystal injection process, an alignment film is coated and rubbed on the lower substrate, followed by an upper / lower substrate bonding process using a seal material, liquid crystal injection, and an injection hole encapsulation process. Finally, in the mounting process, a tape carrier package (TCP) in which integrated circuits such as a gate drive integrated circuit and a data drive integrated circuit is mounted is connected to a pad portion on a substrate.

1 is a cross-sectional view illustrating a substrate bonding apparatus used in a bonding process in a manufacturing process of a liquid crystal display device.

Referring to FIG. 1, the conventional substrate bonding apparatus presses the first substrate 2 on which the upper substrate 4 is seated and the second surface plate 10 on which the lower substrate 8 is seated by pneumatically or hydraulically to press the upper substrate. (4) and the lower substrate 8 are to be bonded. Here, the first and second surface plates 2 and 10 are manufactured to have a flat surface as shown in FIG. 2. This will be described below with reference to FIGS. 3A and 3B.

In FIG. 3A, the upper substrate 4 adsorbed by vacuum and hydraulic pressure is seated on the first surface plate 2 of the substrate bonding apparatus. The upper substrate 4 is formed with a color filter, a common electrode, a black matrix and the like. On the upper substrate 4, spacers 6 for dispersing the lower and upper substrates 4 and 8 at regular intervals during the bonding process are scattered on the upper substrate 4. In addition, a seal material (not shown), which serves to seal the spaces of the lower and upper substrates 4 and 8, is printed on the outer portion of the upper substrate 4.

In FIG. 3B, the lower substrate 8 rotated by 180 ° by a rotating device not shown in the second surface plate 10 of the substrate bonding device is sucked by vacuum and hydraulic pressure so as to face the upper substrate 4. On the lower substrate 8, TFTs are formed at intersections of signal lines such as data lines and gate lines.

The upper and lower substrates 4 and 8 are marked with mark alignment to prevent movement during the bonding process and distortion during curing. The substrate bonding device is pressed onto the upper and lower substrates 4 and 8 at a pressure of about 2 kN, thereby bonding the upper and lower substrates 4 and 8 as shown in FIG.

However, foreign materials such as dust on the transfer device and robot to transfer the substrate in the seal printing process and the spacer spreading process, which are the preliminary processes of the bonding process, and pieces of the substrate that are damaged during the transfer, are applied to the upper and lower substrates 4 and 8. It remains on the back and the first and second surface plates 2 and 10. In this case, when the substrate bonding process is performed, the upper and lower substrates 4 and 8 are formed by the spacers 6 at the portions where the foreign matter 20 remains on the rear surfaces of the upper and lower substrates 4 and 8 as shown in FIG. 4. Will be pressed.

The pressing phenomenon of the upper and lower substrates 4 and 8 due to the foreign matter 20 is impossible to restore even in an aging process, which is the next step of the substrate bonding process, which causes a failure. In addition, if the foreign matter 20 that caused the defect is still remaining will cause a large amount of defect in the continuous bonding process. Accordingly, the alignment of the liquid crystal injected in the liquid crystal injection process is nonuniform. As a result, the liquid crystal cannot adjust the amount of transmission of the light beam corresponding to the video signal, and thus cannot display an accurate image.

Accordingly, it is an object of the present invention to provide a substrate bonding apparatus for minimizing adhesion failure caused by foreign matter by forming guide grooves on the surfaces of the first and second surface plates of the substrate bonding apparatus.

In order to achieve the above object, the substrate bonding apparatus according to the present invention includes a first surface plate on which any one of the two substrates is seated, a second surface plate on which the other one of the two substrates is seated, and the foreign material is inserted Guide grooves formed in the form of lattice lines are provided on the surfaces of the first and second plates. The guide grooves are formed at equal intervals. The guide groove is formed in any one of a triangle, a square and a semicircle. According to an embodiment of the present invention, a substrate bonding apparatus includes a first surface plate on which one of two substrates is seated, a second surface plate on which one of the two substrates is seated, and a surface of the first surface plate and the second surface plate. And a plurality of protrusions provided on the first and second surface plates to have a surface in contact with the substrate, and a groove into which foreign substances located between the protrusions on the surfaces of the first and second surface plates can be inserted. Each of the protrusions is formed to have a rectangular surface. The protrusions are arranged in a matrix form. The protrusions are arranged in a zigzag form.

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Other objects and features of the present invention in addition to the above objects will be apparent from the description of the embodiments with reference to the accompanying drawings.

Hereinafter, exemplary embodiments of the present invention will be described with reference to FIGS. 5 to 10C.

5 is a cross-sectional view illustrating a substrate bonding apparatus according to a first embodiment of the present invention.

5, the substrate bonding apparatus according to the present invention pressurizes the first surface plate 22 on which the upper substrate 24 is seated and the second surface plate 30 on which the lower substrate 28 is seated by air pressure or hydraulic pressure. The upper substrate 24 and the lower substrate 28 of the liquid crystal display panel are bonded to each other. Here, the upper substrate 24 and the lower substrate 28 of the liquid crystal display panel may be mounted on any of the first and second surface plates 22 and 30 according to the substrate bonding device. This will be described below with reference to FIGS. 6A and 6B.

In FIG. 6A, the upper substrate 24 adsorbed by vacuum and hydraulic pressure is seated on the first surface plate 22 of the substrate bonding apparatus. The upper substrate 24 is formed with a color filter, a common electrode, a black matrix and the like. Spacers 26 are disposed on the upper substrate 24 to maintain the upper and lower substrates 24 and 28 at regular intervals during bonding before the bonding process. In addition, a seal material (not shown), which serves to seal the spaces of the upper and lower substrates 24 and 28, is printed on the outer portion of the upper substrate 24.

In FIG. 6B, the lower substrate 28 rotated 180 ° by a rotating device not shown in the second surface plate 30 of the substrate bonding device is sucked by vacuum and hydraulic pressure so as to face the upper substrate 24. On the lower substrate 28, TFTs are formed at intersections of signal lines such as data lines and gate lines.

Mark alignments of the upper and lower substrates 24 and 28 of the liquid crystal display panel to prevent distortion during movement and curing during the bonding process are displayed. The substrate bonding apparatus is pressed onto the upper and lower substrates 24 and 28 at a pressure of about 2 kN to bond the upper and lower substrates 24 and 28 as shown in FIG. 5.

However, in the seal printing process and the spacer spreading process, which are the preliminary steps of the bonding process, the transfer device for transferring the substrate and the dust on the robot, the pieces of the board broken during the transfer, and the first and second surface plates of the substrate bonding device ( Foreign substances such as dust and the like remain on the rear surfaces of the upper and lower substrates 24 and 28 and the first and second surface plates 22 and 30.

In order to remove such foreign matter, guide grooves 31 and 33 are formed in the first and second surface plates 22 and 30 of the substrate bonding apparatus according to the first embodiment of the present invention, as shown in FIG. 7.

Referring to FIG. 7, the guide grooves 31 and 33 may be manufactured by using a machine tool such as a milling machine, and are formed in the form of grids of equal intervals. The guide grooves 31 and 33 have grooves as shown in FIGS. 8A to 8C.

The guide grooves 31 and 33 may be formed to contain foreign substances remaining on the rear surfaces of the upper and lower substrates 24 and 28. The cross-sections of the guide grooves 31 and 33 may have a “V” shape as shown in FIG. 8A, and may have a rectangular shape as shown in FIG. 8B or a semicircular shape as shown in FIG. 8C.

In addition, the surfaces of the first and second surface plates 22 and 30 may be any type of guide grooves 31 and 33 capable of surface contact so that scratches do not occur when the upper and lower substrates 24 and 28 are in contact with each other. Do.

Accordingly, the guide grooves 31 and 33 may be guide grooves 31 even when there are foreign substances 40 remaining on the rear surfaces of the upper and lower substrates 24 and 28 and the first and second surface plates 22 and 30 when the substrates are bonded. By sliding down to 33, it is possible to prevent the phenomenon that the upper and lower substrates 24 and 28 are pressed by the spacer 26 by foreign matter.

Referring to FIG. 9, the first and second surface plates 42 and 44 of the substrate bonding apparatus according to the second embodiment of the present invention have protrusions 46 periodically arranged on the surface thereof.

Each of the protrusions 46 is formed to have a rectangular surface to make surface contact when the upper and lower substrates 24 and 28 are seated.

In addition, the grooves 48 as shown in FIGS. 10A to 10C are formed in the first and second surface plates 42 and 44 to form a step with the protrusion 46 at a predetermined depth except for the protrusion 46.

The groove 48 has a shape capable of containing foreign matter remaining on the rear surfaces of the upper and lower substrates 24 and 28. The cross section of the groove 48 may have a “V” shape as shown in FIG. 10A, and may have a rectangular shape as shown in FIG. 10B or a semicircular shape as shown in FIG. 10C.

The protrusions 46 of the first and second surface plates 42 and 44 are in surface contact so as not to cause a scratch phenomenon when the upper and lower substrates 24 and 28 are in contact with each other. It can have any shape of groove 48 that it can contain.

Therefore, when the upper and lower substrates 24 and 28 are bonded together, even if there is a foreign material 40 remaining on the back surface of the substrate and the first and second surface plates 42 and 44, the foreign material 40 is slid to the groove 48 so that the foreign material may be removed. This prevents the upper and lower substrates 24 and 28 from being pressed by the spacers 26 at the remaining portions.

As described above, the substrate bonding apparatus according to the present invention forms a guide groove through which foreign matter can be inserted on the surface of the bonding table on which the upper and lower substrates are seated, thereby preventing the phenomenon of pressing by the spacer at the site where the foreign matter remains. You can prevent it. In addition, the productivity is greatly improved by preventing the spacer from being pressed by the foreign material.

Those skilled in the art will appreciate that various changes and modifications can be made without departing from the technical spirit of the present invention. Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification but should be defined by the claims.

1 is a cross-sectional view showing a conventional substrate bonding apparatus.

FIG. 2 is a perspective view showing the first and second surface plates shown in FIG. 1. FIG.

3A and 3B are cross-sectional views illustrating a process in which the upper and lower substrates are bonded together.

Figure 4 is a cross-sectional view showing the pressing phenomenon of the substrate by the foreign matter and space in the conventional substrate bonding apparatus.

5 is a cross-sectional view showing a substrate bonding apparatus according to the present invention.

6A and 6B are cross-sectional views illustrating a process in which the upper and lower substrates are bonded together.

7 is a perspective view showing a bonding table of the substrate bonding apparatus according to the first embodiment of the present invention.

8A to 8C are perspective views illustrating the guide grooves of the cementation table shown in FIG. 7.

9 is a perspective view showing a bonding table of the substrate bonding apparatus according to a second embodiment of the present invention.

10A to 10C are perspective views showing the protrusions of the cementation table shown in Fig. 9;

<Explanation of symbols for main parts of drawing>

2, 22: first plate 4, 24: upper substrate

6, 26: spacer 8, 28: lower substrate

10, 30: 2nd plate 20, 40: foreign material

31, 33: guide groove 46: protrusion

48: home

Claims (7)

A bonding apparatus for bonding two substrates to be faced with liquid crystals interposed therebetween, A first surface plate on which any one of the two substrates is seated; A second surface plate on which the other one of the two substrates is seated; Substrate bonding apparatus comprising a guide groove formed in the form of grid lines on the surface of the first and second surface plate so that foreign matter can be inserted. The method of claim 1, And the guide grooves are formed at equal intervals. The method of claim 1, The guide groove is a substrate bonding apparatus, characterized in that formed in any one of a triangle, a square and a semi-circle. A bonding apparatus for bonding two substrates to be faced with liquid crystals interposed therebetween, A first surface plate on which any one of the two substrates is seated; A second surface plate on which the other one of the two substrates is seated; A plurality of protrusions provided on the surfaces of the first and second tables and provided on the first and second tables to have a surface in contact with the substrate; And a groove into which foreign substances located between the protrusions on the surfaces of the first and second surface plates can be inserted. The method of claim 4, wherein And each of the protrusions is formed to have a rectangular surface. The method of claim 4, wherein Substrate bonding apparatus characterized in that the protrusions are arranged in a matrix form. The method of claim 4, wherein Substrate bonding apparatus characterized in that the protrusions are arranged in a zigzag form.