KR100474655B1 - Contact adjustment tool of socket for semiconductor chip test - Google Patents

Abstract

The present invention relates to a contact adjustment tool of a socket for a semiconductor chip test. In the present invention, a support plate having a predetermined thickness is interposed between a support jaw and a carrier, and thereby the test pins are appropriately adjusted by adjusting a contact depth between the test pins and the leads. Excessive contact of the leads can be prevented.

Description

Contact adjustment tool in socket for semiconductor chip test

The present invention relates to a socket for electrically testing a semiconductor chip, and more particularly, to a contact control tool of a socket for a semiconductor chip test that can prevent an excessive contact between the semiconductor chip leads and the test pin in advance. .

In general, a semiconductor chip test socket refers to a device for checking the life and failure of a semiconductor chip by applying an overload to a voltage higher than a normal operating condition in order to confirm the reliability of a chip mounted on a carrier.

1 is an exploded perspective view schematically showing a shape in which a semiconductor chip is coupled to a socket for a semiconductor chip test that performs such a function, FIG. 2 is an enlarged perspective view of a bottom surface of a conventional carrier, and FIG. And an enlarged perspective view of the contact state of the test pins.

As shown in FIG. 1, the carrier 20 having the semiconductor chip 30 mounted thereon is inserted into the base rail 40 between the guide bars 10b formed on the main body 10a of the socket 10.

Accordingly, the carrier bottom surface 20a illustrated in FIG. 2 is seated on the support jaw 10c, and the leads 30a drawn from the semiconductor chip 30 are contacted with the test pins 10d.

Here, the support jaw 10c prevents the surface of the semiconductor chip 30 other than the leads 30a from contacting the socket 10 in advance.

At this time, the main body 10a of the socket 10 is fixed to a work table (not shown) through the screw groove 10e, and the test pins 10d described above are exposed to the bottom of the main body 10a and supplied from the outside. Connected to test power.

Meanwhile, a constant pressure is applied to the base rail 40 to maintain the contact state of the leads 30a and the test pins 10d described above.

When testing the semiconductor chip 30 using a conventional semiconductor chip test socket having such a structure, the operator supplies a predetermined value of power to the test pins 10d through the above-described test power supply, and thus is supplied. The electrical power of the semiconductor chip 30 is tested by allowing a power supply to penetrate the semiconductor chip 30 through the leads 30a contacted to the test pins 10d.

However, there are some serious problems with conventional semiconductor chip test sockets that perform this function.

First, as described above, the test pins and leads continuously maintain their contact state by the pressure applied to the base rail. When such a pressurized state persists, excess contact is generated, as shown in FIG. 3. In this case, a tin burr phenomenon in which leads are pushed sideways is caused, and accordingly, a short is generated between the leads, thereby causing a serious problem of an unexpected process accident.

Second, a tin flake phenomenon in which the surfaces of the leads are scraped off due to the above-described pressure, causes a serious problem that an unexpected failure of the semiconductor chip occurs.

Third, the test pins are broken by the above-mentioned pressure, so that the socket must be frequently replaced, and as a result, the overall cost of the semiconductor chip is increased.

Accordingly, an object of the present invention is to interpose a support plate having a predetermined thickness between the support jaw and the carrier, and thereby to properly adjust the contact depth between the test pins and the leads, thereby preventing excessive contact between the test pins and the leads. The present invention provides a contact control tool for a socket for testing a semiconductor chip.

The present invention for achieving the above object is a guide bar formed on the main body and the carrier on which the semiconductor chip is mounted and guided to the main body, and formed between the guide bars and drawn out to the bottom surface of the main body. A semiconductor chip test socket comprising test pins electrically contacting leads of the semiconductor chip through a test power supply, and a support jaw surrounding the test pins to support the carrier, wherein the test pin is fixed on the main body. 1 body; And a second body integrally formed with the first body and interposed between the bottom of the carrier and the support jaw so that the test pins and the leads are contacted without damage.

Preferably, the material of the first body and the second body is characterized in that the alloy tool steel.

Preferably, the hardness of the alloy tool steel is characterized in that 55HRC-58HRC. Here, HRC denotes Rockwell hardness C-scale, which is a unit of marking a sample with diamond or the like and determining the hardness of the sample by the depth of the mark.

Preferably, the hardness of the alloy tool steel is characterized in that 56HRC.

Preferably, the second body and the first plate is connected to the first body; It characterized in that it comprises a second plate extending to form a predetermined angle at one end of the first plate.

Preferably, the angle is characterized in that 90 °.

Preferably, the other end of the first plate is characterized in that a handling groove having a predetermined depth and a predetermined width is formed.

Preferably, the depth of the handling groove is characterized in that 3.5mm-4.5mm.

Preferably, the depth of the handling groove is characterized in that 3.8mm.

Preferably, the width of the handling groove is characterized in that 1.5mm-2.5mm.

Preferably, the width of the handling groove is characterized in that 2mm.

Preferably, the other end of the first plate is characterized in that the inclined surface formed at a predetermined angle.

Preferably, the angle of the inclined surface is characterized in that 17 °-20 °.

Preferably, the angle of the inclined surface is characterized in that 18 °.

Preferably, the thickness of the second plate is characterized in that 0.5mm-1mm.

Preferably, the thickness of the second plate is characterized in that 0.6mm.

Accordingly, in the present invention, excessive contact between the test pins and the leads is appropriately suppressed.

Hereinafter, the contact control tool of the semiconductor chip test socket according to the present invention will be described in more detail with reference to the accompanying drawings.

4 is a perspective view schematically showing a contact control tool of a socket for a semiconductor chip test according to the present invention, and FIG. 5 is a cross-sectional view schematically showing a coupling state thereof.

As shown in FIG. 4, the contact adjustment tool of the present invention is formed integrally with the first body 100 and the first body 100 such that the test pins 10d and the leads 30a are contacted without damage. The second body 101 is interposed between the bottom surface 20a of the carrier 20 and the support jaw 10c.

Here, the second body 101 is formed of a first plate 101b connected to the first body 100 and a bottom portion of the first plate 101b extending at a predetermined angle, more preferably 90 °. 2 plate 101a is included. Accordingly, the cross section of the second body 101 forms an L shape.

At this time, the first body 100 is formed with a screw groove 100a, the first body 100 is firmly fixed on the main body 10a of the socket 10 through the screw groove (100a).

Hereinafter, the operation of the present invention having such a configuration will be described.

First, as shown in FIG. 5, the carrier 20 on which the semiconductor chip 30 is mounted is inserted between the guide bars 10b of the socket 10 to receive the electrical test described above.

At this time, the first body 100 is seated on the main body 10a and fixed through the aforementioned screw groove 100a, and the second plate 101a of the second body 101 supports the support jaw of the socket 10. Put on (10c). Accordingly, the second plate 101a is interposed between the bottom surface 20a of the carrier 20 and the support jaw 10c.

Here, according to a feature of the present invention, the material of the first body 100 and the second body 101 is made of alloy tool steel, the hardness of which is 55HRC-58HRC, more preferably maintains 56HRC. Accordingly, the main body 10a and the carrier 20 do not suffer unexpected damage even if they collide with the contact adjustment tool of the present invention.

Meanwhile, as described above, the first plate 101b and the second plate 101a of the second body 101 form an L shape, so that the bottom surface 20a of the carrier 20 is the second plate. It is seated on 101a, and the front surface of the carrier 20 is stably in close contact with the first plate 101b.

At this time, according to a feature of the present invention, the inclined surface 101c is formed at an end of the first plate 101b at an angle, for example, 17 ° -20 °, more preferably 18 °. This inclined surface 101c provides a smooth movement path when the carrier 20 is seated on the second plate 101a.

Further, according to a feature of the present invention, a handling groove (shown in FIG. 4: 101d) having a predetermined depth and width is formed from the end of the first plate 101b. This handling groove 101d provides a suitable handling area for the handler (not shown) when the contact adjustment tool of the present invention is transported onto the body 10a of the socket 10.

Here, the depth of the handling groove 101d is 3.5 mm-4.5 mm, more preferably 3.8 mm, the width of which is 1.5 mm-2.5 mm, more preferably 2 mm to suit the size of the handler arm.

Subsequently, pressure is applied to the base rail 40 carrying the carrier 20, so that the leads of the semiconductor chip mounted on the carrier are contacted with the test pins.

In this case, as described above, the second plate 101a is interposed between the bottom surface 20a of the carrier 20 and the support jaw 10c, whereby the leads 30a of the semiconductor chip 30 are formed. The degree of contact with the test pin 10d is limited. Accordingly, excessive contact between the leads 30a and the test pins 10d is prevented in advance, and as a result, the above-described problems such as tin bur, tin flake and the like are properly solved.

At this time, according to the feature of the present invention, the thickness of the second plate 101a is maintained at 0.5mm-1mm, more preferably 0.6mm.

In general, the most suitable contact depth between the leads 30a and the test pins 10d is 0.2 mm. In the conventional case, the above-described tin bur is over-contacted by about 0.5 mm-1 mm deeper than this by the above-mentioned pressure. Problems like tin flakes.

However, in the case of the present invention, as described above, the support plate 10c of the carrier 20 and the socket 10 includes a second plate 101a that maintains a thickness of 0.5 mm to 1 mm, more preferably 0.6 mm. Interposed therebetween restricts the leads 30a of the semiconductor chip 30 mounted on the carrier 20 from being overcontacted with the test pins 10d beyond a contact depth of 0.2 mm, and thus, as described above. The problem can be solved properly.

As such, the contact adjustment tool of the present invention can prevent damage to the semiconductor chip by adjusting the degree of contact between the leads and the test pins through the second body while being firmly fixed to the socket through the first body. have.

Moreover, the contact control tool of the present invention can increase the replacement cycle of the socket by preventing the damage to the test pin through the above-described process, and as a result can reduce the overall cost of the semiconductor chip.

This invention is not limited to only sockets for conducting electrical tests, but has useful effects throughout all test fixtures for testing semiconductor chips.

And while certain embodiments of the invention have been described and illustrated, it will be apparent that the invention may be embodied in various modifications by those skilled in the art.

Such modified embodiments should not be understood individually from the technical spirit or point of view of the present invention and such modified embodiments should fall within the scope of the appended claims of the present invention.

As described in detail above, in the contact adjustment tool of the socket for testing a semiconductor chip according to the present invention, a support plate having a predetermined thickness is interposed between the support jaw and the carrier, and thereby the test depth is appropriately adjusted between the test pins and the leads. Excessive contact of the pins and leads can be prevented.

1 is an exploded perspective view schematically illustrating a shape in which a semiconductor chip is coupled to a socket for a conventional semiconductor chip test;

Figure 2 is an enlarged perspective view of the bottom of the conventional carrier.

3 is an enlarged perspective view illustrating a contact state between conventional leads and test pins;

4 is a perspective view schematically showing a contact control tool of a socket for a semiconductor chip test according to the present invention;

5 is a cross-sectional view schematically showing the engagement state of the contact adjustment tool according to the present invention.

Claims (16)

A guide bar formed on the main body, a guide bar formed on the main body to mount the semiconductor chip to the main body, and drawn between the guide bars and drawn out to the bottom surface of the main body, through a predetermined test power source; A socket for a semiconductor chip test including test pins electrically contacted with a support pin, and a support jaw for supporting the carrier while surrounding the test pins. A first body fixed on the body; And a second body formed integrally with the first body and interposed between the bottom surface of the carrier and the support jaw so that the test pins and the leads are contacted without damage. Tools. The contact control tool of claim 1, wherein the first body and the second body are made of alloy tool steel. The contact control tool of claim 2, wherein the hardness of the alloy tool steel is 55HRC-58HRC. 4. The contact control tool of claim 3, wherein the hardness of the alloy tool steel is 56 HRC. The apparatus of claim 1, wherein the second body comprises: a first plate connected to the first body; And a second plate extending at a predetermined angle to one side end of the first plate. 6. The tool of claim 5, wherein the angle is 90 [deg.]. 6. The tool of claim 5, wherein a handling groove having a predetermined depth and a predetermined width is formed at the other end of the first plate. 8. The contact adjustment tool of claim 7, wherein the depth of the handling groove is 3.5mm-4.5mm. 9. The contact adjusting tool of claim 8, wherein the depth of the handling groove is about 3.8 mm. 8. The contact adjusting tool of claim 7, wherein the width of the handling groove is 1.5mm-2.5mm. 11. The contact adjusting tool of claim 10, wherein the width of the handling groove is 2 mm. The contact control tool of claim 5, wherein an inclined surface having a predetermined angle is formed at the other end of the first plate. The contact control tool of claim 12, wherein the angle of the inclined surface is 17 ° -20 °. The contact control tool of claim 13, wherein the angle of the inclined surface is 18 degrees. 6. The contact adjusting tool of claim 5, wherein the thickness of the second plate is 0.5mm-1mm. 16. The contact adjusting tool of claim 15, wherein the thickness of the second plate is 0.6 mm.

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