KR100436259B1 - Integrated circuit socket - Google Patents

Abstract

The present invention is a process for increasing the reliability of the test process, which is a process for separating the good and defective parts by electrically inspecting the circuit completeness in the package state in the semiconductor manufacturing process. The present invention relates to an integrated circuit socket mainly used in a BURN-IN process, and more particularly to an integrated circuit socket used where electrical connection with a device contact is repeatedly required.

In order to achieve the above object, the present invention, in the elastic elastomer having a position fixing hole at the same XY position as the device contact, and provided with a storage space for accommodating the heater and a fixed body having a through hole. . In addition, the housing is housed in the fixing body such that the hole of the fixing body and the position fixing hole are located on the same axis, and a socket pin serving as a probe to slide smoothly into the positioning fixing hole. The socket pins are intended to protrude out of the holes of the fixture only to the extent permitted by the device to prevent them from completely popping out of the holes of the fixture, and the springs that provide the resilient force to push the socket pins out of the holes of the fixture It is stored in the fixing hole and a part of the socket pin is inserted into the spring. One lower end of the spring also has a tightly wound conduit so that adjacent windings can stick together and be in electrical contact even without compression.

When in contact with the device contact, the spring is compressed and flexed, thereby overlapping the lower end of the socket pin inserted into the spring bore and the conduit and making electrical contact there.

Description

Integrated Circuit Sockets {INTEGRATED CIRCUIT SOCKET}

In the integrated circuit socket (FIG. 1) of the present invention, a test process for electrically inspecting a circuit completeness of a device in a semiconductor manufacturing process and classifying it as good or defective and removing the initial defective product before shipment to increase the reliability of the device- It is a device mainly used in the phosphorus process and serves as a medium for making an electrical connection between the device contact 9 and the printed circuit board contact 11.

The integrated circuit socket (FIG. 1) minimizes the length of the electrical connection between the device contact 9 and the printed circuit board contact 11, which have an absolute effect on the electrical transmission characteristics, while also continuously minimizing the socket pins with minimal space. Maintaining tension in 4) is the key technology.

The conventional technique for maintaining the tension of the socket pin 4 is a method of bending the socket pin 4 in the form of "C" to take advantage of the elasticity of the socket pin 4 itself naturally occurring.

This method requires the socket pin 4 to be bent in a “C” shape, so that the length of the socket pin 4 is about 15.0 mm to 30.0 mm, which is relatively longer than five times longer than the length of the vertical socket pin 4. Electrical transmission characteristics are degraded. In other words, the inductance increases in direct proportion to the length of the electrical connection path, which causes electrical transmission loss and distortion, which adversely affects the electrical transmission characteristics. Since the electrical characteristics of the integrated circuit socket (FIG. 1) are inversely proportional to the length of the socket pin 4, the length of the socket pin 4 should be as short as possible.

Therefore, this structure has reached the current limit as a technology that is difficult to apply to the device 10 for testing the operation speed and the data transmission speed of 100 MHz or more due to the degradation of the electrical transmission characteristics.

In addition, since the socket pin 4 is bent in the form of "C", the tension of the socket pin 4 itself, which occurs naturally, requires a lot of space for tension maintenance. Therefore, whether or not such a structure is applied depending on the package type is determined, it is a technology that is not applicable to the package (BGA: Ball Grid Array) type.

Package trends are moving in the form of Chip Scale Package (CSP) and Fine Ball Grid Array (FBGA). The current technology is difficult to apply because of the limitation of pitch.

In order to solve the above problems, the present invention is provided with a spring having a tightly wound conduit so that adjacent windings are brought into contact with each other even without compression, and a socket pin inserted into the spring to square the number of turns of the spring. It is an object of the present invention to provide an integrated circuit socket which prevents an increase in inductance proportional to and minimizes the electrical connection length between a device contact and a printed circuit board contact capable of handling a reliable and high frequency signal.

And a second object of the present invention is to minimize the space according to the tension maintenance of the socket pin.

1 is a cross-sectional view of an integrated circuit socket

2 is a detailed view of the socket pin 4

3 is a detailed drawing of the spring

4 is a detailed view of the base 7

Explanation of symbols on the main parts of the drawings

(1) contacts (2) elastic transitions (3) connections

(4) Socket pin (5) Spring (6) Conduit

(7) Base part (8) Position fixing hole (9) Divas contact

(10) DEVICE (11) Printed circuit board contacts (12) Printed circuit board

(13) fixing part

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a detailed cross-sectional view of an integrated circuit socket 1 embodying the present invention will be described in detail with reference to the accompanying drawings. An integrated circuit socket is generally a test object to be tested for electrical circuits, i.e. The same number of conductive probes as the electrical contact terminals of a semiconductor device are required.When making electrical contact, electrical connection must be made at an appropriate pressure between all contact terminals and the conductive probes. In order to achieve the above object, the present invention provides a fixing hole 8 in the same XY position as the device contact 9 in the elastic elastomer 7 and the elastomer 7 And a fixing body 13 having a storage space for penetrating the holes. And a socket pin serving as a probe so that the sealer 7 is accommodated in the fixing body 13 so that the hole of the fixing body and the position fixing hole 8 are located on the same axis, and are able to slide smoothly in the fixing hole 8. (4) is stored. The socket pins 4 are intended to protrude out of the holes of the fixture 13 only to the extent permitted by the device for preventing them from completely popping out of the holes of the fixture 13, the socket pins 4 being fixed A spring 5 which provides an elastic force to be pushed out of the hole of 13 is received in the positioning hole 8 and a part of the socket pin 4 is inserted into the spring 5. In addition, one lower end of the spring 5 has a conduit portion 6 which is tightly wound so that adjacent windings can stick together and be in electrical contact even without compression. When making contact, sufficient load is generated by first moving the fixture 13 towards the device 10 and then compressing the spring 5 by pushing the contact portion 1 of the socket pin 4 against the device contact 9. Good electrical connection is made between the socket pin 4 and the device contact 9. The electrical signal obtained from the device contact 9 is transmitted to the conduit 6 via the socket pin 4 and the spring 5. When the electrical signal is transmitted while rotating along the sparsely wound part of the spring 5, distortion is severely caused by an increase in inductance and resistance along the length.

However, as the spring 5 is compressed, a warpage occurs, and a contact between the connection part 3 and the conduit part 6 of the socket pin 4 is caused by the warpage, thereby forming an electrical passage. That is, in the sparsely wound part of the spring 5, an electrical passage is made along the axis of the socket pin 4, and is transmitted in the shortest distance that is a straight line to the tightly wound conduit 6. The conduit part 6 is made as compact as possible to stick together even in a free state. When compressed, the electric passage is not rotated, but is made up of vertical distances like a pipe, and the shortest distance is achieved by increasing the inductance and electrical resistance along the length. Minimize each component and role as follows.

In order to achieve the above object, the present invention provides a plurality of socket pins 4 having the same electrical characteristics and shapes, and the base portion 7 so that the positions of the socket pins 4 always coincide with the XY positions of the device contacts 9. ) Make a fixing hole (8) at the same XY position as the device contact (9), and insert the spring (5) here. And in order for the elasticity of the spring 5 to be converted into tension for continuous vertical movement of the socket pin 4, the outer diameter Φ of the portion of the socket pin 4 larger than the inner diameter Φ of the spring (5) 2) and the electrical connection between the socket pin 4 and the socket printed circuit board contact 11 is made while rotating along the spring 5, the electrical connection length is longer than the vertical connection. In order to solve this problem, the socket pin 4 is inserted into the inner diameter Φ of the spring 5 so that the lower end of the socket pin 4 is configured as a connection part 3 to be connected at the lower end of the spring 5. In addition, by using the conduit part 6 made of the compression type of the lower end of the spring (5) is made in electrical contact with the lower end of the connecting portion (3) it can minimize the length of the electrical connection made while rotating along the spring (5). That is, when the socket pin (4) moves up and down, when the spring (5) is subjected to the compression force, the conduit (6) is connected to each other and is not made while rotating along the length of the spring (5) to make a vertical connection The length of the electrical connection can be minimized, and the fixing part 13 can be included to maintain the shape and to protect the socket pin 4, and each component and role are as follows. Pin (4)

Socket pin (4) is composed of a plurality of electrical characteristics and the same shape, divided into contact portion (1), elastic switching portion (2), connecting portion (3) formed on the same axis, the material has good electrical transmission characteristics Good material with good wear resistance. For example, alloys such as beryllium copper are preferred. Further, the surface of the socket pin 4 may be plated to prevent oxidation of the surface in the air and to improve conductivity. Although the thickness and size of the socket pin 4 may be slightly different depending on the specifications of the device 10 to be applied, the thickness is appropriately 0.1 to 1.0 mm, and the length is appropriately 1.0 to 4.0 mm.

The function and role of each part of the socket pin 4 are as follows.

end. Contact (1)

Protruding from the end of the fixed portion by the elastic force of the spring to be repeatedly made electrical contact with the device contact (9) while transmitting an electrical signal into the device 10, between the device contact (9) and the contact (1) The contact resistance should be as small as possible, and an increase in the contact resistance may cause an error in determining the normal device 10 as defective.

Therefore, the shape of the pin and the elastic force of the spring 5 should be taken into consideration so as to reduce the contact resistance while minimizing the damage of the device contact 9. In order to prevent such an increase in contact resistance and to achieve more stable contact, the head of the contact part 1 may be M-shaped like a crown.

I. Elastic switching part (2)

The cross-sectional area of the portion between the contact portion 1 and the connection portion 3 of the socket pin 4 is larger than the size of the inner diameter Φ of the spring 5 so that the tension of the socket pin 4 is not self-elastic. It is a part to be maintained by elasticity, and also serves to prevent the socket pin from popping out of the fixture. It is preferable that the size of the elastic switching unit 2 be larger than the size of the inner diameter Φ of the spring 5 by 0.1 mm to 1.0 mm so as to stably switch the elasticity in consideration of the pitch of the device 10.

All. Connecting part 3 is a part for minimizing electrical connection in the part where spring 5 is sparsely wound to provide elasticity to socket pin 4, and when electrical connection is made while rotating along the winding of spring 5 The electrical connection is much longer than that along the axis. In order to prevent this phenomenon, the connection part 3 is inserted into the inner diameter of the spring 5 and overlaps with the conduit part. When contacted with the device contact and the contact 1, the spring 5 is bent under compressive force, whereby a connecting portion inserted into the inner diameter of the spring 5 is electrically connected to the conduit 6 and makes an electrical connection along the axis.

In order to smooth the squeezing and smoothing of the spring inside the spring, it is preferable that the thickness of the outer diameter Φ of the connecting portion 3 is about 0.01 to 0.03 mm smaller than the inner diameter Φ of the spring 5.

② Spring (5)

It consists of a concave winding portion 6 which is made of a sparsely wound part for providing elasticity to continuously maintain the vertical movement of the socket pin 4 and the windings adjacent to each other.

Since the elasticity of the spring 5 directly affects the tension of the socket pin 4, the following should be considered. First, when the elastic force is low, a soft contact phenomenon occurs in which electrical contact resistance increases between the contact portion 1 of the socket pin 4 and the contact 9 of the device. This creates a serious problem of misjudgment and, conversely, an increase in elasticity causes damage to the contact 9 of the device. Thus, the elasticity of the spring 5 causes damage to the electrical contact resistance between the contact 1 and the contact 9 of the device. Must satisfy the conditions to minimize simultaneously. Therefore, as a result of the experiment, the elastic force of the spring 5 is less than about 10g to 100g when 0.2 to 0.3mm is contracted.

Use materials with excellent elasticity and durability, but it is better to plate for discoloration and conductivity improvement. Wire diameter Φ is 0.1 ~ 0.05mm, outer diameter Φ is 0.3 ~ 0.8mm and inner diameter Φ is 0.15 ~ 0.3mm. In addition, heat resistance against temperature is also important, and the temperature range is -40 to 250 ° C.

③ Conduit part (6)

If it is compressed and made as compact as possible so that neighboring windings can stick together even in the free state, the electric passage is not made by rotating in this part but it acts like a tube to make the electric passage the shortest distance to increase the inductance and electric resistance along the length. Minimize.

When electrical contact is made between the socket pin 4 and the device contact 9, the spring 5 is pressurized and a warpage occurs, thereby causing contact between the connection part 3 and the conduit part 6. The electrical connection passage is not made while rotating along the winding of the spring (5), so that the vertical connection passage is made by the connection portion 3 and the conduit portion 6 to minimize the electrical connection length.

④ Position fixing hole (8)

The position fixing hole 8 is formed by penetrating the elastic stormer 7 having elastic force at the same XY position as the contact point 9 of the device and accommodating the spring 5, and by the elastic force (shrinkage force) of the stormer spring ( 5) prevents the falling out, the spacing and position of the position fixing hole 8 is determined by the specifications of the device 10 applied.

In addition, the size of the position fixing hole 8 is slightly different depending on the specification of the application device 10, and in the case of using a storm heater, it is about 0.01 to 0.1 mm smaller than the outer diameter Φ of the spring 5, It is good to prevent the spring 5 from being easily pulled out by the elastic force (shrinkage force).

⑤Government government (13)

The fixing part has a storage space of the heater 7 and a through hole for accommodating the socket pin 4, and the protection of the socket pin 4 and the appearance of the integrated circuit socket (Fig. 1). The material of this part is good material such as high tensile, high strength engineering plastic. In addition, it should be electrically insulated and the temperature range is -40 ~ 250 ℃. And the shape of the appearance may vary depending on the intended application.

As described above, according to the present invention, the electrical signal between the printed circuit board and the device contact of the test system is tightly wound around the connection part of the socket pin and the lower end of the spring and transmitted through the conduit part, so that the winding is performed in order to obtain elastic force. Even if the number of turns of the wound is high, the electrical signal is transmitted to the conduit along the axial direction of the socket pin rather than through the winding portion, thereby reducing the inductance and resistance proportional to the square of the number of turns, and minimizing the length of the electrical connection. It is possible to provide an integrated circuit socket that can greatly improve the electrical transmission characteristics. In addition, the socket pin is vertically moved by the elasticity of the elastic converter and the spring to maintain the tension in the minimum space.

Claims (7)

It is used in the test process for electrically inspecting the completeness of devices in the semiconductor manufacturing process and classifying them as good or bad. The device contacts, that is, the electrical input / output terminals, leads or balls. In the integrated circuit socket serving as a medium for the electrical connection between the circuit board contacts) An elastic heater 7 having a position fixing hole 8 penetrated at the same X-Y position as the device contact 9; And A fixed body 13 having a storage space and a through hole for accommodating the heater 7; The heater 7 is accommodated in the fixing body 13 such that the position fixing hole 8 and the hole of the fixing body 13 are located on the same axis. It is accommodated in the position fixing hole 11 so as to be able to move smoothly, and provided with a contact portion (1) protruding out of the end of the fixing body 13 and a connecting portion (3) extending on the same axis from the contact portion (1) Socket pins 4; A spring (5) housed in the positioning hole (8) to provide elasticity that causes the contact portion (1) to protrude out of the fixture (13); And The spring (5) is an integrated circuit socket (Fig. 1), characterized in that it has a tightly wound conduit (6) in which the adjacent windings are attached to each other at the lower end, even if compressed to any extent. 2. An integrated circuit socket (Fig. 1) according to claim 1, characterized in that an elastic converter (2) is provided between the head (1) and the connecting portion (2) which is larger than the inner diameter of the spring (5). The method according to claim 1, wherein when the spring (5) is compressed by inserting the connecting portion (3) into the inner diameter (Φ) of the spring (5), the connecting portion (3) and the conduit portion (6) overlap and electrical connection is made. Integrated circuit socket, characterized in that (Fig. 1). 2. The conduit section (6) according to claim 1, characterized in that it has a conduit (6) with a distance of 0 mm between the winding of the spring (5) and the lower end of the spring (5) which meets the connecting section (3) in order to minimize the electrical connection length. Integrated circuit socket (Fig. 1). The method according to claim 1, wherein the position fixing hole (8) is made in the elastomer (7), and the spring (5) housed in the position fixing hole (8) is the said heater (7). Integrated circuit socket, characterized in that not to fall out by the elastic force of the (). delete The method according to claim 1, wherein when used upside down according to the use environment, that is, the lower end or the conduit 6 of the spring 5 meets the device contact 9 and the contact 1 of the socket pin 4 contacts the printed circuit board. An integrated circuit socket (FIG. 1) characterized by being in contact with (11).