KR100434754B1 - an IC chip adhesive system of credit card - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an integrated circuit chip bonding apparatus for temporarily bonding a thermal adhesive tape to the back surface of an integrated circuit chip as a preliminary step for thermally bonding an IC chip to a surface of a credit card or a transportation card.

In general, the integrated circuit chip made of metal thin film and PVC card are composed of different materials, and due to the heterogeneity, the integrated circuit chip could not be firmly adhered to the surface of the card, which causes the card stored in the wallet to bend or When deformed, a closed circuit occurred such that the integrated circuit chip easily fell off the surface of the card.

Therefore, in the present invention, before the integrated circuit chip 12 is bonded to the thermal adhesive tape 13, the plasma torch 40 discharges the working gas mixed with air to precisely control the size and temperature of the flame. Since the flame is sprayed, foreign matters or impurities remaining on the adhesive surface of the integrated circuit chip 12 are cleanly treated, and the surface of the adhesive surface is finely embossed to eventually increase the contact area, thereby increasing the adhesive strength as much as possible. The integrated circuit chip is very firmly adhered to the surface of the card to provide a high quality integrated circuit chip card that minimizes chip fall or deformation.

Description

An IC chip adhesive system of credit card

The present invention is a bonding device for an integrated circuit chip for temporarily bonding a thermal adhesive tape on the back surface of an integrated circuit chip as a preliminary step for thermally bonding an integrated circuit chip (IC chip) to the surface of a credit card or a transportation card. It is about.

In general, credit cards are a type of consumer credit. Members who sign a contract with a card issuer can purchase goods or services at affiliated retail stores without spending cash.There are various types of credit cards. This card is also used for public transportation.

Magnetic tape is attached to the back of the credit card to record member information, but in modern times, the use of integrated circuit chips is increasing day by day to input more and more diverse information.

The integrated circuit chip may be embedded in a card, but is mainly configured to be bonded while being heated and pressurized by a heat-adhesive tape on the surface of the card. The integrated circuit chip may be formed of a PVC thin film pattern and Are made of different materials.

Therefore, due to the heterogeneity of the materials, the integrated circuit chip could not be firmly adhered to the surface of the card. As a result, the integrated circuit chip easily falls off the surface of the card when the card stored in the wallet is bent or deformed. This occurred.

In addition, if foreign matter or impurities on the adhesive surface are cleanly treated before attaching the integrated circuit chip to the surface of the card, the adhesion strength can be maximized. However, the work of precisely surface treating the integrated circuit chip made of very thin film is almost impossible. It was impossible to increase the adhesion.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object thereof is to bond an integrated circuit chip for a credit card that can maximize the adhesive strength by cleanly treating the adhesive surface before bonding the integrated circuit chip to a thermal adhesive tape. In providing a device.

A feature of the present invention for achieving the above object is that the integrated circuit chip 12 and the thermal adhesive tape 13 wound on the reels (11a) (11b) mounted on both sides of the vertical work table (1) A conveying part 10 wound together with a storage reel 11c mounted on the other side of the work table 1 while being transported through the driving roller 14 and the idle rollers 15; At the portion where the integrated circuit chip 12 and the heat adhesive tape 13 are joined together, a heat plate 22 having a pressure plate 21 and a heating wire heater 22a built therein, which are elevated by a cylinder 21a, is mounted. A thermal bonding portion 20 for heating and pressurizing the 13 and the integrated circuit chip 12; The lower part of the casing 31 mounted on one side of the work table 1 is equipped with a duct 32 connected to the exhaust pump 34 and the hose 33, and the heat adhesive tape 13 is connected to the casing 31 and the duct. A gas discharge part 30 transferred through the gap 31a between the 32; The inside of the casing 31 is equipped with a plasma torch 40 having a nozzle 41 for injection therein, and the air and the working gas introduced through the supply hoses 41a and 41b connected to the upper portion thereof, respectively. Is sprayed through each of the flow paths 42a and 42b and the nozzles 41 and discharged by the electrode 42 to inject a flame to surface-treat the adhesive surface of the integrated circuit chip 12. It can be achieved by the bonding apparatus of the integrated circuit chip for the card.

1 is a schematic device diagram illustrating an embodiment of the present invention;

2 is an enlarged perspective view of a part of the present invention;

3 is a nozzle site cross-sectional view of the plasma torch according to the present invention;

Figure 4 is a front view illustrating a state in which the integrated circuit chip is bonded to the surface of the traffic card according to the present invention.

Explanation of symbols on the main parts of the drawings

1: worktable 10: conveying part

11a, 11b, 11c: reel 12: integrated circuit chip

13: heat adhesive tape 14: drive roller

15: idler roller 16: paper roller

20: bonding portion 21: pressure plate

21a, 43: cylinder 22: hot plate

22a: heater 30: discharge part

31: casing 31a: niche

32: duct 33: hose

34: pump 40: plasma torch

41: nozzles 41a, 41b: supply hose

42a, 42b: 50 as a distribution card

60: ATR tester 61: sensor

70: perforator

Hereinafter, described in detail by the accompanying drawings a preferred embodiment for achieving the above object is as follows.

As shown in Figs. 1 to 4, reels 11a and 11b are mounted on both sides of the worktable 1, which is standing vertically, and the reel 11a and 11b are integrated circuit chips 12 and The thermal adhesive tapes 13 are respectively wound up.

The integrated circuit chip 12 and the heat-adhesive tape 13 wound on the reels 11a and 11b, respectively, are mounted on the work table through driving rollers 14 and idle rollers 15 mounted on both sides of the work table 1. (1) It is structured to be conveyed and wound together in the direction of the storage reel 11c attached to the other side.

Of course, the driving rollers 14 are transferred to the integrated circuit chip 12 and the heat-adhesive tape 13 while being rotated at a predetermined speed by receiving power from a motor (not shown) mounted behind the work table 1. It is supposed to be.

The above-described configuration serves to transfer the integrated circuit chip 12 and the thermal adhesive tape 13 in the direction of the storage reel (11c) to be wound around the transfer unit (10).

The integrated circuit chip 12 and the thermal adhesive tape 13 are joined to each other while passing through oppositely installed paper rollers 16.

The pressing plate 21 is mounted at the lower portion of the portion where the integrated circuit chip 12 and the thermal adhesive tape 13 are joined by the lamination roller 16, and the pressing plate 21 operates the pneumatic cylinder 21a. The heat plate 22 having the heating element heater 22a therein is mounted on the upper portion of the pressure plate 21.

In the above-described configuration, the pressurizing plate 21 is elevated by the operation of the cylinder 21a to temporarily press the integrated circuit chip 12 and the heat adhesive tape 13 passing between the hot plate 22 and the pressurizing plate 21. Serves as a thermal adhesive 20 to bond to.

One side of the worktable 1 is mounted with a casing 31 whose lower part is open, and a duct 32 connected with an exhaust pump 34 and a hose 33 is mounted at the lower part of the casing 31.

A gap 31a is formed between the casing 31 and the duct 32 at a predetermined interval, and the heat-adhesive tape 13 is transferred through the gap 31a.

The above-described configuration is characterized in that the plasma torch 40, which will be described later, is mounted inside the casing 31 to block the ionized harmful gas generated by spraying the flame with the casing 31, while the duct 32 and the hose 33 It serves as a gas discharge unit 30 to discharge the pump to a specific place through).

Inside the casing 31 is mounted a plasma torch 40 having a spray nozzle 41 at the bottom thereof, and supply hoses 41a and 41b are connected to the upper portion of the plasma torch 40, respectively. Thus, the air and the working gas are injected through the flow passages 42a and 42b formed in the plasma torch 40 formed of the pipes, respectively, to be sprayed through the nozzle 41.

An electrode rod 42 is mounted inside the nozzle 41 to discharge the working gas discharged by mixing with air, thereby injecting a flame, and the flame remains on the adhesive surface of the integrated circuit chip 12. It cleans and burns foreign substances or impurities to enhance adhesion. The spark generated at this time has a temperature of 1100 to 1200 ℃, the flame is sprayed evenly on the adhesive surface of the integrated circuit chip 12 is moved to a width of 4 to 5mm and a length of about 3cm.

Of course, the apparatus is provided with a transformer and a rectifier to adjust the voltage and current to precisely control the size and temperature of the flame sprayed from the plasma torch 40, and the mixing amount of the mixed gas and the working gas is appropriately adjusted. It is obvious that it is configured to be adjustable.

The plasma torch 40 is mounted on the cylinder 43 so that the flame can be evenly sprayed on the entire adhesive surface of the integrated circuit chip 12 while being reciprocated.

A perforator 70 may be mounted on the side of the heat adhesive tape 13 through which the heat adhesive tape 13 is wound between the reel 11b, which is transferred between the lamination rollers 16, to make a hole in the heat adhesive tape 13. These holes are drilled to conduct the circuits embedded in the integrated circuit chip 12 and the card 50 with each other.

The sensor 61 and the circuit for detecting the position of the integrated circuit chip 12 is moved on the side of the adhesive tape 13, which is transferred between the lamination rollers 16 in the reel 11a on which the integrated circuit chip 12 is wound. An ATR tester 60 for testing a short circuit of the pattern is mounted so that the presence or absence of a short circuit of the circuit pattern can be determined before the integrated circuit chip 12 is thermally bonded.

In the present invention having the above-described configuration, the plasma torch 40 mounted inside the casing 31 discharges a working gas mixed with air, thereby injecting a flame in which the size or temperature of the flame is precisely controlled. Before the circuit chip 12 is adhered to the thermal adhesive tape 13, the foreign matter or impurities remaining on the adhesive surface of the integrated circuit chip 12 are burned clean so that the adhesive force can be maximized.

As such, when the adhesive surface of the integrated circuit chip 12 is cleanly cleaned and heated and pressurized in the thermal bonding portion 20 in a state where various foreign substances or impurities are removed, the thermal adhesive tape 13 is temporarily attached to the adhesive surface of the integrated circuit chip 12. Since it is to be bonded to it can be stored after winding to the storage reel (11c).

The integrated circuit chip 12 and the heat-adhesive tape 13 wound on the storage reel 11c are transferred to the next process, cut to a predetermined size, and then pressurized and heated for 2 to 3 times as shown in FIG. 4. As described above, it is firmly adhered to the surface of the card 50.

At this time, the adhesive surface of the integrated circuit chip 12 wound on the storage reel (11c) is flame-treated and temporarily bonded to the thermal adhesive tape 13 in the state that the adhesive force is maximally strengthened, the integrated circuit in the next process When the chip 12 is bonded to the card 50, it is very firmly bonded so that the card 50 is never dropped even when the card 50 is bent or deformed, thereby enhancing the external competitiveness of the credit card having the integrated circuit chip as much as possible. .

As described above, in the present invention, before the integrated circuit chip 12 is adhered to the thermal adhesive tape 13, the plasma torch 40 is discharged to discharge the working gas mixed with the air, and thus the size and temperature of the flame. It is possible to increase the adhesive force as much as possible by burning and processing the foreign substances or impurities remaining on the adhesive surface of the integrated circuit chip 12 because the back is sprayed with a precisely controlled flame, so that the integrated circuit chip adheres very firmly to the surface of the card. There is an advantage, such as to provide a high quality integrated circuit chip card that minimizes chipping or deformation.

Claims (2)

The integrated circuit chip 12 and the thermal adhesive tape 13 wound on the reels 11a and 11b mounted on both sides of the worktable 1 standing vertically are driven through the driving rollers 14 and the idle rollers 15. A transfer unit 10 wound together with the storage reel 11c mounted on the other side of the work table 1 while being transferred; At the portion where the integrated circuit chip 12 and the heat adhesive tape 13 are joined together, a heat plate 22 having a pressure plate 21 and a heating wire heater 22a built therein, which are elevated by a cylinder 21a, is mounted. A thermal bonding portion 20 for heating and pressurizing the 13 and the integrated circuit chip 12; The lower part of the casing 31 mounted on one side of the work table 1 is equipped with a duct 32 connected to the exhaust pump 34 and the hose 33, and the heat adhesive tape 13 is connected to the casing 31 and the duct. A gas discharge part 30 transferred through the gap 31a between the 32; The inside of the casing 31 is equipped with a plasma torch 40 having a nozzle 41 for injection therein, and the air and the working gas introduced through the supply hoses 41a and 41b connected to the upper portion thereof, respectively. Is discharged by the electrode rod 42 while injecting through each of the flow passages 42a and 42b and the nozzle 41 to inject the flame, and the temperature of 1100 to 1200 ° C, the width of 4 to 5 mm and the length of about 3 cm. Bonding apparatus for a credit card integrated circuit chip, characterized in that the sprayed flame is evenly sprayed on the adhesive surface of the integrated circuit chip (12). The method of claim 1, wherein the plasma torch 40 is mounted on the cylinder 43, the credit card integrated, characterized in that to spray the flame evenly on the adhesive surface of the integrated circuit chip 12 while reciprocating Junction device for circuit chip.