KR100424892B1 - Two Fold Floor Material and Manufacturing Method Thereof - Google Patents
Two Fold Floor Material and Manufacturing Method Thereof Download PDFInfo
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- KR100424892B1 KR100424892B1 KR10-2001-0080687A KR20010080687A KR100424892B1 KR 100424892 B1 KR100424892 B1 KR 100424892B1 KR 20010080687 A KR20010080687 A KR 20010080687A KR 100424892 B1 KR100424892 B1 KR 100424892B1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B21/00—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board
- B32B21/02—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board the layer being formed of fibres, chips, or particles, e.g. MDF, HDF, OSB, chipboard, particle board, hardboard
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/02—Temperature
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/04—Time
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/12—Pressure
Abstract
본 발명은 전도성 또는 비전도성 타일과 조합목재를 소재로 하는 이중 바닥재 및 그 제조 방법을 개시한다.The present invention discloses a double floor and a method of manufacturing the same, based on conductive or non-conductive tiles and wood.
본 발명은 바닥재의 국압성과 내수성을 보강함과 아울러 경량화된 이중 바닥재 및 그 제조 방법을 제공하기 위하여 전도성 또는 비전도성 타일의 하방에 단판(單板)층과 조합목재층이 교호로 형성되도록 하며, 그 하방에 알루미늄이나 기타 차단재가 위치하도록 하고 이들 사이에 멜라민 수지등 난연성 열경화 수지를 도포한 후 열압프레스로 성형하여서 된 이중 바닥재 및 그 제조 방법을 제안한다.The present invention is to alternately form a single layer and a combination wood layer under the conductive or non-conductive tile in order to reinforce the pressure and water resistance of the flooring material and to provide a lightweight double flooring material and a method of manufacturing the same. It proposes a double floor and a method of manufacturing the same by placing aluminum or other shielding material below and applying a flame retardant thermosetting resin such as melamine resin therebetween and then molding it by hot press.
이에 따라 본 발명은 중량물이 이동에도 변형이나 손상됨이 거의 없고, 내수성이 우수하여 내구성이 탁월하게 되는 효과가 있다.Accordingly, the present invention is hardly deformed or damaged even when the weight is moved, and has excellent water resistance and thus has excellent durability.
Description
본 발명은 이중 바닥재 및 그 제조 방법에 관한 것으로 특히 전도성 또는 비전도성 타일과 조합목재를 소재로 하는 이중 바닥재 및 그 제조 방법에 관한 것이다.TECHNICAL FIELD The present invention relates to a double floor and a method of manufacturing the same, and more particularly, to a double floor using a conductive or non-conductive tile and a combination wood as a material and a method of manufacturing the same.
주지하는 바와 같이 종래에는 건축물의 바닥위에 또 다른 바닥을 시공하여 배선을 위한 공간을 확보하도록 설계된 이중바닥재(ACCESS FLOOR)가 활용되고 있으며,As is well known, a double floor material (ACCESS FLOOR) designed to secure a space for wiring by constructing another floor on the floor of the building is conventionally utilized.
배선의 시스템화를 통해 쾌적한 사무환경을 유도하고 배선의 안전 및 융통성 확보하고 있는 것이다. 이러한 이중바닥재는 액세스 플로어(ACCESS FLOOR)와 사무용 플로어(OA FLOOR)로 구분될 수 있다.Systemization of wiring leads to a pleasant office environment and secures safety and flexibility of wiring. These floors can be divided into ACCESS FLOOR and OA FLOOR.
이중에 액세스 플로어는 대규모배선 및 바닥내 공조시설, 배수설비가 수용가능하고 방음방진시설물, 특수시설물, 대형시설물에 적용하는 것이며, 마감재는 주로 대전방지타일과 전도성타일로 실시한다.The access floor is used for large-scale wiring, floor air conditioning facilities and drainage facilities, and is applied to soundproof dustproof facilities, special facilities, and large facilities. The finishing materials are mainly composed of antistatic tiles and conductive tiles.
또한, 사무용 플로어는 하중이 적고 배선 용량이 적은 일반사무실이나 개보수건물에 주로 사용하는 것이며, 마감재는 주로 카펫타일로 실시한다.In addition, the office floor is mainly used in general offices or renovated buildings with low load and low wiring capacity, and finishes are mainly performed with carpet tiles.
이러한 이중 바닥재의 구조를 살펴보면 도1로 도시한 바와 같이 전도성 또는 비전도성 타일(100) 전도성 또는 비전도성 타일(100)의 하방에 원목에서 목재를 생산하고 남은 조각을 잘게 부수어 한켜씩 펴고, 그 사이에 접착제를 뿌려 높은 온도와 압력으로 압축시켜 판 모양으로 만든 파티클 보드(101)를 접착시키며, 그 저면에 알루미늄 박지등의 차단재(102)를 접착하여서 된 것이다.Looking at the structure of such a double flooring as shown in Figure 1 conductive or non-conductive tile (100) below the conductive or non-conductive tile (100) to produce wood from the wood and finely crush the remaining pieces, and between Sprinkle the adhesive to a high temperature and pressure to adhere to the particle board 101 made of a plate-like shape, it is made by adhering the blocking material 102 such as aluminum foil on the bottom.
이러한 종래의 바닥재는 파티클 보드(101)에 의하여 흡음성이 높고, 단열 효과가 우수하며, 넓은 면적의 판재를 제조할 수 있다는 장점을 얻을 수 있으나, 국부적으로 가하여지는 압력이 높은 경우 파티클 보드(101)가 변형되어 내구성을 확보하기 어려우며,Such a conventional flooring material can be obtained by the particle board 101 has a high sound absorption, excellent thermal insulation effect, can be produced a plate of a large area, but when the pressure is applied locally, the particle board 101 Is difficult to ensure durability by
더욱이 수분이 파티클 보드(101)에 침투되는 경우 부풀음이 발생하며, 이에 따라 쉽게 휘어 바닥면의 평탄도를 유지하기 어렵게 되는 등의 문제점이 있는 것이어서 그 수명이 짧게 되어 주기적인 재 시공이 필요하게 되는 문제점이 있는 것이다.In addition, when moisture penetrates the particle board 101, swelling occurs, and thus, there is a problem such that it is difficult to bend and maintain the flatness of the bottom surface, which shortens its lifespan and thus requires periodic reconstruction. There is a problem.
본 발명의 목적은 이러한 문제점을 해결하기 위하여 바닥재의 국압성과 내수성을 보강함과 아울러 경량화된 이중 바닥재 및 그 제조 방법을 제공함에 있다.It is an object of the present invention to provide a lightweight double flooring and a method of manufacturing the same as well as reinforcing the pressure and water resistance of the flooring to solve such problems.
도1은 종래의 이중바닥재를 보인 종단면도.Figure 1 is a longitudinal sectional view showing a conventional double floor.
도2는 본 발명에 의한 이중 바닥재의 구조를 보인 종단면도.Figure 2 is a longitudinal sectional view showing a structure of a double floor according to the present invention.
*도면의 주요 부분에 대한 부호의 설명* Explanation of symbols for the main parts of the drawings
1:전도성 타일 또는 비전도성 타일1: conductive tiles or non-conductive tiles
2:차단재2: blocker
3:단판층3: single layer
4:블록보드4: blockboard
이러한 본 발명의 목적은 전도성 또는 비전도성 타일의 하방에 단판(單板)층과 조합목재층이 교호로 형성되도록 하며, 그 하방에 알루미늄 박판등 차단재가 위치하도록 하되, 이들 사이에 멜라민 수지등 난연성 열경화 수지를 도포한 후 열압프레스로 성형하여서 된 이중 바닥재 및 그 제조 방법을 제안한다.The object of the present invention is to be formed alternately between the single layer (조합) layer and the combination wood layer below the conductive or non-conductive tile, and to place a shielding material such as aluminum thin plate beneath it, between the flame retardant such as melamine resin The present invention proposes a double bottom material formed by applying a thermosetting resin and then molded by a hot press and a method of manufacturing the same.
이에 따라 본 발명은 중량물의 이동에도 변형이나 손상됨이 거의 없고, 내수성이 탁월하여 내구성이 높은 바닥재를 제공하게 되는 효과가 있다.Accordingly, the present invention is hardly deformed or damaged even in the movement of heavy materials, and has an effect of providing a durable flooring material having excellent water resistance.
이러한 본 발명을 첨부된 도면을 참조하여 더욱 상세히 설명하면 다음과 같다.Referring to the present invention in more detail with reference to the accompanying drawings as follows.
전도성 타일 또는 비전도성 타일(1) 및 차단재(2)로 사용되는 알루미늄 박판등을 구비하여서 된 공지의 것에 있어서, 1 mm 내지 3 mm 두께인 복수개의 단판층(3)과, 두께 10mm 내지 20mm인 복수개의 블록보드(4)(Block Board)를 준비하여 이들을 중첩시키되 이들의 접촉면에 각각 접착용 멜라민 수지등 난연성 열경화 수지를 양면 또는 단면으로 도포량 200g/m2내지 350g/m2가 되도록 스프레더(spreader)로 고르게 도포하고, 열압프레스로 이들을 압착하되, 110℃ 내지 150℃의 온도에서 8Kg/cm2내지 15Kg/cm2의 압력으로 20분 내지 30분간 압착하여 목재합판을 얻고 전기 타일(1) 및 차단재(2) 사이에 접착하여서 된 것이다.In the well-known thing provided with the aluminum thin plate etc. used as the conductive tile or the non-conductive tile 1, and the barrier material 2, it is a several single plate layer 3 of 1 mm-3 mm thickness, and is 10 mm-20 mm thickness. Prepare a plurality of block boards (4) (Block Board) and superimpose them, and spread the flame retardant thermosetting resins such as melamine resin for adhesion to their contact surfaces on both sides or in a cross section of 200g / m 2 to 350g / m 2. spread evenly with a spreader), and compress them with a thermopress press, compressing them for 20 minutes to 30 minutes at a pressure of 8 Kg / cm 2 to 15 Kg / cm 2 at a temperature of 110 ° C. to 150 ° C. to obtain a wood plywood, and the electric tile (1) And adhesive between the barrier material 2.
이와 같이 하여 본 발명은 열압착과정에서의 고압, 고열에 의하여 멜라민 수지등난연성 열경화수지가 단판층(3)과 블록보드(4)에 고루 침투한 상태에서 경화되어 있는 것이어서 내국압성과 내수성등이 탁월하게 된다.In this way, the present invention is that the flame retardant thermosetting resin such as melamine resin is hardened in the state of penetration into the end plate layer (3) and the block board (4) by high pressure and high heat during the thermocompression bonding process. This is excellent.
이러한 본 발명을 구체적인 실시예에 의하여 상세히 설명하면 다음과 같다.When the present invention will be described in detail by specific embodiments as follows.
실시예1Example 1
본 실시예에서는 먼저 2mm 두께의 단판층(3) 2개를 표면층과 중면층으로 하고 그 하방에 두께 12mm인 블록보드(4)(Block Board)를 놓고 그 하방에 1.2mm두께의 단판층(3) 1개층을 중면층으로 배열하며, 두께 12mm인 블록보드(4)를 그 하방에 배치하고 이의 하방에는 2개의 두께 2.0mm인 단판층(3)을 배치하되, 이들의 접촉면에 멜라민 수지를 도포량 250g/m2가 되도록 스프레더(spreader)로 고르게 펴 바르고, 열압프레스로 이들을 압착하되, 130℃의 온도에서 9Kg/cm2의 압력으로 25분간 압착하여 완성하였던 바 이러한 본 발명에 의한 이중 바닥재는 내국압성 시험결과 500Kg/f의 하중에서 2mm의 휨율이 측정되었으며, 압축파괴하중 시험을 실시한 결과 1500Kg/f이상의 우수한 결과를 얻었으며, 내수성 시험결과 변형이 없는 양호한 결과를 얻었다.In the present embodiment, first, two 2 mm thick single plate layers 3 are used as the surface layer and the middle layer, and a block board 4 (Block Board) having a thickness of 12 mm is placed below the 1.2 mm thick single plate layer (3). 1 layer is arranged in the middle layer, and a block board 4 having a thickness of 12 mm is disposed below it, and a single plate layer 3 having two thicknesses of 2.0 mm is disposed below it, and a melamine resin is applied to the contact surfaces thereof. Spread it evenly with a spreader to 250g / m 2 , and compress them by a hot press, it was completed by pressing for 25 minutes at a pressure of 9Kg / cm 2 at a temperature of 130 ℃ bar double floor according to the present invention is domestic As a result of the pressure test, a bending rate of 2 mm was measured at a load of 500 Kg / f, and the compression fracture test resulted in excellent results of more than 1500 Kg / f. The water resistance test resulted in a good result without deformation.
실시예2Example 2
본 실시예에서는 먼저 1.2mm 두께의 단판층(3) 2개를 표면층과 중면층으로 하고 그 하방에 두께 13mm인 블록보드(4)(Block Board)를 놓고 그 하방에 2.0mm두께의 단판층(3) 1개층을 중면층으로 배열하며, 두께 13.0mm인 블록보드(4)를 그 하방에 배치하고 이의 하방에는 두께 7mm인 단판층(3)을 배치하되, 이들의 접촉면에 멜라민 수지를 도포량 250g/m2가 되도록 스프레더(spreader)로 고르게 펴 바르고, 열압프레스로 이들을 압착하되, 130℃의 온도에서 8Kg/cm2의 압력으로 30분간 압착하여 완성하였던 바 이러한 본 발명에 의한 이중 바닥재는 내국압성 시험결과 500Kg/f의 하중에서 2mm의 휨율이 측정되었으며, 압축파괴하중 시험을 실시한 결과 1500Kg/f이상의 우수한 결과를 얻었으며, 내수성 시험결과 변형이 전혀 없는 우수한 결과를 얻었다.In this embodiment, first, two 1.2 mm thick single plate layers 3 are used as the surface layer and the middle layer, and a block board 4 (Block Board) having a thickness of 13 mm is placed below the 2.0 mm thick single plate layer ( 3) Arrange one layer in a middle layer, and place a block board 4 having a thickness of 13.0 mm below the bottom and a single plate layer 3 having a thickness of 7 mm below the bottom, and apply a melamine resin to the contact surfaces thereof. Spread evenly with a spreader (spreader) to be / m 2 , and compress them by a hot press, which was completed by pressing for 30 minutes at a pressure of 8Kg / cm 2 at a temperature of 130 ℃ bar double floor according to the present invention is pressure-resistant As a result of the test, the bending rate of 2mm was measured at the load of 500Kg / f. The compression failure test resulted in excellent results of more than 1500Kg / f, and the water resistance test resulted in no deformation at all.
실시예3Example 3
본 실시예에서는 먼저 1.2mm 두께의 단판층(3) 2개를 표면층과 중면층으로 하고 그 하방에 두께 12.7mm인 블록보드(4)(Block Board)를 놓고 그 하방에 1.2mm두께의 단판층(3) 1개층을 중면층으로 배열하며, 두께 12.7mm인 블록보드(4)를 그 하방에 배치하고 이의 하방에는 두께 1.2mm인 단판층(3)을 배치하되, 이들의 접촉면에 멜라민 수지를 도포량 300g/m2가 되도록 스프레더(spreader)로 고르게 펴 바르고, 열압프레스로 이들을 압착하되, 130℃의 온도에서 7Kg/cm2의 압력으로 20분간 압착하여 완성하였던 바 이러한 본 발명에 의한 이중 바닥재는 내국압성 시험결과 500Kg/f의 하중에서 2mm의 휨율이 측정되었으며, 압축파괴하중 시험을 실시한 결과 1500Kg/f이상의 우수한 결과를 얻었으며, 내수성 시험결과 변형이 없는 우수한 결과를 얻었다.In this embodiment, two single plate layers 3 of 1.2 mm thickness are used as the surface layer and the middle layer, and a block board 4 (Block Board) having a thickness of 12.7 mm is placed below, and a single plate layer having a thickness of 1.2 mm is below. (3) Arrange one layer in a middle layer, and place a block board 4 having a thickness of 12.7 mm below it, and a single plate layer 3 having a thickness of 1.2 mm below it, with melamine resin on the contact surface thereof. Evenly spread with a spreader (spreader) so as to apply the coating amount 300g / m 2 , and compressing them by a hot press, it was completed by pressing for 20 minutes at a pressure of 7Kg / cm 2 at a temperature of 130 ℃ bar floor according to the present invention As a result of the pressure resistance test, the bending rate of 2mm was measured at the load of 500Kg / f, and the compression fracture test resulted in excellent results of more than 1500Kg / f.
이러한 실시예1,2,3에 의한 결과는 내 국압성을 평가할때 기준인 500Kg/f의 하중에서 4mm인 기준치의 1/2이하이며, 내수성 또한 월등히 우수한 수준임을 알 수 있었다.The results according to Examples 1, 2, and 3 were less than 1/2 of the reference value of 4 mm at the load of 500 Kg / f, which is the standard when evaluating the pressure resistance, and it was found that the water resistance was also excellent.
이와 같이 하여 본 발명은 종래의 이중 바닥재에 비하여 월등한 내국압성, 내하중성, 내수성등이 모두 우수하여 내구성이 높은 고품질의 이중 바닥재를 제공할 수 있게 되는 유용한 효과가 있다.In this way, the present invention has a useful effect that can provide a high-quality double flooring material with excellent durability, excellent domestic pressure resistance, load resistance, water resistance and the like compared to the conventional double flooring material.
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0168247A2 (en) * | 1984-07-10 | 1986-01-15 | Thorsman & Co. (U.K.) Limited | An improved access floor structure |
JPH05272227A (en) * | 1992-03-23 | 1993-10-19 | Nichias Corp | Floor panel for free-access floor |
JPH07292943A (en) * | 1994-04-26 | 1995-11-07 | Sekisui Seikei Kogyo Kk | Flooring |
JP2000127296A (en) * | 1998-10-22 | 2000-05-09 | Noda Corp | Board for building |
JP2000355073A (en) * | 1999-06-15 | 2000-12-26 | Sato Kakosho:Kk | Laminated sheet |
-
2001
- 2001-12-18 KR KR10-2001-0080687A patent/KR100424892B1/en not_active IP Right Cessation
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0168247A2 (en) * | 1984-07-10 | 1986-01-15 | Thorsman & Co. (U.K.) Limited | An improved access floor structure |
JPH05272227A (en) * | 1992-03-23 | 1993-10-19 | Nichias Corp | Floor panel for free-access floor |
JPH07292943A (en) * | 1994-04-26 | 1995-11-07 | Sekisui Seikei Kogyo Kk | Flooring |
JP2000127296A (en) * | 1998-10-22 | 2000-05-09 | Noda Corp | Board for building |
JP2000355073A (en) * | 1999-06-15 | 2000-12-26 | Sato Kakosho:Kk | Laminated sheet |
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