CA2210558A1 - Composite panel - Google Patents
Composite panelInfo
- Publication number
- CA2210558A1 CA2210558A1 CA 2210558 CA2210558A CA2210558A1 CA 2210558 A1 CA2210558 A1 CA 2210558A1 CA 2210558 CA2210558 CA 2210558 CA 2210558 A CA2210558 A CA 2210558A CA 2210558 A1 CA2210558 A1 CA 2210558A1
- Authority
- CA
- Canada
- Prior art keywords
- panel
- mat
- veneer
- waferboard
- composite panel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F13/00—Coverings or linings, e.g. for walls or ceilings
- E04F13/07—Coverings or linings, e.g. for walls or ceilings composed of covering or lining elements; Sub-structures therefor; Fastening means therefor
- E04F13/08—Coverings or linings, e.g. for walls or ceilings composed of covering or lining elements; Sub-structures therefor; Fastening means therefor composed of a plurality of similar covering or lining elements
- E04F13/16—Coverings or linings, e.g. for walls or ceilings composed of covering or lining elements; Sub-structures therefor; Fastening means therefor composed of a plurality of similar covering or lining elements of fibres or chips, e.g. bonded with synthetic resins, or with an outer layer of fibres or chips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B21/00—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board
- B32B21/02—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board the layer being formed of fibres, chips, or particles, e.g. MDF, HDF, OSB, chipboard, particle board, hardboard
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B21/00—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board
- B32B21/14—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board comprising wood board or veneer
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04C—STRUCTURAL ELEMENTS; BUILDING MATERIALS
- E04C2/00—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels
- E04C2/02—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by specified materials
- E04C2/10—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by specified materials of wood, fibres, chips, vegetable stems, or the like; of plastics; of foamed products
- E04C2/16—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by specified materials of wood, fibres, chips, vegetable stems, or the like; of plastics; of foamed products of fibres, chips, vegetable stems, or the like
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/02—Flooring or floor layers composed of a number of similar elements
Abstract
A composite panel having a waferboard core and a layer of veneer on each first and second planar surface of the core where the veneer is bonded to the waferboard core and extends the full area of the panel.
Description
CA 02210~8 1997-07-1~
COMPOSITE PANEL
The present invention relates to a composite panel for use as sheeting and a method of making such a panel.
Plywood panels are well known in the construction industry. Plywood is used in construction of buildings for roofs, floors, and walls. It is an expensive product to make. Plywood also does not use the entire tree; rather usually only the solid base portion can be used.
Another form of fabricated panel is waferboard. Waferboard is manufactured by taking thin "wafers" of wood, mixing with wax and resin, and forming this mixture into a mat that is pressed under high heat and pressure into a structural panel.
Waferboard is cheaper to manufacture than plywood and is used in place of plywood in many applications. The waferboard process is capable of utilizing the entire tree trunk. This maximizes our resource.
It is an aim of the present invention to provide a composite panel which eliminates or at least reduces some of the disadvantages found in conventional plywood and waferboard panels.
It is a further aim of the present invention to provide a composite panel having lower weights than waferboard, with the structural strength of plywood, better thickness variation than plywood, yet with the solid wood surface of plywood.
It is a further aim of the present invention to provide a composite board that can be suitably formed with tongue and groove.
A construction in accordance with the present invention comprises a composite panel having a pair of parallel planar first and second surfaces. The panel consists of a waferboard core extending to the full area of the panel and is sandwiched by at least a layer of veneer on each first and second planar CA 02210~8 1997-07-1~
surfaces, and each veneer layer is bonded to the wafer core and extends the full area of the panel, whereby the veneer layers provide enhanced strength characteristics to the composite board.
In a more specific construction of the present invention, the waferboard core includes a phenolic resin while the wafers are selected from aspen.
A method of producing a composite panel in accordance with the present invention comprises the steps of first laying up a mat of wood wafers with resin, pressing the so-formed mat under heat and pressure, curing the mat, sanding the surfaces of the mat to provide smooth surfaces and consistent thickness to the mat, the mat being formed such that it has the shape of the panel with first and second parallel planar surfaces and end and side edges, applying adhesive to the first and second planar surfaces and laying up at least a layer of plywood veneer on each of the first and second planar surfaces to form a composite panel.
In a more specific embodiment of the method of the present invention, the resin utilized in the matter is a phenolic resin and the cross bands of the veneer extend in the lengthwise direction of the formed panel.
A composite panel, according to a preferred embodiment, includes a waferboard core with veneer layers on the front and back of the core. Typically, the composite panel measures 4 feet by 8 feet and a thickness of 7/16 inch or 5/8 inch. However, the thickness could be anywhere between 7/16 inch to 1-1/2 inches. The veneer layers may have a thickness of between .1 inch to .145 inch and cover each face of the panel. The waferboard core is made from a mat of aspen species wood wafers in a phenolic resin. Other suitable wood species may also be used. The following CA 02210~8 1997-07-1~
Table provides the properties of these two thicknesses of the composite board in accordance with a preferred embodiment:
Specifications 7/16 inch 5/8 inch Moisture content (max) 18% 18%
Linear expansion (max) 0.50% 0.50%
Roof dry - ultimate load (miniml]m) 400 lbs. n/a Uniform load roof dry - maximum deflections 0.133 inch n/a Roof dry ultimate load (miniml]m) 150 psf n/a Single floor dry -maximum deflection 0.067 inch Single floor dry -ultimate load 330 psf The veneer may be a C-grade veneer and bonded to the waferboard core by means of a suitable adhesive.
20A method of manufacturing the composite board includes the steps of forming a mat of wood wafers, such as aspen wood wafers, and a phenolic resin. The mat is pressed in a typical waferboard press using a specific pressure of 500 psi. The plate temperature is 415~F. while the pressing time is at least 4 minutes. The temperature of the mat should reach at least 275~F. The rate of the pressing should be slower than the typical waferboard pressing rates in order to ensure a more uniform density throughout the mat. It has been found that a rate slower than 20% of the typical pressing/time curves satisfies this requirement. The mat moisture during the pressing should be between 4 and 7~. Once the wafer core has been removed from the press, it should be cured in hot stacks for at least 4 days and up to 8 days. The core is then sanded on all of its surfaces in order to attain a target thickness of .414 inch with a thickness tolerance within the panel of +.010 inch in the case of a composite panel having a thickness of 5/8 inch. The CA 02210~8 1997-07-1~
waferboard core density should be between 39-41 lbs./ft.3 +0.5 lbs./ft.3~ The surface veneer may be selected from C-grade and better material. The waferboard core temperature should be below 100~F.
before pressing the veneer to it. The veneer stock should also be kept below 100~F.
The resulting composite panel made in accordance with the above process has superior flatness, that is, because of the processing steps, it is less liable to warp. This is caused by the more uniform density of the wafer core and the longer hot stack curing time of the core.
The resulting composite panel allows the formation of tongue and groove, especially when used for flooring.
COMPOSITE PANEL
The present invention relates to a composite panel for use as sheeting and a method of making such a panel.
Plywood panels are well known in the construction industry. Plywood is used in construction of buildings for roofs, floors, and walls. It is an expensive product to make. Plywood also does not use the entire tree; rather usually only the solid base portion can be used.
Another form of fabricated panel is waferboard. Waferboard is manufactured by taking thin "wafers" of wood, mixing with wax and resin, and forming this mixture into a mat that is pressed under high heat and pressure into a structural panel.
Waferboard is cheaper to manufacture than plywood and is used in place of plywood in many applications. The waferboard process is capable of utilizing the entire tree trunk. This maximizes our resource.
It is an aim of the present invention to provide a composite panel which eliminates or at least reduces some of the disadvantages found in conventional plywood and waferboard panels.
It is a further aim of the present invention to provide a composite panel having lower weights than waferboard, with the structural strength of plywood, better thickness variation than plywood, yet with the solid wood surface of plywood.
It is a further aim of the present invention to provide a composite board that can be suitably formed with tongue and groove.
A construction in accordance with the present invention comprises a composite panel having a pair of parallel planar first and second surfaces. The panel consists of a waferboard core extending to the full area of the panel and is sandwiched by at least a layer of veneer on each first and second planar CA 02210~8 1997-07-1~
surfaces, and each veneer layer is bonded to the wafer core and extends the full area of the panel, whereby the veneer layers provide enhanced strength characteristics to the composite board.
In a more specific construction of the present invention, the waferboard core includes a phenolic resin while the wafers are selected from aspen.
A method of producing a composite panel in accordance with the present invention comprises the steps of first laying up a mat of wood wafers with resin, pressing the so-formed mat under heat and pressure, curing the mat, sanding the surfaces of the mat to provide smooth surfaces and consistent thickness to the mat, the mat being formed such that it has the shape of the panel with first and second parallel planar surfaces and end and side edges, applying adhesive to the first and second planar surfaces and laying up at least a layer of plywood veneer on each of the first and second planar surfaces to form a composite panel.
In a more specific embodiment of the method of the present invention, the resin utilized in the matter is a phenolic resin and the cross bands of the veneer extend in the lengthwise direction of the formed panel.
A composite panel, according to a preferred embodiment, includes a waferboard core with veneer layers on the front and back of the core. Typically, the composite panel measures 4 feet by 8 feet and a thickness of 7/16 inch or 5/8 inch. However, the thickness could be anywhere between 7/16 inch to 1-1/2 inches. The veneer layers may have a thickness of between .1 inch to .145 inch and cover each face of the panel. The waferboard core is made from a mat of aspen species wood wafers in a phenolic resin. Other suitable wood species may also be used. The following CA 02210~8 1997-07-1~
Table provides the properties of these two thicknesses of the composite board in accordance with a preferred embodiment:
Specifications 7/16 inch 5/8 inch Moisture content (max) 18% 18%
Linear expansion (max) 0.50% 0.50%
Roof dry - ultimate load (miniml]m) 400 lbs. n/a Uniform load roof dry - maximum deflections 0.133 inch n/a Roof dry ultimate load (miniml]m) 150 psf n/a Single floor dry -maximum deflection 0.067 inch Single floor dry -ultimate load 330 psf The veneer may be a C-grade veneer and bonded to the waferboard core by means of a suitable adhesive.
20A method of manufacturing the composite board includes the steps of forming a mat of wood wafers, such as aspen wood wafers, and a phenolic resin. The mat is pressed in a typical waferboard press using a specific pressure of 500 psi. The plate temperature is 415~F. while the pressing time is at least 4 minutes. The temperature of the mat should reach at least 275~F. The rate of the pressing should be slower than the typical waferboard pressing rates in order to ensure a more uniform density throughout the mat. It has been found that a rate slower than 20% of the typical pressing/time curves satisfies this requirement. The mat moisture during the pressing should be between 4 and 7~. Once the wafer core has been removed from the press, it should be cured in hot stacks for at least 4 days and up to 8 days. The core is then sanded on all of its surfaces in order to attain a target thickness of .414 inch with a thickness tolerance within the panel of +.010 inch in the case of a composite panel having a thickness of 5/8 inch. The CA 02210~8 1997-07-1~
waferboard core density should be between 39-41 lbs./ft.3 +0.5 lbs./ft.3~ The surface veneer may be selected from C-grade and better material. The waferboard core temperature should be below 100~F.
before pressing the veneer to it. The veneer stock should also be kept below 100~F.
The resulting composite panel made in accordance with the above process has superior flatness, that is, because of the processing steps, it is less liable to warp. This is caused by the more uniform density of the wafer core and the longer hot stack curing time of the core.
The resulting composite panel allows the formation of tongue and groove, especially when used for flooring.
Claims (8)
1. A composite panel having a pair of parallel planar first and second surfaces, said panel consisting of a waferboard core extending to the full length of the panel and being sandwiched by at least a layer of veneer on each first and second planar surfaces and each veneer layer being bonded to the waferboard core and extending the full area of the panel, whereby the veneer layers provide enhanced strength characteristics to the composite board.
2. A composite panel as defined in claim 1, wherein the layers of veneer each have a thickness of between 0.1 and 0.145 inch in thickness.
3. A composite panel as defined in claim 2, wherein the density of the waferboard core is between 39 and 41 lbs. per cubic foot.
4. A composite panel as defined in claim 1, wherein the wafers are from aspen species wood and the resin is a phenolic resin.
5. A method of producing a composite panel comprising the steps of first laying up a mat of wood wafers with resin, pressing the so-formed wafer mat under heat and pressure, curing the wafer mat, sanding the surfaces of the wafer mat to provide smooth surfaces and consistent thickness to the wafer mat, forming the wafer mat such that it has the shape of the panel with first and second parallel planar surfaces and end and side edges, applying adhesive to the first and second planar surfaces and laying up at least a layer of plywood veneer on each of the first and second planar surfaces to form a composite panel.
6. A method as defined in claim 5, wherein the core temperature in the wafer mat is at least 275°F., and the pressing time is at least 4 minutes while the curing time of the mat after pressing is between 4 and 8 days.
7. A method as defined in claim 5, wherein the resin utilized is a phenolic resin and the cross bands of the veneer extend in a lengthwise direction of the panel.
8. A method as defined in claim 6, wherein the pressing rate is 20% slower than waferboard pressing rate curves.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA 2210558 CA2210558A1 (en) | 1997-07-15 | 1997-07-15 | Composite panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA 2210558 CA2210558A1 (en) | 1997-07-15 | 1997-07-15 | Composite panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2210558A1 true CA2210558A1 (en) | 1999-01-15 |
Family
ID=29274883
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA 2210558 Abandoned CA2210558A1 (en) | 1997-07-15 | 1997-07-15 | Composite panel |
Country Status (1)
| Country | Link |
|---|---|
| CA (1) | CA2210558A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6949161B2 (en) | 2002-03-20 | 2005-09-27 | Longlac Wood Industries Inc. | One step multiple-ply panel pressing |
| WO2021076047A1 (en) * | 2019-10-18 | 2021-04-22 | Välinge Innovation AB | Wood fibre based panel and a method for obtaining such panel |
-
1997
- 1997-07-15 CA CA 2210558 patent/CA2210558A1/en not_active Abandoned
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6949161B2 (en) | 2002-03-20 | 2005-09-27 | Longlac Wood Industries Inc. | One step multiple-ply panel pressing |
| WO2021076047A1 (en) * | 2019-10-18 | 2021-04-22 | Välinge Innovation AB | Wood fibre based panel and a method for obtaining such panel |
| CN114630945A (en) * | 2019-10-18 | 2022-06-14 | 瓦林格创新股份有限公司 | Panel based on wood fibres and method for obtaining such a panel |
| EP4045729A4 (en) * | 2019-10-18 | 2023-11-08 | Välinge Innovation AB | Wood fibre based panel and a method for obtaining such panel |
| CN114630945B (en) * | 2019-10-18 | 2023-12-19 | 瓦林格创新股份有限公司 | Wood fiber based panel and method of obtaining such a panel |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FZDE | Dead |