KR100415737B1 - Pressure sensor package - Google Patents

Pressure sensor package Download PDF

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Publication number
KR100415737B1
KR100415737B1 KR10-2001-0070443A KR20010070443A KR100415737B1 KR 100415737 B1 KR100415737 B1 KR 100415737B1 KR 20010070443 A KR20010070443 A KR 20010070443A KR 100415737 B1 KR100415737 B1 KR 100415737B1
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KR
South Korea
Prior art keywords
wall
pressure sensor
sensor package
gas
pressure
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KR10-2001-0070443A
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Korean (ko)
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KR20030039504A (en
Inventor
주성철
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주식회사 케이이씨
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Priority to KR10-2001-0070443A priority Critical patent/KR100415737B1/en
Publication of KR20030039504A publication Critical patent/KR20030039504A/en
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

이 발명은 압력센서 패키지에 관한 것으로, 압력센서의 정밀도를 향상시킬 수 있도록, 상부에서 하부를 향하여 제1통공벽이 형성되고, 상기 제1통공벽과 대략 직각의 외주연 방향으로 제2통공벽을 갖는 몸체와, 상기 몸체의 제2통공벽 하부에 접착된 압력센서로 이루어진 압력센서 패키지에 있어서, 상기 몸체는 상기 제1통공벽과 제2통공벽의 경계 영역에 기체 등이 상기 압력센서 쪽으로 용이하게 흐를 수 있도록 라운드벽이 형성된 것을 특징으로 함.The present invention relates to a pressure sensor package, in order to improve the accuracy of the pressure sensor, a first through-wall is formed from the top to the bottom, and the second through-wall in an outer circumferential direction substantially perpendicular to the first through-wall. In the pressure sensor package consisting of a body having a pressure sensor bonded to the lower portion of the second through-wall of the body, the body is a gas or the like toward the pressure sensor in the boundary region of the first through-wall and the second through-wall; Round wall is formed so that it can flow easily.

Description

압력센서 패키지{Pressure sensor package}Pressure sensor package

본 발명은 압력센서 패키지에 관한 것으로, 더욱 상세하게 설명하면 압력센서의 정밀도를 향상시킬 수 있는 압력센서 패키지에 관한 것이다.The present invention relates to a pressure sensor package, and more particularly to a pressure sensor package that can improve the accuracy of the pressure sensor.

통상 압력센서 패키지(예를 들면, 혈압계)는 기체 등의 압력을 감지하여, 이를 소정의 전기적 신호로 변환하여 출력하는 기능을 한다. 또한 상기 압력센서 패키지는 기체 등이 통과하는 관(Tube)에 직렬로 연결된 채 사용되며, 이러한 종래의 압력센서 패키지(100')가 도1a 및 도1b에 도시되어 있다. 이를 참조하여 종래 기술을 설명하면 다음과 같다.In general, a pressure sensor package (for example, a blood pressure monitor) detects a pressure such as gas, and converts the pressure into a predetermined electrical signal. In addition, the pressure sensor package is used while being connected in series to the tube (Tube) through which gas, etc., such a conventional pressure sensor package 100 'is shown in Figures 1a and 1b. Referring to this, the prior art will be described.

도시된 바와 같이 상부에 입구(20')가 형성되어 있고 하부에는 확장구(22')가 형성되어 있으며, 상기 입구(20')에서 상기 확장구(22')까지는 소정 직경의 통공(4')이 형성된 플라스틱 몸체(2')가 형성되어 있다. 여기서, 상기 통공(4')은 일정 직경을 갖는 제1통공벽(6')과 상기 제1통공벽(6')에 대략 직각 외주연 방향으로 형성된 제2통공벽(8')을 포함한다.As shown, an inlet 20 'is formed in the upper portion and an expansion opening 22' is formed in the lower portion, and a through hole 4 'of a predetermined diameter extends from the inlet 20' to the expansion opening 22 '. ) Is formed of a plastic body 2 '. Here, the through hole 4 ′ includes a first through wall 6 ′ having a predetermined diameter and a second through wall 8 ′ formed in a substantially perpendicular outer circumferential direction to the first through wall 6 ′. .

또한, 상기 몸체(2')의 확장구(22') 즉, 상기 제2통공벽(8')의 하부에는 상면(16')과 바닥면(14')을 갖는 대략 "V"자형의 압력센서(12')가 설치되어 있다. 즉, 상기 압력센서(12')의 상면(16')이 상기 제2통공벽(8')에 접착되어 있다.In addition, a pressure of a substantially "V" shape having an upper surface 16 'and a bottom surface 14' at the lower part of the expansion hole 22 'of the body 2', that is, the second through-wall 8 '. The sensor 12 'is provided. That is, the upper surface 16 'of the pressure sensor 12' is bonded to the second through wall 8 '.

따라서, 상기 입구(20')를 통과한 기체는 상기 통공(4')을 따라 상기 압력센서(12')쪽으로 진입하며, 상기 기체는 상기 압력센서(12')의 바닥면(14')에 소정 압력을 가한다. 물론, 상기 압력센서(12')의 바닥면(14')에 작용한 기체의 압력은 상기 압력센서(12')에 의해 소정의 전기적 신호로 변환되어 출력된다.Accordingly, the gas passing through the inlet 20 'enters the pressure sensor 12' along the through hole 4 ', and the gas enters the bottom surface 14' of the pressure sensor 12 '. A predetermined pressure is applied. Of course, the pressure of the gas acting on the bottom surface 14 'of the pressure sensor 12' is converted into a predetermined electrical signal by the pressure sensor 12 'and output.

그러나, 이러한 종래의 압력센서 패키지(100')는 플라스틱 몸체(2')가 금형을 이용한 사출 성형에 의해 제조됨으로써, 상기 몸체(2')의 제1통공벽(6')과 제2통공벽(8')의 경계 영역에 일정길이의 버(24')(Burr)가 형성되는 단점이 있다. 즉,도1b에 도시된 바와 같이 압력 센서(12')의 상부에 형성되는 제1통공벽(6')과 제2통공벽(8')의 경계 영역에 일정 길이의 버(24')가 형성된다.However, such a conventional pressure sensor package 100 'is manufactured by injection molding using a plastic body 2', so that the first through wall 6 'and the second through wall of the body 2' are formed. There is a disadvantage in that a burr 24 having a predetermined length is formed in the boundary region of 8 '. That is, as illustrated in FIG. 1B, a burr 24 ′ having a predetermined length is formed at a boundary area between the first through wall 6 ′ and the second through wall 8 ′ formed on the pressure sensor 12 ′. Is formed.

이러한 버(24')는 압력센서(12')의 바닥면(14')으로 향하는 기체의 흐름에 와류를 형성시킬 뿐만 아니라 압력에도 변화를 일으킴으로써, 결국 상기 압력센서(12')에 의한 기체의 압력이 정확하게 측정되지 않는 문제를 야기한다.This burr 24 'not only forms a vortex in the flow of gas destined for the bottom surface 14' of the pressure sensor 12 'but also changes the pressure, so that the gas by the pressure sensor 12' This causes a problem in that the pressure in is not measured accurately.

따라서 본 발명은 상기와 같은 종래의 문제점을 해결하기 위해 안출한 것으로, 제1통공벽과 제2통공벽의 버를 제거하여 압력센서의 정밀도를 향상시킬 수 있는 압력센서 패키지를 제공하는데 있다.Accordingly, the present invention has been made to solve the above-mentioned conventional problems, and to provide a pressure sensor package that can improve the accuracy of the pressure sensor by removing the burr of the first and second through walls.

도1a는 통상적인 압력센서 패키지를 도시한 단면도이고, 도1b는 도1a의 A 영역을 확대 도시한 단면도이다.FIG. 1A is a cross-sectional view illustrating a conventional pressure sensor package, and FIG. 1B is an enlarged cross-sectional view of region A of FIG. 1A.

도2a는 본 발명에 의한 압력센서 패키지를 도시한 단면도이고, 도2b는 도2a의 B 영역을 확대 도시한 단면도이다.FIG. 2A is a cross-sectional view illustrating a pressure sensor package according to the present invention, and FIG. 2B is an enlarged cross-sectional view of region B of FIG. 2A.

- 도면중 주요 부호에 대한 설명 --Description of the main symbols in the drawings-

100; 본 발명에 의한 압력센서 패키지100; Pressure sensor package according to the present invention

2; 몸체 4; 통공2; Body 4; Through

6; 제1통공벽 8; 제2통공벽6; First through-wall 8; Second through wall

10; 라운드벽 12; 압력센서10; Round wall 12; Pressure sensor

14; 바닥면 16; 상면14; Bottom surface 16; Top

20; 입구 22; 확장구20; Inlet 22; Expansion

상기한 목적을 달성하기 위해 본 발명은 상부에서 하부를 향하여 제1통공벽이 형성되고, 상기 제1통공벽과 대략 직각의 외주연 방향으로 제2통공벽을 갖는 몸체와, 상기 몸체의 제2통공벽 하부에 접착된 압력센서로 이루어진 압력센서 패키지에 있어서, 상기 몸체는 상기 제1통공벽과 제2통공벽의 경계 영역에 기체 등이 상기 압력센서 쪽으로 용이하게 흐를 수 있도록 라운드벽이 형성된 것을 특징으로 한다.In order to achieve the above object, the present invention provides a body having a first through-wall formed from an upper side to a lower side, and having a second through-wall formed in an outer circumferential direction substantially perpendicular to the first through-wall. In the pressure sensor package consisting of a pressure sensor bonded to the lower portion of the through-hole wall, the body has a round wall formed in the boundary region of the first through-wall and the second through-wall so that gas or the like can easily flow toward the pressure sensor It features.

상기와 같이 하여 본 발명에 의한 압력센서 패키지에 의하면 기체가 흐르는 제1통공벽 및 제2통공벽의 경계 영역에 라운드벽을 형성함으로써, 기체에 와류 현상이 발생하지 않도록 하고 또한 압력센서쪽으로 균일한 압력이 제공되도록 함으로써, 상기 압력센서의 정밀도를 향상시킬 수 있게 된다.According to the pressure sensor package according to the present invention as described above, by forming a round wall in the boundary region of the first through-wall and the second through-wall through which the gas flows, the vortex phenomenon does not occur in the gas and is uniform toward the pressure sensor. By providing a pressure, it is possible to improve the accuracy of the pressure sensor.

이하 본 발명이 속한 기술분야에서 통상의 지식을 가진 자가 본 발명을 용이하게 실시할 수 있을 정도로 본 발명의 바람직한 실시예를 첨부된 도면을 참조하여 상세하게 설명하면 다음과 같다.Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings such that those skilled in the art can easily implement the present invention.

도2a는 본 발명에 의한 압력센서 패키지(100)를 도시한 단면도이고, 도2b는 도2a의 B 영역을 확대 도시한 단면도이다.2A is a cross-sectional view of the pressure sensor package 100 according to the present invention, and FIG. 2B is an enlarged cross-sectional view of region B of FIG. 2A.

도시된 바와 같이 상부에 입구(20)가 형성되어 있고, 하부에는 확장구(22)가 형성되어 있으며, 상기 입구(20)와 확장구(22) 사이에는 소정 직경의 통공(4)이 형성된 플라스틱 몸체(2)가 형성되어 있다. 또한, 상기 통공(4)은 일정 직경을 갖는 제1통공벽(6)과 상기 제1통공벽(6)에 대략 직각의 외주연을 향하여 형성된 제2통공벽(8)을 포함한다.As shown, the inlet 20 is formed in the upper portion, the expansion hole 22 is formed in the lower portion, and the plastic through which the through hole 4 of a predetermined diameter is formed between the inlet 20 and the expansion hole 22. The body 2 is formed. In addition, the through hole 4 includes a first through wall 6 having a predetermined diameter and a second through wall 8 formed toward the outer circumference at a right angle to the first through wall 6.

더불어, 상기 몸체(2)의 확장구(22) 즉, 상기 제2통공벽(8)의 하부에는 상면(16)과 바닥면(14)을 갖는 대략 "V"자형의 압력센서(12)가 접착되어 있다. 즉, 상기 압력센서(12)의 상면(16)이 상기 제2통공벽(8)에 접착되어 있으며, 이러한 구성은 종래와 동일하다.In addition, a pressure sensor 12 having a substantially “V” shape having an upper surface 16 and a bottom surface 14 is provided below the expansion hole 22 of the body 2, that is, the second through-wall 8. It is glued. That is, the upper surface 16 of the pressure sensor 12 is bonded to the second through-wall 8, and this configuration is the same as in the prior art.

단, 본 발명은 상기 제1통공벽(6)과 상기 제2통공벽(8) 사이의 경계 영역에 라운드벽(10)이 더 형성된 것이 특징이다. 즉, 상기 제1통공벽(6)과 제2통공벽(8)의 경계 영역에 종래와 같은 버(Burr)가 발생되지 않고, 일정 반경을 갖는 라운드벽(10)이 형성됨으로써, 상기 제1통공벽(6) 및 제2통공벽(8)을 따라 흐르는 기체의 와류 현상을 억제함은 물론, 상기 기체의 압력 변화도 최소화되도록 한 것이다.However, the present invention is characterized in that the round wall 10 is further formed in the boundary region between the first through wall 6 and the second through wall 8. That is, since the burr does not generate | occur | produce conventionally in the boundary area | region of the said 1st through-wall 6 and the 2nd through-wall 8, the round wall 10 which has a fixed radius is formed, and the said 1st In addition to suppressing the vortex phenomena of the gas flowing along the through-wall 6 and the second through-wall 8, the pressure change of the gas is also minimized.

따라서, 상기 통공(4)을 따라 흐르는 기체의 압력이 상기 압력센서(12)에 의해 정확한 값으로 감지되고, 이에 따라 상기 압력센서(12)의 정확도가 향상된다.Therefore, the pressure of the gas flowing along the through hole 4 is sensed by the pressure sensor 12 to an accurate value, thereby improving the accuracy of the pressure sensor 12.

또한, 상기 제1통공벽(6) 및 제2통공벽(8)의 경계에는 상기 라운드벽(10) 대신 도시되지 않은 챔퍼벽(Chamfer Wall)이 형성될 수도 있으며, 여기서 이를 한정하는 것은 아니다.In addition, a chamfer wall (not shown) may be formed at the boundary between the first through wall 6 and the second through wall 8, instead of the round wall 10, but is not limited thereto.

이러한 라운드벽(10) 또는 챔퍼벽은 금형의 디자인을 변경하여 몸체(2)를 사출 성형함으로써 형성하거나 또는 종래와 같은 구조로 형성된 몸체(2)의 제1통공벽(6)과 제2통공벽(8) 사이의 경계 영역을 공작기계로 가공함으로써 구현할 수 있으며, 여기서 그 제조 방법을 한정하는 것은 아니다.The round wall 10 or the chamfer wall is formed by injection molding the body 2 by changing the design of the mold, or the first through wall 6 and the second through wall of the body 2 formed in a conventional structure. The boundary area between (8) can be implemented by machining with a machine tool, and the manufacturing method is not limited here.

이상에서와 같이 본 발명은 비록 상기의 실시예에 한하여 설명하였지만 여기에만 한정되지 않으며, 본 발명의 범주 및 사상을 벗어나지 않는 범위내에서 여러가지로 변형된 실시예도 가능할 것이다.As described above, although the present invention has been described with reference to the above embodiments, the present invention is not limited thereto, and various modified embodiments may be possible without departing from the scope and spirit of the present invention.

따라서, 본 발명에 의한 압력센서 패키지는 기체가 흐르는 제1통공벽 및 제2통공벽의 경계 영역에 라운드벽을 형성함으로써, 기체에 와류 현상이 발생하지 않도록 하고 또한 압력센서쪽으로 균일한 압력이 제공되도록 함으로써, 압력센서의 정밀도를 향상시킬 수 있는 효과가 있다.Therefore, the pressure sensor package according to the present invention forms a round wall at the boundary area between the first through-wall and the second through-wall through which gas flows, thereby preventing eddy currents from occurring in the gas and providing a uniform pressure toward the pressure sensor. By doing so, there is an effect that can improve the accuracy of the pressure sensor.

Claims (1)

(정정) 상부에서 하부를 향하여 일정 직경을 갖는 제1통공벽(6)이 형성되고, 상기 제1통공벽(6)과 대략 직각의 외주연 방향으로 제2통공벽(8)이 형성된 몸체(2)와, 상기 몸체(2)의 제2통공벽(8) 하부에 접착된 압력센서(12)로 이루어진 압력센서 패키지에 있어서,(Correction) A body having a first through-wall 6 having a predetermined diameter from the top to the bottom thereof, and having a second through-wall 8 formed in an outer circumferential direction substantially perpendicular to the first through-wall 6. 2) and a pressure sensor package composed of a pressure sensor 12 bonded to a lower portion of the second through-wall 8 of the body 2, 상기 몸체(2)는 상기 제1통공벽(6)과 제2통공벽(8)의 경계 영역에 기체 등이 상기 압력센서(12) 쪽으로 용이하게 흐를 수 있도록 라운드벽(10)이 형성된 것을 특징으로 하는 압력센서 패키지.The body 2 is characterized in that the round wall 10 is formed in the boundary region between the first through-wall 6 and the second through-wall 8 so that gas or the like can easily flow toward the pressure sensor 12. Pressure sensor package.
KR10-2001-0070443A 2001-11-13 2001-11-13 Pressure sensor package KR100415737B1 (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR900014871A (en) * 1989-03-07 1990-10-25 한스 빌헬름 헤프너/거드 쿠도르퍼 Pressure sensor and its manufacturing method
KR930010540A (en) * 1990-11-28 1993-06-22 시키 모리야 Pressure sensor
KR20010051337A (en) * 1999-11-02 2001-06-25 요코야마 다카요시 Pressure sensor
JP2001311673A (en) * 2000-04-28 2001-11-09 Fujikura Ltd Semiconductor pressure sensor

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR900014871A (en) * 1989-03-07 1990-10-25 한스 빌헬름 헤프너/거드 쿠도르퍼 Pressure sensor and its manufacturing method
KR930010540A (en) * 1990-11-28 1993-06-22 시키 모리야 Pressure sensor
KR20010051337A (en) * 1999-11-02 2001-06-25 요코야마 다카요시 Pressure sensor
JP2001311673A (en) * 2000-04-28 2001-11-09 Fujikura Ltd Semiconductor pressure sensor

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