KR100414400B1 - Vacuum device of semiconductor-chip forming press - Google Patents
Vacuum device of semiconductor-chip forming press Download PDFInfo
- Publication number
- KR100414400B1 KR100414400B1 KR10-2001-0086617A KR20010086617A KR100414400B1 KR 100414400 B1 KR100414400 B1 KR 100414400B1 KR 20010086617 A KR20010086617 A KR 20010086617A KR 100414400 B1 KR100414400 B1 KR 100414400B1
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- South Korea
- Prior art keywords
- vacuum
- vacuum chamber
- mold
- guide block
- outside
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 claims abstract description 21
- 238000012856 packing Methods 0.000 claims abstract description 12
- 239000000428 dust Substances 0.000 claims abstract description 10
- 238000000465 moulding Methods 0.000 claims description 33
- 239000011347 resin Substances 0.000 claims description 27
- 229920005989 resin Polymers 0.000 claims description 27
- 230000003028 elevating effect Effects 0.000 claims 2
- 230000007547 defect Effects 0.000 abstract description 7
- 238000001746 injection moulding Methods 0.000 abstract description 7
- 238000007789 sealing Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 6
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/34—Moulds having venting means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
본 발명은 반도체 칩 성형프레스의 진공장치에 관한 것으로, 특히 상부금형과 상판 사이에 형성되는 가이드블럭과, 상기 가이드블럭 몸체에 상단이 상부패킹에 의해 밀실하게 밀착되고 가이드블럭상에서 상하 이송 가능하며 하단에 하부패킹을 갖는 진공챔버와, 상기 진공챔버의 좌우측에 형성된 고정브라켓에 하단이 체결 고정되고 상단은 상판에 결합된 상태에서 하부금형이 상승하여 상부금형과 형합되면 진공챔버를 하강시켜 이 상,하부금형을 외부와 밀폐시키게 하는 승하강실린더와, 상기 승하강실린더에 의해 상,하부금형이 외부와 밀폐되면 내부의 공기 및 먼지를 외부로 강제 배출시킬수 있도록 진공호스와 연결되는 진공펌프와, 상기 진공챔버 몸체 전면에 형성되어 내부의 작업상황을 볼수 있게 하는 투시창으로 이루어진 진공장치를 마련한 후 이 진공장치를 통하여 진공상태에서 사출 성형작업이 이루어지게 하여 에어로 인한 제품 불량률을 최소화하고, 그 구조를 간편화하여 하부금형의 착탈과 부품교환이 간편하게 이루어질 수 있도록 한 것이다.The present invention relates to a vacuum device for a semiconductor chip forming press, and in particular, a guide block formed between an upper mold and an upper plate, and the upper end is tightly adhered to the guide block body by an upper packing, and can be vertically transported on the guide block. The lower chamber is fastened and fixed to the vacuum chamber having a lower packing, and fixed brackets formed on the left and right sides of the vacuum chamber and the upper end is coupled to the upper plate when the lower mold rises and is combined with the upper mold to lower the vacuum chamber. A lifting cylinder for sealing the lower mold with the outside, a vacuum pump connected with a vacuum hose to forcibly discharge the inside air and dust to the outside when the upper and lower molds are sealed with the outside by the lifting cylinder; It is provided on the front of the vacuum chamber body to provide a vacuum device consisting of a viewing window to view the working situation inside After that, the injection molding work is performed in a vacuum state through the vacuum device, thereby minimizing product defect rate due to air, and simplifying the structure so that the lower mold can be easily removed and replaced.
Description
본 발명은 반도체 칩 성형프레스의 진공장치에 관한 것으로, 특히 반도체 칩에 수지 몰딩시 별도의 진공장치를 통하여 진공상태에서 사출 성형작업이 이루어지게 하여 에어로 인한 제품 불량률을 최소화하고, 그 구조를 간편화하여 하부금형의 착탈과 부품교환이 간편하게 이루어질 수 있도록 한 반도체 칩 성형프레스의 진공장치에 관한 것이다.The present invention relates to a vacuum device of a semiconductor chip molding press, and in particular, injection molding work is carried out in a vacuum state through a separate vacuum device when resin molding on a semiconductor chip to minimize product defect rate due to air, and to simplify the structure The present invention relates to a vacuum device for a semiconductor chip forming press to easily remove and replace a lower mold.
일반적인 전자제품의 회로기판에 사용되는 반도체는 중간에 칩이 형성되어 있고 이 칩의 양단에는 회로기판에 고정되는 리드프레임이 형성되어 있다. 또한 반도체 칩에는 칩을 보호하기 위한 직사각형상의 수지몰딩이 성형되는데, 이러한 수지몰딩은 재질이 수지로 이루어지며 성형프레스의 상하부금형 형상시 사출실린더에 의해 반도체 칩에 사출 성형된다.A semiconductor used for a circuit board of a general electronic product has a chip formed in the middle, and lead frames fixed to the circuit board are formed at both ends of the chip. In addition, a rectangular resin molding is formed on the semiconductor chip to protect the chip. The resin molding is made of a resin, and is injection molded into the semiconductor chip by an injection cylinder in the upper and lower mold shapes of the molding press.
이를 도면과 함께 간단하게 설명하면 반도체 칩에 수지몰딩을 사출 성형하는 성형프레스는 크게 도1에서와 같이 내부에 히터(11)가 내장된 상태에서 표면에 성형공간(12)와 유로(13)가 형성되고 고정판(14)의 하단에 고정되는 상부금형(10)과, 상기 상부금형(10)과 대응한 위치에 성형공간(22)과 유로(23)가 형성되고 가동판(25)의 상단에 고정되며 수직방향으로 수지안착홈(24)이 일체로 마련되는 하부금형(20)과, 상기 상하부금형(10)(20)이 형합되면 실린더(31)내에서 상승하는 피스톤(30)과, 상기 피스톤(30)에 의해 가압핀(33)을 상승시켜 수지안착홈(24)에 안착된 수지를 가압하여 유로(13)(23)를 통해 성형공간(12)(22)으로 수지가 유입되도록 하는 받침대(32)로 구성되어 있다.To explain this briefly with drawings, the molding press for injection molding resin molding on a semiconductor chip has a molding space 12 and a flow path 13 formed on the surface thereof with a heater 11 embedded therein as shown in FIG. The upper mold 10 is formed and fixed to the lower end of the fixed plate 14, and the molding space 22 and the flow path 23 is formed at a position corresponding to the upper mold 10, the upper mold 10 When the lower mold 20 is fixed and the resin seating groove 24 is integrally provided in the vertical direction, and the upper and lower molds 10 and 20 are combined, the piston 30 rising in the cylinder 31 and the The pressure pin 33 is raised by the piston 30 to pressurize the resin seated in the resin seating groove 24 so that the resin flows into the molding spaces 12 and 22 through the flow passages 13 and 23. It is comprised by the base 32.
이와 같이 구성된 성형프레스를 사용하기 위해서는 먼저 하부금형(20)의 성형공간(22)에 반도체 칩을 수지안착홈(24)에는 고체의 수지를 각각 안착시킨후 유압장치를 작동시키면 유압이 공급됨에 따라 가동판(25)이 상부로 상승하면서 상부금형(10)에 하부금형(20)을 형합시킨다.In order to use the molding press configured as described above, first, the semiconductor chip is placed in the molding space 22 of the lower mold 20 and the solid resin is seated in the resin seating groove 24. As the movable plate 25 rises upward, the lower mold 20 is joined to the upper mold 10.
상기와 같이 상하부금형(10)(20)이 서로 형합되면 피스톤(30)이 실린더(31)내에서 상승하고, 상승하는 피스톤(30)에 의해 받침대(32)가 가압핀(33)을 상부로 상승시킨다. 이때 가압핀(33)은 고체의 수지를 가압하고 가압된 수지는 히터(11)(21)에 의해 녹으면서 유로(13)(23)를 따라 성형공간(13)(23)으로 흘러들어가 반도체 칩에 수지몰딩을 사출 성형하게 된다.When the upper and lower molds 10 and 20 are joined together as described above, the piston 30 rises in the cylinder 31, and the pedestal 32 moves the pressure pin 33 upward by the rising piston 30. Raise. At this time, the pressing pin 33 pressurizes the solid resin, and the pressurized resin is melted by the heaters 11 and 21 and flows into the forming spaces 13 and 23 along the flow paths 13 and 23 to form a semiconductor chip. Injection molding of resin molding is carried out.
이러한 성형프레스를 이용하여 반도체 칩에 수지몰딩을 할 수 있다는 잇점은 있으나, 수지몰딩시 주변에 거주하는 공기 및 먼지에 의해 수지에 기포가 발생하거나 먼지가 투입되어 제품의 불량률이 다량 발생하는 단점이 있었다.This molding press has the advantage of resin molding on the semiconductor chip, but when the resin molding, air and dust in the periphery of the resin generated by the air bubbles or dust is injected into the defect caused a lot of product defect rate there was.
따라서 종래에는 상기와 같은 단점을 감안하여 진공장치를 성형프레스에 장치한 후 이를 이용하여 진공상태에서 반도체 칩에 수지몰딩을 실시 하였으나 종래 진공장치는 상부금형측과 하부금형측에 진공장치를 각각 설치한 후 이를 이용하여 작업을 실시하였기 때문에 구조가 복잡하여 생산원가가 상승되는 요인이 되었다. 또한 하부금형측에 진공장치가 설치되어 있는 관계로 인하여 하부금형을 착탈하거나 주변부품을 교환하기 위해서는 하부금형에 위치한 일부 진공장치를 분리한 후하부금형을 착탈하거나 주변 부품을 교환한 후 다시 조립해야 하는 불편한 제반 문제점이 발생되었다.Therefore, in the related art, in view of the above disadvantages, the vacuum device was mounted on a molding press and resin molding was performed on the semiconductor chip under vacuum using the vacuum device. However, in the conventional vacuum device, a vacuum device is installed on the upper mold side and the lower mold side, respectively. Since the work was carried out afterwards, the structure was complicated, resulting in an increase in production cost. In addition, in order to remove or replace the peripheral parts of the lower mold due to the installation of the vacuum device on the lower mold side, after removing some vacuum devices located on the lower mold, it is necessary to remove the lower mold or replace the peripheral parts and reassemble them. There was an uncomfortable overall problem.
따라서 본 발명의 목적은 상기와 같은 종래의 문제점을 감안하여 안출한 것으로, 반도체 칩에 수지몰딩을 사출 성형시 별도의 진공장치를 통하여 진공상태에서 사출 성형작업이 이루어지게 함으로서 에어로 인한 제품 불량률을 최소화하고, 그 구조를 간편화하여 하부금형의 착탈과 부품교환이 간편하게 이루어질 수 있도록 한 반도체 칩 성형프레스의 진공장치를 제공하는데 있다.Accordingly, an object of the present invention is to conceive in view of the conventional problems as described above, by minimizing product defect rate due to air by injection molding operation in a vacuum state through a separate vacuum device when molding resin molding on a semiconductor chip In addition, the present invention provides a vacuum device for a semiconductor chip forming press that simplifies the structure so that attachment and detachment of a lower mold and parts replacement can be easily performed.
도1은 일반적인 성형프레스의 구성을 나타낸 단면도,1 is a cross-sectional view showing the configuration of a general molding press,
도2는 본 발명에 따른 진공장치가 성형프레스에 장치되어 작동되기 전의 상태를 나타낸 구성도,2 is a configuration diagram showing a state before the vacuum apparatus according to the present invention is installed in the molding press to operate;
도3은 본 발명에 따른 진공장치가 성형프레스에 장치되어 작동된 상태를 나타낸 구성도,Figure 3 is a block diagram showing a state in which the vacuum apparatus according to the present invention is operated in the molding press,
도4는 본 발명에 따른 진공장치가 하강한 상태를 나타낸 구성도,4 is a configuration diagram showing a state in which the vacuum apparatus according to the present invention is lowered;
도5는 본 발명에 따른 진공챔버의 사시도,5 is a perspective view of a vacuum chamber according to the present invention;
도6은 본 발명에 따른 진공챔버의 단면도.6 is a sectional view of a vacuum chamber according to the present invention;
(도면중 주요 부분에 대한 부호의 설명)(Explanation of symbols for the main parts of the drawing)
10 ; 상부금형 20 ; 하부금형10; Upper mold 20; Bottom mold
100 ; 진공챔버 110 ; 상부패킹100; Vacuum chamber 110; Upper packing
120 ; 하부패킹 130 ; 투시창120; Lower packing 130; Viewing window
140 ; 고정브라켓트 200 ; 가이드블럭140; Fixing bracket 200; Guide Block
300 ; 승하강실린더 400 ; 진공펌프300; Lifting cylinder 400; Vacuum pump
410 ; 진공호스410; Vacuum hose
상기와 같은 목적을 달성하기 위한 수단으로 본 발명은, 상부금형과 상판 사이에 형성되는 가이드블럭과,As a means for achieving the above object, the present invention provides a guide block formed between the upper mold and the upper plate,
상기 가이드블럭 몸체에 상단이 상부패킹에 의해 밀실하게 밀착되고 가이드블럭상에서 상하 이송 가능하며 하단에 하부패킹을 갖는 진공챔버와,A vacuum chamber having an upper end tightly adhered to the guide block body by an upper packing and being transported up and down on the guide block and having a lower packing at the bottom;
상기 진공챔버의 좌우측에 형성된 고정브라켓에 하단이 체결 고정되고 상단은 상판에 결합된 상태에서 하부금형이 상승하여 상부금형과 형합되면 진공챔버를 하강시켜 이 상,하부금형을 외부와 밀폐시키게 하는 승하강실린더와,The lower mold is fastened and fixed to the fixing brackets formed on the left and right sides of the vacuum chamber, and the upper mold is coupled to the upper plate, and the lower mold is raised to form an upper mold, thereby lowering the vacuum chamber to seal the upper and lower molds with the outside. With the lowering cylinder,
상기 승하강실린더에 의해 상,하부금형이 외부와 밀폐되면 내부의 공기 및 먼지를 외부로 강제 배출시킬수 있도록 진공호스와 연결되는 진공펌프와,When the upper and lower molds are sealed to the outside by the lifting cylinder, the vacuum pump is connected to the vacuum hose to forcibly discharge the air and dust inside,
상기 진공챔버 몸체 전면에 형성되어 내부의 작업상황을 볼수 있게 하는 투시창으로 구성되는 것을 그 기술적 구성상의 기본 특징으로 한다.It is formed on the front of the vacuum chamber body is composed of a see-through window that allows you to see the working situation inside the basic feature of the technical configuration.
이하 본 발명의 바람직한 실시예를 첨부도면을 참조하여 보다 상세하게 설명하면 다음과 같다.Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
도2는 본 발명에 따른 진공장치가 성형프레스에 장치되어 작동되기 전의 상태를 나타낸 구성도이고, 도3은 본 발명에 따른 진공장치가 성형프레스에 장치되어 작동된 상태를 나타낸 구성도이며, 도4는 본 발명에 따른 진공장치가 하강한 상태를 나타낸 구성도이다. 도5는 본 발명에 따른 진공챔버의 사시도 이고, 도6은 본 발명에 따른 진공챔버의 단면도 이다.2 is a configuration diagram showing a state before the vacuum apparatus according to the present invention is installed in the molding press is operated, Figure 3 is a configuration diagram showing a state in which the vacuum apparatus according to the invention is installed and operated in the molding press, Figure 4 is a configuration diagram showing a state in which the vacuum apparatus according to the present invention is lowered. Figure 5 is a perspective view of a vacuum chamber according to the present invention, Figure 6 is a cross-sectional view of the vacuum chamber according to the present invention.
본 발명의 반도체 칩 성형프레스도 상,하부금형(10)(20)이 서로 형합될때 수지를 강제 압착하여 반도체의 칩에 수지몰딩을 성형 하는 기본적인 맥락은 종래와 같다.In the semiconductor chip forming press of the present invention, when the upper and lower molds 10 and 20 are combined with each other, the basic context of forming the resin molding on the chip of the semiconductor by forcibly compressing the resin is the same as in the related art.
다만 본 고안은 반도체 칩 성형프레스에 진공장치를 장치하고, 이 진공장치에 의해 제품의 불량률을 최소화시키고 부품교환이 간편하게 이루어질 수 있도록 한 것으로 이는 도2 내지 도6에서와 같이 기본적으로 상하부금형(10)(20)이 형합되면 이를 외부와 밀폐시키는 진공챔버(100)와, 이 진공챔버(100)를 성형프레스상에서 상하 승하강시키는 승하강실린더(300) 및 진공챔버(100) 내부의 공기 및 먼지를 외부로 배출시키는 배출수단이 동원된다.However, the present invention is to provide a vacuum device to the semiconductor chip forming press, and by using this vacuum device to minimize the defect rate of the product and to easily replace parts, which is basically the upper and lower molds (10) When the (20) is combined, the vacuum chamber 100 which seals it with the outside and the lifting cylinder 300 and the air inside the vacuum chamber 100 which raise and lower the vacuum chamber 100 up and down on the molding press, and dust Discharge means for discharging the gas to the outside is mobilized.
진공챔버(100)는 상부금형(10)과 상판(11) 사이에 형성되는 가이드블럭(200) 몸체에 상단이 상부패킹(110)에 의해 밀실하게 밀착된 상태에서 가이드블럭(200)를 따라 상하 이송 가능하게 구성되어 있고, 하단에는 하부금형(20)측과 밀실하게 밀착되는 하부패킹(120)이 형성되며 몸체 전면에는 내부의 작업상황을 볼수 있게 하는 투시창(130)이 일체로 형성된다.The vacuum chamber 100 is vertically up and down along the guide block 200 in a state where the upper end is tightly adhered to the body of the guide block 200 formed between the upper mold 10 and the upper plate 11 by the upper packing 110. It is configured to be transportable, and a lower packing 120 is formed at the bottom of the lower mold 20 to be in close contact with each other. The front of the body is integrally formed with a see-through window 130 to view a working situation therein.
승하강실린더(300)는 진공챔버(100)의 좌우측에 형성된 고정브라켓트(140)에 하단이 체결 고정되고 상단은 상판(11)에 결합된 상태에서 하부금형(20)이 상승하여 상부금형(10)과 형합되면 진공챔버(100)를 하강시켜 이 상,하부금형(10)(20)을 외부와 밀폐시키게 하는 역활을 수행한다.The lifting cylinder 300 has a lower mold 20 in the state in which the lower end is fastened to the fixing bracket 140 formed on the left and right sides of the vacuum chamber 100 and the upper end is coupled to the upper plate 11 so that the upper mold 10 ) And lower the vacuum chamber 100 to seal the upper and lower molds 10 and 20 to the outside.
배출수단으로 사용되는 진공펌프(400)는 진공챔버(100)에 의해 상,하부금형(10)(20)이 외부와 완전 밀폐되면 진공챔버(100) 내의 공기 및 먼지를 외부로 강제 배출시킬수 있도록 진공호스(410)와 연결되는 구성을 갖는다.The vacuum pump 400 used as the discharge means is to be forced to discharge the air and dust in the vacuum chamber 100 when the upper and lower molds 10 and 20 are completely sealed by the vacuum chamber 100 to the outside. It has a configuration connected to the vacuum hose 410.
이와 같이 구성된 본 발명을 사용하기 위해서는 먼저 도2에서와 같이 진공호스(410)와 진공펌프(400)가 연결된 진공챔버(100)의 상단은 가이드블럭(200)에 결합함과 동시에 고정브라켓트(140)를 이용하여 승하강실린더(300)에 체결 고정한다.In order to use the present invention configured as described above, as shown in FIG. 2, the upper end of the vacuum chamber 100 to which the vacuum hose 410 and the vacuum pump 400 are connected is coupled to the guide block 200 and the fixing bracket 140 at the same time. Fasten to the lifting cylinder 300 by using).
상기와 같은 상태에서 성형프레스를 작동시키면 도3에서와 같이 통상의 방법을 통하여 하부금형(20)이 상부로 상승하여 상부금형(10)과 형합된다. 그러면 승하강실린더(300)에 전원이 인가되고, 이 승하강실린더(300)에 의해 진공챔버(100)는 가이드블럭(200)을 따라 하강하면서 도4에서와 같이 하단이 하부금형(20) 상단에 밀착되어 전체적으로 상하부금형(10)(20)을 외부와 밀폐시키게 된다. 이때 상하부금형(10)(20) 측은 진공챔버(100)의 상하단에 형성된 상부패킹(110)과 하부패킹(120)에 의해 외부와의 접촉이 더욱 긴밀하게 차단된 상태를 유지하게 된다.When the molding press is operated in the above state, as shown in FIG. 3, the lower mold 20 is raised to the upper portion through the conventional method, and the upper mold 10 is combined with the upper mold 10. Then the power is applied to the lifting cylinder 300, the lowering cylinder 300 is lowered along the guide block 200 by the lifting cylinder 300 as shown in FIG. In close contact with the upper and lower molds 10 and 20 as a whole to seal the outside. At this time, the upper and lower molds 10 and 20 sides maintain a state in which contact with the outside is more closely blocked by the upper packing 110 and the lower packing 120 formed at the upper and lower ends of the vacuum chamber 100.
상기와 같이 진공챔버(100)가 상하부금형(10)(20)측을 외부와의 접촉을 차단시키면 진공펌프(400)를 이용하여 내부의 공기와 먼지를 흡입하면 공기와 먼지는 진공호스를 통해 외부로 강제 배출되며, 상기와 같이 공기와 먼지가 없는 진공 상태에서 반도체 칩에 수지몰딩 작업을 실시하면 상하부금형(10)(20)측은 진공챔버(100)에 의해 진공상태이기 때문에 수지측에 기포가 생기지 않고 수지몰딩 작업을 실시할 수 있는 것이며 투시창(130)을 통해서는 내부의 작업상황을 확인하면 되는 것이다.As described above, when the vacuum chamber 100 blocks the upper and lower molds 10 and 20 side from contacting with the outside, the vacuum and the suction of the air and dust inside the vacuum pump 400, the air and dust through the vacuum hose When the resin molding operation is carried out to the semiconductor chip in a vacuum state free from air and dust as described above, the upper and lower molds 10 and 20 sides are bubbled to the resin side because they are vacuumed by the vacuum chamber 100. It is possible to perform the resin molding work without the occurrence and through the viewing window 130 is to check the working situation inside.
이상에서 살펴본 바와 같이 본 발명에 의하면, 반도체 칩에 수지몰딩을 사출 성형시 별도의 진공장치가 장치되어 있고 이 진공장치를 통하여 진공상태에서 사출 성형작업이 이루어지기 때문에 에어로 인한 제품 불량률을 최소화되는 것이다.As described above, according to the present invention, a separate vacuum device is provided when injection molding resin molding onto a semiconductor chip, and injection molding is performed in a vacuum state through the vacuum device, thereby minimizing product defect rate due to air. .
또한, 성형프레스에 장치된 진공장치는 구조가 간편화되어 있어 하부금형의 착탈과 부품교환이 간편하게 이루어질 수 있는 등의 효과가 있는 것이다.In addition, the vacuum device provided in the molding press has the effect that the structure can be simplified and the removal and replacement of the lower mold can be made easily.
이상에서는 본 발명을 특정의 바람직한 실시예를 참고하여 설명하였으나, 본 발명은 상기한 실시예에 한정되지 아니하며 본 발명의 요지를 벗어나지 않는 범위에서 통상의 지식을 가진자에 의해 다양한 변경과 수정이 이루어질 수 있는 것임을 밝혀둔다.The present invention has been described above with reference to specific preferred embodiments, but the present invention is not limited to the above embodiments and various changes and modifications may be made by those skilled in the art without departing from the gist of the present invention. Make sure you can.
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| KR100880790B1 (en) * | 2008-05-30 | 2009-02-02 | 이경선 | Vacuum brazing apparatus and the method therewith |
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