KR100393085B1 - 분할전극부분을 가진 급전롤러를 이용한 연속도금방법 및장치 - Google Patents
분할전극부분을 가진 급전롤러를 이용한 연속도금방법 및장치 Download PDFInfo
- Publication number
- KR100393085B1 KR100393085B1 KR10-2000-0083683A KR20000083683A KR100393085B1 KR 100393085 B1 KR100393085 B1 KR 100393085B1 KR 20000083683 A KR20000083683 A KR 20000083683A KR 100393085 B1 KR100393085 B1 KR 100393085B1
- Authority
- KR
- South Korea
- Prior art keywords
- feed roller
- plating
- cathode
- plated
- anode
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/16—Apparatus for electrolytic coating of small objects in bulk
- C25D17/28—Apparatus for electrolytic coating of small objects in bulk with means for moving the objects individually through the apparatus during treatment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/12—Shape or form
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Automation & Control Theory (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000173442A JP3285572B2 (ja) | 2000-06-09 | 2000-06-09 | 分割電極部分を有する給電ローラを用いた連続めっき方法並びに装置 |
JP173442 | 2000-06-09 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20010110973A KR20010110973A (ko) | 2001-12-15 |
KR100393085B1 true KR100393085B1 (ko) | 2003-07-31 |
Family
ID=18675671
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR10-2000-0083683A KR100393085B1 (ko) | 2000-06-09 | 2000-12-28 | 분할전극부분을 가진 급전롤러를 이용한 연속도금방법 및장치 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP3285572B2 (ja) |
KR (1) | KR100393085B1 (ja) |
TW (1) | TW522176B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014112817A1 (ko) * | 2013-01-16 | 2014-07-24 | 주식회사 잉크테크 | 도금 장치 및 도금 방법 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL1025446C2 (nl) * | 2004-02-09 | 2005-08-10 | Besi Plating B V | Werkwijze en inrichting voor het elektrolytisch doen toenemen van de dikte van een elektrisch geleidend patroon op een dielektrische drager alsmede dielektrische drager. |
JP4700396B2 (ja) * | 2005-04-14 | 2011-06-15 | 日本メクトロン株式会社 | プリント基板のめっき方法 |
JP5336948B2 (ja) * | 2009-06-30 | 2013-11-06 | 株式会社フジクラ | めっき装置およびめっき方法 |
JP5174082B2 (ja) * | 2010-04-23 | 2013-04-03 | 株式会社フジクラ | プリント配線板の製造方法及びプリント配線板の製造装置 |
JP5795514B2 (ja) * | 2011-09-29 | 2015-10-14 | アルメックスPe株式会社 | 連続メッキ装置 |
-
2000
- 2000-06-09 JP JP2000173442A patent/JP3285572B2/ja not_active Expired - Fee Related
- 2000-12-08 TW TW089126167A patent/TW522176B/zh not_active IP Right Cessation
- 2000-12-28 KR KR10-2000-0083683A patent/KR100393085B1/ko not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014112817A1 (ko) * | 2013-01-16 | 2014-07-24 | 주식회사 잉크테크 | 도금 장치 및 도금 방법 |
Also Published As
Publication number | Publication date |
---|---|
TW522176B (en) | 2003-03-01 |
JP3285572B2 (ja) | 2002-05-27 |
JP2001303299A (ja) | 2001-10-31 |
KR20010110973A (ko) | 2001-12-15 |
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