KR100368494B1 - Complex chip of combining with resistor and capacitor for high frequency and fabricating method therefor - Google Patents

Abstract

The present invention relates to a high frequency RC coupling chip manufactured by specially designing and manufacturing a through hole and an internal electrode pattern (Pattern) so that the high frequency equivalent inductance of the RC coupling chip element can be used stably even at high frequencies. The present invention relates to a small size RC coupled chip device having a low equivalent inductance value by forming a resistance component in a hole and designing an internal electrode pattern such that current flows in adjacent internal electrode layers in the chip are opposite to each other. .

In particular, through-holes are formed in the stacked sheets, resistive elements are formed in predetermined through-holes, and inner electrodes of each sheet are connected through the through-holes to reverse current flow in two adjacent inner electrode layers. The present invention relates to a RC coupled chip device having a desired device characteristic even at high frequency by canceling inductance to be a and a method of manufacturing the same.

Description

High frequency resistor-capacitor composite chip and manufacturing method thereof {Complex chip of combining with resistor and capacitor for high frequency and fabricating method therefor}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high frequency resistor-capacitor (RC) coupled composite chip component having a resistance component and a capacitor component in a single chip and having a low overall impedance even at high frequencies of several hundred MHz and more particularly, using a through hole in the chip. To form a resistance component and design an internal electrode pattern such that current flow in adjacent internal electrode layers of the multilayer capacitor is opposite to each other.

Representative passive elements in electronic circuits include resistors (R), capacitors (C), and inductors (L), and their functions and roles vary widely. For example, the resistor controls the flow of current through the circuit and also plays a role in achieving impedance matching in the AC circuit. The capacitor basically blocks the direct current and passes the AC signal, but also constitutes the time constant circuit, the time delay circuit, the RC and the LC filter circuit, and the capacitor itself plays the role of noise elimination. Its features are the most diverse and complex. In the case of the inductor, it removes high frequency noise and performs impedance matching.

In general, the passive element circuit is mounted as a single element in a chip form, but recently, with the development of small electronic devices such as mobile communication devices and digital cameras, arrays are used for the purpose of increasing the mounting efficiency and reducing the noise problem between devices. Arrays and combined chipping of two or more passive devices are accelerating. The LC-filter, which already combines the inductor (L) and capacitor (C), is a single chip and is being mass-produced by some electronic parts companies such as Murata in Japan, and the RC-coupled chip that combines the resistor (R) and capacitor (C) is manufactured by AVX of the United States. Owns some patents and are currently prototyping them on the market.

The RC coupling chip forms an RC coupling filter circuit, forms a delay line that delays a signal, and also plays a role of an external connection terminal and a pull-up filter, that is, electromagnetic wave blocking, required for each system expansion. As shown in FIG. 1, since a simple RC coupling (R1, R2, C) is often repeated in a circuit, an array that can accommodate many of these RC coupling chips on a single chip is essential for further miniaturization of electronic devices. can do.

The frequency-impedance characteristics of a conventional RC coupling chip (eg, an RC coupling chip of AVX) are shown in FIG. 2 using impedances of frequencies measured using a network analyzer. In this case, the impedance rises again, and thus cannot serve as the original RC coupling chip. This is because, in the case of a capacitor, high frequency increases the equivalent series inductance, which increases the overall impedance.

As described above, the conventional RC coupling chip component has a problem in that impedance is increased when used at high frequency.

In addition, the conventional RC coupling chip component has a problem that it is difficult to array to accommodate multiple RC coupling chips due to the complexity and difficulty in the manufacturing process.

SUMMARY OF THE INVENTION An object of the present invention for solving the above-described problems is to form a resistance component using through holes in a chip and to design an internal electrode pattern such that current flow in adjacent internal electrode layers of a multilayer capacitor is opposite to each other. Therefore, the present invention is to manufacture a RC coupling chip component that can be used stably at high frequency. It is also an object of the present invention to provide a manufacturing method for manufacturing such a composite chip component device.

In other words, by processing a through-hole (Hhrough hole) in the ceramic sheet to form a resistive component by printing a resistive material in the hole (Hole), the capacitor is laminated like a conventional multilayer ceramic capacitor or one electrode through the through-hole An object of the present invention is to fabricate an RC composite chip device having a desired device characteristic at high frequencies because the electrode surface is formed in a structure in which current flow is canceled to lower the high-frequency equivalent series inductance, thereby lowering the overall impedance at high frequencies of several hundred MHz. There is this.

In addition, another object of the present invention is to produce a miniaturized chip and an array chip by manufacturing a plurality of the RC coupling chip as a single chip.

1 is a connection example of a resistor-capacitor applied to an input / output terminal of various integrated circuits (IC).

Figure 2 Impedance characteristic curve for frequency of a conventional resistor-capacitor integrated chip

3 is a manufacturing diagram of a high frequency series RC coupling chip of Embodiment 1 of the present invention;

4 is a high frequency series RC coupling chip and an equivalent circuit according to the first embodiment of the present invention.

5 is a manufacturing diagram of a high frequency parallel RC coupling chip of the second embodiment of the present invention

6 is a high frequency parallel RC coupling chip and an equivalent circuit according to the second embodiment of the present invention.

Fig. 7 High-frequency series and parallel RC combination chip in the form of a four-row array

RC composite chip device according to the present invention for solving the above object to form a through-hole at a desired position by making a thin sheet (Sheet) of a slurry of a predetermined composition prepared according to the desired device characteristics using a doctor blade method, etc. A resistive paste is inserted into the through hole, and a pattern of a desired internal electrode is printed on the sheet so that the flow of current in adjacent inner electrode layers is opposite to each other. After laminating by the desired number, the laminate is fired to be integrated into a single body, and formed by forming a terminal electrode connected to each internal electrode. In addition, the RC composite chip according to the present invention can change the formation position of the resistance component, the internal electrode pattern or the number of laminated sheets according to the purpose of use. For example, in order to adjust the resistance value of the chip, the size and number of through holes are controlled, the capacitance value is changed by changing the number of laminated sheets, and the shape and position of the through holes and internal electrode patterns are changed to change the resistance and capacitance components. Change the connection method in series or in parallel.

An embodiment of manufacturing an RC composite chip device according to the present invention will be described in more detail below with reference to the accompanying drawings for the manufacture of a series RC composite chip.

Using a commercially available raw material powder for capacitor devices, a slurry for the device is manufactured in a desired composition, and the slurry is formed into a molded sheet having a desired thickness as shown in FIG. 3 by a doctor blade or the like. 301 to 306, green sheet).

Through holes (307, 308) are formed on the manufactured sheet so that internal electrodes of the upper and lower parts are connected through the through holes at one end of both ends of the molded sheet as shown in FIG. 3 using a hole puncher. The through hole can be manufactured in various forms such as polygonal shape such as quadrilateral or cylindrical shape. In the formed through-holes, resistive pastes such as RuO ₂ pastes are printed to fill the holes to form resistive components 309 and 310. At this time, the resistance value is adjusted by the shape, size and number of through-holes in which the resistive paste is filled.

As described above, internal electrodes 311 to 316 having a predetermined pattern are formed by using electrode pastes such as palladium (Pd) or silver-palladium (Ag-Pd) paste on the molded sheets 301 to 306 on which the resistance components are formed. Print by screen printing method. That is, the first sheet 301 is formed by printing an internal electrode 311 connected to the positive terminal and the resistance component in the through hole and insulated from the negative terminal to form the first sheet 301, and the positive terminal and the resistance component in the through hole. A second sheet 302 is formed by printing an internal electrode 312 which is insulated from and connected to the negative terminal to the surface of the sheet, and is connected to the resistance component in the through-hole and insulated from the positive and negative terminals. The internal electrode 313 is printed on the surface of the sheet to form the third sheet 303, that is, the internal electrode 314 is connected to the negative terminal and the resistance component in the through hole and insulated from the positive terminal. The fourth sheet 304 is printed on the surface to form a fourth sheet 304, and the fifth sheet 305 is printed by printing on the surface of the sheet an internal electrode 315 which is insulated from the negative terminal and the resistance component in the through hole and connected to the positive terminal. ), Which is connected to the resistance component in the through hole and disconnected from the positive and negative terminals. Printing an internal electrode 316 to the surface of the sheet to form a sixth seat (306).

As described above, when the first to sixth sheets 301 to 306 having the resistance component and the internal electrodes are formed in pairs and stacked as desired, through the resistance components of the through-holes as shown in FIG. The internal electrodes of the first sheet and the third sheet are connected to each other, and the internal electrodes of the fourth and sixth sheets are connected to each other. By repeatedly stacking a unit structure as shown in FIG. 3B, a device for implementing various capacitance values and resistance values can be manufactured.

In order to remove all organic components such as binders in the laminate 317 prepared as described above, the laminate is heated at a temperature of 400 ° C. for about 6 hours to bake out, and then the temperature is raised to sinter the laminate at an appropriate firing temperature. In addition, an external electrode 318 connected to the internal electrode of the laminate is formed outside the fired laminate to manufacture a series RC coupled single chip.

The RC coupling chip manufactured as described above is composed of a resistor component 41 formed in a through hole and a capacitor component 42 in the form of a sheet as shown in FIG. 4, and each component is composed of a resistor component and a capacitance as shown in an equivalent circuit. The components are made from a series RC coupled single chip connected in series. At this time, if the positive / negative voltage is applied to the external electrode 43 at both ends of the chip, the current flow direction of the internal electrode is as shown in Fig. 4, so that the directions of the current flow of two adjacent internal electrode layers are opposite to each other, so that the inductance is canceled and Equivalent inductance is also greatly reduced when used at.

Another embodiment of an RC coupled single chip is a parallel RC coupled single chip device in which a resistance component and a capacitance component are connected in parallel.

In the same manner as in Example 1, a plurality of forming sheets for devices 501 to 505 are manufactured.

First, at least two through holes 506 are formed in the sheet so that two adjacent inner electrodes are connected to each other by using a hole puncher on the sheet manufactured as described above to form a parallel resistor. The resistive paste 507 is printed and filled into the through hole to form a resistive component 507. The sheet is insulated from the positive terminal as opposed to the internal electrode 509 connected to the positive terminal and insulated from the negative terminal, respectively. The internal electrodes 510 connected to the negative terminals are printed to form first and second sheets 501 and 502.

In order to form a capacitor component, a through hole 508 is formed at one end of the sheet to connect internal electrodes at upper and lower ends thereof, as shown in FIG. 5, using a hole puncher on the sheet manufactured as described above. The internal electrodes 511 to 513 of a predetermined pattern are printed on the molded sheet on which the through-holes are formed by using an electrode paste. That is, a third sheet 503 is formed by simultaneously printing the internal electrode 511 connected to the electrode in the through hole and insulated from the positive and negative terminal in the surface of the sheet and the through hole 508 at the same time. The inner electrode 512, which is insulated from the electrode in the through hole and connected to the negative terminal, is simultaneously printed in the surface of the sheet and the through hole to form a fourth sheet 504, and connected to the electrode in the through hole and the positive terminal. And an internal electrode 513, which is insulated from the negative terminal, is simultaneously printed in the surface of the sheet and the through hole to form a fifth sheet 505.

As shown in FIGS. 5B and 5B, when the first and second sheets having the resistance component and the internal electrode are formed and the third, fourth, and fifth sheets in which the inner electrodes are printed and paired as desired, are stacked. Likewise, the internal electrodes of the first sheet and the second sheet are connected through the resistance component of the through hole, and the third sheet and the fifth sheet are connected through the internal electrode of the through hole. Squeeze. By repeatedly stacking a unit structure as shown in FIG. 5B, a device for implementing various capacitance values and resistance values may be manufactured.

In order to remove all organic components such as various binders in the laminate 514 manufactured as described above, the laminate is heated at 400 ° C. for about 6 hours to bake out, and then the temperature is raised to sinter the laminate at an appropriate firing temperature. In addition, an external electrode 515 connected to the internal electrode of the laminate is formed on the outside of the fired laminate to manufacture a parallel RC bonded single chip.

The RC coupling chip manufactured as described above is composed of a resistor component 61 formed in a through hole and a capacitor component 62 in a sheet form as shown in FIG. 6, and each component is composed of a resistance component and capacitance as shown in an equivalent circuit. The components are made of parallel RC-coupled single chips connected in parallel. At this time, if a positive / negative voltage is applied to the external electrodes 63 at both ends of the chip, the current flow direction of the internal electrodes is as shown in FIG. 6, so that the directions of the current flows of two adjacent internal electrode layers are opposite to each other, thereby canceling the inductance Equivalent inductance is also greatly reduced when used at.

The series or parallel RC coupling chip manufactured as described above is designed by designing a printed pattern and a through hole forming pattern of an internal electrode into a plurality of patterns, for example, four or more repeated RC coupling chips, rather than a pattern of one RC coupling chip. Later, when the stacked chip is manufactured by the above process, an array chip having a series and parallel structure as shown in FIG. 7 may be manufactured.

On the other hand, by using a combination of the printed pattern and the through-hole forming pattern of the internal electrode of the series or parallel RC coupling chip manufactured as described above to manufacture an RC coupling chip in which both the series resistance component and the parallel resistance component are present in a single chip. can do.

The technology for manufacturing the RC coupling chip manufactured as described above changes the through-hole and the internal electrode pattern in addition to the above-described device to form a resistance component in the through-hole, and a current flow in the opposite direction occurs between adjacent inner electrode layers. Various types of devices may be manufactured as stacked chip component devices.

In addition, the technology for manufacturing the RC coupling chip manufactured as described above may be applied to various applications in the manufacture of a device for a composite electronic component manufactured by combining two or more of the desired characteristics.

As described above, the RC coupling chip device manufactured by changing the through-hole and the internal electrode pattern according to the present invention to form a resistance component in the through-hole and generating a current flow in the opposite direction between adjacent internal electrodes has an equivalent inductance even at a high frequency. It has a reducing effect. Therefore, it can be used as a stable chip component even at high frequencies.

Since the RC coupling chip element as described above constitutes a resistance component and a capacitance component in the same chip, it is possible to manufacture a small RC coupling chip.

Since the RC coupling chip device as described above is manufactured by a simple process without the addition of a separate process, there is an effect that it is possible to manufacture a small and thin RC coupling chip device and an array chip that can realize the desired electrical characteristics. .

In addition, as described above, the RC-coupled chip device can easily adjust the resistance value by adjusting the size and number of through holes in the chip, and realize various capacitance values and resistance values by repeatedly stacking the unit structure of the chip. There is an effect that can manufacture a device.

Claims (9)

In the RC coupling chip device, An RC coupling chip element in which a resistance component is formed inside a through hole in a chip, and the current flow of adjacent inner electrode layers is reversed by connecting an inner electrode of a predetermined capacitor layer. In the RC coupling chip device, A body in which at least two layers of a plurality of capacitor element sheets having desired characteristics are laminated; A plurality of through holes formed in the element sheet; A resistance component formed in said predetermined through hole, Internal electrodes formed on the stacked element sheets, An external electrode formed at an end of a body in which an element sheet having an internal electrode formed thereon is laminated and connected to the internal electrode The inner electrode of the predetermined sheet has two layers connected to one outer terminal through a through hole, and an inner electrode connected to the other outer terminal is formed between the two layers so that current flow of the inner electrodes of adjacent layers is reversed. RC coupling chip device, characterized in that formed to be. The RC coupling chip device according to claim 1 or 2, wherein the resistance component and the capacitor component are connected in series. The RC coupling chip device according to claim 1 or 2, wherein the resistance component and the capacitor component are connected in parallel. According to claim 1 or claim 2, RC array chip device of the array type of a plurality of chips are repeated by stacking two or more layers of the RC coupling chip. In the method of manufacturing the RC coupling chip device, Manufacturing a molding sheet for a capacitor element using a slurry having a predetermined composition, Forming a plurality of through holes penetrating the molded sheet; Printing the resist paste into a specific through hole in a desired form; Printing an electrode paste on a sheet in a desired form to form an internal electrode on the sheet or in the through hole, Forming at least two or more layers of molded sheets on which electrode paste is printed, a resistance component is formed in a predetermined through hole, and the internal electrodes of the predetermined sheet are connected through the through holes so that the current flow of the internal electrodes of adjacent layers is reversed. step, Pressing the laminated sheet; Calcining the compacted laminate by heat treatment, And forming an external electrode connected to the internal electrode at both ends of the stack. The method of claim 6, wherein the through-hole pattern and the internal electrode pattern are adjusted to connect the resistance component and the capacitor component in series. The method of claim 5, wherein the through-hole pattern and the internal electrode pattern are adjusted to connect the resistance component and the capacitor component in series. The method of manufacturing a RC coupled chip device according to any one of claims 6 to 8, wherein the RC coupled chip device is made of an RC bonded chip device having an array of a plurality of chips.