KR100364759B1 - master for plasma display panel and method for fabricating the same and method for fabricating plate of plasma display panel using the same - Google Patents

Abstract

A mold for a PD, a method for manufacturing the same, and a method for manufacturing a PD substrate using the same, in which a mold for forming a PD is formed and patterned on a substrate to form a plating frame having an uneven shape to expose a portion of the substrate, and to the exposed substrate. Forming a metal material layer, flattening the plating mold and the metal material layer, and then removing the plating mold to form a metal structure having a concave-convex shape. Similarly, by using micromachining technology and semiconductor device manufacturing process, it is possible to achieve uniformity, precision, and miniaturization, to realize high definition and large area, and to improve throughput and yield by mass copying PDP substrate. .

Description

Mold for PD and its manufacturing method and method for manufacturing PD substrate using same {master for plasma display panel and method for fabricating the same and method for fabricating plate of plasma display panel using the same}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of a plasma display panel (PDP) which is a flat panel display device, and more particularly, to a mold for a PD, a method of manufacturing the same, and a method of manufacturing a PD substrate using the same.

Recent development trends of image display devices can be summarized in terms of large area and high definition, and conventional image display devices employing cathode ray tubes (CRTs) have limitations in their size. As an image display device capable of overcoming the limitations of the CRT, the demand for flat panel displays is gradually increasing.

That is, in the case of a flat panel display device, the thickness of an image display device having the same screen size as that of a CRT can be greatly reduced, and since the screen itself is flat, a thinner product can be realized, thereby allowing a large screen such as a home theater. It is expected to be suitable for applications requiring

Such a flat panel display includes a thin film liquid crystal display (TFT LCD), a field emission display (FED), an electroluminescent display (ELD), etc., but PDP is a method that has recently been in the spotlight in view of viewing angle, illuminance, and large area. .

However, the above-described conventional mold for PDPD, its manufacturing method, and PDPC substrate manufacturing method using the same are produced in a large number of substrates through various processes such as photoresist coating, exposure, development, and chemical etching. There is a problem in terms of throughput and yield.

Therefore, the present invention has been made to solve the above problems, by using a micro machining technology and a semiconductor device manufacturing process to produce a precision mold, by molding a large amount of PDP substrate with the produced mold, It is an object of the present invention to provide a mold for a PD, a method of manufacturing the same, and a method for manufacturing a PD substrate using the same, which enables uniformity and miniaturization of pixels to realize high definition and large area, and improve mass productivity and yield.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 shows the configuration of a PD display device having an upper plate and a lower plate using micromachining

2A-2I illustrate a precision mold forming process for PDP back substrate / back-plate using micro machining

3A to 3C show a PD back-plate forming process using a mold manufactured by micro machining.

* Explanation of symbols for main parts of the drawings

10: mold disc 11: seed layer

12 thick film photosensitive film 13 photo mask

14 photosensitive film plating frame 15 ultraviolet parallel light

16: mask pattern transmitted light 17: metal material

18 metal structure 20 back-plate / back substrate

21: partition 22: substrate

23 back-plate raw material 24 lower electrode (anode)

25: mold 31: top plate

32: upper electrode

A feature of a PD mold according to the present invention for achieving the above object is a PD mold for obtaining a PD substrate having a partition structure of a plurality of stripe patterns, the substrate, a seed metal layer formed on the substrate, And a metal structure formed in a concave-convex shape so as to have a sidewall slope inclined at an angle between 0 and 90 degrees with respect to the vertical direction of the substrate by plating on the seed metal layer. It consists of a substance that contains.

In order to achieve the above object, there is provided a PD mold manufacturing method according to the present invention in the manufacture of a PD mold for obtaining a PD substrate having a partition structure of a plurality of stripe patterns, forming a seed metal layer on the substrate, A first step of forming a pattern material on the seed metal layer, and patterning the pattern material to have an inclined sidewall slope at an angle of 0 to 90 degrees such that the seed metal layer is exposed to the stripe pattern area between 0 and 90 degrees. A second step of forming a plating frame having an uneven shape having a sidewall slope inclined at an angle of the second step, a third step of forming a metal material layer on the exposed substrate, and removing and planarizing the plating frame and the metal material layer The fourth step and removing the plating mold to have the sidewall slope inclined at an angle between 0 and 90 degrees. There makin comprises a fifth step of forming in the structure.

The seed metal layer is formed by any one of an evaporation method, a sputtering method, and a chemical vapor deposition (CVD) deposition method.

In the third step, when forming the metal material layer, the metal material layer is formed to be higher than the height of the plating mold, and the metal material layer is formed by an electrolytic plating or an electroless plating process. .

The pattern material is made of a photosensitive film, and the fourth step is planarized using a mechanical method, or a chemical method, or a mechanical and chemical method.

Features of the PDPC substrate manufacturing method using the PD mold for the present invention for achieving the above object is a mold having a seed metal layer formed on the substrate and a metal structure formed in the concave-convex shape by plating on the seed metal layer. In the method of manufacturing a PD substrate using the method, the produced mold has a plurality of stripe patterns by hot press embossing or injection molding, the sidewall of the sprite pattern is 0 ~ 90 degrees Replicating a PD substrate having a partition structure inclined at an angle therebetween. The replication of the PD substrate by the compression molding method includes a first step of preparing the mold and the substrate, and placing the mold on or below the substrate. And a second step of moving the mold to the substrate surface to pressurize the mold. And a third step of transferring, a fourth step of removing the mold from the substrate, and a fifth step of sequentially repeating the second, third, and fourth steps.

An operation according to the characteristics of the present invention is to manufacture a precision-processed mold to produce a PDP substrate, in the manufacture of a PD display device using compression and injection molding techniques of the precision-processed mold and the substrate, the mold is micro Since it is manufactured using a machining technique and a semiconductor device manufacturing process, it can be mass-produced to increase the mass production and yield of a PD display device, and to realize a large area by high definition, uniformity and smoothing due to the miniaturization and precision of pixels.

Other objects, features and advantages of the present invention will become apparent from the following detailed description of embodiments taken in conjunction with the accompanying drawings.

With reference to the accompanying drawings, a preferred embodiment of the mold for PDPC according to the present invention, a method for manufacturing the same, and a method for manufacturing a rear substrate for PDPD using the mold will be described below.

FIG. 1 is a schematic plan view of a PD screen in which a back plate 20 having a comb-shaped sidewall 21 and a top plate 31 including a transparent counter electrode as an upper electrode 32 are assembled. .

PDP individually controls each pixel constituting the screen, generates a plasma discharge state for each pixel, and emits light by itself, and transmits the fluorescent material formed on the emitted pixel to transmit the color of the desired pixel and the display device. Adjust the brightness.

Each pixel includes electrodes for plasma excitation, sidewalls 21 for causing plasma discharge independently for each pixel, three primary fluorescent materials of red, green, and blue that emit light by plasma discharge for each pixel, and plasma In order to cause the discharge, the back plate 20 and the top plate 31 are formed in a space between the partitions 21 joined to each other, and are composed of Xe and the like which are filling and discharge gases excited in a plasma state.

As shown in FIG. 1, the back plate 20 of PDPD has a lower electrode 24, which is an anode for generating plasma discharge for each pixel, and a partition wall for isolating the plasma discharge from an adjacent pixel. 21 and the like, and a fluorescent material and an upper electrode 32 which is a cathode are formed on a cover plate 31, and the back plate 20 and the top plate 31 are aligned and bonded to each other. The CD screen is completed.

A PD screen is constructed by assembling a back plate 20 having a metal lower electrode 24 and a top plate 31 having a counter electrode, which is a fluorescent material for each pixel, and a counter electrode, which is an upper electrode 32. do.

The counter electrode, which is the upper electrode 32 patterned on the transparent upper plate 31, is formed on the minute plasma discharge space and the back electrode 24 formed on the back-plate substrate 22. It is formed correspondingly.

2A to 2I are views showing a process of processing the precision mold 25 for manufacturing the PD back plate 20 through micromachining and semiconductor device manufacturing processes.

As shown in FIG. 2A, a mold original plate 10 used as a support part of the mold 25 is prepared, and a cleaning process for removing impurities on the surface thereof is performed. As shown in FIG. 2B, a seed layer 11 made of metal to be used as a seed in the plating process is deposited on one surface of the mold original plate 10. The plating method of the plating seed layer 11 may be a method used in a conventional semiconductor device manufacturing process such as evaporation, sputtering, and CVD, and the mold original plate 10 is made of a metal material. In this case, the seed layer 11 can be omitted.

Then, as shown in FIG. 2C, the thick film photosensitive film 12 is applied by the height of the partition wall 21 of the back plate 20, and the photosensitive film has photosensitivity and improves adhesion to the mold disc 10. Appropriate heat treatment should be applied if possible. Thereafter, as shown in FIG. 2D, the thick film photoresist film 12 is passed through a photomask 13 in which a planar shape of the partition wall 21 structure is prepared in advance by a parallel light exposure device such as a mask aligner or a stepper. It exposes. Negative photoresist can be applied in the same manner. After the exposure (develop) process and heat treatment process as shown in Figure 2e to complete the shape of the photosensitive film plating frame (14). The inclination of the sidewall of the photoresist plating mold 14 can be arbitrarily adjusted by adjusting the exposure conditions of the thick film photoresist 12.

As shown in FIG. 2F, a method suitable for electroforming or electroless-plating a metal suitable for mold use in compression molding is performed on the photoresist plating mold 14 formed of the thick film photoresist 12. Fill it with That is, the metal structure 18 having the uneven shape corresponding to the plasma discharge of the partition wall 21 and the pixel is manufactured by electrolytic or electroless plating on the photoresist plating frame 14 patterned with the thick film photoresist 12.

As shown in FIG. 2G, the plating process is continued to perform an overflow plating so that the plated metal overflows the photosensitive film plating frame 14. Then, as illustrated in FIG. 2H, the overflowed metal is polished to a desired thickness through chemical mechanical polishing and removed by the height of the photoresist plating mold 14 to improve the smoothness of the metal structure 18 to improve the overall mold. The smoothness of 25 is improved, and the height of the partition 21 is adjusted.

In this manner, the photosensitive film plating mold 14 of the PD25 back plate 20 mold 25 is manufactured by a photographic drawing process using the thick film photosensitive film 12.

As shown in FIG. 2I, the photosensitive film plating frame 14 made of the thick film photosensitive film 12 is removed from the substrate 22 by chemical or physical methods without damage to complete the mold 25. The thick film photoresist 12 is removed by a selective etching technique to complete the mold formed of the mold metal structure 19.

3A to 3C are views illustrating a compression molding manufacturing process of the PD back plate 20 according to the present invention, and the PD is formed by compression molding using a mold manufactured by the process as shown in FIGS. 2A to 2I. The process of manufacturing the back plate of this is shown.

The precision mold (master) processed by the micro-machining and semiconductor device manufacturing process is pressed to the back-plate raw material 23, such as the sheet (sheet) form to form the back-plate 20 at a predetermined temperature and pressure, The reverse shape of the irregularities formed on the surface is duplicated, and then duplicated through a process such as heat treatment and sintering. This mold is reused again to mass process the same replica back-plate 20.

The above process steps are repeated to uniformly produce a large number of identical back-plate 20 shapes. The machined precision mold is repeatedly reproduced by hot press embossing or injection molding, and the bulkhead 21 of the manufactured back plate 20 structure is repeatedly replicated. Patterning the anode 24 in the pixel area of the shadow mask (shadow mask) method to complete the back-plate 20 for the PD.

The trend toward larger areas of display and higher definition requires more precise processing of display components. That is, in the case of PD, the area of the back-plate 20 substrate is increased due to the large area trend, while the size of each pixel has to be reduced due to the high-definition trend. Since it is to be made uniformly, the requirements of processing precision and uniformity of the manufacturing process must be further strengthened.

These two requirements, large area and high definition, have strong opposite aspects, and even if the two requirements are met, the yield of the manufactured product is lowered.

However, as shown in FIGS. 2A to 2I, a mold having a partition wall 21 structure, which is a key element of the PD back plate 20, is manufactured by using a micromachining technique and a semiconductor device manufacturing process. By mass replicating the back-plate 20, both yields can be improved while meeting both requirements.

As described above, the mold for a PD, the manufacturing method thereof, and the PD substrate manufacturing method using the same have the following effects.

First, by applying the compression molding technique to the mold manufactured by the micro machining technology, the PDPC substrate is replicated in large quantities in order to improve the throughput, and improve the uniformity and yield of products between the substrates. There is.

Second, by applying compression molding techniques to molds manufactured by micromachining technology and semiconductor device manufacturing process, miniaturization and precision of substrate pixels are realized to realize high definition of PDP, and the smoothness of the mold and chemical barrier height are improved by chemical mechanical polishing. It is possible to achieve the uniformity of, thereby corresponding to the large area of the PD screen.

Those skilled in the art will appreciate that various changes and modifications can be made without departing from the spirit of the present invention.

Therefore, the technical scope of the present invention should not be limited to the contents described in the embodiments, but should be defined by the claims.

Claims (14)

In a mold for a PD to obtain a PD substrate having a partition structure of a plurality of stripe patterns, Substrate, A seed metal layer formed on the substrate, and And a metal structure formed in a concave-convex shape so as to have a sidewall slope inclined at an angle between 0 and 90 degrees with respect to the vertical direction of the substrate by plating on the seed metal layer. The mold of claim 1, wherein the substrate comprises a metal material. delete delete delete In manufacturing a PD mold for obtaining a PD substrate having a partition structure of a plurality of stripe patterns, Forming a seed metal layer on the substrate, and forming a pattern material on the seed metal layer; The pattern material is patterned to have a sidewall slope inclined at an angle of 0 to 90 degrees to expose the seed metal layer as much as the stripe pattern region, thereby forming an uneven plated shape having sidewall slope inclined at an angle of 0 to 90 degrees. The second step of forming a frame, Forming a metal material layer on the exposed substrate; A fourth step of planarizing by removing the plating mold and the metal material layer; And a fifth step of removing the plating mold to form a concave-convex metal structure to have an inclined sidewall inclination at an angle between 0 and 90 degrees. delete The method of claim 6, wherein the seed metal layer is formed by any one of an evaporation method, a sputtering method, and a chemical vapor deposition (CVD) deposition method. 7. The method of claim 6, wherein the metal material layer is formed higher than the height of the plating mold when the metal material layer is formed in the third step. The method of claim 6, wherein the metal material layer is formed by an electrolytic plating or an electroless plating process. 7. The method of claim 6, wherein the pattern material is a photosensitive film. 7. The method of claim 6, wherein the fourth step is planarized using a mechanical method, a chemical method, or a mechanical and chemical method. In the method of manufacturing a PD substrate using a mold having a seed metal layer formed on the substrate and a metal structure formed in the concave-convex shape by plating on the seed metal layer, The PDPC substrate has a plurality of stripe patterns by hot press embossing or injection molding using the manufactured mold, and has a partition structure in which sidewalls of the sprite patterns are inclined at an angle between 0 and 90 degrees. PDPC substrate manufacturing method characterized in that to replicate. The method of claim 13, wherein the compression molding method A first step of preparing the mold and the substrate; A second step of disposing the mold on the upper or lower portion of the substrate; A third step of moving the mold onto the substrate surface to pressurize and reverse transfer the mold; A fourth step of removing the mold from the substrate, Method for manufacturing a PDP substrate, characterized in that consisting of a fifth step of sequentially repeating the second, third, fourth step.