KR100331501B1 - Production methode for flat-type vivration plate of speaker - Google Patents

Production methode for flat-type vivration plate of speaker Download PDF

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Publication number
KR100331501B1
KR100331501B1 KR1020000012722A KR20000012722A KR100331501B1 KR 100331501 B1 KR100331501 B1 KR 100331501B1 KR 1020000012722 A KR1020000012722 A KR 1020000012722A KR 20000012722 A KR20000012722 A KR 20000012722A KR 100331501 B1 KR100331501 B1 KR 100331501B1
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South Korea
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diaphragm
speaker
present
flat
foaming
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KR1020000012722A
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Korean (ko)
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KR20010091232A (en
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유인희
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유인희
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/003—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor for diaphragms or their outer suspension
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
    • H04R7/04—Plane diaphragms
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2307/00—Details of diaphragms or cones for electromechanical transducers, their suspension or their manufacture covered by H04R7/00 or H04R31/003, not provided for in any of its subgroups
    • H04R2307/021—Diaphragms comprising cellulose-like materials, e.g. wood, paper, linen
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2307/00—Details of diaphragms or cones for electromechanical transducers, their suspension or their manufacture covered by H04R7/00 or H04R31/003, not provided for in any of its subgroups
    • H04R2307/025—Diaphragms comprising polymeric materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/15—Transducers incorporated in visual displaying devices, e.g. televisions, computer displays, laptops

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Manufacturing & Machinery (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)

Abstract

본 발명은 평면 스피커 진동판의 제조방법에 관한 것으로서, 이는 특히 평면 스피커의 전면 평판면을 이루는 진동판이 얇고 단단하며, 진동에 대한 떨림 현상을 높일 수 있어 이러한 스피커의 음질을 고품위로 제공할 수 있도록 한 것이다.The present invention relates to a method for manufacturing a flat speaker diaphragm, which is particularly thin and rigid, and the vibration plate forming the front flat surface of the flat speaker can increase the vibration phenomenon of the vibration to provide a high quality sound of such a speaker will be.

본 발명은 폴리스틸렌 쉬트를 기재로하여 양면에 종이기재를 합지하여 소정 온도의 예열롤에 진입시키는 예열처리공정과, 예열처리 공정이후 소정 온도의 합지롤에 진입시켜 고온 발포 및 융착처리를 수행하는 고온 발포/융착공정과, 도온 발포/융착 공정이후 소정 온도로 냉각처리 하는 냉각공정과, 이후 두께조절 고무롤로 진입시켜 두께를 조절하는 두께조절 공정등을 포함하는 평면 스피커 진동판의 제조방법을 제공 하는데 있다.The present invention is a preheating process of laminating a paper substrate on both sides of a polystyrene sheet to enter a preheating roll of a predetermined temperature, and a high temperature to enter a paper roll of a predetermined temperature after the preheating process to perform high temperature foaming and fusion treatment. The present invention provides a method for manufacturing a flat speaker diaphragm including a foaming / fusion process, a cooling process for cooling to a predetermined temperature after the thermal foaming / fusion process, and a thickness adjusting process for adjusting thickness by entering a thickness adjusting rubber roll. .

이러한 본 발명은 평면스피커의 진동판이 얇고 단단하며 음향주파수에 대한 떨림 현상을 양호히 확보할 수 있어 이러한 평면스피커의 음질을 양호히 높일 수 있다.In the present invention, the diaphragm of the plane speaker is thin and hard, and the vibration phenomenon of the acoustic frequency can be secured well, so that the sound quality of the plane speaker can be improved.

Description

평면스피커의 진동판 제조방법{Production methode for flat-type vivration plate of speaker}Method for manufacturing diaphragm of flat speaker {Production methode for flat-type vivration plate of speaker}

본 발명은 평판스피커의 진동판 제조방법에 관한 것으로서, 이는 특히 평면스피커의 진동판이 얇고 단단하며 음향주파수에 대한 떨림 현상을 양호히 확보할 수 있어 이러한 평면스피커의 음질을 양호히 높일 수 있도록 한 것이다.The present invention relates to a method for manufacturing a diaphragm of a flat panel speaker, which is particularly designed to make the diaphragm of a flat speaker thin and hard and to ensure a good vibration of the acoustic frequency.

평판스피커는 데스크탑 피시(PC), 노트북컴퓨터, 휴대용시디 플레이어, 카세트 플레이어 등에 탑재되는 소형 스피커로서 널리 활용되고 있으며, 이는 콘덴서형 스피커나 또는 마그네트형 스피커 등이 있으며, 이들 중 일례로, 마그네틱형 스피커의 형태는 도 1과 같이 나타 내었다.Flat panel speakers are widely used as small speakers mounted on desktop PCs, notebook computers, portable CD players, cassette players, and the like. These include condenser-type speakers or magnet-type speakers. The shape of is shown in FIG.

여기서는 스피커 본체에 마그네트(23) 및 보이스코일(22)이 설치된 전면에 떨림을 위한 평면 진동판 (21)이 구비 되어져 있으며, 이러한 진동판(21)은 상기와 같은 휴대용 제품이나 소형스피커를 요구하는 물품에 경박단소화 하게 설치될 수 있다는 점에서 장점이 있고, 종래에는 이러한 진동판(21) 형태가 도 2와 같이 이뤄져 있다.Here, a flat diaphragm 21 for vibration is provided on the front surface of the magnet body 23 and the voice coil 22 installed on the speaker body, and the diaphragm 21 is applied to an article requiring such a portable product or a small speaker. There is an advantage in that it can be installed to be light and short, and the conventional diaphragm 21 is made as shown in FIG.

즉, 중앙에 제 1기재(26)를 중심으로 양측에 제 2기재(24)들이 층을 이루고 있고, 이들 제 1,2기재(26,24)들은 상호 접착제(25)로 부착하여 목적물인 진동판을 구성하게 되는 것이었다.That is, the second base material 24 forms a layer on both sides of the first base material 26 in the center, and the first and second base materials 26 and 24 are attached to each other with an adhesive 25 to form a diaphragm as an object. It was to construct.

그러나, 이러한 종래 진동판(21)은 제 1,2기재(26,24)들을 상호 접착제(25)로 저온 결합시키게 됨으로서 이에 따른 작업성이 불리하고 일단 완성된 제품의 불량율이 높으며, 내구성도 저하되어 이러한 평면 스피커 진동판으로서 문제가 많은 것이었다.However, such a conventional diaphragm 21 is coupled to the first and second substrates 26 and 24 at low temperature by the mutual adhesive 25, and thus workability is disadvantageous, and the defective rate of the finished product is high, and durability is also lowered. There have been many problems as such a flat speaker diaphragm.

특히, 상기와 같이 완성된 진동판은 접착제에 의하여 기재들을 저온 합지하는 것이어서 완성된 제품이 누글 누글 하거나 견고성 및 내구성은 물론 결합특성이 양호하지 못하여 스피커의 음질특성을 저하시키게 되는 원인이 되는 것 이었으 며, 한편으로는 이러한 진동판이 좀더 얇은 두께로 성형되야 떨림특성이 좋게 된다는 것을 고려 할 때 그 두께를 줄이는데 한계가 있는 것이었다.In particular, the completed diaphragm is a low-temperature lamination of the substrates by an adhesive, which causes the finished product to be nuggled, or have poor durability and durability as well as poor coupling properties, causing deterioration of sound quality characteristics of the speaker. On the other hand, there was a limit to reducing the thickness, considering that the diaphragm had to be molded to a thinner thickness, so that the vibration characteristics were good.

본 발명은 상기와 같은 종래 기술의 문제점을 개선할 수 있도록 이러한 스피커 진동판이 내구성 및 견고성등이 골고루 충족되면서 두께를 최소화하여 떨림 특성을 개선할 수 있도록 한 평면스피커의 진동판 제조방법을 제공 하는데 있다.The present invention is to provide a diaphragm manufacturing method of a flat speaker to improve the vibration characteristics by minimizing the thickness of the speaker diaphragm evenly to meet the durability and robustness, such as to improve the problems of the prior art as described above.

본 발명의 또다른 목적은 상기 진동판은 폴리스틸렌 쉬트를 제 1기재로 하고 이것을 중심으로 양면에 고온 열접착으로 증착되는 종이부재층을 갖는 평면스피커의 진동판을 제공 하는데 있다.It is still another object of the present invention to provide a diaphragm of a plane speaker having a polystyrene sheet as a first substrate and a paper member layer deposited on both sides by high temperature thermal bonding.

본 발명의 또다른 목적은 상기 진동판은 폴리스틸렌 쉬트를 제 1기재로 하고 이것을 중심으로 양면에 고온으로 열접착 증착되는 종이부재층과, 이 종이부재층의 양면에 라미네이팅층을 갖는 평면스피커의 진동판을 제공 하는데 있다.Still another object of the present invention is to provide a diaphragm of a flat speaker having a polystyrene sheet as a first substrate and a paper member layer heat-bonded and deposited on both sides of the paper member at a high temperature, and a laminating layer on both sides of the paper member layer. To provide.

도 1은 본 발명과 관련된 평판스피커의 일례도1 is an example of a flat panel speaker according to the present invention

도 2는 종래 평판스피커의 진동판 형태를 나타낸 참고도2 is a reference diagram showing the shape of a diaphragm of a conventional flat panel speaker

도 3은 본 발명의 진동판을 나타낸 단면도3 is a cross-sectional view showing a diaphragm of the present invention.

도 4는 본 발명의 조립공정을 나타낸 참고도Figure 4 is a reference diagram showing the assembly process of the present invention

도 5는 본 발명에 의한 진동판의 또다른 실시예도Figure 5 is another embodiment of the diaphragm according to the present invention

* 도면의 주요부분에 대한 부호설명 ** Explanation of Signs of Major Parts of Drawings *

1. 진동판 11. 종이부재층1. Diaphragm 11. Paper member layer

12. 기재층 13. 라미네이팅층12. Base layer 13. Laminating layer

a. 가이드부 b. 고주파처리부a. Guide part b. High frequency processor

c. 제 1,2차예열부 d. 합지롤부c. 1st and 2nd preheating part d. Paper roll part

e. 냉각부 f. 블로워부e. Cooling section f. Blower

g. 두께조절부g. Thickness Control

본 발명은 특히,폴리스틸렌 쉬트를 기재로하여 양면에 종이기재를 합지하여 소정 온도의 예열롤에 진입시키는 예열처리공정과, 예열처리 공정이후 소정 온도의 합지롤에 진입시켜 발포 및 융착처리를 수행하는 고온 발포/융착공정과, 고온 발포/융착 공정이후 소정 온도로 냉각처리 하는 냉각공정과, 이후 두께조절 고무롤로 진입시켜 두께를 조절하는 두께조절 공정등을 포함하는 평면 스피커 진동판의 제조방법에 특징이 있다.Particularly, the present invention provides a preheating process for laminating a paper substrate on both sides of a polystyrene sheet and entering a preheating roll at a predetermined temperature, and entering the paper roll at a predetermined temperature after the preheating process to perform foaming and fusion treatment. The manufacturing method of the flat speaker diaphragm includes a high temperature foaming / fusion process, a cooling process for cooling to a predetermined temperature after the high temperature foaming / fusion process, and a thickness adjusting process for adjusting the thickness by entering the thickness adjusting rubber roll. have.

본 발명의 또다른 특징은 상기 진동판이 폴리스틸렌 쉬트를 제 1기재층으로 하고 이것을 중심으로 양면에 열접착으로 증착되는 종이부재층을 갖는 평면스피커의 진동판에 있다.Another feature of the present invention resides in a diaphragm of a planar speaker, wherein the diaphragm has a polystyrene sheet as a first substrate layer and a paper member layer deposited on both sides by thermal bonding.

본 발명의 또다른 특징은 상기 진동판은 폴리스틸렌 쉬트를 제 1기재층으로 하고 이것을 중심으로 양면에 열접착으로 증착되는 종이부재층과, 이 종이부재층의 양면에 라미네이팅층을 갖는 평면스피커의 진동판에 있다.Another feature of the present invention is that the diaphragm is a diaphragm of a planar speaker having a polystyrene sheet as a first substrate layer and a paper member layer deposited on both sides by thermal bonding, and a laminating layer on both sides of the paper member layer. have.

이하에서 이를 첨부된 도면과 함께 좀더 구체적으로 설명하여 봄으로서 본 발명의 보다 상세한 특징들이 이해될 수 있을 것이다.Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings.

본 발명의 평면스피커 진동판(1)은 그 형태를 도 3과 같이 나타 내었다.The planar speaker diaphragm 1 of the present invention is shown in the form as shown in FIG.

여기서는 상기 진동판(1)이 폴리스틸렌 쉬트를 제 1기재층(12)과, 이것을 중심으로 양면에 고온 열접착 증착되는 종이부재층(11)을 갖는 형태로 이뤄져 있다.In this case, the diaphragm 1 is formed in the form of a polystyrene sheet having a first base layer 12 and a paper member layer 11 which is thermally adhesively deposited on both surfaces thereof.

또, 상기 진동판(1)은 도 5와 같이 폴리스틸렌 쉬트에 의한 제 1기재층(12),이것을 중심으로 양면에 고온 열접착으로 증착되는 종이부재층(11)과 함께 이 종이부재층(11)의 양면에 라미네이팅층(13)을 갖는 형태로 실시 할 수도 있다.In addition, the diaphragm 1 is a paper member layer 11 together with a first substrate layer 12 made of a polystyrene sheet, a paper member layer 11 deposited on both sides of the diaphragm by high temperature thermal bonding as shown in FIG. 5. It can also be carried out in the form having a laminating layer 13 on both sides of.

한편, 상기와 같은 진동판(1)은 이하와 같은 공법으로 제조된다.On the other hand, the diaphragm 1 as described above is manufactured by the following method.

즉, 폴리스틸렌 쉬트를 기재로한 제 1기재와 이 제 1기재 양면에 종이기재를 합지하여 콘베어 라인상의 가이드부(a)로 제공하여 고주파부(b)에서 이들 표면을 거칠게 하기위해 고주파 표면 처리 공정을 수행한다.That is, a high frequency surface treatment process for laminating a first substrate based on a polystyrene sheet and a paper substrate on both surfaces of the first substrate to provide the guide portion (a) on a conveyor line to roughen these surfaces at the high frequency portion (b). Do this.

상기와 같은 표면 처리는 후술하는 제 1,2차 예열공정 및 발포 및 융착공정에서 이들 두 기재들의 합지 결합 특성을 높이기 위한 것이다.The surface treatment as described above is intended to increase the lamination properties of the two substrates in the first and second preheating processes and the foaming and fusion processes described later.

이후, 상기 피목적물은 제 1,2예열부(c)의 제 1,2예열롤을 통과시켜 제 1,2예열처리공정을 수행하며, 이때 상기 제 1,2예열부(c)의 예열롤 온도는 제각기 200℃∼220℃, 280℃∼310℃ 범위로 유지 시킨다.Thereafter, the object is subjected to the first and second preheating processes by passing the first and second preheating rolls of the first and second preheating portions (c), wherein the preheating rolls of the first and second preheating portions (c) are performed. The temperature is maintained in the range of 200 ° C. to 220 ° C. and 280 ° C. to 310 ° C., respectively.

상기 과정을 거친 피목적물은 발포 및 융착을 위해 다시 합지롤부(d)에서 발포 및 융착 처리를 수행하며, 이때의 합지롤은 그 온도가 약 230℃∼250℃의 고온을 유지 시킨다.The object subjected to the above process is subjected to foaming and fusion treatment again in the lamination roll part (d) for foaming and fusion, and the lamination roll at this time maintains a high temperature of about 230 ° C to 250 ° C.

이후, 상기 피목적물은 냉각롤부(e)를 통하여 냉각 시키며, 이때의 온도는 약 0℃∼10℃ 정도 유지하는 것이 바람직하다.Thereafter, the target object is cooled through the cooling roll part (e), and the temperature at this time is preferably maintained at about 0 ° C to 10 ° C.

따시 상기 피목적물은 블로워부(f)에서 바람을 불어넣어 건조 시키고, 이를 두께조절부(g)를 통과시켜 소정 두께의 최종 목적물을 완성하게 되는 것이다.Then, the object is to blow the wind in the blower (f) to dry, and to pass it through the thickness adjusting portion (g) to complete the final object of a predetermined thickness.

이때의 두께는 약 1.5㎜∼3㎜ 정도의 범위로 성형하는 것이 바람직하다.It is preferable to shape | mold the thickness at this time in the range of about 1.5 mm-about 3 mm.

이러한 구성의 본 발명은 본 발명에 의하여 제조된 스피커 진동판(1)이 제 1기재층(12)과 종이부재층(11)이 고온으로 발포 및 열융착으로 상호 합지 되어 이것의 견고성과 내구성이 좋게 되고 최소한의 얇은 두께를 롤로 유지할 수 있게 되어 진동판(1)의 떨림특성이 양호히 확보 될 수 있는 것이다.According to the present invention, the speaker diaphragm 1 manufactured according to the present invention is laminated with the first base material layer 12 and the paper member layer 11 by foaming and heat fusion at high temperature so that the firmness and durability thereof are good. And the minimum thin thickness can be maintained in a roll that can ensure a good vibration characteristics of the diaphragm (1).

상기 진동판(1)의 제조과정에서 초음파 처리는 이들 합지되는 기재들의 표면을 거칠게 하게 되면 고온 발포 및 열융착시 이들의 결합특성을 증가시켜 좀더 단단하고 견고하며 내구성이 양호히 증가 될 수 있다.If the ultrasonic treatment in the manufacturing process of the diaphragm (1) to roughen the surface of these laminated substrates to increase their bonding properties during high temperature foaming and heat fusion can be more firm, robust and durable increases.

이러한 본 발명은 평판스피커의 진동판이 초음파처리와 함께 열융착되고 이후 소정 두께로 두께조절 됨으로서 이러한 진동판의 견고성 및 단단함, 내구성등을 양호히 충족 시키면서도 최소범위의 두께를 유지할 수 있어 진동판의 주파수에 대한 떨림 특성이 우수하게 되는 것이다.In the present invention, the diaphragm of the flat panel speaker is heat-sealed together with the ultrasonication and then the thickness is adjusted to a predetermined thickness, thereby maintaining the minimum thickness while satisfactorily satisfying the rigidity, rigidity and durability of the diaphragm. The characteristics are excellent.

그러므로, 이를 노트북 컴퓨터의 평면 스피커로 활용하게 되면 종래와 같이 고음역에서 찢어지는 소리가 나거나 또는 스피커의 중앙에서 멀어 질 수록 주변의 소리가 약해지는 불리한 현상들을 양호히 제거할 수 있는 것이다.Therefore, by using this as a flat speaker of a notebook computer, it is possible to satisfactorily eliminate the adverse effects of the sound being torn in the high range as in the prior art or the surrounding sound weakening as the distance from the center of the speaker increases.

Claims (2)

폴리스틸렌 쉬트를 기재로하여 양면에 종이기재를 합지하여 소정 온도의 예열롤에 진입시키는 예열처리공정과, 예열처리 공정이후 소정 온도의 합지롤에 진입시켜 고온으로 발포 및 융착처리를 수행하는 고온 발포/융착공정과, 고온 발포/융착 공정이후 소정 온도로 냉각처리 하는 냉각공정과, 이후 두께조절 고무롤로 진입시켜 두께를 조절하는 두께조절 공정을 포함하는 것을 특징으로 하는 평면 스피커 진동판의 제조방법Pre-heating process of laminating paper base on both sides with polystyrene sheet as a base and entering pre-heating roll of predetermined temperature, and high-temperature foaming / foaming and fusion treatment at high temperature by entering into a pre-heating roll of pre-treatment A method of manufacturing a flat speaker diaphragm, comprising a fusion process, a cooling process of cooling to a predetermined temperature after a high temperature foaming / fusion process, and a thickness adjusting process of adjusting the thickness by entering a thickness adjusting rubber roll. 제 1항에 있어서, 상기 제조방법으로 제조된 제 1기재층(12)과 이것을 중심으로 양면에 열접착으로 증착되는 종이부재층(11)을 갖는 진동판(1) 양면에는 라미네이팅층(13)이 형성 되기 위한 라미네이팅 처리를 한 것을 특징으로 하는 평면스피커의 제조방법2. The laminating layer 13 is formed on both sides of the diaphragm 1 according to claim 1, wherein the diaphragm 1 has both the first base layer 12 manufactured by the manufacturing method and the paper member layer 11 deposited on both sides by heat bonding. Method for manufacturing a flat speaker characterized in that the laminating treatment for forming
KR1020000012722A 2000-03-14 2000-03-14 Production methode for flat-type vivration plate of speaker KR100331501B1 (en)

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KR100480207B1 (en) * 2002-05-07 2005-03-30 주식회사 하이켐텍 The diaphragm of micro speaker

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0522790A (en) * 1991-07-10 1993-01-29 Matsushita Electric Ind Co Ltd Method for preparing acoustic vibration plate
KR960009003A (en) * 1994-08-24 1996-03-22 Thin film formation method and apparatus
KR19990004254A (en) * 1997-06-27 1999-01-15 이형도 Manufacturing method of diaphragm for high performance speaker
KR19990070978A (en) * 1998-02-26 1999-09-15 김충지 Diaphragm for speaker and manufacturing method thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0522790A (en) * 1991-07-10 1993-01-29 Matsushita Electric Ind Co Ltd Method for preparing acoustic vibration plate
KR960009003A (en) * 1994-08-24 1996-03-22 Thin film formation method and apparatus
KR19990004254A (en) * 1997-06-27 1999-01-15 이형도 Manufacturing method of diaphragm for high performance speaker
KR19990070978A (en) * 1998-02-26 1999-09-15 김충지 Diaphragm for speaker and manufacturing method thereof

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