KR100330967B1 - Blind system using in a fabricating process of a semiconductor device - Google Patents

Abstract

The present invention relates to a blind system for a manufacturing process of a semiconductor device capable of selectively exposing only necessary chips by excluding unnecessary chips in one shot on a semiconductor wafer. N is a positive integer) and the main blind for exposing the pattern projected through the lens to the N chips by forming one chip, and the main blind for controlling the size of the shot by moving the main blind to the X and Y axes. The sub-blind which selects a predetermined chip of some N chips in the shot formed by the motor and the main blind to expose the pattern projected through the lens, and adjusts the position of the main blind by moving the sub-blind to the X-axis and the Y-axis. Provided is a blind system for a manufacturing process of a semiconductor device including a sub-motor. Therefore, according to the present invention, there is an effect that can remove the unnecessary chips of the outermost shot of the wafer, thereby obtaining an effect that can remove the particle source by defocus.

Description

Blind system for manufacturing process of semiconductor device {BLIND SYSTEM USING IN A FABRICATING PROCESS OF A SEMICONDUCTOR DEVICE}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a stepper used in a photo process in a semiconductor manufacturing process, and more particularly to a blind system in a stepper.

As is well known, the photo process in the semiconductor manufacturing process is a process of drawing a circuit actually needed on the wafer by using a photo resist, and irradiates light onto a photo mask on which a circuit pattern to be designed is drawn. By photosensitive photoresist applied on the substrate, a desired pattern can be formed on the wafer.

In addition, a stepper used in such a photo process is a kind of photographic exposure equipment, and is a device which reduces and projects the pattern of a photo mask onto a wafer by using an optical lens.

On the other hand, since the above-described photo mask is manufactured in a rectangular shape of X × Y shape, a blinding operation using a blinding system is required to selectively expose only chips required on a circular wafer.

In this regard, FIG. 1 is a view illustrating a blinding system used in a conventional stepper, which will be described in detail with reference to FIG. 1.

First, the configuration of the conventional blind system is, as shown in Figure 1, the first blind 10, the second blind 20, and the first blind 10 for moving the first blind 10 in the X-axis direction In the Y-axis direction and the second X-axis motor 26 for moving the X-axis motor 21 and the first Y-axis motor 27 and the second blind 20 for moving in the Y-axis direction. A second Y-axis motor 27 for movement.

Referring to FIG. 1, the first X-axis motor 21 moves the first blind 10 left and right in the X-axis direction, and the first Y-axis motor 22 moves the first blind 10 in the Y-axis direction. To move up and down. The second X-axis motor 26 moves the second blind 20 left and right in the X-axis direction, and the second Y-axis motor 27 moves the second blind 20 up and down in the Y-axis direction. do. Therefore, the positions of the first and second blinds 10 and 20 are changed by the driving of the respective motors 21,..., 27 to adjust the size of the shot to be exposed.

Meanwhile, in the photolithography process using this blinding system, some chips of the outermost shot of the wafer are patterned and defocused due to edge bead removal (EBR) or wafer edge exposure (WEE). ) Will occur. In this case, the generated defocus chips may act as a particle source in an etch process to cause a block etch.

FIG. 2 is a view for explaining a process of forming a pattern on a wafer using a photo mask in the above-described stepper. Referring to FIG.

As shown in FIG. 2, one shot includes a plurality of chips (for example, six chips), and shots located at the outermost side of the wafer 100, that is, the first, second, and third shots 10. , 20 and 30 have unnecessary chips 5, that is, chips whose patterns are cut out during the exposure process. The chips 5 cut out of this pattern are virtually unnecessary chips, and some of them are particle sources.

However, in the conventional blinding system as shown in FIG. 1, there is a problem in that only the necessary chips can be selectively exposed by excluding unnecessary chips as described above in one shot, and therefore, by EBR or WEE. Defocused chips have a problem of causing block etch by acting as a particle source in an etch process.

Accordingly, the present invention has been made to solve the above-described problem, it is possible to selectively expose only the necessary chips by excluding unnecessary chips in one shot on the wafer, thereby preventing the occurrence of defocus and eliminating particle sources An object of the present invention is to provide a blind system for a manufacturing process of a semiconductor device.

SUMMARY OF THE INVENTION The present invention for achieving the above object is a blinding system for selectively exposing a plurality of chips on a wafer to selectively form a pattern projected from a photo mask, wherein the N chips on the wafer are one A main blind formed by shots of the light source to expose the pattern projected through the lens to the N chips; A main motor for controlling the size of the shot by moving the main blind on the X and Y axes; A sub-blind that selects a predetermined chip among the N chips in the shot formed by the main blind and exposes the pattern projected through the lens to the M chips; Provided is a blind system for a manufacturing process of a semiconductor device comprising a sub-motor to move the sub-blind on the X-axis and Y-axis to adjust the position of the main blind.

1 is a view showing a blinding system used in a conventional stepper,

2 is a view for explaining a process of forming a pattern on a wafer using a blinding system.

3 shows a blinding system according to a preferred embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

10: first main blind 20: second main blind

X1, Y1, X2, Y2: main motors 51, 52,... , 58: sub-blind

X11, X12,... , X18, Y11, Y12,... , Y18: Sub-motor

Hereinafter, a blind system for manufacturing a semiconductor device according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

3 is a view illustrating a blinding system according to a preferred embodiment of the present invention, in which a first main blind 10 and a second main blind 20, and respective ones for moving them in the X and Y axes, respectively. Main motors X1, Y1, X2, Y2. Further, according to the present invention, the first and second,... Mounted on the upper or lower portion of the above-mentioned first and second main blinds 10, 20. , Each sub-motor X11, X12,... For moving the eighth sub-blinds 51, 52,..., 58 and the respective sub-blinds 51, 52,..., 58. , X18, Y11, Y12, ..., Y18).

3, the first and second main blinds 10 and 20 and the first and second, third and fourth main motors X1, X2, Y1 and Y2 for moving the first and second main blinds 10 and 20 are described. First and second blinds 10 and 20, and first and first X-axis motors 21 and 26, first and second Y-axis motors 22 in the conventional blinding system shown in FIG. , 27).

In other words, the blinding system according to the present invention shown in FIG. 3 includes a plurality of sub-blinds 51, 52,... In addition to the respective blinds provided in the conventional blinding system and the respective motors for driving the blinds. 58) and a plurality of sub-motors X11, X12, ..., X18, Y11, Y12, ..., Y18 for driving the same.

Then, the lengths and widths of the first to eighth sub blinds 51 to 58 shown in FIG. 3 and the moving ranges of the respective sub blinds 51 to 58 by the respective motors X11 to X18 and Y11 to Y18. Is set to a size and range capable of selectively blinding a plurality of chips included in one shot of the main blinds 10 and 20, which can be easily changed by those skilled in the art within the scope of the present invention.

For example, the lengths and widths of the first to eighth sub-blinds 51 to 58 are 25% or more from the maximum shot size by the main blinds 10 and 20, and the sub-motors X11 to X18 and Y11. Since the movement range of each sub-blind 51 to 58 by ˜Y18 is about 50% from the maximum shot size, it is possible to selectively expose only a desired chip among a plurality of chips included in one shot.

The sub-blinds 51 to 58 described above are driven by the respective sub-motors X11 to X18 and Y11 to Y18 only when exposing the outermost shot on the wafer, that is, the shot including an unnecessary chip through which the pattern is cut off. When performing exposure to other shots, that is, when unnecessary chips are not included in the shot, exposure is performed using only the main blinds 10 and 20 as in the conventional blinding system.

2 and 3, the blinding system according to the present invention will be described in detail as follows.

First, when the part located in the first shot 10 shown in FIG. 2 is to be exposed using a stepper equipped with a blinding system as shown in FIG. 3, the second sub-blind shown in FIG. 3 is exposed. 52, the third sub-blind 53, and the fourth sub-blind 54 may be moved to exclude unnecessary chips 5 included in the first shot 10 area, and then exposure may be performed.

When the third shot 30 is to be exposed, the second sub blind 52, the third sub blind 53, the fourth sub blind 54, and the fifth sub blind shown in FIG. 3 are exposed. By removing the unnecessary chips 5 included in the third shot 30 area using the following method and performing exposure, defocusing generated from the chip located at the outermost side of the wafer 100 by EBR or WEE can be prevented. Will be.

As described above, according to the present invention, in performing exposure using a blinding system, since unnecessary chips of the outermost shot of the wafer can be removed, there is an effect of removing a particle source due to defocus. .

Claims (4)

A blinding system for selectively exposing a plurality of chips on a wafer to selectively form a pattern projected from a photo mask, A main blind which forms N (N is positive integer) chips on the wafer as one shot to expose the pattern projected through the lens to the N chips; A main motor for controlling the size of the shot by moving the main blind on the X and Y axes; A sub blind for selecting a predetermined chip of a portion of the N chips in the shot formed by the main blind to expose a pattern projected through the lens; And a sub-motor for moving the sub-blinds on the X-axis and the Y-axis to adjust the position of the main blind. The method of claim 1, The sub-blind has a length and width that is at least 25% or more from the maximum size of the shot formed by the main blind, And the sub-motor moves the sub-blind to the X-axis and the Y-axis in a 50% movement range from the maximum size of the shot formed by the main blind. The blind system of claim 1, wherein the sub blind comprises a plurality of sub blinds. 4. The blind system according to claim 3, wherein the sub-motor comprises two sub-motors for moving one sub-blind to the X-axis and the Y-axis, respectively.