KR100309275B1 - PDP manufacturing method and PDP gas injection and exhaust machine - Google Patents

Abstract

The present invention has a problem in that the PDP manufacturing method and the exhaust / gas injection device to exhaust the PDP through the exhaust of the chamber takes a lot of production time and has a high production cost due to the consumption of a large amount of discharge gas, By exhausting PDPs through separate lines to increase exhaust speed and injecting discharge gas only into PDP, PDP manufacturing method and gas can save production time and discharge gas and reduce production cost An injection and exhaust system.

In the PDP manufacturing method of the present invention, the exhaust system is directly compressed to the PDP to exhaust the impurity gas in the PDP and the gas in the chamber separately, and discharge gas is injected only into the PDP to perform exhaust and gas injection. and,;

The gas injection and exhaust system of the PDP is connected to a chamber having gates at both ends and gas inlets and chamber exhaust ports respectively formed at upper and lower surfaces thereof, an alignment unit for aligning and supporting the PDP in the chamber, and an exhaust port of the PDP. A gas injection / exhaust unit through which exhaust and gas injection are performed, exhaust means connected to the gas injection / exhaust unit to exhaust impurity gas inside the PDP, and a discharge gas connected to the gas injection / exhaust unit into the PDP It characterized in that it comprises a gas injection means for injecting.

Description

PD Production Method and PD Injection and Exhaust Systems

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an exhaust and gas injection device for exhausting impurity gas in a panel and injecting discharge gas in manufacturing a PDP. In particular, the present invention relates to a PDP which is configured inline to perform exhaust and gas injection without an exhaust pipe. The present invention relates to a gas injection and exhaust system and a method thereof.

In general, a plasma display panel (PDP) is an apparatus for displaying an image using a plasma generated by an electrical discharge. As shown in FIG. 1, a surface substrate 11a formed of glass and positioned on an upper side thereof, and the surface It consists of the back board 12a located under the board | substrate 11a.

The address electrode 12b is disposed in the back substrate 12a in a stripe shape, and the partition wall 12c is disposed in parallel with the address electrode 12b to separate the address electrode 12b into a plurality of discharge cells. In addition, the fluorescent material 15 is applied between the partition walls 12c of the rear substrate 12a. On the other hand, a plurality of display electrodes 11b are provided on the lower surface of the surface substrate 11a to form the dielectric layer 13 and the protective layer 14.

The surface substrate 11a and the rear substrate 12a are assembled so that the display electrode 11b and the address electrode 12b are orthogonal to each other, and are hermetically sealed with a glassy sealing material 16, and the inside thereof is discharged such as Ne (neon) or the like. Filling the gas completes the manufacture of the PDP.

A general PDP manufacturing process is completed by separately manufacturing the surface substrate and the back substrate as shown in FIG. 2 and fusing them, and then injecting a discharge gas.

In order to manufacture the surface substrate, the glass substrate is first cleaned (c1), a metal film for forming the display electrode 1b is deposited (c2), and then a photoresist is applied (c3). When the mask is engraved with a desired pattern, the light is exposed to light (Exposure; c4), and the photoresist exposed to the light is dissolved in the developer (c5). That is, the photoresist may be left only in a desired portion through the development process.

Subsequently, when the etching process is performed using the etching solution, the metal film of the portion where the photoresist is not left is melted. Therefore, stripping the photoresist leaves only the metal remaining under the photoresist, thereby forming a stripe electrode (c6). The dielectric is then applied to the entire surface of the top plate (c6), baked (c8), and then coated with a glassy sealing agent (c9) for adhesion with the back substrate 2a. It waits for bonding with the board | substrate 2a.

The rear substrate 2a is also subjected to the cleaning (d1) process of the glass substrate, and then forms a barrier rib (d2). Subsequently, in order to form the address electrode 2b as in the formation of the display electrode 1b of the surface substrate 1a, deposition (d3), photoresist coating (d4), exposure (d5), development (d6), etching and photoresist are performed. The residue is removed (d7). Thereafter, the phosphor is formed (d8), and finally, after the firing (d9), the bonding with the surface substrate 1a is awaited.

Subsequently, the surface substrate and the rear substrate coated with the glassy sealing material are adhered (e1), the impurity gas is removed, the discharge gas is injected, and the exhaust / gas injection process (e2) including MgO activation is performed. Thereafter, the driving voltage of the PDP is appropriately lowered through aging (e3), the quality is inspected (e4), and the manufacture of the PDP is completed.

In the exhaust and gas injection process, which is one of the major factors determining the quality of the PDP, as shown in FIG. 3, the surface substrate and the rear substrate are brought into close contact with each other, and the temperature is raised (f1) to be bonded (f2) to activate the MgO. After the process (f3) and the cooling (f4), the vacuum system is connected to remove impurities therein, and then discharge gas is injected to finally encapsulate (f5).

The conventional gas injection and exhaust devices shown in FIGS. 4 to 6 are in-line type without exhaust pipes, and perform a work process of injecting exhaust and discharge gas of PDP in a total of seven chambers. In addition, the impurity gas in the PDP is exhausted by venting the chamber itself after drilling the exhaust port as shown in FIG. 7 without attaching the exhaust pipe for exhausting to the PDP.

Conventional gas injection and exhaust devices include a loading chamber 21a on which the PDP 10 is loaded, a bonding chamber 21b for bonding the surface substrate and the back substrate, and a temperature for cooling the temperature of the PDP 10 to the MgO activation temperature. The cooling chamber 21c and the cleaning gas are injected into the PDP 10 and then exhausted to clean the interior of the PDP 10. The temperature of the MgO active / gas cleaning chamber 21d and the PDP 10 is about 200 ° C. After cooling all of the second cooling chamber 21e for cooling, the gas inside the PDP 10, the exhaust / gas injection chamber 21f for injecting and encapsulating discharge gas, and cooling and unloading the PDP after cooling to room temperature 21 g of unloading chambers, the gate 22 which partitions each chamber 21, the pump 23 which exhausts air in the said chamber 21, and the gas for injecting a cleaning gas and discharge gas into a PDP An injection means 24, a gas supply 25 for supplying gas to the gas injection means 24, and a heater for heating the PDP ( 26) and the sealing stopper supply part 27 which supplies the sealing stopper for sealing an exhaust port.

The conventional gas injection and exhaust device configured as described above operates as follows. When the PDP is initially stored in the loading chamber 21a, the gate is opened and the PDP is transferred to the bonding chamber 21b by the roller at the bottom of the chamber. The PDP transferred to the bonding chamber 21b is heated f1 to 450 ° C by the heater 26 while maintaining the pause state. After 1 hour of holding at 450 ° C., the frit seal, a glassy sealing agent, is melt-bonded to bond the surface substrate and the rear substrate (f2). As described above, since the exhaust pipe is not connected to the PDP and the inside of the PDP is exposed into the chamber, all the processes are performed while the chamber itself is continuously exhausted.

The PDP in which the bonding process is completed is introduced into the cooling chamber 21c through the gate. In the cooling chamber 21c, the PDP is cooled to 350 ° C, which is a temperature for MgO activation. After reaching the temperature of 350 ° C, the PDP is introduced into the next chamber, the MgO activation / gas cleaning chamber 21d, through the gate 22.

In the MgO activation / gas cleaning chamber 21d, the temperature of the PDP is maintained at 350 ° C. and the MgO activation process f3 is performed. During this process, a cleaning gas is introduced and exhausted to remove impurities generated from the materials in the PDP. After this process, the PDP is moved to the cooling chamber 21e. The PDP is cooled to 200 ° C. or less in the cooling chamber 21e and then moved to the exhaust / gas injection chamber 21f.

The PDP performs the following discharge gas injection and encapsulation processes in the exhaust / gas injection chamber 21f. 5 and 6 illustrate the exhaust / gas injection chamber 21f in detail. The PDP 10 having the exhaust port 17 formed on the rear substrate is moved along the roller 28, and the upper side of the PDP 10 is shown. The heater 26 is installed in the lower part of the chamber, and a vacuum exhaust pipe 29b for exhausting the gas in the chamber and a gas injection pipe 29a for injecting discharge gas are connected to the lower side of the chamber. The gas injection pipe 29a is provided with a drive mechanism for moving the sealing plug 27a for sealing the exhaust port 17 of the PDP 10, and the sealing binder 27b on the upper side of the sealing plug 27a. ) Is applied, and a sealing heater 27c is provided separately.

After the PDP 10 is introduced, the gas in the exhaust / gas injection chamber 21f is continuously exhausted through the vacuum exhaust pipe 29d, and the exhaust is stopped when the vacuum reaches about 10 ⁻⁷ Torr. Thereafter, the discharge gas is introduced through the gas injection pipe 29a to fill the exhaust / gas injection chamber 21f. Therefore, the discharge gas is also filled inside the PDP 10.

Subsequently, the sealing plug 27a, which has been heated on the sealing heater 27c to about 420 ° C., rises to seal the exhaust port 17. The PDP 10 is sealed is passed through the gate 22 to the cooling / unloading chamber (21g) to complete all the processes after performing the rest of the cooling process.

Unlike the batch type, the in-line exhaust / gas injection process configured as described above has a lot of irrationalities in the process and structure since the process technology is not determined and is in a conceptual state. Problems in an in-line exhaust / gas injection process without exhaust pipes are as follows.

First, the in-line exhaust / gas injection process is performed with each PDP stopped in each chamber due to the structure of the equipment. The MgO activation / gas cleaning process and the exhaust / gas injection process have high vacuum inside. Since the cleaning gas and the discharge gas are injected into the entire chamber, the inside of the PDP is cleaned or gas injected, thereby increasing efficiency and gas consumption.

Second, since the high vacuum is exhausted twice according to the injection and exhaust of the cleaning gas, it takes a long time and decreases the efficiency. That is, in the gas cleaning process, the entire chamber is exhausted, the exhaust port exhausts the inside of the PDP through the chamber, and then the cleaning gas is introduced into the entire chamber to inject the cleaning gas into the PDP. After that, the entire chamber is exhausted again to remove impurities in the PDP together with the cleaning gas. In this case, considering the size of the PDP, a large amount of time is consumed because it has to be exhausted twice to the high vacuum region of the chamber 10 ^-7 Torr of about 300ℓ.

Third, a large number of bulkheads are formed inside the PDP, and the spaces between the bulkheads are very narrow passages, but the size of the exhaust port is limited due to the structural limitations of the PDP. .

Fourth, when injecting the discharge gas into the PDP, the discharge gas is injected into a large-capacity chamber. The purity of the discharge gas is very important in terms of its characteristics, and the manufacturing cost is high because the discharge gas remaining in the chamber must be discarded or a regeneration system must be additionally installed.

8 is a view showing another example of the prior art, a view related to the PDP manufacturing method disclosed in Fujitsu, Japan, Japanese Patent Laid-Open No. 4-245138. That is, it is a batch type type apparatus in which the exhaust pipe is installed in the PDP to perform the exhaust / gas injection process.

Fujitsu's PDP manufacturing method comprises the steps of connecting the exhaust pipe 31 of the PDP 30 and the gas introduction / exhaust system 33 to perform vacuum exhaust, and when the inside of the PDP 30 reaches 10 ^-4 Torr, the heating furnace (32 The temperature inside the heating furnace 32 is increased to 350 ° C., while the cleaning gas is introduced into one of the exhaust pipes 31 and exhausted to the other side. Performing the process about several times, stopping the exhausting after the final exhaust is naturally cooled to room temperature, generating impurities in the PDP 30 by applying power after injecting the discharge gas, and exhausting the discharge gas. And discharging the final discharge gas, and removing the exhaust pipe 31 of the PDP 30.

That is, since it is difficult to effectively remove impurities due to the low conductance inside the PDP 30, the cleaning gas is injected from one side while switching directions using two exhaust pipes 31 and the flow path switching device 33 'and the other By exhausting one side, impurities in the PDP 30 can be easily removed and the cleaning efficiency is improved.

However, the above-described PDP manufacturing method is limited to a batch-type apparatus, which makes it difficult to inline work and takes a long time due to exhaust / gas injection.

The present invention has been made to solve the above-mentioned problems of the prior art, and inline the PDP manufacturing operation to facilitate the operation while increasing the exhaust efficiency and reducing the consumption of discharge gas to improve productivity and reduce the manufacturing cost It is an object of the present invention to provide a PDP manufacturing method and a gas injection and exhaust system that can be used.

Figure 1a is a perspective view of a typical PDP,

1B is a cross-sectional view showing a cell of the PDP;

2 is a flowchart illustrating a manufacturing process of the PDP;

3 is a process diagram showing the exhaust and gas injection process,

4 is a configuration diagram showing a conventional inline gas injection and exhaust device,

5 is a configuration diagram showing an exhaust / gas injection chamber which is a conventional main configuration;

FIG. 6A is a detailed view of portion “A” of FIG. 5;

6B is a detailed view of the portion “B” of FIG. 5;

7 is a view illustrating an exhaust port position of a PDP;

8 is a view showing a gas injection and exhaust system of the conventional PDP manufacturing apparatus,

9 is a process diagram showing the gas injection of the PDP and the exhaust / gas injection process of the exhaust system according to the present invention;

10 is a view showing the device line of the gas injection and exhaust system of the PDP according to the present invention,

11 is a configuration diagram showing a gas injection and exhaust system of the PDP according to the present invention;

12 is a view showing an exhaust port of the PDP according to the present invention.

* Explanation of symbols for the main parts of the drawings

50: PDP 51: exhaust port

60 chamber 61 chamber supply mechanism

62: chamber exhaust 63: gate

64: alignment unit 65: gas injection / exhaust unit

65a: gas injection pipe 65b: exhaust pipe

66: sealing jig 67: roller

68: heater

PDP manufacturing method of the present invention for achieving the above object is a step of heating and bonding the surface substrate and the back substrate of the PDP is working inside the chamber, exhausting the impurity gas in the bonded PDP, and inside the PDP In the PDP manufacturing method comprising the step of introducing a discharge gas furnace,

The step of evacuating the impurity gas inside the PDP is through an exhaust unit installed in a hole formed in a portion of the PDP so as to differentiate the impurity gas inside the chamber. In addition, a process of lowering the pressure in the chamber by exhausting the gas in the chamber where the PDP is located through the chamber exhaust port,

The step of injecting the discharge gas into the PDP is to inject the discharge gas into the PDP through a gas injection unit installed in a hole formed in a part of the PDP and to inject the gas into the chamber where the PDP is located through the chamber supply mechanism. Characterized in that it comprises a process of increasing the pressure in the interior.

In addition, the gas injection and exhaust system of the PDP according to the present invention uses a plurality of chambers formed along a line to squeeze the surface substrate and the back substrate of the PDP, remove the impurity gas and inject the discharge gas to manufacture the PDP In the PDP manufacturing apparatus,

After the gates are formed at both ends and the gas inlet and the chamber exhaust are respectively formed on the upper and lower surfaces, the rollers are positioned inside the chamber to move the PDP, and the PDP is checked in the chamber using the imaging means. An alignment unit for positioning and supporting the PDP by shaking using a PDP support means, a gas injection / exhaust unit directly connected to an exhaust port of the PDP to perform exhaust and gas injection, and the gas injection / exhaust unit Exhaust means connected to exhaust the impurity gas inside the PDP, gas injection means connected to the gas injection / exhaust unit to inject discharge gas into the PDP, and located inside the gas injection / exhaust unit and discharged. A sealing jig that blocks the exhaust port of the PDP after gas injection is completed, and P is compared by comparing the internal pressure of the PDP with the internal pressure of the chamber. It is characterized in that the pressure control unit for adjusting the pressure so that the DP is not destroyed.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

The apparatus line of the gas injection and exhaust system of the PDP according to the present invention includes a plurality of chambers 60 separated by the gate 63 according to the reference process time as shown in FIG. And a vacuum pump and a gas apparatus 70 for exhausting impurity gas and injecting discharge gas from the inside of 50).

That is, in the device line, the chamber 60 is not divided by processes, and all process chambers are classified based on the minimum process time (that is, reference process time) of a process that must be processed in a single chamber due to the characteristics of the inline process. That is, the heating, bonding, MgO activity, and cooling processes are divided into gates 63 based on the time (standard process time) for performing the gas cleaning / discharging gas injection / encapsulation process. In addition, two PDPs 50 are processed in one chamber 60, and each chamber 60 is installed in a two-layer structure such that a total of four PDPs 50 are processed in each process.

In the gas injection and exhaust system of the PDP according to the present invention, as shown in FIG. 11, a gate 63 is formed at both ends, and a gas inlet 61 and a chamber exhaust port 62 are formed at upper and lower surfaces, respectively. And a roller 67 positioned inside the chamber 60 to move the PDP 50, an alignment unit 64 for aligning and supporting the PDP 50 in the chamber 60, and the PDP. A gas injection / exhaust unit 65 which is directly connected to the exhaust port 51 of the exhaust gas 50 and performs gas injection and exhaust gas, and is connected to the gas injection / exhaust unit 65 to discharge impurity gas inside the PDP 50. An exhaust pipe and valve 65b for exhausting, a gas injection pipe and valve 65a connected to the gas injection / exhaust unit 65 for injecting discharge gas into the PDP 50, and the gas injection / An encapsulation jig 66 located inside the exhaust unit 65 and blocking the exhaust port 51 of the PDP 50 after the discharge gas injection is completed. It is configured.

A pressure controller (not shown) for adjusting the pressure so that the PDP 50 is not destroyed by comparing the internal pressure of the PDP 50 with the internal pressure of the chamber 60 is added. The alignment unit 64 checks the position of the PDP by using the image pickup means, and positions the PDP. The alignment unit 64 supports the PDP so as not to shake by using the PDP support means. In addition, a sealing material (not shown) is provided at a portion where the gas injection / exhaust unit 65 and the exhaust port 51 of the PDP 50 are connected.

The gas injection and exhaust system and the device line of the PDP of the present invention configured as described above is to perform the impurity gas removal and discharge gas injection of the PDP according to the process shown in Figure 9, the detailed process is as follows.

First, the PDP 50 is supplied to the device line and heated by the heater while passing through the three chambers Ch1, Ch2, Ch3. Each heating chamber heats the PDP 50 by a predetermined temperature for a reference process time and continues to heat the PDP 50 coming from the previous process chamber immediately after the PDP 50 moves to the next process chamber.

In a heating process, a heating process is performed at atmospheric pressure, without making the inside of a chamber into a vacuum. At this time, the contamination is introduced from the outside through the gate 63 by removing the inlet and the exhaust port in which the filter is installed for pollution control.

The bonding process is performed while maintaining the temperature of 450 degreeC for 30 minutes in the PDP 50 which finished the remaining heating in Ch3. The PDP 50 in which the bonding process is completed is transferred by the roller 67 to the cooling process Ch4, and immediately receives the next PDP 50 in Ch3.

Thereafter, the PDP 50 bonded in the two chambers Ch4 and Ch5 is cooled to 350 ° C. for MgO activation. Particularly, in Ch5, cooling and MgO activation process are performed at the same time. Due to the nature of the MgO activation process, a vacuum range of 10 ^-7 Torr must be maintained, so Ch4 must be continuously maintained at the vacuum degree of Ch5. Therefore, when the PDP 50 is introduced into Ch4 to use Ch4 and Ch5 as the vacuum buffer, the chamber is continuously evacuated until the vacuum degree of Ch5 is reached. As a result, Ch5 may perform the MgO activation process without changing the degree of vacuum.

The MgO activation process starts when Ch5 reaches 350 ° C, the temperature for MgO activation. When the reference process time at Ch5 is reached, the PDP 50 is moved to Ch6 to continue the MgO activation process. At the moment the gate 63 between Ch5 and Ch6 is opened, the temperature and pressure of the two chambers are the same at 350 ° C. and 10 ⁻⁷ Torr, respectively.

Thereafter, the PDP 50 is moved to Ch7 to perform gas cleaning and discharge gas injection and encapsulation. The gate 63 is closed after the PDP 50 in which the MgO activation process is completed is introduced into Ch7, and the chamber 60 is already 10 ^-5 Torr or more through the chamber exhaust port 62 and the PDP exhaust pipe 65b. In the exhausted state, when the PDP 50 is introduced, the chamber 60 and the inside of the PDP 50 maintain the same pressure.

When the PDP 50 is located at the center of the chamber, the camera installed in the alignment unit 64 is operated to position the PDP 50 at the correct position, and the PDP support means on the upper portion of the PDP 50 is lowered to the PDP 50. At the same time, the gas injection / exhaust unit 65 under the PDP 50 is raised to be in contact with the PDP 50. The sealing material at the end of the gas injection / exhaust unit 65 is in close contact with the exhaust port of the PDP 50 with the aid of the PDP support means lowered from the top to connect the exhaust system and the inside of the PDP 50.

When the gas injection / exhaust unit 65 and the PDP 50 are in close contact with each other, the inside of the PDP 50 is continuously exhausted through the PDP exhaust pipe 65b and exhausted to 10 ⁻⁷ Torr. At this time, the chamber is also continuously exhausted through the chamber exhaust port 62. When the exhaust is completed, the valve of the exhaust pipe 65b is closed to separate the exhaust system and the PDP 50, and the gas injection pipe 65a is opened to inject cleaning gas into the cleaning gas injection exhaust port 51a for exhausting the cleaning gas. The exhaust port 51b is exhausted. Therefore, the cleaning gas moves between the partition walls 52 of the PDP 50 to remove impurities remaining in the PDP. At this time, in order to prevent destruction of the PDP 50 due to the pressure difference between the PDP 50 and the chamber, N ₂ gas or the like is introduced into the chamber through the gas inlet 61 to be similar to the inside of the PDP 50. To be

After the gas cleaning process, the gas injection pipe 65 is closed and the exhaust pipe 65b is opened to exhaust the PDP 50 to 10 ⁻⁷ Torr. At this time, since the pressure inside the chamber 60 is higher than the pressure inside the PDP 50, there is little risk of destruction of the PDP 50. Therefore, the chamber 60 does not need to be exhausted together with the PDP 50. This is because the PDP 50 has a weak force to withstand internal pressure but can withstand a relatively large force to external pressure.

When the inside of the PDP 50 is exhausted to 10 ^-7 Torr, the exhaust pipe 65b is closed and the valve of the gas injection pipe 65a is opened to inject discharge gas. Since the discharge gas should have a pressure of 300 ~ 500 Torr at room temperature in the PDP 50, when the injection gas is injected at a high temperature of 350 ℃ it is injected at a pressure based on the calculation considering the temperature. At this time, since the pressure inside the PDP 50 is increased, in order to prevent destruction due to the internal pressure of the PDP 50, the pressure inside the PDP is simultaneously injected into the chamber 60 such as N ₂ . Matches

When the discharge gas is filled into the PDP 50 at an appropriate pressure, a valve for separating the exhaust pipe 10d and the plug supply chamber is opened, and the stopper supply jig 66 is raised therein to stop the plug from the exhaust port 51. The exhaust port 51 is sealed by being in close contact with the air.

PDP 50 is sealed is unloaded from the line after cooling to room temperature while passing through Ch8 and Ch9.

As described above, the PDP manufacturing method and the gas injection and exhaust system of the present invention exhaust the vacuum chamber and the PDP through separate lines to increase the exhaust speed and reduce the production time and reduce the production cost by simplifying the process through inline. There is an advantage to this.

In addition, when cleaning the inside of the PDP by using the cleaning gas, cleaning efficiency can be increased by forcibly supplying / exhausting the cleaning gas to the inside of the PDP, and discharge gas can be saved by injecting discharge gas only into the inside of the PDP. There is another advantage of reducing production costs since no regeneration of gas is required.

Claims (3)

PDP manufacturing method comprising the step of heating and bonding the surface substrate and the back substrate of the PDP to be worked inside the chamber, exhausting the impure gas in the bonded PDP, and introducing a discharge gas into the PDP To; The step of evacuating the impurity gas inside the PDP is to exhaust the impurity gas inside the PDP to the outside through an exhaust unit installed in a hole formed in a portion of the PDP so as to differentiate the impurity gas inside the chamber. Exhausting the gas in the chamber where the PDP is located to the outside through the chamber exhaust port to lower the pressure in the chamber; The step of injecting the discharge gas into the PDP is to inject the discharge gas into the PDP through a gas injection unit installed in a hole formed in a part of the PDP and to inject the gas into the chamber where the PDP is located through the chamber supply mechanism. PDP manufacturing method comprising the step of raising the pressure in the interior. An in-line PDP manufacturing apparatus for manufacturing a PDP by pressing a surface substrate and a back substrate of a PDP using a plurality of chambers formed along a line, removing impurity gas, and injecting a discharge gas, wherein gates are formed at both ends, and an upper surface thereof is formed. A chamber having a gas inlet and a chamber exhaust at the bottom and bottom, a roller positioned inside the chamber to move the PDP, and positioning the PDP within the chamber using an image pickup means, and then positioning the PDP support means. An alignment unit which supports the PDP so as not to shake, a gas injection / exhaust unit directly connected to the exhaust port of the PDP to perform exhaust and gas injection, and an impurity inside the PDP connected to the gas injection / exhaust unit Connected to the gas injection / exhaust unit to exhaust gas and to inject discharge gas into the inside of the PDP; An injection means, an encapsulation jig located inside the gas injection / exhaust unit and blocking the exhaust port of the PDP after discharge gas injection is completed, and a pressure so as not to destroy the PDP by comparing the internal pressure of the PDP with the internal pressure of the chamber. Gas injection and exhaust system of the PDP, characterized in that consisting of a pressure control unit for adjusting the. 3. The gas injection and exhaust system according to claim 2, wherein the gas injection / exhaust unit is provided with a sealing material at a portion connected to the exhaust port of the PDP.