KR100307199B1 - Test fixture for semiconductor component - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a test apparatus for a semiconductor memory device, comprising: connecting a unit device socket to a main board of a PC through an intermediary board, and inserting the semiconductor device to be tested into the unit device socket to mount and test the semiconductor device; In the test apparatus, the memory module socket is removed and the computer main board equipped with the connector pin is fixedly installed on the PC support with the rear side facing upward, and the connector is detachably installed on the connector pin of the main board. While the intermediary board is connected on the connector for electrical communication, the intermediary board is fixedly supported by a unit element socket support mechanism and a support having a plurality of socket holes, and the intermediary board has a plurality of unit elements. A receptacle in which a socket and the unit element socket pin are inserted is formed. Was, the pushing unit consists of a structure that the upper pressing the socket in the support state on the PC support of the socket is installed. The pushing unit has a top plate formed with openings for each position of a socket installed on each board, a spring for elastically supporting the top plate on a lower PC support, and fixedly installed between the top plate and the medium board to pull the top plate downward. It consists of a cylinder that presses the socket.

Description

Test fixture for semiconductor component

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a test device for semiconductor devices, and more particularly, to a semiconductor device that can be tested simply by using a semiconductor device slot provided in a main board of a personal computer, without using a special equipment for inspecting only semiconductor devices. It relates to a test apparatus of the device.

In general, in a device using a semiconductor memory such as synchronous dynamic random access memory (SDRAM), RAMBUS DRAM, or stud random random access memory (SRAM), the characteristics and reliability of the internal circuits are changed after the device assembly process. For inspection, the assembled semiconductor device is inserted into a socket and tested using expensive specialized equipment.

However, the above-described specialized semiconductor device test apparatus has a number of problems, for example, because the separate specialized semiconductor device test apparatus is very expensive, the cost of testing a single semiconductor device is increased. In addition to lowering the price competitiveness, environmental characteristics such as noise generated in a computer main board, which is an environment in which the semiconductor element is actually used, are tested in a completely separate device, not in an environment in which the semiconductor element is actually installed and used. Because of the lack of proper implementation of the test, the accuracy of the test is inferior, causing a quality problem.

Due to these problems, semiconductor device manufacturers tend to prefer a test method using a main board of a computer that actually uses a semiconductor device. Thus, a method using a main board of a computer uses a module or a semiconductor unit device on the back of the main board. After attaching the socket for detachable installation, the module or unit to be tested is inserted into the socket and the PC is operated to determine whether the semiconductor device is normal or defective.

In particular, in recent years, as the processing speed of semiconductor devices has been increased, quality problems have occurred due to problems such as noise in the use environment, and in actual environment where the product is used, that is, in a mounting environment, rather than the quiet environment provided by the dedicated test equipment. Is being recognized in a more appropriate way.

Here, the test of the mounting environment is performed by inserting a memory to be inspected into a main board for a PC or a WORK STATION where a semiconductor memory device is installed and used, and then operating the PC or WORK STATION. Refers to a method for inspecting the amount and defect of memory elements.

At this time, most of the semiconductor memory attached to the main board is in the form of a module, but some of them also inspect each module by modularizing, where modularization is a circuit board that connects the devices to make them behave like a module. Is to use.

Therefore, in the case of testing individual devices, an intermediate board for modularizing the devices and a socket for detachably coupling semiconductor devices are installed on the intermediate board. The general structure of such a device will be described with reference to FIG. As follows.

1 and 2 show a conventional tester structure for testing a semiconductor device in a mounting environment as described above. As shown in these drawings, a test apparatus in a mounting environment using a main board of a general PC is shown in FIG. The main board 103 is fixedly installed using the fixture 104 in a state in which the main board 103, on which the module socket 102a and the add-in board 102b, etc. are installed, is supported on the support mechanism 101 of the PC. The intermediate board 106 is connected to the upper surface in the installation state of the rear side by using the connection 105, and a plurality of unit element sockets 107 are mounted on the intermediate board 106.

Therefore, the electrical signal generated from the main board 103 is transmitted to the unit device socket 107 via the connector 105 and the intermediate board 106.

On the other hand, in the structure of the bar as described above, the socket 107 is normally pressed by pressing from above using a hand or a handler or other equipment, so that the lead wire which is an external electrical contact of an individual unit element can be inserted. 107 has a structure in which the inside is opened.

Therefore, the method of setting the unit device to be tested in the socket 107 is a method in which the lead wires of the inserted individual elements are contacted while being caught by the socket by first pressing the socket from the top and releasing the unit element. The unit element is set in the socket 107.

However, this method has some problems in terms of the ease and reliability of the unit device test, firstly, the operator needs to operate the individual elements while holding the socket 107, and thus the workability is inferior. When the media board 106 is repeatedly used for a long time due to the physical force generated during the pressing operation of the valve 107, the socket 107 is broken or the media board 106 on which the socket 107 is installed. There was a problem that is broken.

On the other hand, the problem such as damage to the socket 107 or damage to the intermediate board 106 in this way is because the socket 107 is directly in contact with the intermediate board 106, so that the medium from the socket 107 This is because force is directly transmitted to the board 106.

Accordingly, the present invention improves the productivity of the test apparatus in a mounting environment using a conventional PC motherboard as described above, improves productivity by improving workability, and has durability to endure long use, The goal is to provide a semiconductor device test apparatus that ultimately enables automation.

In addition, another object of the present invention is to provide a semiconductor device test apparatus which prevents a problem such as damage to an intermediate board and a socket due to a force pushing a socket in a test apparatus in a mounting environment using a PC main board.

In the semiconductor device test apparatus of the present invention for achieving the above object, a semiconductor device is mounted by connecting a unit device socket to a main board of a PC through an intermediary board, and inserting a semiconductor device to be tested into the unit device socket. In the semiconductor device test apparatus for testing, the memory module is removed, the computer main board equipped with the connector pin is fixed to the PC support so that the back side is upward, the connector is removable from the main board on the connector pin of the main board Installed on the connector, the intermediate board is electrically connected to the connector, and the intermediate board is fixedly supported by the unit element socket support mechanism and the support having the plurality of socket holes, and the intermediate board In the receptacle is inserted a plurality of unit element socket and the unit element socket pin Is formed, characterized in that the pushing unit for pressing the socket in the state supported by the PC support on the upper socket is installed.

The pushing unit includes a top plate having openings formed at positions of sockets installed on each board, a spring for elastically supporting the top plate on a lower PC support, and a top plate fixed downward between the top plate and the medium board. It consists of a cylinder that pulls and pushes the socket.

On the other hand, the coupling pin is connected to the upper end of the cylinder so as to rotate, the upper plate is formed with a through hole through which the coupling pin can pass, the upper surface of the upper plate is engaged with the engaging pin is caught Formed.

In addition, a support wing is formed at the peripheral edge of the socket hole to support the tip of the unit element socket.

The device of the present invention having the structure as described above, it is possible to simply and effectively control the operation of pressing the socket to insert the unit element into the socket installed on the intermediary board can not only improve productivity, The effect of enabling automation is also achieved.

In addition, since the medium board on which the unit device socket is installed is fixed by a socket support mechanism, and a support wing supporting the socket is provided at an edge of the opening of the socket support mechanism, so that the socket is mechanically supported by the top plate. When pressed, it is possible to prevent the phenomenon caused by excessive force, such as being damaged or pushed downward to damage the intermediary board, thereby extending the life of the socket and the intermediary board.

1 is a cross-sectional view showing a conventional semiconductor device mounting tester device;

2 is a side view of FIG. 1,

3 is an exploded view of a mounting test apparatus for a semiconductor device according to an embodiment of the present invention;

4 is a cross-sectional view of the device of FIG. 3 in which the socket is not pressed;

5 is a cross-sectional view showing a state after the socket is pressed from the state of FIG. 4;

6 is a plan view of FIGS. 4 and 5;

7 is a partial cross-sectional view showing a form in which one socket is coupled to a socket support according to the present invention;

8 is a plan view of a socket support according to the present invention.

* Explanation of symbols on the main parts of the drawings

1-motherboard 2-connector pin

3-PC support 4-Connector

5-Intermediate Board 6-Unit Socket Support Mechanism

7-Support 8-Unit Device Socket

9-Socket Pin 10-Receptacle

11- Socket Hole 12-Base Wings

13-pushing unit 14-opening

15-Top 16-Spring

17-Cylinder 18-Coupling Pin

19-through hole 20-locking groove

21-switch

Hereinafter, with reference to the accompanying drawings, a specific embodiment of the present invention will be described in detail.

Figure 3 is an exploded cross-sectional view showing a specific embodiment according to the present invention, Figure 4 shows a state before the combined operation of the device of the embodiment shown in Figure 3, Figure 5 according to the embodiment of Figure 3 As shown in these figures, the device according to the present invention removes a plurality of memory module sockets installed on a main board 1 of a computer, and then the connector pin 2 ) Is mounted by welding, so that the connector pin (2) protrudes to the rear surface of the main board (1).

The main board 1 is fixedly installed on the PC support 3 so that the rear side is upward, and the connector 4 is detachably installed on the connector pin 2 of the main board 1 so as to be detachable from the main board 1. The medium board 5 is connected to the connector 4 by contact or welding so as to be in electrical communication.

In addition, the intermediate board 5 is fixedly supported by the unit element socket support mechanism 6 and the support 7 as shown in FIGS. 3 and 7, and the intermediate board 5 includes a plurality of The unit element socket 8 is installed, and the receptacle 10 into which the unit element socket pin 9 is inserted is formed on the intermediate board 5. The reason for using the receptacle 10 is as described above. The element socket 8 is inserted into the intermediate board 5 as necessary so that the device socket 8 can be easily replaced.

Accordingly, the unit device socket 8 is electrically connected to the intermediate board 5 through the socket pin 9 and the receptacle 10, and the receptacle 10 is welded at the lower portion of the intermediate board 5; It is.

On the other hand, the socket support mechanism 6 is formed with a plurality of socket holes 11 into which the unit element socket 8 is fitted, and the unit element sockets provided in the intermediate board 5 through the socket holes 11. 4, 5 and 7, as shown in Figures 4, 5, and 7 are projected upwards of the socket support mechanism 6, and the support wing 12 is formed at the peripheral edge of the socket hole 11, the support The blade 12 supports the tip of the unit element socket 8 to support it.

Thus, when the socket 8 is pushed downward, the edge of the socket 8 is supported by the support wing 12 to prevent the socket 8 itself from being pushed downward, as well as the socket ( 8) Prevent the pressing force from being transmitted to the lower intermediate board (5).

On the other hand, the upper part of the socket 8 is provided with a pushing unit 13 for pressing the socket 8 while being supported by the PC support 3, the pushing unit 13 is the socket 8 Top plate 15 formed with openings 14 for each position of the spring, a spring 16 for elastically supporting the top plate 15 on the lower PC support 3, and the top plate 15 and the intermediate board 5 It is composed of a cylinder (17) fixedly installed between the two to pull the upper plate 15 downward to press the socket (8).

The spring 16 is set in a state in which the top plate 15 supports the socket 8 from being pressed in a basic state, and the top plate 14 is connected to the socket 8 so as to insert a unit element into the socket 8. When pressing 8), the cylinder 17 is contracted so that the upper plate 14, which is caught on the upper end of the cylinder 17, moves downward.

Meanwhile, referring to FIG. 6, the structure of the top plate 15 of the pushing unit 13 will be described in more detail. The top plate 15 is formed by the spring 16 on the support 3 installed in a stable structure. It is elastically supported, and the upper plate 15 has a plurality of openings 14 formed in accordance with the number and position of the sockets 8 installed on the lower intermediate board 5. A guide is required in order to be able to move up and down while being exactly coincident with the position of the socket 8. In the embodiment of the present invention, the guide is combined with the spring 16.

In addition, the cylinder 17 provided between the upper plate 15 and the intermediate board 5 is installed in the front and rear directions of the upper plate 15 to avoid the opening 14 so that the upper plate 15 is not inclined downward. Although it is installed to be pulled, the working medium of the cylinder 17 is preferably pneumatic, but other media may be used if necessary.

On the other hand, the upper end of the cylinder 17 is coupled to be separated from the upper plate 15 in preparation for the change of the upper plate 15, the structure of the coupling pin 18 is rotated on the upper end of the cylinder 17 The upper plate 15 is formed with a through hole 19 through which the coupling pin 18 can pass, and the upper plate 15 is shown in FIGS. 4 and 5 on the upper surface of the upper plate 15. As described above, the engaging groove 20 is formed to engage the coupling pin 18.

Therefore, when the cylinder 17 and the upper plate 15 are coupled, the cylinder 17 is inserted into the through hole 19 with the coupling pin 18 provided at the upper end, and the state as shown in FIG. Rotation to the coupling pin 18 is inserted into the locking groove 20 is fastened.

In addition, when the cylinder 17 and the upper plate 15 are to be separated, the cylinder 17 and the upper plate 15 are rotated by rotating the coupling pin 18 of the cylinder 17 in a state such as 'I' of FIG. 6. ) Is released, the upper plate 15 is free to lift.

On the other hand, the cylinder 17 is stretched in accordance with the switching state of the control valve (not shown) for controlling the operating medium to raise and lower the top plate 15, the control valve for controlling the operation of the cylinder 17 is a support (3) It has a structure electrically connected to the electrical switch 21 installed in the).

When the device of the present invention having such a structure is in an initial state, that is, when the top plate 15 is not pulled downward by the cylinder 17, the top plate 15 is a spring (as shown in FIG. 4). 16, it is in the state lifted with respect to the support stand 3, and it is in the state which does not press the socket 8 provided in the intermediate board 5. As shown in FIG.

In this state, when the operating medium such as compressed air is delivered to the cylinder 17 by operating the switch 21, as the cylinder 17 contracts, the upper plate 15 is pulled downward, as shown in FIG. The upper plate 15 makes the state in which the unit element can be inserted into the socket 8 by pressing the socket 8 installed on the intermediate board 5 with a constant force.

That is, by operating the switch 21, the cylinder 17 is contracted, the upper plate 15 is moved downward to press the socket 8, this way, when the socket 8 is pressed, a slit formed therein This is a slightly open state can be inserted into the unit element, at this time it is to insert the unit element to be tested in the socket (8) through the opening 14 formed in the upper plate (15).

As described above, when the socket 8 is pressed by receiving the force of the upper plate 15, the support wing (the edge of the socket 8 is formed in the socket hole 11 of the socket support mechanism 6) 12), the socket 8 itself is pushed down so as not to retreat or break down, thereby improving stability, and the excessive force from the socket 8 is transmitted to the intermediate board 5. You can prevent it.

Therefore, not only the damage of the socket 8 pressed by the upper plate 15 can be prevented, but also the damage of the intermediate board 5 can be prevented.

Then, after completing the test work by moving the upper plate 15 downward to operate the cylinder 17 in the above-described operation, the switch 21 is turned off to return the upper plate 15 to its original position. When the cylinder 17 is extended, the upper plate 15 simply returns to its original position by the restoring force of the spring 16.

As described above, the apparatus according to the present invention is a top plate which is raised and lowered by the operation of the cylinder 17 while the unit element socket 8 installed on the intermediate board 5 is elastically supported by the spring 16. Since it is mechanically pressed by (15), it is possible to easily and effectively control the operation of pressing the socket 8 to insert the unit element into the socket 8, thereby improving productivity as well as automation. You can get the effect that makes it possible.

In addition, the medium board 5 on which the unit device socket 8 is installed is fixedly supported by the socket support mechanism 6, and the socket (6) is formed at the edge of the opening 11 of the socket support mechanism 6. 8) Since the supporting wing 12 is provided to support the socket 8, when the socket 8 is mechanically pressed by the upper plate 15, it is damaged or pushed downward by excessive force to damage the intermediate board 5 This phenomenon can be prevented from occurring, and the effect of extending the lifespan of the socket 8 and the intermediate board 5 can be obtained.

Claims (6)

A semiconductor device test in which a unit device socket 8 is connected to a main board 1 of a PC through an intermediary board 5, and a semiconductor device to be tested is inserted into the unit device socket 8 to test the semiconductor device. In the apparatus, The computer main board (1) with the memory module socket removed and the connector pin (2) installed is fixedly installed on the PC support (3) with the back side facing upward, and the connector (2) on the connector pin (2) of the main board (1) 4) is installed on the main board (1) detachably, the intermediate board formed with a receptacle (10) in which a plurality of unit element socket (8) and the unit element socket pin (9) is inserted on the connector (4) While (5) is connected in electrical communication, a unit element socket support mechanism (6) having a plurality of socket holes (11) is arranged on the intermediate board (5), so that the intermediate board (5) In addition to being fixed by the socket support mechanism (6), it is characterized in that it is made to support the element socket (8) which is inserted and pressed into the receptacle (10) of the intermediate board (5) through the socket hole (11) Semiconductor device test apparatus. A support wing (12) according to claim 1, characterized in that a support wing (12) is provided at the peripheral edge of the socket hole (11) formed in the socket support mechanism (7) to support and support the tip of the unit element socket (8). Semiconductor device test apparatus. 2. The semiconductor device testing device according to claim 1, wherein a pushing unit (13) for pressing the socket (8) while being supported by the PC support (3) is further installed on the socket (8). A semiconductor device test in which a unit device socket 8 is connected to a main board 1 of a PC through an intermediary board 5, and a semiconductor device to be tested is inserted into the unit device socket 8 to test the semiconductor device. In the apparatus, The computer main board (1) with the memory module socket removed and the connector pin (2) installed is fixedly installed on the PC support (3) with the back side facing upward, and the connector (2) on the connector pin (2) of the main board (1) 4) is installed on the main board (1) detachably, the intermediate board formed with a receptacle (10) in which a plurality of unit element socket (8) and the unit element socket pin (9) is inserted on the connector (4) While the (5) is connected so as to be in electrical communication, the pushing unit 13 for pressing the socket 8 in the state supported by the PC support (3) is installed on the upper portion of the socket (8) Semiconductor device test apparatus. 5. The upper plate (15) according to claim 4, wherein the pushing unit (13) has an opening (14) formed at each position of the socket (8) installed on the intermediate board (5), and the upper plate (15) has a lower PC support ( 3) a cylinder (17) which is elastically supported by the spring (16) and is fixedly installed between the upper plate (15) and the intermediate board (5) to pull the upper plate (15) downward to press the socket (8). Semiconductor device test apparatus, characterized in that consisting of. The method of claim 5, wherein the coupling pin 18 is rotatably connected to the upper end of the cylinder 17, the upper plate 15 through hole 19 through which the coupling pin 18 can be passed. Is formed, the upper surface of the upper plate 15, the semiconductor device test apparatus, characterized in that the engaging groove (20) for engaging the coupling pin (18) is formed.