KR100297873B1 - Diffusion Process Equipment for Semiconductor Device Manufacturing - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a diffusion process facility for manufacturing a semiconductor device which rotates and lifts a wafer boat loaded with the wafer in a diffusion path so as to uniformly spray process gas onto a wafer to form a uniform diffusion film.

A diffusion process apparatus for manufacturing a semiconductor device according to the present invention includes a diffusion path, a wafer boat loaded with a plurality of wafers positioned inside the diffusion path, a gas supply source and a gas supply source to supply a process gas into the diffusion path. Gas supply means having an injection nozzle connected to the rotating lifting means for rotating and raising and lowering the wafer boat in the interior of the diffusion path.

Therefore, the wafer boat loaded with a plurality of wafers is rotated and lowered in the diffusion path through which the process gas is injected, thereby improving the uniformity of the diffusion film formed on the wafer.

Description

Diffusion Process Equipment for Semiconductor Device Manufacturing

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a diffusion process facility for manufacturing a semiconductor device, and more particularly, to rotate and lift a wafer boat loaded with a wafer in a diffusion path so as to uniformly spray process gas onto a wafer to form a uniform diffusion film. A diffusion process facility for manufacturing a semiconductor device.

In general, a wafer is manufactured as a semiconductor device after repeatedly performing a semiconductor device manufacturing process such as photography, diffusion, etching, chemical vapor deposition, and metal deposition.

In the semiconductor device manufacturing process, a diffusion process is a process in which impurity particles are diffused on a wafer so that the wafer has required electrical characteristics. The diffusion of materials moves from a high concentration to a low concentration equilibrium. It is a process using development.

The diffusion process is generally performed by placing a wafer inside a diffusion path and injecting a process gas containing the impurity particles into the diffusion path to diffuse the impurity particles on the wafer. It is carried out in diffusion process equipment for manufacturing semiconductor devices.

Here, the diffusion process equipment for manufacturing a semiconductor device of the related art will be described. The diffusion process equipment for manufacturing a semiconductor device has a diffusion path in which the diffusion process is performed.

In the diffusion path, a wafer boat in which a plurality of wafers are stacked and formed at regular intervals is positioned.

In addition, the diffusion path is provided with a gas supply means having a gas supply source and injection nozzles to inject a process gas containing an impurity gas onto the wafer, the injection nozzle is provided on the top, bottom or side of the wafer boat The process gas is injected.

In this case, a plurality of spray nozzles may be installed on the side of the wafer boat to uniformly spray the process gas on the wafer to form a uniform diffusion film, and the height of the wafer boat is adjusted to adjust the height of the wafer boat. It is possible to control the distance at which the process gas reaches the wafer, or to include the rotating means for rotating the wafer boat inside the diffusion path to inject the process gas in all directions around the wafer.

However, there is a problem that the diffusion film formed on the wafer is not uniform because the arrival distance of the process gas injected from the injection nozzle onto the wafer varies according to the height of the wafer boat.

That is, when the height of the injection nozzle is higher than the height of the wafer located on the wafer boat, the process gas is injected to a far distance on the wafer, but the distribution of the process gas is sparse at the portion close to the injection nozzle. Uniformity of the diffusion film formed on the wafer is lowered.

In addition, when the height of the injection nozzle is lower than the height of the wafer, the process gas is injected only in a portion close to the injection nozzle, so that the diffusion film is properly formed at the end of the wafer that is far from the injection nozzle. It won't work.

This problem occurs even if the injection nozzle is located at the center of the wafer and the wafer. This is because the process gas is sprayed well, but the amount of the process gas distributed at the center and the end of the wafer is different. Again, the uniformity of the diffusion film formed on the wafer is lowered.

In addition, even if the process gas is sprayed in all directions around the wafer by rotating the wafer boat, the process gas is injected only a certain distance on the wafer, thereby decreasing the uniformity of the diffusion film formed on the wafer. There was a problem.

The present invention is to solve the above conventional problems, the object of the diffusion film formed on the wafer by rotating and lowering the wafer boat loaded with a plurality of wafers in the diffusion path in which the process gas is injected It is to provide a diffusion process equipment for manufacturing a semiconductor device to improve the uniformity.

1 is a partial cutaway sectional view showing a diffusion process apparatus for manufacturing a semiconductor device according to a first preferred embodiment of the present invention.

FIG. 2 is a cross-sectional view taken along the line II of FIG. 1. FIG.

Figure 3 is a side view showing the lifting portion of FIG.

4 is a partial cutaway sectional view showing a diffusion process apparatus for manufacturing a semiconductor device according to a second preferred embodiment of the present invention.

Fig. 5 is a partial cutaway sectional view showing a diffusion process apparatus for manufacturing a semiconductor device according to a third embodiment of the present invention.

FIG. 6 is a partial cutaway cross-sectional view illustrating the pneumatic cylinder and the controller of FIG. 5. FIG.

Explanation of symbols on the main parts of the drawings

1, 31, 61: Diffusion process equipment for semiconductor device manufacturing

2, 32, 62: diffusion furnace 3, 33, 63: wafer

4, 34, 64: wafer boat 5, 35, 65: injection nozzle

6, 36, 66: movable plate 7, 37, 67: fixed plate

8: Boss 9, 11: Ball-bearing

10: spline shaft 13, 77: rotary drive unit

12, 41, 70: Magnetic-seal

14: rotation shaft 15, 22, 47, 78: drive motor

16, 79: driving pulley 17, 80: driven pulley

18, 81: belt 19: lifting section

20: Cam 21: Camshaft

38: screw hole 39, 68: box

40: fixed rod 42: screw rod

43: gear drive 44: gear box

45: vertical bevel gear 46: horizontal bevel gear

48: vertical axis 49: guide part

50: vertical guide rod 51: guide member

52, 82: control unit 53, 83: upper limit sensor

54, 84: lower limit sensor 55, 85: position detection sensor

56, 86 controller 69, lead rod

71: Piston (Piston) 72: pneumatic cylinder

73: cylinder 74: partition plate

75: Air-port 76: pneumatic supply source

87: Guide

In order to achieve the above object, a diffusion process apparatus for manufacturing a semiconductor device of the present invention includes a diffusion furnace, a wafer boat placed inside the diffusion furnace by loading a plurality of wafers, and supplying process gas into the diffusion furnace. Gas supply source It characterized in that it comprises a gas supply means having a spray nozzle connected to the gas supply source and the rotating lifting means for rotating and lifting the wafer boat in the diffusion passage.

The rotating lifting means includes a moving plate on which the wafer boat is located, a fixed plate positioned below the moving plate to seal the diffusion path, and fixed to the moving plate through the fixing plate and having a spline formed therein. A spline shaft and a spline groove formed on an inner surface thereof so that the spline shaft is inserted and a ball bearing supported on the fixed plate, and a rotatable boss; rotating the boss to rotate the spline shaft inserted into the boss and rotating the spline shaft. It is preferable to include a lifting and lowering unit connected to the spline shaft to raise and lower the moving plate by raising and lowering the spline shaft and the rotary drive unit connected to the boss to rotate the moving plate by.

In addition, the rotation elevating means is a movable plate in which the wafer boat is located, a fixed plate positioned below the movable plate to seal the diffusion path, a box fixed to the fixed plate and having a screw hole formed at the bottom thereof; A fixing rod positioned inside the box and fixed to the movable plate through the fixing plate, a screw rod fixed to the fixing rod and coupled to the screw hole formed in the box, and rotating the screw rod. It is also preferable to include a gear driving unit for rotating and raising and lowering the moving plate by rotating and lifting, a guide unit for preventing the flow of the gear driving unit and a control unit for applying a control signal to control the operation of the gear driving unit.

In addition, preferably, the rotary lifting means includes a moving plate on which the wafer boat is located, a fixed plate positioned below the moving plate to seal the diffusion path, a box fixed to the lower portion of the fixed plate, and A pneumatic cylinder positioned inside the box and fixed to the movable plate through the fixing plate, a piston connected to the lead rod, and lifting and lowering the piston to raise and lower the movable plate; and rotating the lead rod. It is connected to the lead rod to rotate the moving plate to be guided to the guide member installed on the side of the box is a rotary drive unit capable of raising and lowering and a control unit for controlling the operation of the pneumatic cylinder and the rotary drive unit will be.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Referring to FIG. 1, a diffusion process apparatus 1 for manufacturing a semiconductor device according to a first embodiment of the present invention includes a diffusion path 2, and a plurality of wafers inside the diffusion path 2; The wafer boat 4 on which (3) is loaded is located.

At this time, the wafer boat 4 is loaded into the diffusion path 2 by a wafer boat elevator (not shown) that raises and lowers the wafer boat 4.

In addition, a gas supply means including a gas supply source (not shown) and an injection nozzle 5 connected to the gas supply source is provided to supply a process gas into the diffusion path 2.

On the other hand, the diffusion process equipment 1 for manufacturing a semiconductor device is provided with rotation lifting means for rotating and lifting the wafer boat 4 inside the diffusion path 2.

The rotary lifting means includes a movable plate 6 on which the wafer boat 4 is located, and the diffusion plate 2 is coupled to the diffusion path 2 in the lower portion of the movable plate 6. A fixing plate 7 for sealing is provided, and a wafer boat elevator is installed below the fixing plate 7 to raise and lower the fixing plate 7.

The spline shaft 10 penetrating the fixed plate 7 is fixed to the movable plate 6, and a spline is formed on the spline shaft 10.

The fixing plate 7 is rotatably supported by a ball bearing 9 with a boss 8 having a spline groove formed therein so that the spline shaft 10 is inserted therein.

That is, referring to FIG. 2, the spline shaft 10 is inserted into the boss 8, and the spline shaft 10 is configured to move up and down inside the boss 8. do.

The boss 8 is a ball spline type in which a ball bearing 11 is installed between the boss 8 and the spline shaft 10 so as to prevent friction generated when the spline shaft 10 moves up and down. desirable.

Referring again to FIG. 1, the spline shaft 10 is provided with a magnetic thread 12 to seal the fixing plate 7 penetrated by the spline shaft 10, and the magnetic thread ( 12 seals the spline 10 and the fixed plate 7 which rotate at low speed under low pressure to prevent the process gas injected into the diffusion path 2 from leaking.

On the other hand, the boss 8 is provided with a rotary drive unit 13 for rotating the boss 8, the rotary drive unit 13 is inserted into the boss 8 by rotating the boss (8). The spline shaft 10 is rotated, and the movable plate 6 is rotated by the rotation of the spline shaft 10.

In this case, the rotation driving unit 13 includes a driving motor 15 having a rotation shaft 14, and a driving pulley 16 is connected to the rotation shaft 14.

In addition, a driven pulley 17 is fixed to the boss 8 on an outer wall of the boss 8, and the driving pulley 16 and the driven pulley 17 are connected by a belt 18.

3, the spline shaft 10 is connected to a lifting unit 19 for elevating the moving plate 6 vertically by elevating the spline shaft 10 vertically. The lifting unit 19 has a cam 20 in contact with one side end of the spline shaft 10, the cam 20 is connected to a cam shaft 21, and the cam shaft 21 is driven. It is connected to the motor 22 to rotate.

At this time, the cam 20 is preferably replaceable with a cam formed of various cam heights to be able to adjust the distance in which the spline shaft 10 rises and falls vertically.

In addition, the diffusion process facility 1 for manufacturing a semiconductor device is configured to rotate and lift the wafer boat 4 in the diffusion process after the wafer boat 4 is positioned inside the diffusion path 2. It is also preferable to include a control unit (not shown) for controlling the operation of the rotary drive unit 13 and the elevating unit 18 by applying a control signal to the rotary drive unit 13 and the elevating unit 18.

Here, the operation relationship of the diffusion process equipment 1 for manufacturing a semiconductor device according to the first preferred embodiment of the present invention will be described. The wafer boat 4 having a plurality of wafers 3 loaded thereon is the movable plate. Located on (6), the wafer boat elevator raises the fixed plate (7) to move the wafer boat (4) located on the moving plate (6) into the diffusion path (2).

In addition, the injection nozzle 5 connected to the gas supply source injects the process gas toward the wafer 3 from the inside of the diffusion path 2, and the rotary driving unit 13 and the elevating unit 19. Is operated to rotate and raise and lower the movable plate 6 on which the wafer boat 4 is located.

At this time, the drive motor 15 provided in the rotary drive unit 13 rotates the drive pulley 16, is connected by the drive pulley 16 and the belt 18 and the boss (8) The boss 8 is rotated by rotating the driven pulley 17 fixed to the outer wall.

The spline shaft 10 rotates by the rotation of the boss 8, and the movable plate 6 fixed to the spline shaft 10 rotates to rotate the wafer boat 4. Rotated.

In addition, when the driving motor 22 provided in the lifting unit 19 operates, the cam shaft 21 provided in the driving motor 22 is rotated so that the cam 20 rotates.

At this time, the spline shaft 10 coming into contact with one side end of the cam 20 is moved up and down by the rotation of the cam 20, so that the movable plate 6 fixed to the spline shaft 10 is moved. The wafer boat 4 placed on the movable plate 6 is moved up and down.

Therefore, the wafer boat 4 located on the movable plate 6 by the operation of the rotary driving unit 13 and the elevating unit 19 is inside the diffusion path 2 into which the process gas is injected. Rotates and descends.

Meanwhile, referring to FIG. 4, the diffusion process facility 31 for manufacturing a semiconductor device according to the second exemplary embodiment of the present invention will be described. The diffusion process facility 31 for manufacturing a semiconductor device includes a diffusion path 32. In the diffusion path 32, a wafer boat 34 on which a plurality of wafers 33 are placed is located.

At this time, the wafer boat 34 is loaded into the diffusion path 32 by a wafer boat elevator (not shown) that raises and lowers the wafer boat 34.

In addition, a gas supply means including a gas supply source (not shown) and an injection nozzle 35 connected to the gas supply source is provided to supply a process gas into the diffusion path 32.

On the other hand, the diffusion process equipment for manufacturing a semiconductor device 31 is provided with a rotary lifting means for rotating and lifting the wafer boat 34 in the diffusion path (32).

The rotating lifting means includes a moving plate 36 on which the wafer boat 34 is located, and the diffusion path 32 is coupled to the diffusion path 32 at a lower portion of the moving plate 36. A fixing plate 37 for sealing is provided, and a wafer boat elevator is installed below the fixing plate 37 to raise and lower the fixing plate 37.

A box 39 having a screw hole 38 formed therein is fixed to a lower portion of the fixing plate 37, and the moving plate 36 penetrates the fixing plate 37 inside the box 39. The fixed rod 40 fixed to the is installed.

Here, the magnetic rod 41 is provided in the fixing rod 40 to seal the fixing plate 37 penetrated by the fixing rod 40, and the magnetic chamber 41 rotates at low speed under low pressure. The fixing rod 40 and the fixing plate 37 are sealed to prevent the process gas injected into the diffusion path 32 from leaking.

In addition, a screw rod 42 fixed to the fixing rod 40 is coupled to the screw hole 38 formed in the box 39, and the screw rod 42 connects the screw rod 42. It is connected to the gear drive part 43 for rotating and raising and lowering the movable plate 36 fixed to the fixed rod 40 by rotating.

The gear driving part 43 includes a gear box 44 installed under the screw rod 42, and a vertical bevel gear 45 connected to the screw rod 42 in the gear box 44. Is installed, the vertical bevel gear 45 is connected to be orthogonal to the horizontal bevel gear 46, the horizontal bevel gear 46 is connected to the drive motor 47.

At this time, the vertical bevel gear 45 has a vertical shaft 48 protruding to the outside through the gear box 44, the vertical shaft 48 is coupled and fixed to the screw rod 42 have.

On the other hand, the gear driving unit 43 is connected to the guide portion 49 to prevent the flow of the gear driving portion 43, the guide portion 49 is a vertical guide rod 50 fixed to the fixed plate 37 A guide member 51 is formed on the side surface of the gearbox 44 by the vertical guide rod 50.

In addition, the rotation elevating means has a control unit 52 for controlling the operation of the gear driving unit 43, the control unit 52 is installed on the upper and lower portions of the vertical guide rod 50, respectively, And a lower position sensor (53) and a position sensor (55) installed in the guide member (51), and applied from the upper and lower limit sensors (53) and the position sensor (55). It is provided with a controller 56 for applying a control signal to control the operation of the gear drive unit 43 by a signal.

At this time, the upper limit sensor 53 is preferably installed on the side of the vertical guide rod 50 so as to be able to adjust the height of the wafer boat 34 to move up and down.

Referring to the operation relationship of the diffusion process equipment 31 for manufacturing a semiconductor device according to the second preferred embodiment of the present invention, the wafer boat 34 on which the plurality of wafers 33 are loaded is the movable plate. Located on 36, the wafer boat elevator raises the fixed plate 37 to move the wafer boat 34 located on the moving plate 36 into the diffusion path 32. As shown in FIG.

In addition, the injection nozzle 35 connected to the gas supply source injects the process gas toward the wafer 33 in the diffusion path 32, and the controller 56 is connected to the gear driving part 43. The gear driving part 43 is driven by applying a control signal.

At this time, if the position signal applied by the position detection sensor 55 and the lower limit sensor 54 is not detected, the controller 56 applies a control signal to the gear driving unit 43 to start the process. That is, the gear driving unit 43 is operated such that the position detecting sensor 55 is located at the height of the lower limit sensor 54.

When the position sensor 55 contacts the lower limit sensor 54 to apply a position signal, the controller 56 operates the gear driver 43 and the gear driver 43 is provided. The drive motor 47 provided in the drive motor 47 rotates the horizontal bevel gear 46 and is vertically connected to be perpendicular to the horizontal bevel gear 46 by the rotation of the horizontal bevel gear 46. The bevel gear 45 rotates, and the screw rod 42 coupled to and fixed to the vertical shaft 48 provided in the vertical bevel gear 45 rotates by the rotation of the vertical bevel gear 45. Done.

Since the screw rod 42 is screwed with the screw hole 38 formed in the box 39, and the box 39 is fixed to the fixing plate 37, the screw rod 42 is As you rotate, you rise.

In this case, the gearbox 39 in which the vertical bevel gear 45 connected to the screw rod 42 is coupled with the guide member 51 formed on the side of the gearbox 39 is the vertical guide. Guided to the rod 50 is to rise with the threaded rod (42).

In addition, as the screw rod 42 rotates and rises, the fixed rod 40 connected to the screw rod 42 rotates and rises, and thus the movable plate 36 fixed to the fixed rod 40. The wafer boat 34 positioned on) also rotates and rises.

On the other hand, when the position detecting sensor 55 installed in the guide member 51 is raised to contact the upper limit sensor 53 installed in the vertical guide rod 50, the upper limit sensor 53 is the controller 56 ) And the controller 56 applies a control signal to the drive motor 47 to switch the rotation of the drive motor 47 in the reverse direction to reverse the operation of the gear driver 43. Rotate and lower the wafer boat.

By repeatedly performing the operation of the gear driver 43, the wafer boat 34 positioned on the moving plate 36 rotates and descends inside the diffusion path 32 through which the process gas is injected. .

Referring to FIG. 5, a diffusion process facility 61 for manufacturing a semiconductor device according to a third exemplary embodiment of the present invention will be described. The diffusion process facility 61 for manufacturing a semiconductor device includes a diffusion path 62. In the diffusion path 62, a wafer boat 64 on which a plurality of wafers 63 are loaded is located.

At this time, the wafer boat 64 is loaded into the diffusion path 62 by a wafer boat elevator (not shown) that raises and lowers the wafer boat 64.

In addition, a gas supply means including a gas supply source (not shown) and an injection nozzle 65 connected to the gas supply source is provided to supply a process gas into the diffusion path 62.

On the other hand, the diffusion process facility 61 for manufacturing a semiconductor device is provided with a rotary lifting means for rotating and raising and lowering the wafer boat 64 inside the diffusion path 62.

The rotating lifting means includes a moving plate 66 on which the wafer boat 64 is located, and the diffusion path 62 is coupled to the diffusion path 62 at a lower portion of the moving plate 66. A fixing plate 67 for sealing is provided, and a wafer boat elevator is installed below the fixing plate 67 to raise and lower the fixing plate 67.

The box 68 is fixed to the lower portion of the fixing plate 67, and a lead rod 69 fixed to the moving plate 66 through the fixing plate 67 is installed inside the box 68. have.

In order to seal the fixing plate 67 penetrated by the lead rod 69, the lead rod 69 is provided with a magnetic seal 70, and the magnetic seal 70 rotates at low speed under low pressure. The lead rod 69 and the fixing plate 67 are sealed to prevent the process gas injected into the diffusion path 62 from leaking.

In addition, the lead rod 69 has a piston 71 connected to the lead rod 69, and the pneumatic cylinder for raising and lowering the lead rod 69 vertically by raising and lowering the piston 71 vertically. 72 is provided, and the pneumatic cylinder 72 is fixed inside the box 68.

6, the pneumatic cylinder 72 has a cylinder 73 fixed to the box 68, and the cylinder 73 has two independent interiors of the cylinder 73. A divider plate 74 connected to the piston 71 is provided so as to be divided into two spaces, and an air port 75 for supplying air pressure to two spaces independent of the divider plate 74 is provided.

The airport 75 is connected to the pneumatic supply source 76, by supplying the air pressure alternately to each of the airport (75) by raising and lowering the partition plate 74 vertically to the partition plate (74) The moving plate 66 to which the piston 71 is fixed is raised and lowered by raising and lowering the piston 71 connected thereto.

Referring to FIG. 5 again, the rotation elevating means includes a rotation driving part 77 connected to the lead rod 69 to rotate the movable plate 66 by rotating the lead rod 69. Doing.

The rotation driving unit 77 includes a driving motor 78, and a driving pulley 79 is connected to the driving motor 78.

In addition, a driven pulley 80 is formed on an outer wall of the lead rod 69 on the lead rod 69, and the driving pulley 79 and the driven pulley 80 are connected by a belt 81. have.

In addition, the rotary driver 77 is provided on the sidewall of the box 68 to prevent the rotation of the rotary driver 77 generated when the lead rod 69 is raised by the operation of the pneumatic cylinder (72). A guide piece 87 is formed, and the guide piece 87 is inserted into and coupled to the side surface of the drive motor 86 to guide the guide piece 87 to move up and down the driving motor 86. Grooves are formed.

On the other hand, the rotary lifting means is provided with a controller 82 for controlling the operation of the pneumatic cylinder 72 and the rotary drive unit 77.

Referring to FIG. 6, the control unit 82 is provided with upper and lower limit sensors 83 and 84 installed on the upper and lower portions of the cylinder 73 and position detecting sensors 85 installed on the partition plate 74, respectively. And a control signal is applied to the pneumatic cylinder (72) and the rotary drive unit (77) by signals applied from the upper and lower limit sensors (83) (84) and the position detecting sensor (85). It is provided with a controller 86 for controlling the operation of the pneumatic cylinder 72 and the rotary drive unit 77.

In this case, the upper limit sensor 83 is preferably installed on the side wall of the cylinder 73 to enable height adjustment so that the wafer boat 64 can move up and down.

Here, the operation relationship of the diffusion process equipment 61 for manufacturing a semiconductor device according to the third preferred embodiment of the present invention will be described. The wafer boat 64 on which the plurality of wafers 63 are loaded is the movable plate. The wafer boat elevator lifts the fixed plate 67 to move the wafer boat 64 located on the movable plate 66 into the diffusion path 62.

In addition, the injection nozzle 65 connected to the gas supply source injects the process gas toward the wafer 63 inside the diffusion path 62, and the controller 86 is connected to the pneumatic cylinder 72. A control signal is applied to the rotary driver 77 to drive the pneumatic cylinder 72 and the rotary driver 77.

At this time, the controller 86 applies a control signal to the pneumatic cylinder 72 when the position signal applied by the contact of the position detection sensor 85 and the lower limit sensor 84 is not detected, the process initial state. That is, the pneumatic cylinder 72 is operated so that the position detecting sensor 85 is located at the height of the lower limit sensor 84.

When the position detecting sensor 85 contacts the lower limit sensor 84 to apply a position signal, the controller 86 operates the pneumatic cylinder 72 and the rotation driving unit 77.

That is, when pneumatic pressure is supplied to the airport 75 located below the pneumatic cylinder 72, the piston 71 is raised by the rising of the partition plate 74, and to the piston 71 The wafer boat 64 is raised on the movable plate 66 by the connected lead rod 69.

At this time, the rotation driving unit 77 is guided and lifted by the guide piece 87 coupled to the drive motor 78.

In addition, when the driving motor 78 provided in the rotary driving unit 77 operates to rotate the driving pulley 79, the driven pulley 80 connected by the driving pulley 79 and the belt 81 is rotated. ) Rotates, and the wafer boat 64 located on the movable plate 66 rotates by rotating the lead rod 69 having the driven pulley 80 fixed to the outer wall.

By simultaneously performing such an operation, the wafer boat 64 rotates and rises.

When the partition plate 74 is raised to reach the lower limit sensor 84 of the position detecting sensor 85 installed on the partition plate 74, the lower limit sensor 84 is connected to the controller 86. In this case, the controller 86 applies a control signal to the pneumatic supply source 76 to supply air pressure to the air port 75 provided at the upper portion of the pneumatic cylinder 72 to divide the division signal. The plate 74 is lowered, and the rotation driving unit 77 is guided and lowered by the guide piece 87, and the wafer boat 64 is lowered in the reverse order of the operation.

In addition, since the rotary drive unit 77 continues to operate, the wafer boat 64 rotates while being lowered.

On the other hand, when the partition plate 74 is lowered and the position detecting sensor 85 installed on the partition plate 74 reaches the lower limit sensor 84, the lower limit sensor 84 is connected to the controller 86. The position signal is applied, and the controller 86 again applies a control signal to the pneumatic source 76 to raise the partition plate 74.

By repeatedly performing the operations of the pneumatic cylinder 72 and the rotary drive unit 77, the wafer boat 64 located on the moving plate 66 is used in the diffusion path 62 in which the process gas is injected. It rotates and descends inside.

Therefore, the diffusion process apparatus for manufacturing a semiconductor device according to the preferred embodiments of the present invention is uniformly formed on the wafer loaded on the wafer boat by rotating and lifting the wafer boat in the diffusion path in which the process gas is injected. One diffusion film can be formed.

As described above, according to the diffusion process facility for manufacturing a semiconductor device according to the present invention, the uniformity of the diffusion film formed on the wafer by rotating and lifting the wafer boat loaded with the plurality of wafers inside the diffusion path through which the process gas is injected. It has an effect of improving.

Although the present invention has been described in detail only with respect to the described embodiments, it will be apparent to those skilled in the art that various modifications and variations are possible within the technical scope of the present invention, and such modifications and modifications belong to the appended claims.

Claims (16)

Diffusion furnace; A wafer boat loaded with a plurality of wafers and positioned inside the diffusion path; Gas supply means having a gas supply source and an injection nozzle connected to the gas supply source to inject a process gas into the diffusion path; And Rotation lifting means for rotating and lifting the wafer boat in the interior of the diffusion path; The rotating lifting means, A moving plate on which the wafer boat is located; A fixed plate positioned under the moving plate to seal the diffusion path; A spline shaft penetrating the fixed plate and fixed to the moving plate and having a spline formed therein; A spline groove formed in an inner surface of the spline shaft to be inserted therein, the ball bearing being supported on the fixed plate and being rotatable; Rotate the spline shaft inserted into the boss by rotating the boss; A rotation driving part connected to the boss to rotate the moving plate by the rotation of the spline shaft; And An elevating portion connected to the spline shaft to elevate the spline shaft to elevate the movable plate; Diffusion process equipment for manufacturing the semiconductor device, characterized in that comprises a. The method of claim 1, And said boss is a ball spline type having a ball bearing provided between said spline shaft and said boss so as to prevent friction generated when said spline shaft moves up and down. The method of claim 1, The rotary drive unit, A drive motor having a rotating shaft; A drive pulley provided on the rotation shaft; A driven pulley fixed to the outer wall of the boss; And A belt connecting the driving pulley and the driven pulley; Diffusion process equipment for manufacturing the semiconductor device, characterized in that comprises a. The method of claim 1, The elevating unit, A cam contacting one end of the spline shaft; A camshaft connected to the cam; And A drive motor for rotating the camshaft; Diffusion process equipment for manufacturing the semiconductor device, characterized in that comprises a. The method of claim 4, wherein The cam can be replaced with a cam formed of various cam heights can be adjusted to the distance that the spline shaft rises and falls, characterized in that the diffusion process equipment for manufacturing a semiconductor device. The method of claim 1, And a magnetic seal provided in the spline shaft to seal the fixed plate penetrated by the spline shaft. Diffusion furnace; A wafer boat loaded with a plurality of wafers and positioned inside the diffusion path; Gas supply means having a gas supply source and an injection nozzle connected to the gas supply source to inject a process gas into the diffusion path; And Rotation lifting means for rotating and lifting the wafer boat in the interior of the diffusion path; The rotating lifting means, A moving plate on which the wafer boat is located; A fixed plate positioned under the moving plate to seal the diffusion path; A box fixed to the fixing plate and having a screw hole formed at a bottom thereof; A fixing rod positioned inside the box and fixed to the moving plate through the fixing plate; A screw rod fixed to the fixing rod and coupled to the screw hole formed in the box; A gear driving unit for rotating and elevating the movable plate by rotating and elevating the fixed rod by rotating the screw rod; A guide part for preventing the flow of the gear driving part; And A control unit for applying a control signal to control the operation of the gear driving unit; Diffusion process equipment for manufacturing the semiconductor device, characterized in that comprises a. The method of claim 7, wherein The gear drive unit, A vertical bevel gear having a vertical shaft coupled with the screw rod; A horizontal bevel gear orthogonal to the vertical bevel gear; A drive motor for rotating the horizontal bevel gear; And A gear box in which the vertical bevel gear, the horizontal bevel gear and the driving motor are located; Diffusion process equipment for manufacturing the semiconductor device, characterized in that comprises a. The method of claim 8, The guide unit, A vertical guide rod fixed to the fixing plate; And A guide member formed on a side of the gearbox and guided to the vertical guide rod; Diffusion process equipment for manufacturing the semiconductor device, characterized in that comprises a. The method of claim 9, The control unit, An upper limit sensor installed at an upper portion of the vertical guide rod to enable height adjustment; A lower limit sensor installed at a lower portion of the vertical guide rod; A position sensor installed at the guide member; And A controller for applying a control signal to control the operation of the gear driving unit by signals applied from the upper and lower limit sensors and the position detection sensor; Diffusion process equipment for manufacturing the semiconductor device, characterized in that comprises a. The method of claim 7, wherein And a magnetic seal provided in the fixing rod to seal the fixing plate penetrated by the fixing rod. Diffusion furnace; A wafer boat loaded with a plurality of wafers and positioned inside the diffusion path; Gas supply means having a gas supply source and an injection nozzle connected to the gas supply source to inject a process gas into the diffusion path; And Rotation lifting means for rotating and lifting the wafer boat in the interior of the diffusion path; The rotating lifting means, A moving plate on which the wafer boat is located; A fixed plate positioned under the moving plate to seal the diffusion path; A box fixed to the bottom of the fixing plate; A lead rod positioned inside the box and fixed to the moving plate through the fixing plate; A pneumatic cylinder having a piston connected to the lead rod, and lifting and lowering the moving plate to raise and lower the piston; A rotation driving part connected to the lead rod to rotate the lead rod to rotate the movable plate and guided and lowered by a guide member installed on the side of the box; And A controller for controlling the operation of the pneumatic cylinder and the rotary drive unit; Diffusion process equipment for manufacturing the semiconductor device, characterized in that comprises a. The method of claim 12, The pneumatic cylinder, cylinder; A divider plate connected to the piston to divide the inside of the cylinder into two independent spaces; An air port installed to supply air pressure to two independent spaces, respectively; And A pneumatic source connected to the air port; Diffusion process equipment for manufacturing the semiconductor device comprising a. The method of claim 12, The rotary drive unit, Drive motor; A drive pulley connected to the drive motor; A driven pulley fixed to an outer wall of the lead rod; And A belt connecting the driving pulley and the driven pulley; Diffusion process equipment for manufacturing the semiconductor device, characterized in that comprises a. The method of claim 13, The control unit, An upper limit sensor installed at an upper portion of the cylinder to enable height adjustment; A lower limit sensor installed at the lower portion of the cylinder; A position sensor installed on the partition plate; And A controller for applying a control signal to control the operation of the pneumatic cylinder and the rotary driver by signals applied from the upper and lower limit sensors and the position detection sensor; Diffusion process equipment for manufacturing the semiconductor device, characterized in that comprises a. The method of claim 12, And a magnetic seal provided in the piston to seal the fixed plate penetrated by the piston.