KR200146689Y1 - Dual chamber photoresist coating apparatus for manufacturing semiconductor devices - Google Patents

Abstract

The present invention, when the photosensitive film is applied to the upper surface of the wafer for manufacturing a semiconductor device, the photosensitive film can be applied to a uniform thickness over the entire surface of the wafer to prevent the poor focusing during exposure.

To this end, the present invention has an out chamber (2) having a wafer entrance opening (1) on one side, an inner chamber (3) installed inside the out chamber (2), the out chamber (2) and the inner chamber (3) an out chamber according to the detection signal of the temperature / humidity sensor 4 installed inside and detecting the temperature / humidity inside the out chamber 2 and the inner chamber 3, and the temperature / humidity sensor 4; (2) and a temperature / humidity controller (5) connected to the out chamber (2) and the inner chamber (3), respectively, to adjust the temperature and humidity inside the inner chamber (3), and the temperature / humidity controller (5) of the A filter 6 installed above the inside of the out chamber 2 and the inner chamber 3 to filter impurities in the air supplied into the chamber under control, and a wafer chuck installed in the inner chamber 3 ( 7), a wafer chuck driving motor 8 provided below the wafer chuck 7 so as to rotate the wafer chuck 7, and in the inner chamber 3; In a dual-chamber-type photosensitive film coating device for manufacturing a semiconductor device consisting of a process liquid drain pipe 9 to be collected foreign objects connected to the lower part so as to discharge to the outside the inner chamber (3) arising during the process.

Description

Double chamber type photoresist coating device for semiconductor device manufacturing

The present invention relates to a dual chamber photosensitive film coating apparatus for manufacturing a semiconductor device, and more particularly, to an inner chamber to allow the photosensitive film to be applied with a uniform thickness over the entire surface of the wafer when the photosensitive film is applied to the upper surface of the wafer.

As shown in FIG. 1, the chamber 2a for a photoresist coating process for manufacturing a conventional semiconductor device has a filter 6 for filtering impurities in the air supplied into the chamber 2a. In addition, a wafer chuck 7 in which a wafer is loaded is installed at the lower center, and a driving motor 8 for rotating the wafer chuck 7 at high speed is installed in the lower part of the wafer chuck 7.

In addition, a temperature / humidity sensor 4 is installed at one lower side of the filter 6 of the process chamber 2a, and a temperature detected by the temperature / humidity sensor 4 is disposed at one side of the upper portion of the process chamber 2a. Temperature / humidity controller 5 for controlling the temperature and humidity inside the chamber (2a) according to the humidity is connected, the bottom of the process chamber (2a) to collect the foreign matter of the process liquid generated during the process to discharge to the outside ( 9) is connected.

Meanwhile, an opening 1 for loading and unloading a wafer is formed at one side of the process chamber 2a. The photosensitive film application | coating process performed by the conventional photosensitive film coating apparatus comprised in this way advances as mentioned later.

First, the temperature and humidity values measured by the temperature / humidity sensor 4 in the state where the wafer enters the chamber 2a through the opening 1 of the process chamber 2a and is loaded on the upper surface of the wafer chuck 7 are measured as on. / Humidity is transmitted to the controller (5).

Accordingly, the temperature / humidity controller 5 compares the measured value of the temperature / humidity sensor 4 with the set value for the process, and supplies air having a temperature and humidity corresponding to the correction value to the inside of the chamber 2a. The temperature and humidity inside the chamber 2a are corrected by supplying to the.

Then, when the temperature and humidity correction in the process chamber 2a is completed, the Guam mineral agent is sprayed to the center of the upper surface of the wafer through the injection nozzle 14 and the wafer chuck 7 is rotated at high speed by receiving the driving force of the motor. As a result, the photosensitive agent injected onto the wafer upper surface is evenly applied to the wafer surface by centrifugal force.

However, in the conventional photosensitive film coating apparatus, as shown in FIG. 2, the thickness of the photosensitive film 15a applied to the upper surface of the wafer is not uniform, and a large thickness difference d occurs between the thick portion and the thin portion. There was a problem causing poor focusing. That is, the thickness of the coated photosensitive film 15a becomes uneven. This thickness difference causes many problems, such as poor focusing during the exposure process due to high integration of the semiconductor device, resulting in a decrease in the number of semiconductor devices.

The present invention is to solve the above problems, when the photosensitive film is applied to the upper surface of the wafer for manufacturing a semiconductor device, the photosensitive film can be applied to a uniform thickness over the entire surface of the wafer to prevent poor focusing during exposure It is an object of the present invention to provide a double chamber photosensitive film coating apparatus for manufacturing a semiconductor device.

In order to achieve the above object, the present invention has an out chamber having an opening for accessing the wafer on one side, an inner chamber installed inside the out chamber, and installed inside the out chamber and the inner chamber and inside the out chamber and the inner chamber. A temperature / humidity sensor for detecting temperature / humidity of the temperature / humidity sensor, and a temperature / humidity controller connected to the out chamber and the inner chamber to adjust temperature and humidity in the out chamber and the inner chamber according to the detection signal of the temperature / humidity sensor; And a filter installed at the upper side of the inner chamber and the inner chamber to filter impurities in the air supplied into the chamber under the control of the temperature / humidity controller, a wafer chuck installed in the inner chamber, and the wafer chuck rotated. The wafer chuck driving motor installed below the wafer chuck and the process liquid generated during the process inside the inner chamber Collecting the dual-chamber type photosensitive film coating device for manufacturing a semiconductor element formed by a drain pipe connected to the inner chamber bottom so as to discharge to the outside.

1 is a block diagram showing a chamber for a conventional photosensitive film coating process.

2 is a cross-sectional view of the wafer showing the photosensitive film coating state in the prior art device.

Figure 3 is a block diagram showing a photosensitive film coating device according to the present invention.

4 is a cross-sectional view of the wafer showing the photosensitive film coating state in the device of the present invention.

* Explanation of symbols for main parts of the drawings

1: opening of wafer entrance 2: out chamber

3: inner chamber 4: temperature / humidity sensor

5: temperature / humidity controller 6: filter

7 wafer chuck 8 wafer driving motor

9: drain pipe 10: lower case

11: upper case lifting motor 12: upper case

13: Inner chamber drive motor

Hereinafter, an embodiment of the present invention will be described in detail with reference to FIGS. 3 and 4 of the accompanying drawings.

Figure 3 is a block diagram showing a photosensitive film coating apparatus according to the present invention, Figure 4 is a cross-sectional view of the wafer showing a photosensitive film coating state in the device of the present invention, the present invention is an out chamber having a wafer entrance opening (1) on one side ( 2), an inner chamber 3 installed inside the out chamber 2, and an inside of the out chamber 2 and the inner chamber 3 and installed inside the out chamber 2 and the inner chamber 3; The temperature / humidity sensor 4 which detects temperature / humidity, and the out-chamber to adjust the temperature and humidity inside the out chamber 2 and the inner chamber 3 according to the detection signal of the temperature / humidity sensor 4. 2) and the temperature / humidity controller 5 respectively connected to the inner chamber 3 and the out chamber 2 to filter impurities in the air supplied into the chamber under the control of the temperature / humidity controller 5. And a filter 6 installed in the upper side of the inner chamber 3, and installed in the inner chamber 3; A wafer chuck 7, a wafer chuck driving motor 8 provided below the wafer chuck 7 so as to rotate the wafer chuck 7, and a process liquid generated during the process inside the inner chamber 3. It consists of a drain pipe (9) connected to the lower portion of the inner chamber (3) to collect the foreign matter of the discharge.

At this time, the inner chamber 3 includes a lower case 10 on which the wafer driving motor 8 and the wafer chuck 7 are placed, and an upper case lifting motor (not shown) to open or seal the lower case 10. 11), it is composed of the upper case elevating motor (11) for lifting and receiving movement of the lifting motor.

On the other hand, the inner chamber 3 is configured to be mounted to the inner chamber driving motor 13 to rotate the inner chamber (3).

The photosensitive film application | coating process in this invention apparatus comprised in this way is performed as mentioned later.

First, when the wafer enters into the out chamber 2 through the wafer entrance opening 1 of the out chamber 2, the temperature measured by the temperature / humidity sensor 4 installed on one side of the out chamber 2, and The humidity value is transmitted to the temperature / humidity controller 5 for the out chamber 2.

Accordingly, the temperature / humidity controller 5 for the out chamber 2 compares the measured value of the temperature / humidity sensor 4 with a set value for process progress, and thus, the constant temperature and humidity in the out chamber 2. The temperature and humidity in the out chamber 2 are corrected by injecting controlled air into the chamber.

Then, when the temperature and humidity correction in the out chamber 2 is completed, the upper case elevating motor 11 of the inner chamber 3 is raised to lower the case 10 to open the wafer to the inner chamber 3. When the wafer can be loaded on the upper surface of the wafer chuck 7, and thus the wafer enters the inner chamber 3 and is loaded on the upper surface of the wafer chuck 7 installed in the inner chamber 3, the upper case lifting motor 11 ) Is lowered by receiving the driving force of the lifting motor to seal the lower case (10).

After the inner chamber 3 is closed, this time the temperature / humidity values in the inner chamber 3 are measured by the temperature / humidity sensor 4 by the temperature / humidity sensor 4 installed in the inner chamber 3. It is transmitted to the temperature / humidity controller 5.

Accordingly, the temperature / humidity controller 5 for the inner chamber 3 corrects the temperature and humidity by comparing the measured value of the temperature / humidity sensor 4 in the inner chamber 3 with a set value for process progression. Done.

That is, the temperature and humidity in the inner chamber 3 are corrected by injecting controlled air at a constant temperature and humidity into the inner chamber 3 as in the temperature and humidity correction in the out chamber 2. Then, when the temperature and humidity correction in the inner chamber 3 is completed, the wafer chuck 7 and the inner chamber 3 are rotated under the power of the motor, respectively, and at the same time, the upper surface of the wafer through the injection nozzle 14. The photosensitive agent injected onto the wafer upper surface by spraying the photosensitive agent is evenly applied to the wafer surface by centrifugal force.

That is, as the inner chamber 3 also rotates, the centrifugal force acting on the photosensitive agent injected onto the wafer upper surface becomes larger, so that the photosensitive film 15 formed by the photosensitive agent is more effectively applied with a uniform thickness over the entire surface of the wafer. . On the other hand, the subject innovation is installed closer, and thus the application state of the photosensitive film 15 to be sprayed becomes more uniform.

That is, the present invention uses a double structure of the out chamber 2 and the inner chamber 3 as the photosensitive film coating chamber to more precisely control the conditions in the chamber, and further stabilize the process atmosphere, thereby applying the photosensitive film to the upper surface of the wafer. By uniformizing the thickness of 15, it is possible to prevent a poor focusing during exposure.

As described above, the present invention allows the photosensitive film 15 to be coated with a uniform thickness over the entire surface of the wafer when the photosensitive film is applied to the upper surface of the wafer for manufacturing a semiconductor device, thereby preventing focusing defects during exposure. It is a very useful design to improve the yield of the device.

Claims (3)

An out chamber having a wafer entrance opening at one side, an inner chamber installed inside the out chamber, and a temperature / humidity sensor installed inside the out chamber and the inner chamber to detect temperature / humidity in the out chamber and the inner chamber. And a temperature / humidity controller connected to the out chamber and the inner chamber, respectively, to adjust the temperature and the humidity in the out chamber and the inner chamber according to the detection signal of the temperature / humidity sensor, and the chamber under the control of the temperature / humidity controller. A filter installed in the upper side of the out chamber and the inner chamber to filter impurities in the air supplied to the inside, a wafer chuck installed in the inner chamber, and a wafer chuck installed below the wafer chuck to rotate the wafer chuck. The inner motor to collect foreign substances of the process liquid generated during the process inside the inner chamber and the inner chamber and discharge them to the outside Dual chamber type photosensitive film coating apparatus for manufacturing a semiconductor device, characterized in that consisting of a drain pipe connected to the lower portion. According to claim 1, wherein the inner chamber is composed of a wafer chuck driving motor and a lower case on which the wafer chuck is placed, and an upper case for receiving the driving force of the upper case lifting motor to open or close the lower case to move up and down. Dual chamber type photosensitive film coating apparatus for manufacturing a semiconductor device, characterized in that. The apparatus of claim 1, wherein an inner chamber driving motor is mounted below the inner chamber to rotate the inner chamber.