KR100297839B1 - Method and apparatus for manufacturing microstructure using 3D spatial light modulator - Google Patents

Abstract

The present invention relates to a method and apparatus for manufacturing a microstructure using a three-dimensional spatial light modulator (SLM), wherein the photosensitive resin layer 11 reacting only by a beam of a specific intensity is thickly formed on the glass substrate 10. The three-dimensional shape of the desired structure 12 is separated into the front and side surfaces of the photosensitive resin layer 11 and the upper surface of the glass substrate 10 to be converted into x mask data, y mask data, and z mask data. Inputting the x, y, and z mask data into three spatial light modulators, respectively, the three spatial light modulators on the front and side surfaces of the photosensitive resin layer 11 and the upper surface of the glass substrate 10. And irradiating a beam through the beam and removing the non-exposed portion of the photosensitive resin layer 11 and depositing a metal to form a structure having a desired shape.

The present invention can simply form a three-dimensional fine pattern structure using three or two spatial light modulator.

Description

Method and apparatus for manufacturing microstructure using 3D spatial light modulator

The present invention relates to a method and apparatus for manufacturing a microstructure using a three-dimensional spatial light modulator (SLM).

In general, a photosensitive resin and a mask pattern are used to manufacture the microstructure, which will be described below with reference to FIGS. 1 and 2.

First, as shown in FIGS. 1A and 1B, the photosensitive resin 2 is formed on the substrate 1, and then the mask pattern 4 including the mask 3 having a desired shape is formed. Put it on and irradiate the light.

When the light is irradiated in this manner, as shown in FIG. 2 (a), the exposed portion 5 to which light is applied is cured in the case of a negative photopolymer. As shown in FIG. 2 (b) in the state where the exposed portion 5 is cured as described above, the remaining portion except the exposed portion 5 of the photosensitive resin 2, that is, the non-exposed portion is removed and the second (c) is removed. After depositing the metal (6) as shown in FIG. 6, the remaining photosensitive resin 2, i.e., the exposed portion 5, is removed, and as shown in FIG. 2 (d), the substrate 1 has a desired shape. Only metal 6 remains.

Conventionally, microstructures have been manufactured in this manner, but in the case of using a thick material, a number of processes are required.

This is because it is difficult to raise the photosensitive resin uniformly high, because the spray method Dipping method and the spin coating method are used to coat the photosensitive resin on the substrate.

In the spray method, it is difficult to uniformly deposit the photosensitive resin by spraying the photosensitive resin onto the substrate.

In addition, in the dipping method, the substrate is immersed in the photosensitive resin liquid and then taken out, which is also difficult to uniformly deposit the photosensitive resin.

In addition, the spin coating method is to drop the photosensitive resin on the substrate, and then rotate the substrate to spread widely by centrifugal force. When the viscosity of the photosensitive resin is low, it can be spread far by centrifugal force, but the thickness is about 1 μm or thinner. In the case where the photosensitive resin is formed and the viscosity of the photosensitive resin is high, the photosensitive resin is formed thick, but the photosensitive resin cannot be spread far enough to prevent the photosensitive resin from being formed uniformly.

Accordingly, since the current photosensitive resin can only be made to a height of about 100 μm, the above-described process was repeated to make a thick microstructure.

Thus, the process of forming the thick microstructure will be described with reference to FIGS. 3 and 4.

As shown in FIG. 3, when the thick microstructure 6 having one side inclined is manufactured, it is divided into a plurality of layers as shown in FIG.

That is, as described above, after forming a thin metal film on the substrate 1, the process of forming the thin metal film again is repeated to form a thick fine structure 6 having a desired inclined shape.

However, when the thick microstructure 6 is formed by such a lamination method, there is a problem in that a step is formed on an inclined surface as shown in FIG. 4.

In order to improve the above problems, an object of the present invention is to provide a method and apparatus for manufacturing a microstructure using a three-dimensional spatial light modulator for manufacturing a three-dimensional structure using a plurality of spatial light modulator.

In order to achieve the above object, the present invention provides a step of thickly forming a photosensitive resin layer on a glass substrate, which reacts only by a beam of a specific intensity, the three-dimensional shape of the desired structure to the front and side surfaces of the photosensitive resin layer and the top surface of the glass substrate. Separating and converting the x mask data, the y mask data, and the z mask data, and inputting the x, y, and z mask data into three spatial light modulators, respectively, the front and side surfaces of the photosensitive resin layer and the top of the glass substrate. Irradiating a beam to the surface through the three spatial light modulators, and removing the non-exposed portions of the photosensitive resin layer and depositing a metal to form a structure having a desired shape. It provides a method for producing a microstructure using.

In addition, the present invention is a three-dimensional form of the three spatial light modulator, the desired structure formed on the glass substrate, respectively positioned at a predetermined distance from the front and side of the photosensitive resin layer and the top of the glass substrate to react only by a beam of a specific intensity A mask data generator that separates the front and side surfaces of the photosensitive resin layer and the top surface of the glass substrate, converts the mask into x mask data, y mask data, and z mask data, and inputs them to the three spatial light modulators, respectively. The light source irradiating a beam through a light modulator, three objective lenses each reducing a beam incident through the three spatial light modulators, and three beams passing through the three objective lenses into parallel beams, respectively, And three parallel lenses each of which is incident on the front and side surfaces of the resin layer and the upper end of the glass substrate. Provided is a microstructure manufacturing apparatus using a three-dimensional spatial light modulator.

1 and 2 are views for explaining a conventional method for manufacturing microstructures.

3 and 4 are views for explaining a conventional method for manufacturing microstructures.

5 is a view for explaining a photosensitive layer according to the present invention.

6 is a structural diagram of a microstructure to be formed.

7 is a structural diagram of a mask pattern according to the present invention.

8 is a structural diagram of a microstructure manufacturing apparatus according to the present invention.

* Explanation of symbols for main parts of the drawings

10 glass substrate 11 photosensitive resin layer

12: structure 20, 30, 40: spatial light modulator

21, 31, 41: objective lens 22, 32, 42: parallel lens

50: mask data generator 60: light source

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The microstructure fabrication method using the three-dimensional spatial light modulator according to the present invention is shown in FIGS. 5, 6, 7 (a), 7 (b), 7 (c), and 8. As shown in the drawing, the photosensitive resin layer 11 reacting only by a beam of a specific intensity is thickly formed on the glass substrate 10 (FIG. 5). The three-dimensional shape of the desired structure 12 is formed by the photosensitive resin layer 11. Separating the front and side surfaces and the upper surface of the glass substrate 10 into x mask data, y mask data, and z mask data (FIG. 6), and converting the x, y, z mask data into three Respectively inputting into the spatial light modulator (seventh (a)-7 (c)), the three spatial light on the front and side surfaces of the photosensitive resin layer 11 and the top surface of the glass substrate 10 Irradiating a beam through a modulator (FIG. 8), and removing a non-exposed portion of the photosensitive resin layer 11 and depositing a metal to form a structure having a desired shape. It is performed by the steps:

Here, the sum of the incident multiple beams is greater than the critical response intensity of the photosensitive resin. The photosensitive resin is a photoresist or photopolymer.

The microstructure manufacturing method of the three-dimensional spatial light modulator according to the present invention made as described above will be described in detail.

First, as shown in FIG. 5, the photosensitive resin layer 11 which responds only by the beam of a specific intensity | strength is thickly formed on the glass substrate 10. As shown in FIG.

That is, the photosensitive resin layer 11 is deposited higher than the thickness of the structure 12 to be formed on the glass substrate 10 regardless of uniformity.

In addition, the three-dimensional shape of the structure 12 to be formed shown in FIG. 6 is separated into the front and side surfaces of the photosensitive resin layer 11 and the upper end surface of the glass substrate 10 so that x mask data, y mask data, and Convert to z mask data.

That is, since the spatial light modulator is positioned on three axes x, y, and z around the photosensitive resin layer 11, x, y, z mask data to be input to the spatial light modulator is obtained.

For example, when one side is inclined as shown in FIG. 6, the front and side surfaces of the photosensitive resin layer 11 and the glass substrate as shown in FIGS. 7 (a) to 7 (c) are shown. Obtain x, y, and z mask data to be input to the spatial light modulator on the top surface.

That is, since the x mask data to be input to the spatial light modulator located in front of the photosensitive resin layer 11 is made as shown in FIG. 7 (a), the corresponding data is obtained and the side surface of the photosensitive resin layer 11 is obtained. Since the y mask data to be input to the spatial light modulator at is made as shown in FIG. 7 (b), the corresponding data is obtained, and the z mask data to be input to the spatial light modulator located at the top of the glass substrate 10 is obtained. Is obtained as shown in FIG. 7 (c), and data corresponding thereto is obtained.

In other words, data to be input to the spatial light modulator is obtained so that light does not pass through the hatched portions of FIGS. 7 (a), 7 (b), and 7 (c).

After obtaining the x, y, z mask data in this manner, the x, y, z mask data is input to the spatial light modulators at the corresponding positions, respectively, and the front and side surfaces of the photosensitive resin layer 11 and the glass substrate 10 are obtained. The beams are irradiated through spatial light modulators respectively positioned on the top surface of the.

In this case, light incident on the photosensitive resin layer 11 through the spatial light modulator is incident on the photosensitive resin layer 11 in the corresponding direction.

In this case, the intensity of the three beams incident from the three spatial light modulators is adjusted so that the photosensitive resin layer reacts only with the sum of the three incident beams.

That is, the photosensitive resin layer 11 reacts only where all three beams meet.

After performing the exposure process as described above, a non-exposed part of the photosensitive resin layer 11 is removed and a metal is deposited to form a structure having a desired shape.

That is, if the remaining portion of the photosensitive resin 11 except the exposed portion, that is, the non-exposed portion, the metal is deposited and the exposed portion is removed, only the metal 12 of the desired shape remains on the substrate 10 as shown in FIG. do.

Meanwhile, depending on the shape of the structure to be formed, it may be implemented with only two beams.

That is, when the structure to be formed is not made of the inclined surface but only a thick layer as shown in FIG. 6, only y and z mask data are needed, so only two spatial light modulators are needed. In this case, the intensity of the two beams incident from the two spatial light modulators is adjusted so that the photosensitive resin layer reacts only with the sum of the two incident beams. That is, the photosensitive resin layer 11 reacts only where both beams meet.

In addition, the apparatus for manufacturing a microstructure using the three-dimensional spatial light modulator according to the present invention includes three spatial light modulators 20, 30, and 40, a mask data generator 50, and a light source 60, as shown in FIG. ), Objective lenses 21, 31, 41, and parallel lenses 22 32, 42.

The three spatial light modulators 20, 30, 40 are formed on the glass substrate 10 and are fixed on the front and side surfaces of the photosensitive resin layer 11 and the top of the glass substrate 10 reacting only by beams having a specific intensity. Located at a distance from each other, the light corresponding to the mask is irradiated to the front and side surfaces of the photosensitive resin layer 11 and the top of the glass substrate 10.

The mask data generation unit 50 separates the three-dimensional shape of the desired structure 12 into the front and side surfaces of the photosensitive resin layer 11 and the top surface of the glass substrate 10 to thereby obtain x mask data y mask data, and z. The data is converted into mask data and input to the three spatial light modulators 20, 30, and 40, respectively.

The light source 30 irradiates beams through the three spatial light modulators 20, 30, and 40.

The three objective lenses 21, 31, and 41 reduce the beams incident through the three spatial light modulators 20, 30, and 40, respectively.

The three parallel lenses 22, 32, and 42 make three beams passing through the three objective lenses 21, 31, and 41 into parallel beams, respectively, and the front and side surfaces of the photosensitive resin layer 11 and the glass. Each of them is incident on the upper end of the substrate 10.

Here, the sum of the incident multiple beams is greater than the critical response intensity of the photosensitive resin. The operation of the microstructure manufacturing apparatus using the three-dimensional spatial light modulator according to the present invention configured as described above will be described.

As shown in FIG. 5, the photosensitive resin layer 11 which reacts only by the beam of a specific intensity | strength is formed by thickly depositing on the glass substrate 10, ignoring uniformity.

In addition, the mask data generator 50 separates the three-dimensional shape of the structure 12 to be formed as shown in FIG. 6 into the front and side surfaces of the photosensitive resin layer 11 and the upper surface of the glass substrate 10. Convert to x mask data, y mask data, and z mask data.

As described above, the x, y and z mask data generated by the mask data generator 50 are input to the spatial light modulators 20, 30, and 40, respectively, and the light source 60 receives the spatial light modulators 20, 30, Each beam is irradiated with 40).

In this case, the shapes of the light output from the spatial light modulators 20, 30, and 40 are as shown in FIG. 7 (a), 7 (b), and 7 (c).

In this way, the beams modulated by the spatial light modulators 20, 30, and 40 are respectively reduced in size in the objective lenses 21, 31, and 41, and then made into parallel beams in the parallel lenses 22, 32, and 42. It enters into each surface of the photosensitive resin layer 11, ie, x, y, z surface.

In this case, the photosensitive resin layer is controlled by adjusting the intensity of three beams incident from the three spatial light modulators 20, 30, and 40 through the objective lenses 21, 31, and 41 and the parallel lenses 22, 32, and 42. React only in the sum of these three incident beams.

That is, the photosensitive resin layer 11 reacts only where all three beams meet, so that a desired structure can be formed.

After performing the exposure process as described above, the non-exposed part of the photosensitive resin layer 11 may be removed, and a metal may be deposited to form a structure having a desired shape.

Meanwhile, depending on the shape of the structure to be formed, it may be implemented with only two beams.

That is, when the structure to be formed is not made of the inclined surface but only a thick layer, only the y and z mask data are needed, so only two spatial light modulators 20 and 30 are needed. In this case, the intensity of the two beams incident from the two spatial light modulators 20 and 30 is adjusted so that the photosensitive resin layer 11 reacts only with the sum of the two incident beams. That is, the photosensitive resin layer 11 reacts only where both beams meet.

As described above, the method and apparatus for manufacturing a microstructure using the three-dimensional spatial light modulator according to the present invention can simply form a three-dimensional fine pattern structure using three or two spatial light modulators.

Claims (2)

Forming a thick photosensitive resin layer (11) on the glass substrate (10) in which the sum of the plurality of incident beams reacts only by the beam having an intensity greater than the critical reaction intensity; Separating the three-dimensional shape of the desired structure 12 into the front and side surfaces of the photosensitive resin layer 11 and the top surface of the glass substrate 10 and converting them into x mask data, y mask data and z mask data; Inputting the x, y, and z mask data into three spatial light modulators, respectively; Irradiating a beam through the three spatial light modulators on the front and side surfaces of the photosensitive resin layer (11) and the top surface of the glass substrate (10); And removing the non-exposed portion of the photosensitive resin layer (11) and depositing metal to form a structure having a desired shape. The sum of a plurality of beams formed and incident on the glass substrate 10 reacts only by the beam larger than the critical reaction intensity, and the front and side surfaces of the photosensitive resin layer 11 and the upper end of the glass substrate 10 are each at a predetermined distance. Three spatial light modulators 20, 30, 40 located; The three-dimensional shape of the desired structure 12 is separated into the front and side surfaces of the photosensitive resin layer 11 and the top surface of the glass substrate 10, and converted into x mask data, y mask data, and z mask data. Mask data generators 57 input to the spatial light modulators 20, 30, and 40, respectively; A light source (60) for irradiating a beam through the three spatial light modulators (20, 30, 40); Three objective lenses (21, 31, 41) for respectively reducing the beams incident through the three spatial light modulators (20, 30, 40); And three beams having passed through the three objective lenses 21, 31, and 41 into parallel beams, respectively, which are respectively incident on the front and side surfaces of the photosensitive resin layer 11 and the top of the glass substrate 10. Microstructure manufacturing apparatus using a three-dimensional spatial light modulator, characterized in that it comprises a parallel lens (22, 32, 42).